JPS62124938A - Manufacture of metallic-foil lined laminated board - Google Patents
Manufacture of metallic-foil lined laminated boardInfo
- Publication number
- JPS62124938A JPS62124938A JP26464385A JP26464385A JPS62124938A JP S62124938 A JPS62124938 A JP S62124938A JP 26464385 A JP26464385 A JP 26464385A JP 26464385 A JP26464385 A JP 26464385A JP S62124938 A JPS62124938 A JP S62124938A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- phenolic resin
- adhesive
- coated
- butyral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、印刷回路板用などに使用される金属箔張り積
層板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing metal foil laminates used for printed circuit boards and the like.
従来の技術
従来、フェノール樹脂を使用した両面または片面金属箔
張り積層板は、フェノール樹脂を基材に含浸、乾燥した
プリプレグを所要枚数積み重ね、その片面または両面ｌ
ζ接着剤付金属箔を載置し、これを加熱加圧して積層成
形することにより製造しＣいる。接着剤付金属箔を用い
るのは、接着剤がないと金属箔の接着強度が小さく、半
田耐熱性、ビール強度等の特性を満足できないためであ
る。Conventional technology Conventionally, double-sided or single-sided metal foil-covered laminates using phenolic resin have been produced by impregnating a base material with phenolic resin, stacking the required number of dried prepregs, and stacking the required number of prepregs on one or both sides.
It is manufactured by placing a metal foil coated with ζ adhesive and laminating it by heating and pressing. The reason why metal foil with adhesive is used is that without adhesive, the adhesive strength of metal foil is low and properties such as solder heat resistance and beer strength cannot be satisfied.
発明が解決しようとする問題点
しかしながら、接着剤を塗布しｆこ金属箔は、湿度等の
影響でカールし易く、積層成形時の組込みに支障を来た
し、生産性を低下させる問題点を有する。また、接着剤
付金属箔は、接着剤の可使期間が限定されＣおり、可使
期間を過ぎたものは接着性が低下し°Ｃｕｔうので、そ
の管理に難点がある。Problems to be Solved by the Invention However, metal foil coated with adhesive tends to curl under the influence of humidity, etc., which poses a problem in that it hinders assembly during lamination molding and reduces productivity. In addition, adhesive-coated metal foil has a limited shelf life, and if the shelf life has passed, the adhesive properties of the adhesive will decrease and the adhesive will be cut, making it difficult to manage.
本発明は、接着強度の優れた金属箔張り積層板を効率よ
く製造することを目的とするものである。An object of the present invention is to efficiently produce a metal foil-clad laminate with excellent adhesive strength.
問題点を解決するための手段
上記目的を達成するｔこめに、本発明は、フェノール樹
脂を含浸した基材からなる主層の両面または片面に金属
箔を載置して積層成形す６積層板の製造において、フェ
ノール樹脂を含浸、予備乾燥した後ブチラール変性フェ
ノール樹脂を塗布、乾燥した基材の層を゛、前記主層と
金属箔の間に介在させることを特徴とするものである。Means for Solving the Problems In order to achieve the above objects, the present invention provides a 6-laminate plate formed by laminating and forming metal foils on both sides or one side of a main layer made of a base material impregnated with a phenolic resin. In the production of this method, a layer of a base material is impregnated with a phenolic resin, pre-dried, coated with a butyral-modified phenolic resin, and dried, which is then interposed between the main layer and the metal foil.
作用
本発明は、金属箔に接着剤を塗布しないので、金属箔が
カールすることはなく、金属箔と主層基材の間に介在さ
せたブチラール変性フェノール樹脂の基材層によって、
金属箔の充分な接着強度が確保できる。Function The present invention does not apply adhesive to the metal foil, so the metal foil does not curl, and the base material layer of butyral-modified phenolic resin interposed between the metal foil and the main layer base material
Sufficient adhesive strength of metal foil can be ensured.
また、ブチラール変性フェノール樹脂を塗布した基材を
用いる方法は、ブチラール変性フェノール樹脂の塗布を
、基材にフェノール樹脂を含浸、乾燥する工程と同様の
設備で行なうことができ、必要量だけの生産管理が容易
となる。In addition, in the method of using a substrate coated with butyral-modified phenolic resin, the coating of butyral-modified phenolic resin can be carried out using the same equipment as the process of impregnating the substrate with phenolic resin and drying, and only the necessary amount can be produced. Management becomes easier.
実施例
本発明で使用するブチラール変性フェノール樹脂を塗布
した基材は、基材にフェノール樹脂を含浸、予備乾燥し
た後、ロールコータ−でブチラール変性フェノール樹脂
を塗布し、次いで乾燥して得る方法が望ましい。ロール
コータ−による方法は、ブチラール変性フェノール樹脂
の一定膜厚を連続して形成できる。ブチラール変性フェ
ノール樹脂の塗布方法とし“Ｃ、ディップ方式も考えら
れるが、この場合は、樹脂固形分とが女り落とす必要が
あつ、所定量の塗布をするための多量の溶剤の使用、乾
燥工程で揮散した多量の溶剤の処理等の問題があり、ロ
ールコータ−による方法が有利である。EXAMPLE The substrate coated with the butyral-modified phenolic resin used in the present invention can be obtained by impregnating the substrate with the phenol resin, pre-drying it, applying the butyral-modified phenolic resin using a roll coater, and then drying. desirable. The method using a roll coater allows continuous formation of a constant film thickness of butyral-modified phenol resin. A dipping method is also considered as a method of applying butyral-modified phenolic resin, but in this case, it is necessary to remove the resin solid content, use of a large amount of solvent to apply a predetermined amount, and drying process. Since there are problems such as disposal of a large amount of solvent volatilized in the process, a method using a roll coater is advantageous.
ブチラール変性フェノール樹脂を塗布した基材は、１６
０″Ｃでの揮発分が２〜４′４のものが望ましい。揮発
分が少ないものは接着強度が小さく、揮発分の多いもの
は耐熱性を低下させる。The base material coated with butyral modified phenolic resin is 16
It is desirable that the volatile content at 0''C is from 2 to 4'4.Those with a low volatile content have low adhesive strength, and those with a high volatile content reduce heat resistance.
実施例１
桐油変性フェノール樹脂をクラフト紙に含浸、乾燥させ
樹脂付着分４８ｗ ｔ４の塗工紙を得に０これを塗工紙
Ａとする。Example 1 Kraft paper was impregnated with a phenolic resin modified with tung oil and dried to obtain coated paper with a resin adhesion content of 48 wt4. This was designated as coated paper A.
次に、桐油変性フェノール樹脂をクラフト紙に含浸、予
備乾燥させた後、固形分５０Ｗｔ４ｆ７）ブチラール変
性フェノール樹脂をロールコータ−で塗布し乾燥し°Ｃ
１１６０”Ｃで【Ｏ分間加熱時の揮発分２．５壬、樹脂
付着分４８ｗ ｔ ’ｌｒの塗工紙を得た。これを塗工
紙Ｂとする。Next, kraft paper was impregnated with tung oil-modified phenolic resin and pre-dried, and then coated with butyral-modified phenolic resin with a solid content of 50 Wt4f7) using a roll coater and dried at °C.
A coated paper with a volatile content of 2.5 liters and a resin adhesion content of 48 wt'lr upon heating at 1160"C for 0 minutes was obtained. This is referred to as coated paper B.
塗工紙Ａを７プライと接着剤なしの３５μ厚銅箔との間
に塗工紙Ｂをｌプライを介在させ、１６０°Ｃ，１ｏＯ
ｋｙｆ／７の条件にて６０分加熱加圧して厚８１．６
ｗｍの片面銅張り積層板を得た。その性能を第１表に示
す。1 ply of coated paper B was interposed between 7 plies of coated paper A and 35μ thick copper foil without adhesive, and heated at 160°C at 1oO.
Heat and pressurize for 60 minutes under the conditions of kyf/7 to obtain a thickness of 81.6
A single-sided copper-clad laminate of wm was obtained. Its performance is shown in Table 1.
比較例１
実施例１で得た塗工紙Ａを８プライの片面に接着剤なし
３５μ厚の銅箔を重ね、実施例１と同条件で成形し厚さ
１．６簡の片面銅張り積層板を得た。その性能を第１表
に示す。Comparative Example 1 Coated paper A obtained in Example 1 was layered with 35μ thick copper foil without adhesive on one side of 8 plies, and molded under the same conditions as Example 1 to form a single-sided copper-clad laminate with a thickness of 1.6 sheets. Got the board. Its performance is shown in Table 1.
比較例２
実施例１で得た塗工紙Ａを８プライの片面に接着剤（ブ
チラール変性フェノール樹脂）付き３５μ厚の銅箔を重
ね、実施例１と同条件で成形し厚さ１．６ｍの片面銅張
り積層板を得た。その性能を第１表に示す。Comparative Example 2 Coated paper A obtained in Example 1 was layered with 35μ thick copper foil coated with adhesive (butyral modified phenol resin) on one side of 8 plies, and molded under the same conditions as Example 1 to a thickness of 1.6 m. A single-sided copper-clad laminate was obtained. Its performance is shown in Table 1.
第［表
発明の効果
本発明による金属箔張り積層板は、フェノール樹脂を基
材に含浸、乾燥させて得た塗工紙の主層と接着剤なし金
属箔との間に、フェノール樹脂を含浸、予備乾燥させた
後ブチラール変性フェノール樹脂を塗布し乾燥させて得
た塗工紙を介在させることにより、接着剤付金属箔を用
いる場合と同等かそれ以上に特性を向上することができ
た。接着剤なしの金属箔を用いるので、金属箔がカール
することはなく、塗工紙と金属箔の組込み作業を能率よ
く行なえ、生産性を低下させることはない。また、ブチ
ラール変性フェノール樹脂を塗工した塗工紙の製造は、
必要量だけを簡単に製造できるので、可使期間の管理も
容易になるなど、その工業的価値は大である。Table 1 [Effects of the Invention The metal foil-clad laminate according to the present invention has a phenol resin impregnated between the main layer of coated paper obtained by impregnating a base material with a phenol resin and drying it, and the adhesive-free metal foil. By interposing a coated paper obtained by pre-drying, coating with butyral-modified phenol resin and drying, it was possible to improve the properties to the same level or better than when using adhesive-coated metal foil. Since the metal foil is used without adhesive, the metal foil does not curl, and the work of assembling the coated paper and the metal foil can be carried out efficiently without reducing productivity. In addition, the production of coated paper coated with butyral-modified phenolic resin,
It has great industrial value, as it can be easily manufactured in only the required amount, making it easier to manage its shelf life.
Claims (1)
は片面に金属箔を載置して積層成形する積層板の製造に
おいて、フェノール樹脂を含浸、予備乾燥した後ブチラ
ール変性フェノール樹脂を塗布、乾燥させた基材の層を
、前記主層と金属箔の間に介在させることを特徴とする
金属箔張り積層板の製造法。In the production of laminates in which metal foil is placed on both sides or one side of the main layer consisting of a base material impregnated with phenolic resin and then laminated, the laminate is impregnated with phenolic resin and pre-dried, then coated with butyral-modified phenolic resin and dried. A method for producing a metal foil-clad laminate, comprising interposing a layer of a base material between the main layer and the metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26464385A JPS62124938A (en) | 1985-11-25 | 1985-11-25 | Manufacture of metallic-foil lined laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26464385A JPS62124938A (en) | 1985-11-25 | 1985-11-25 | Manufacture of metallic-foil lined laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62124938A true JPS62124938A (en) | 1987-06-06 |
| JPH0531466B2 JPH0531466B2 (en) | 1993-05-12 |
Family
ID=17406201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26464385A Granted JPS62124938A (en) | 1985-11-25 | 1985-11-25 | Manufacture of metallic-foil lined laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62124938A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56156A (en) * | 1979-06-15 | 1981-01-06 | Matsushita Electric Works Ltd | Copper lined phenol resin laminated board |
| JPS5624158A (en) * | 1979-08-07 | 1981-03-07 | Mitsubishi Gas Chemical Co | Manufacture of copper pasted paper phenol laminated board |
-
1985
- 1985-11-25 JP JP26464385A patent/JPS62124938A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56156A (en) * | 1979-06-15 | 1981-01-06 | Matsushita Electric Works Ltd | Copper lined phenol resin laminated board |
| JPS5624158A (en) * | 1979-08-07 | 1981-03-07 | Mitsubishi Gas Chemical Co | Manufacture of copper pasted paper phenol laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0531466B2 (en) | 1993-05-12 |
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