JPH0221747U - - Google Patents

Info

Publication number
JPH0221747U
JPH0221747U JP9943188U JP9943188U JPH0221747U JP H0221747 U JPH0221747 U JP H0221747U JP 9943188 U JP9943188 U JP 9943188U JP 9943188 U JP9943188 U JP 9943188U JP H0221747 U JPH0221747 U JP H0221747U
Authority
JP
Japan
Prior art keywords
semiconductor chip
cylindrical member
surrounded
insulating material
member made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9943188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9943188U priority Critical patent/JPH0221747U/ja
Publication of JPH0221747U publication Critical patent/JPH0221747U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
図面はいずれも本考案の一実施例を示し、第1
図は正面図で第2図は平面図である。また、第3
図は筒状部材の斜視図である。 1……基板、2……筒状部材、3……導電パタ
ーン、4……樹脂。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板上に装着されている半導体チツプの樹脂モ
    ールドにおいて、 前記半導体チツプは、絶縁性物質にて形成され
    ている筒状部材にて囲繞され、当該筒状部材内に
    樹脂が充填されていることを特徴とする半導体チ
    ツプの樹脂モールド。
JP9943188U 1988-07-27 1988-07-27 Pending JPH0221747U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9943188U JPH0221747U (ja) 1988-07-27 1988-07-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9943188U JPH0221747U (ja) 1988-07-27 1988-07-27

Publications (1)

Publication Number Publication Date
JPH0221747U true JPH0221747U (ja) 1990-02-14

Family

ID=31326585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9943188U Pending JPH0221747U (ja) 1988-07-27 1988-07-27

Country Status (1)

Country Link
JP (1) JPH0221747U (ja)

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