JPH02206544A - Composite panel enhanced in vibration-damping and sound-insulating performance - Google Patents
Composite panel enhanced in vibration-damping and sound-insulating performanceInfo
- Publication number
- JPH02206544A JPH02206544A JP1026750A JP2675089A JPH02206544A JP H02206544 A JPH02206544 A JP H02206544A JP 1026750 A JP1026750 A JP 1026750A JP 2675089 A JP2675089 A JP 2675089A JP H02206544 A JPH02206544 A JP H02206544A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- polyester resin
- modified polyester
- stainless steel
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 18
- 238000013016 damping Methods 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229920001225 polyester resin Polymers 0.000 claims abstract description 13
- 239000004645 polyester resin Substances 0.000 claims abstract description 13
- 238000009413 insulation Methods 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 16
- 239000010935 stainless steel Substances 0.000 abstract description 16
- 239000000853 adhesive Substances 0.000 abstract description 11
- 230000001070 adhesive effect Effects 0.000 abstract description 11
- 239000004566 building material Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000000155 melt Substances 0.000 abstract description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 2
- INDXRDWMTVLQID-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO.OCCCCO INDXRDWMTVLQID-UHFFFAOYSA-N 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 235000014113 dietary fatty acids Nutrition 0.000 abstract 1
- 229930195729 fatty acid Natural products 0.000 abstract 1
- 239000000194 fatty acid Substances 0.000 abstract 1
- 150000004665 fatty acids Chemical class 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Building Environments (AREA)
- Roof Covering Using Slabs Or Stiff Sheets (AREA)
- Laminated Bodies (AREA)
- Soundproofing, Sound Blocking, And Sound Damping (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
内、外装材および屋根材として使用する建材に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) This invention relates to building materials used as interior, exterior and roofing materials.
（従来の技術）
屋根用金属板として耐食性、強度ならびに経済性を改善
するため銅または鉛とステンレス鋼板あるいは鉄板のよ
うに展延差の大きい金属同志を接着剤で接着させたもの
はある。但し、接着剤は特定されていない（特開昭６０
−１１２９５７号公報参照）。(Prior Art) In order to improve corrosion resistance, strength, and economical efficiency, there are metal plates for roofs made by bonding together metals with a large spread difference, such as copper or lead and stainless steel plates or iron plates, with an adhesive. However, the adhesive is not specified (Japanese Unexamined Patent Publication No. 1983
(Refer to Publication No.-112957).
又、鉛とステンレス鋼板または鉄板との接着剤は多々考
えられているが、例えば、エポキシ樹脂系接着剤で鉛板
とステンレス鋼板を重合した複合板は振動減衰比が大き
くなり難く、複合板の曲げ振動等の振れに伴って接着剤
層にずり変形を生じさせてしまい、複合板の振動減衰比
を高めるとともに鉛板とステンレス鋼板、又は鉄板とを
強固に接着する接着剤に適切なものがなかった。In addition, many adhesives for lead and stainless steel plates or iron plates have been considered, but for example, a composite plate made by polymerizing a lead plate and a stainless steel plate with an epoxy resin adhesive has a vibration damping ratio that is difficult to increase. Shear deformation occurs in the adhesive layer due to deflection such as bending vibration, and it is necessary to use an appropriate adhesive to increase the vibration damping ratio of the composite plate and firmly bond the lead plate and stainless steel plate or iron plate. There wasn't.
（発明が解決しようとする問題点）
この発明は、上記の従来技術の問題点である振動減衰比
が小であるものを振動減衰比（制振性能）を大にすると
ともに、密度大の鉛を使用することにより遮音性能をも
大にした複合板を得ることである。この複合板の振動時
において減衰比を大きくするにはヤング率を高める必要
があり、このためステンレス鋼板等の金属板の使用が望
ましく、更に遮音性能を大きくするために密度の大きい
鉛板の使用が望まれ、これらを重合接着して建材として
使用できるような特殊な合成樹脂接着剤を開発したもの
である。(Problems to be Solved by the Invention) This invention aims to increase the vibration damping ratio (vibration damping performance) of the problem of the prior art described above, which is a low vibration damping ratio, and to By using this method, a composite board with improved sound insulation performance can be obtained. In order to increase the damping ratio when this composite plate vibrates, it is necessary to increase the Young's modulus, so it is desirable to use a metal plate such as a stainless steel plate, and to further increase the sound insulation performance, use a lead plate with a high density. We have developed a special synthetic resin adhesive that can be used as a building material by polymerizing and bonding these materials.
（問題点を解決するための手段）
そこで、この発明は、鉛板と金属板とを変性ポリエステ
ル樹脂層を介して重合接着した複合板を開発したもので
ある。(Means for Solving the Problems) Therefore, the present invention has developed a composite plate in which a lead plate and a metal plate are polymerized and bonded via a modified polyester resin layer.
（実施例）
以下、本発明の実施例を図面並びに表に基づいて詳細に
説明する。(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings and tables.
第１図は、本発明の複合板を分解したところを示すもの
で、鉛板１とステンレス鋼板等の金属板３を変性ポリエ
ステル樹脂層２を介して重合接着したものである。第２
図は部分的に円弧部を形成した複合板を示し、第３図は
端部を折り曲げたものを示す。FIG. 1 shows an exploded view of the composite plate of the present invention, in which a lead plate 1 and a metal plate 3 such as a stainless steel plate are polymerized and bonded via a modified polyester resin layer 2. Second
The figure shows a composite plate partially formed with arcuate portions, and FIG. 3 shows a composite plate with bent ends.
ここで、接着剤層として変性ポリエステル樹脂層が何故
に良いかを詳細に説明する。先ず、接着剤を説明する前
に、複合板として鉛板とステンレス鋼板等の金属板を利
用する理由を説明すると、板の振動時において、振動減
衰比を大きくするにはヤレグ率を高める必要がある。こ
のためにステンレス鋼板等の金属板が望ましい。Here, the reason why a modified polyester resin layer is good as an adhesive layer will be explained in detail. First, before explaining the adhesive, I will explain the reason why metal plates such as lead plates and stainless steel plates are used as composite plates.When the plate vibrates, it is necessary to increase the wear rate in order to increase the vibration damping ratio. be. For this purpose, a metal plate such as a stainless steel plate is desirable.
また、遮音性能を大にするには密度の大きい鉛板を使用
することが望ましい。更に、鉛板、ステンレス鋼板とも
耐食性がある。このために建材の複合板として、鉛板と
ステンレス鋼板等金属板とにより形成したものが望まれ
ていた。しかし、この鉛板とステンレス鋼板等金属板の
両方を接着し、建材使用温度範囲である一２０℃〜＋８
０℃の温度範囲で減衰比を大にする接着剤である合成樹
脂フィルムが見い出されていなかった。これを種々研究
し開発したのが本願発明で使用した変性ポリエステル樹
脂である。Additionally, in order to improve sound insulation performance, it is desirable to use lead plates with a high density. Furthermore, both lead plate and stainless steel plate have corrosion resistance. For this reason, there has been a desire for a composite board for building materials made of a lead plate and a metal plate such as a stainless steel plate. However, by bonding both the lead plate and the metal plate such as stainless steel plate, the temperature range for building materials is -20℃~+8℃.
No synthetic resin film has been found that is an adhesive that increases the damping ratio in the 0°C temperature range. The modified polyester resin used in the present invention was developed through various research.
それでは、この変性ポリエステル樹脂はどのような成分
で、どのように製造されるのかを以下に説明すると、先
ず、厚さについて述べれば、１００μ以下が望ましい。Now, what kind of ingredients are used in this modified polyester resin and how is it manufactured will be explained below. First, the thickness is preferably 100 μm or less.
これは樹脂層厚がｌＯＯμを越えると固有振動数（共振
振動数）が多くなり易いためである。This is because when the resin layer thickness exceeds lOOμ, the natural frequency (resonance frequency) tends to increase.
次に、この変性ポリエステル樹脂層について成分等説明
すると、熱可塑性ポリエステルのうち、二塩基性酸とし
てテレフタル酸とイソフタル酸と脂肪族二塩基性酸の混
合物（これらの比は、それぞれのモル％で約８０ ：
６０ ： ４０〜３０ ： １０ ： ５が望ましい）
および、グリコールとしてテトラメチレングリコール（
１４−ブタンジオール）を用いた生成物であり、かつ、
還元粘度が０．３〜０ 、９ ａｉｌ ／ ｇ、好まし
くは０．４〜０ 、８ ｔｅｌ ／ ｇ、および１９０
℃におけるメルトインデックス（ＭＩ）が３０〜５００
ｇ／１０分、好ましくは４０〜３００ ｇ ／ １０分
を有するものである。Next, to explain the components of this modified polyester resin layer, a mixture of terephthalic acid, isophthalic acid, and aliphatic dibasic acid as dibasic acids among thermoplastic polyesters (ratios of these are expressed in mol% of each). Approximately 80:
60:40~30:10:5 is desirable)
and tetramethylene glycol (
14-butanediol), and
Reduced viscosity of 0.3-0, 9 ail/g, preferably 0.4-0, 8 tel/g, and 190
Melt index (MI) at °C is 30-500
g/10 minutes, preferably 40 to 300 g/10 minutes.
ここで還元粘度は、ｍ−クレゾール溶媒中でポリエステ
ル濃度０．２５ｇ１０．２５准、４０℃で測定した値で
あり、又１９０℃におけるメルトインデックスはＪＩＳ
、に６７６０−１９７７に準じて測定した値である。Here, the reduced viscosity is the value measured at 40°C with a polyester concentration of 0.25g 10.25m in m-cresol solvent, and the melt index at 190°C is the JIS
, 6760-1977.
なお、上記の熱可塑性ポリエステルに対して、添加剤と
して、ポリエチレン、ポリプロピレン、エチレン−α−
オレフィン共重合体、エチレン−ビニルエステル共重合
体、ポリアミド、エポキシ樹脂、石油樹脂などの熱可塑
性樹脂あるいは炭酸カルシウム、酸化亜鉛、酸化チタン
、タルク、アルミナ、シリカ、ヒユームドシリカ、ガラ
ス繊維などの無機充填剤を特殊な変性ポリエステル樹脂
１００！ｉｆ量に対し、５０重量を越えない範囲の添加
も本発明の有用性を損なわない。In addition, polyethylene, polypropylene, ethylene-α-
Thermoplastic resins such as olefin copolymers, ethylene-vinyl ester copolymers, polyamides, epoxy resins, and petroleum resins, or inorganic fillers such as calcium carbonate, zinc oxide, titanium oxide, talc, alumina, silica, fumed silica, and glass fibers. 100% special modified polyester resin! The usefulness of the present invention is not impaired even if the amount added does not exceed 50% by weight based on the if amount.
そのほか、ジオクチルフタレート、Ｐ−オキシ安息香酸
、ｐ−トルエンスルホンアミドなどの可塑材、ヒンダー
ドフェノール系などの安定剤や有機アルコキシシランな
どの添加も可能である。In addition, it is also possible to add plasticizers such as dioctyl phthalate, p-oxybenzoic acid, and p-toluenesulfonamide, stabilizers such as hindered phenol, and organic alkoxysilane.
以上、説明してきた通り、変性ポリエステル樹脂は、エ
ステル結合と言う極性基を多量に有し、ｉ集力の強い接
着剤のため、接着強度が大である。更に加えて、エポキ
シ樹脂等、金属に対して密着性の良い樹脂を配合してあ
り、これらの相乗効果により強固に接着されるものであ
る。As explained above, modified polyester resin has a large amount of polar groups called ester bonds and is an adhesive with strong i-concentration, so it has high adhesive strength. In addition, resins such as epoxy resins that have good adhesion to metals are blended, and the synergistic effect of these resins provides strong adhesion.
又、この複合板の製造法は、表面をきれいにした鉛板お
よびステンレス鋼板（例えば、ＵＳＵ３０４）を１４０
℃に加熱後、本発明による特殊な変性ポリエステル樹脂
（フィルム厚１００μ以下）を挿入して熱間プレス機で
加熱温度１４０℃、加圧力２ ｋｇ ／ （！１１．加
圧時間２分間で本発明複合板を製作し、熱間プレス機よ
り取り出し放冷する。尚、熱間プレス機で製作するばか
りでなく、圧延機のロールによる圧着によって製作でき
るのは勿論である。In addition, this composite plate manufacturing method uses lead plates and stainless steel plates (for example, USU304) with a clean surface at 140°C.
After heating to ℃, a special modified polyester resin according to the present invention (film thickness 100μ or less) is inserted, and heated in a hot press at a temperature of 140℃ and a pressing force of 2 kg/(!11. Pressing time of 2 minutes) A composite plate is produced, taken out from a hot press machine, and allowed to cool.It goes without saying that it can be produced not only by a hot press machine, but also by crimping with the rolls of a rolling mill.
ここで１本発明例と従来のものとを比較してみると、幅
３０ｍ×長さ２５０講の試験片を採取し、測定条件によ
るバラツキの少ないインピーダンス法を使用して測定し
た損失係数を表に示す。Here, when comparing the example of the present invention and the conventional one, a test piece with a width of 30 m x a length of 250 mm was taken, and the loss coefficient was measured using the impedance method, which has less variation depending on the measurement conditions. Shown below.
〔表１〕
２０℃における ” ５００七尚、ステン
レス鋼など金属板としては、銅、アルミ、錫、鉄等、切
断、曲げ等の機械加工が可能なものであれば良いことは
いうまでもない。[Table 1] 500 at 20°C.It goes without saying that the metal plate, such as stainless steel, should be made of copper, aluminum, tin, iron, etc., as long as it can be machined by cutting, bending, etc. .
（発明の効果）
本発明は、以上説明したように、振動減衰比（制振作用
）が大で密度大の鉛板を使用することにより、遮音性能
が向上する他、Ｘ線の透過を防ぐことができ、更に耐食
性が良好であり、かつ、ステンレス鋼板等の金属板側に
任意の塗装が可能であり、しかも、切断、曲げ等の機械
加工性に富むので、内、外装材、又は屋根材など建材に
利用すると最適である（但し、合成樹脂フィルムは電気
絶縁性に富むので電気抵抗溶接は不可であることはいう
までもない）。(Effects of the Invention) As explained above, the present invention improves sound insulation performance and prevents the transmission of X-rays by using a lead plate with a high vibration damping ratio (damping effect) and high density. Furthermore, it has good corrosion resistance, and can be coated with any desired coating on the side of metal plates such as stainless steel plates.Moreover, it has excellent machinability such as cutting and bending, so it can be used for interior, exterior, or roofing materials. It is most suitable for use in building materials such as wood (however, it goes without saying that electric resistance welding is not possible since synthetic resin films have high electrical insulation properties).
第１図は、本発明に係る複合板を分解した斜視図、第２
図は、本発明に係る一部円弧状に形成した複合板の斜視
図、第３図は、本発明に係る端部を折り曲げて形成した
複合板の斜視図である。
図中 １・・・鉛板
２・・・変性ポリエステル樹脂
３・・・ステンレス鋼板等の金属板FIG. 1 is an exploded perspective view of a composite plate according to the present invention, and FIG.
The figure is a perspective view of a composite plate formed into a partially arcuate shape according to the present invention, and FIG. 3 is a perspective view of a composite plate formed by bending the end portion according to the present invention. In the diagram: 1...Lead plate 2...Modified polyester resin 3...Metal plate such as stainless steel plate
Claims (1)
た制振性能、遮音性能を高めた複合板。A composite board with improved vibration damping and sound insulation performance, made by bonding a lead plate and a metal plate via modified polyester resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1026750A JP2665966B2 (en) | 1989-02-07 | 1989-02-07 | Composite board with improved vibration suppression and sound insulation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1026750A JP2665966B2 (en) | 1989-02-07 | 1989-02-07 | Composite board with improved vibration suppression and sound insulation performance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02206544A true JPH02206544A (en) | 1990-08-16 |
| JP2665966B2 JP2665966B2 (en) | 1997-10-22 |
Family
ID=12201967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1026750A Expired - Fee Related JP2665966B2 (en) | 1989-02-07 | 1989-02-07 | Composite board with improved vibration suppression and sound insulation performance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2665966B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2148027A1 (en) * | 1997-04-15 | 2000-10-01 | Maquinaria Jumilla S L | Building roof stamped steel based construction element includes a fungicidal and fire resistant coating on intermediate epoxy polyester and e.g. marble layers |
| US8479876B2 (en) | 2010-06-16 | 2013-07-09 | Shiloh Industries, Inc. | Sound damping patch |
-
1989
- 1989-02-07 JP JP1026750A patent/JP2665966B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2148027A1 (en) * | 1997-04-15 | 2000-10-01 | Maquinaria Jumilla S L | Building roof stamped steel based construction element includes a fungicidal and fire resistant coating on intermediate epoxy polyester and e.g. marble layers |
| US8479876B2 (en) | 2010-06-16 | 2013-07-09 | Shiloh Industries, Inc. | Sound damping patch |
| JP2013535030A (en) * | 2010-06-16 | 2013-09-09 | シロー インダストリーズ インコーポレイテッド | Sound attenuation patch |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2665966B2 (en) | 1997-10-22 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |