JPH0219994B2 - - Google Patents

Info

Publication number: JPH0219994B2
Authority: JP; Japan
Prior art keywords: copper foil; zinc; layer; copper; base material
Prior art date: 1982-08-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP13529982A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5925297A (ja

Inventor

Takeshi Yamagishi

Masayoshi Ando

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nippon Denkai Co Ltd

Original Assignee

Nippon Denkai Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-08-03

Filing date

1982-08-03

Publication date

1990-05-07

1982-08-03 Application filed by Nippon Denkai Co Ltd filed Critical Nippon Denkai Co Ltd

1982-08-03 Priority to JP13529982A priority Critical patent/JPS5925297A/ja

1984-02-09 Publication of JPS5925297A publication Critical patent/JPS5925297A/ja

1990-05-07 Publication of JPH0219994B2 publication Critical patent/JPH0219994B2/ja

Status Granted legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 84
239000011889 copper foil Substances 0.000 claims description 71
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 24
229910052725 zinc Inorganic materials 0.000 claims description 24
239000011701 zinc Substances 0.000 claims description 24
ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 20
229910001297 Zn alloy Inorganic materials 0.000 claims description 10
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
229910052710 silicon Inorganic materials 0.000 claims description 4
239000003795 chemical substances by application Substances 0.000 claims description 2
125000000753 cycloalkyl group Chemical group 0.000 claims description 2
125000000524 functional group Chemical group 0.000 claims description 2
125000005647 linker group Chemical group 0.000 claims description 2
229920000642 polymer Polymers 0.000 claims description 2
239000000463 material Substances 0.000 description 23
239000010409 thin film Substances 0.000 description 14
229910052802 copper Inorganic materials 0.000 description 12
239000010949 copper Substances 0.000 description 12
239000010408 film Substances 0.000 description 11
239000006087 Silane Coupling Agent Substances 0.000 description 10
238000010438 heat treatment Methods 0.000 description 10
229910052751 metal Inorganic materials 0.000 description 8
239000002184 metal Substances 0.000 description 8
229910045601 alloy Inorganic materials 0.000 description 7
239000000956 alloy Substances 0.000 description 7
238000004070 electrodeposition Methods 0.000 description 7
238000007747 plating Methods 0.000 description 6
239000000243 solution Substances 0.000 description 6
229910000881 Cu alloy Inorganic materials 0.000 description 5
239000007864 aqueous solution Substances 0.000 description 5
239000007822 coupling agent Substances 0.000 description 5
230000000694 effects Effects 0.000 description 5
JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 4
TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 4
238000000034 method Methods 0.000 description 4
238000007788 roughening Methods 0.000 description 4
229910001369 Brass Inorganic materials 0.000 description 3
229910001128 Sn alloy Inorganic materials 0.000 description 3
239000010951 brass Substances 0.000 description 3
238000003475 lamination Methods 0.000 description 3
GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 3
WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 2
238000007796 conventional method Methods 0.000 description 2
229910000365 copper sulfate Inorganic materials 0.000 description 2
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
229910052738 indium Inorganic materials 0.000 description 2
APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
238000003825 pressing Methods 0.000 description 2
NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
229910000368 zinc sulfate Inorganic materials 0.000 description 2
229960001763 zinc sulfate Drugs 0.000 description 2
OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
108010010803 Gelatin Proteins 0.000 description 1
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
235000019270 ammonium chloride Nutrition 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
229910052793 cadmium Inorganic materials 0.000 description 1
BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
229910052804 chromium Inorganic materials 0.000 description 1
239000011651 chromium Substances 0.000 description 1
229940117975 chromium trioxide Drugs 0.000 description 1
WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
230000008878 coupling Effects 0.000 description 1
238000010168 coupling process Methods 0.000 description 1
238000005859 coupling reaction Methods 0.000 description 1
230000007812 deficiency Effects 0.000 description 1
238000007598 dipping method Methods 0.000 description 1
238000001035 drying Methods 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
239000004744 fabric Substances 0.000 description 1
238000005246 galvanizing Methods 0.000 description 1
229920000159 gelatin Polymers 0.000 description 1
239000008273 gelatin Substances 0.000 description 1
235000019322 gelatine Nutrition 0.000 description 1
235000011852 gelatine desserts Nutrition 0.000 description 1
239000011521 glass Substances 0.000 description 1
229910052749 magnesium Inorganic materials 0.000 description 1
239000011777 magnesium Substances 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
238000012545 processing Methods 0.000 description 1
238000011160 research Methods 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
238000003860 storage Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
239000000758 substrate Substances 0.000 description 1
229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
239000010936 titanium Substances 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1
BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
238000001771 vacuum deposition Methods 0.000 description 1
239000011667 zinc carbonate Substances 0.000 description 1
229910000010 zinc carbonate Inorganic materials 0.000 description 1
235000004416 zinc carbonate Nutrition 0.000 description 1
GTLDTDOJJJZVBW-UHFFFAOYSA-N zinc cyanide Chemical compound [Zn+2].N#[C-].N#[C-] GTLDTDOJJJZVBW-UHFFFAOYSA-N 0.000 description 1
239000011787 zinc oxide Substances 0.000 description 1

Landscapes

Parts Printed On Printed Circuit Boards (AREA)
Laminated Bodies (AREA)
Manufacturing Of Printed Wiring (AREA)

JP13529982A 1982-08-03 1982-08-03 印刷回路用銅箔 Granted JPS5925297A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP13529982A JPS5925297A (ja)	1982-08-03	1982-08-03	印刷回路用銅箔

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP13529982A JPS5925297A (ja)	1982-08-03	1982-08-03	印刷回路用銅箔

Publications (2)

Publication Number	Publication Date
JPS5925297A JPS5925297A (ja)	1984-02-09
JPH0219994B2 true JPH0219994B2 (zh)	1990-05-07

Family

ID=15148453

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP13529982A Granted JPS5925297A (ja)	1982-08-03	1982-08-03	印刷回路用銅箔

Country Status (1)

Country	Link
JP (1)	JPS5925297A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005262506A (ja) *	2004-03-16	2005-09-29	Mitsui Mining & Smelting Co Ltd	絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
WO2010038531A1 (ja) *	2008-09-30	2010-04-08	イビデン株式会社	多層プリント配線板、及び、多層プリント配線板の製造方法
WO2010038532A1 (ja) *	2008-09-30	2010-04-08	イビデン株式会社	多層プリント配線板、及び、多層プリント配線板の製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5071520A (en) *	1989-10-30	1991-12-10	Olin Corporation	Method of treating metal foil to improve peel strength
US5622782A (en) *	1993-04-27	1997-04-22	Gould Inc.	Foil with adhesion promoting layer derived from silane mixture
JP4986060B2 (ja) *	2005-06-23	2012-07-25	Ｊｘ日鉱日石金属株式会社	プリント配線板用銅箔
JP4460026B2 (ja) *	2007-11-14	2010-05-12	日鉱金属株式会社	抵抗膜層を備えた銅箔
JP5885054B2 (ja) *	2010-04-06	2016-03-15	福田金属箔粉工業株式会社	銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。

1982
- 1982-08-03 JP JP13529982A patent/JPS5925297A/ja active Granted

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005262506A (ja) *	2004-03-16	2005-09-29	Mitsui Mining & Smelting Co Ltd	絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
JP4570070B2 (ja) *	2004-03-16	2010-10-27	三井金属鉱業株式会社	絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
WO2010038531A1 (ja) *	2008-09-30	2010-04-08	イビデン株式会社	多層プリント配線板、及び、多層プリント配線板の製造方法
WO2010038532A1 (ja) *	2008-09-30	2010-04-08	イビデン株式会社	多層プリント配線板、及び、多層プリント配線板の製造方法
JP2012109631A (ja) *	2008-09-30	2012-06-07	Ibiden Co Ltd	多層プリント配線板、及び、多層プリント配線板の製造方法
JP4951674B2 (ja) *	2008-09-30	2012-06-13	イビデン株式会社	多層プリント配線板、及び、多層プリント配線板の製造方法
JP5033192B2 (ja) *	2008-09-30	2012-09-26	イビデン株式会社	多層プリント配線板、及び、多層プリント配線板の製造方法

Also Published As

Publication number	Publication date
JPS5925297A (ja)	1984-02-09

Publication	Publication Date	Title
KR900000865B1 (ko)	1990-02-17	구리-크롬-폴리이미드 복합체 및 그의 제조방법
US4387006A (en)	1983-06-07	Method of treating the surface of the copper foil used in printed wire boards
JP4626390B2 (ja)	2011-02-09	環境保護を配慮したプリント配線板用銅箔
CN102165104B (zh)	2013-07-24	表面处理铜箔及镀铜层压板
JP2620151B2 (ja)	1997-06-11	印刷回路用銅箔
JPH0329879B2 (zh)	1991-04-25
US5322975A (en)	1994-06-21	Universal carrier supported thin copper line
JP5505828B2 (ja)	2014-05-28	複合金属箔及びその製造方法
US5762778A (en)	1998-06-09	Non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath
EP3882378B1 (en)	2024-07-17	Surface-treated copper foil for high-frequency circuit and method for producing the same
US4061837A (en)	1977-12-06	Plastic-metal composite and method of making the same
JP2920083B2 (ja)	1999-07-19	印刷回路用銅箔及びその製造方法
US4311768A (en)	1982-01-19	Printed circuit board having mutually etchable copper and nickel layers
JPH0219994B2 (zh)	1990-05-07
KR100575100B1 (ko)	2006-04-28	고온내열용 캐리어박 구비 전해동박의 제조방법
JPH08222857A (ja)	1996-08-30	銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板
JP2717910B2 (ja)	1998-02-25	印刷回路用銅箔及びその製造方法
JP2006028635A (ja)	2006-02-02	微細回路基板用表面処理銅箔の製造方法及びその銅箔
JP4391449B2 (ja)	2009-12-24	キャリア付き極薄銅箔及びプリント配線基板
JP2501842B2 (ja)	1996-05-29	印刷配線板の製法
JP2875186B2 (ja)	1999-03-24	印刷回路用銅箔の処理方法
US20140308538A1 (en)	2014-10-16	Surface treated aluminum foil for electronic circuits
JPH10226009A (ja)	1998-08-25	プリント配線板用銅箔及びその製造方法
JP2684164B2 (ja)	1997-12-03	印刷回路用銅箔の表面処理方法
JP2006159632A (ja)	2006-06-22	銅メタライズド積層板及びその製造方法