JPH02170609A - Multilayer printed filter for electric circuit and its manufacture - Google Patents
Multilayer printed filter for electric circuit and its manufactureInfo
- Publication number
- JPH02170609A JPH02170609A JP32562888A JP32562888A JPH02170609A JP H02170609 A JPH02170609 A JP H02170609A JP 32562888 A JP32562888 A JP 32562888A JP 32562888 A JP32562888 A JP 32562888A JP H02170609 A JPH02170609 A JP H02170609A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- capacitor
- coil
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000003990 capacitor Substances 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000005245 sintering Methods 0.000 claims abstract description 45
- 238000007639 printing Methods 0.000 claims abstract description 27
- 238000010304 firing Methods 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 16
- 239000003989 dielectric material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000000696 magnetic material Substances 0.000 claims description 8
- 230000008602 contraction Effects 0.000 abstract description 3
- 230000005684 electric field Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 148
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 238000001354 calcination Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気回路用多層印刷フィルタ及びその製造方法
に関し、詳しくは製造時の表面亀裂や内部断線の発生を
防止した電気回路用多層印刷フィルタ及びその製造方法
に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a multilayer printed filter for electric circuits and a method for manufacturing the same, and more specifically, a multilayer printed filter for electric circuits that prevents surface cracks and internal disconnections during manufacturing. and its manufacturing method.
電気回路用多層印刷フィルタとして、誘電体又は磁性体
からなる基板の片面に、所定パターンの導体層と誘電体
層とを交互に印刷してコンデンサ層を形成するとともに
、基板の他面に所定パターンの導体層と磁性体層とを交
互に印刷してコイル層を形成し、このコンデンサ層とコ
イル層とを基板を介して接続したものが知られている。As a multilayer printed filter for electric circuits, a capacitor layer is formed by alternately printing conductive layers and dielectric layers with a predetermined pattern on one side of a substrate made of dielectric or magnetic material, and a predetermined pattern on the other side of the substrate. It is known that a coil layer is formed by alternately printing conductor layers and magnetic layers, and the capacitor layer and coil layer are connected via a substrate.
この従来の電気回路用多層印刷フィルタは、コイル層と
コンデンサ層とを基板面の両面に直接、あるいは各層間
に中間層を設けて印刷積層した後に、全体を所定の温度
に加熱して一体焼成していた。This conventional multilayer printed filter for electric circuits is made by printing and laminating the coil layer and capacitor layer directly on both sides of the substrate surface or by providing an intermediate layer between each layer, and then heating the whole to a predetermined temperature and firing it as a unit. Was.
しかしながら、上記誘電体と磁性体は、それぞれ材料成
分が異なるため、最適焼結温度も焼結時の収縮率も異な
るものである。そのため、両者を基板の両面に積層した
後に一体焼成を行うと、磁性体と誘電体との最適焼結温
度の差や、焼結時の収縮率の差により、表面に亀裂が発
生したり、コイル層内部に断線が発生することがあった
。また、それぞれに種々の材料を添加し、電気的特性を
損わずに両者の物理的特性を揃えようとしても、やはり
表面亀裂やコイルの内部断線等が発生しがちであった。However, since the dielectric material and the magnetic material have different material components, the optimum sintering temperature and the shrinkage rate during sintering are also different. Therefore, if the two are laminated on both sides of the substrate and then fired together, cracks may occur on the surface due to the difference in the optimal sintering temperature between the magnetic material and the dielectric material, and the difference in shrinkage rate during sintering. Disconnection sometimes occurred inside the coil layer. Furthermore, even if various materials were added to each to make the physical properties of the two similar without impairing the electrical properties, surface cracks and internal disconnection of the coil tended to occur.
そこで本発明は、上記焼成時の表面亀裂や内部断線を防
ＩＦすることのできる電気回路用多層印刷フィルタ及び
その製造方法を提供することを目的としている。Therefore, an object of the present invention is to provide a multilayer printed filter for electric circuits that can prevent surface cracks and internal disconnections during firing as described above, and a method for manufacturing the same.
上記目的を達成するために、本発明の電気回路用多層印
刷フィルタ及びその製造方法は、誘電体又は磁性体等か
らなる基板と、該基板の片面に導体層と誘電体層とを交
互に印刷して焼成されたコンデンサ層と、該基板の他面
に導体層と磁性体層とを交互に印刷して焼成されたコイ
ル層とを有し、コンデンサ層とコイル層とを基板を介し
て接続した電気回路用多層印刷フィルタにおいて、前記
誘電体層と磁性体層の焼結温度の高い順に印刷焼成して
コンデンサ層及びコイル層を形成したことを特徴とする
電気回路用多層印刷フィルタ、あるいは誘電体からなる
グリーンシートの片面に、前記誘電体層と磁性体層のい
ずれか焼結温度の高い層を印刷し、該層とグリーンシー
トとを同時に焼成してコンデンサ層あるいはコイル層を
形成するとともに前記グリーンシートを基板と成し、さ
らに、この基板の他面にいずれか焼結温度の低い層を印
刷して焼成し、コイル層あるいはコンデンサ層を形成し
たことを特徴とする電気回路用多層印刷フィルタを提供
するもので、さらに前記コイル層とコンデンサ層は、基
板内スルーホール接続と端面接続とを併用して接続され
ていることを特徴としている。In order to achieve the above object, the multilayer printed filter for electric circuits and the manufacturing method thereof of the present invention include a substrate made of a dielectric or magnetic material, and conductor layers and dielectric layers alternately printed on one side of the substrate. A capacitor layer is formed by printing a conductor layer and a magnetic layer alternately on the other surface of the substrate, and a coil layer is formed by printing and firing the capacitor layer. A multilayer printed filter for electrical circuits, characterized in that a capacitor layer and a coil layer are formed by printing and firing the dielectric layer and the magnetic layer in the order of the sintering temperature, or the dielectric layer. Printing either the dielectric layer or the magnetic layer, which has a higher sintering temperature, on one side of the green sheet consisting of the body, and simultaneously firing the layer and the green sheet to form a capacitor layer or a coil layer. Multilayer printing for electric circuits, characterized in that the green sheet is used as a substrate, and a layer having a lower sintering temperature is printed on the other surface of the substrate and then fired to form a coil layer or a capacitor layer. The present invention provides a filter, and is further characterized in that the coil layer and the capacitor layer are connected using both an in-board through-hole connection and an end surface connection.
また本発明の電気回路用多層印刷フィルタの製造方法は
、基板の片面に前記誘電体層と磁性体層のいずれか焼結
温度の高い層の印刷を行って焼成し、次いで基板の他面
にいずれか焼結温度の低い層の印刷を行って焼成するこ
と、あるいは誘電体からなるグリーンシートの片面に、
前記誘電体層と磁性体層のいずれか焼結温度の高い層の
印刷を行い、該層とグリーンシートとを同時に焼成して
グリーンシートを基板と成し、次いで、この基板の他面
にいずれか焼結温度の低い層の印刷を行って焼成するこ
とを特徴とするもので、さらに前記コイル層とコンデン
サ層を、基板内スルーホール接続と端面接続とを併用し
て接続することを特徴とするものである。Further, the method for manufacturing a multilayer printed filter for electric circuits of the present invention includes printing and firing either the dielectric layer or the magnetic layer, which has a higher sintering temperature, on one side of the substrate, and then printing the layer on the other side of the substrate. Either a layer with a low sintering temperature is printed and fired, or one side of a dielectric green sheet is printed.
Either the dielectric layer or the magnetic layer, which has a higher sintering temperature, is printed, the layer and the green sheet are simultaneously fired to form the green sheet as a substrate, and then a layer is printed on the other side of the substrate. The method is characterized in that a layer with a low calcination temperature is printed and fired, and further characterized in that the coil layer and the capacitor layer are connected using a combination of through-hole connection in the substrate and end surface connection. It is something to do.
上記のごとく、誘電体層と磁性体層のいずれか焼結温度
の高い順にコンデンサ層及びコイル層を形成することに
より、コンデンサ層とコイル層とを最適焼結温度で焼成
することができ、亀裂や断線等の無い、各層それぞれの
本来め特性を生かした電気回路用多層印刷フィルタを得
ることができる。As described above, by forming the capacitor layer and the coil layer in the order of the dielectric layer or the magnetic layer having the highest sintering temperature, the capacitor layer and the coil layer can be fired at the optimum sintering temperature, and cracks may occur. It is possible to obtain a multilayer printed filter for electric circuits that is free from wire breakage and disconnection, and which takes advantage of the original characteristics of each layer.
また上記方法により電気回路用ｒ層印刷フィルタを製造
することにより、低い焼結温度を持つ層が高温に晒され
ることがなくなり、亀裂や変形を防止することができる
。Furthermore, by manufacturing the R-layer printed filter for electric circuits by the above method, the layer having a low sintering temperature is not exposed to high temperatures, and cracking and deformation can be prevented.
さらに誘導体からなるグリーンシートを用いることによ
り、グリーンシートの焼成を焼結温度の高い層の焼成と
同時に行うことができ、焼成後の基板とコンデンサ層及
びコイル層との密着性を向上させることができる。Furthermore, by using a green sheet made of a derivative, the green sheet can be fired at the same time as the layer with a high sintering temperature, and the adhesion between the substrate and the capacitor layer and coil layer after firing can be improved. can.
加えて、両層を基板内スルーホール接続と端面接続とを
併用して接続することにより、各種、＜ターンのフィル
タを容易に得ることができる。In addition, by connecting both layers using a combination of in-substrate through-hole connection and end surface connection, various <turn filters can be easily obtained.
［実施例〕
以下、本発明を図面に示す実施例に基づいてさらに詳細
に説明する。[Example] Hereinafter, the present invention will be explained in more detail based on an example shown in the drawings.
まず第１図乃至第４図において、電気回路用多層印刷フ
ィルタ（以下、単にフィルタという）１は、第１図に示
すように、誘電体又は磁性体よりなる基板２と、該基板
２の片面に多層印刷してなるコンデンサ層３と、基板２
の他面に多層印刷してなるコイル層４と、両層３，４を
端面接続する前記フィルタ１の両端に設けた断面略半円
形のスルーホール５，６，７，８．９と、各スルーホー
ル５，６，７，８．９に連設する前記コンデンサ層３上
面に設けられた端子電極１０．１１，１２゜１３．１４
とから構成される。First, in FIGS. 1 to 4, a multilayer printed filter for electric circuits (hereinafter simply referred to as a filter) 1 consists of a substrate 2 made of a dielectric or magnetic material, and one side of the substrate 2. A capacitor layer 3 formed by multilayer printing on a substrate 2
A coil layer 4 formed by multilayer printing on the other side, through holes 5, 6, 7, 8.9 with a substantially semicircular cross section provided at both ends of the filter 1 connecting both layers 3 and 4 at their end faces, and Terminal electrodes 10.11, 12°13.14 provided on the upper surface of the capacitor layer 3 connected to the through holes 5, 6, 7, 8.9
It consists of
前記コンデンサ層３は、導体層である所定の容量を得る
ための複数の電極層と、該電極層を接続するピアホール
を設けた所定の誘電率の誘電体層とを交互に多層印刷し
て形成される。また前記コイル層４は、導体層である複
数のコイルパターン層と、該コイルパターン層を接続す
るピアホールを設けた磁性体層とを交互多層に印刷して
形成される。The capacitor layer 3 is formed by alternately printing a plurality of electrode layers, which are conductor layers, to obtain a predetermined capacitance, and a dielectric layer having a predetermined dielectric constant and having a peer hole connecting the electrode layers. be done. Further, the coil layer 4 is formed by printing a plurality of coil pattern layers, which are conductor layers, and a magnetic layer having peer holes connecting the coil pattern layers in an alternating multilayer manner.
尚、上記導体層としては、従来と同様のＡｇ−Ｐｄ等の
耐熱金属粉を適宜なバインダーによりペースト状にした
ものを用いることができ、磁性体層としては、フェライ
ト等の磁性酸２化物の粉末を、また誘電体層としては、
Ｔ ｉ ０２やＢａ３０４等のセラミックの粉末を、そ
れぞれ適宜なバインダーによりペースト状にしたものを
用いることができる。さらに上記各層の印刷は、通常の
この種のフィルタの製造に採用されている印刷法により
行うことができる。The conductor layer may be made of heat-resistant metal powder such as Ag-Pd made into a paste with an appropriate binder, and the magnetic layer may be made of a magnetic oxide dioxide such as ferrite. Powder and dielectric layer:
Ceramic powders such as T i 02 and Ba304 can be made into a paste with an appropriate binder. Furthermore, printing of each of the above-mentioned layers can be performed by a printing method that is normally employed in manufacturing this type of filter.
前記スルーホールの配置は、前記フィルタ１の一端にス
ルーホール５．６．７が、他端にスルーホール８．９が
それぞれ配されており、また各端子電極も端子電極ｉｏ
、１１．１２がそれぞれスルーホール５．６．７に隣接
し、端子電極１３゜１４がそれぞれスルーホール８．９
に隣接して設けられている。The arrangement of the through holes is such that a through hole 5.6.7 is placed at one end of the filter 1, and a through hole 8.9 is placed at the other end, and each terminal electrode is also arranged like a terminal electrode io.
, 11.12 are adjacent to the through holes 5, 6, 7, respectively, and the terminal electrodes 13, 14 are adjacent to the through holes 8, 9, respectively.
It is located adjacent to.
前記コンデンサ層３には、第２図に示すように、スルー
ホール５，８を結ぶ回路にコンデンサＣ１が、スルーホ
ール６．８を結ぶ回路にコンデンサＣ２が、スルーホー
ル６．９を結ぶ回路にコンデンサＣ３が、そしてスルー
ホール７．９を結ぶ回路にコンデンサＣ４がそれぞれ多
層印刷されている。In the capacitor layer 3, as shown in FIG. 2, a capacitor C1 is connected to a circuit connecting through holes 5 and 8, a capacitor C2 is connected to a circuit connecting through holes 6.8, and a capacitor C2 is connected to a circuit connecting through holes 6.9. A capacitor C3 and a capacitor C4 are printed in multiple layers on the circuit connecting the through hole 7.9.
また前記コイル層４には、第３図に示すように、スルー
ホール８，６．９より延びる回路にそれぞれＬ１．Ｌ２
．Ｌ３が多層印刷され内部で接続されている。Further, in the coil layer 4, as shown in FIG. 3, circuits extending from the through holes 8 and 6.9 are connected to L1. L2
．． L3 is multilayer printed and connected internally.
上記各コンデンサＣ１，Ｃ２，Ｃ３，Ｃ４及びコイルＬ
１．Ｌ２．Ｌ３は、各スルーホール５゜６，７，８．９
により基板２を介して接続される。Each of the above capacitors C1, C2, C3, C4 and coil L
1. L2. L3 is each through hole 5゜6, 7, 8.9
are connected via the board 2.
従って前記フィルタ１は、第４図に示すように、スルー
ホール６．５間の回路にコンデンサＣＩ。Therefore, as shown in FIG. 4, the filter 1 includes a capacitor CI in the circuit between the through holes 6.5.
Ｃ２を、スルーホール６．７間の回路にコンデンサＣ３
，Ｃ４を、またスルーホール６．８間の回路にコイルＬ
２とコイルＬ１を、スルーホール６゜９間の回路にコイ
ルＬ２とコイルＬ３を有する等鉦回路を備えることがで
きる。C2 and capacitor C3 in the circuit between through holes 6 and 7.
, C4, and coil L in the circuit between through holes 6.8.
2 and the coil L1, and an equal-angle circuit having the coil L2 and the coil L3 can be provided in the circuit between the through hole 6°9.
このように、基板２の両面にそれぞれ設けられたコンデ
ンサ層３とコイル層４とは、焼結温度の高い順に印刷及
び焼成が行われる。例えば、コンデンサ層３を形成する
誘電体層の焼結温度が約９５０℃であって、コイル層４
を形成する磁性体層の焼結温度が約８５０℃である場合
゛には、まず基板２の片面に焼結温度の高いコンデンサ
層３の導体層と誘電体層とを印刷して約９５０℃で焼結
を行い、該基板面にコンデンサ層３を形成する。その後
、コイル層４の導体層と磁性体層の印刷を行って、約８
５０℃で焼成する。これにより、焼結温度の低い磁性体
層が自身の最適焼結温度（約８５０℃）より高い温度（
約９５０℃）にまで加熱されることがなくなり、最適焼
結温度で焼成されるので、コイル層４が高い温度に晒さ
れることがなくなり、無理な膨張収縮に基因する亀裂の
発生や内部断線の発生を防止することができる。In this way, the capacitor layer 3 and the coil layer 4 provided on both sides of the substrate 2 are printed and fired in descending order of sintering temperature. For example, the sintering temperature of the dielectric layer forming the capacitor layer 3 is about 950°C, and the coil layer 4
If the sintering temperature of the magnetic layer forming the capacitor layer 3 is approximately 850°C, first print the conductor layer and dielectric layer of the capacitor layer 3, which have a high sintering temperature, on one side of the substrate 2 and sinter the magnetic layer at approximately 950°C. Sintering is performed to form a capacitor layer 3 on the substrate surface. After that, the conductor layer and magnetic layer of the coil layer 4 were printed, and the
Bake at 50°C. This allows the magnetic layer with a low sintering temperature to reach a temperature higher than its own optimum sintering temperature (approximately 850°C).
Since the coil layer 4 is no longer heated to a temperature of approximately 950°C and is fired at the optimum sintering temperature, the coil layer 4 is not exposed to high temperatures, which prevents cracks and internal disconnections caused by unreasonable expansion and contraction. Occurrence can be prevented.
逆に磁性体層の焼結温度が誘電体層の焼結温度よりも高
い場合には、コイル層４の焼成を先に行うことでコンデ
ンサ層３の亀裂や断線の発生を防止することができる。Conversely, if the sintering temperature of the magnetic layer is higher than the sintering temperature of the dielectric layer, it is possible to prevent cracks and disconnections in the capacitor layer 3 by firing the coil layer 4 first. .
即ち、フィルタ１の所定の性能を得るために最適な材料
により誘電体層と磁性体層とを形成し、それぞれを最適
焼結温度で焼成することができるので、それぞれの特性
を生かした優れたフィルタを得ることができ、亀裂や断
線の無いものを安定して製造することが可能となる。In other words, it is possible to form the dielectric layer and the magnetic layer using the most suitable materials in order to obtain the specified performance of the filter 1, and to sinter each of them at the optimum sintering temperature. It is possible to obtain filters and to stably manufacture filters without cracks or disconnections.
さらに基板２の素材として、誘電体材料の粉末と有機バ
インダーとの混合物からなる、いわゆるグリーンシート
を用い、該グリーンシートの片面に、前記誘電体層と磁
性体層のいずれか焼結温度の高い層の印刷を行い、核層
とグリーンシートとを同時に焼成してコンデンサ層３あ
るいはコイル層４を形成するとともにグリーンシートを
基板２と成し、次いで、この基板２の他面に焼結温度の
低い磁性体層あるいは誘電体層の印刷を行って焼成し、
コイル層４あるいはコンデンサ層３を形成することによ
り、基板２と両層３，４との焼成後の密着性や強度の向
上を図ることができる。このグリーンシートは、焼結温
度の高い層の焼結と同時に焼成されて基板２となるので
、グリーンシートのみの焼成を省略することができる。Furthermore, as the material for the substrate 2, a so-called green sheet made of a mixture of dielectric material powder and an organic binder is used, and on one side of the green sheet, either the dielectric layer or the magnetic layer, which has a higher sintering temperature, is attached. The core layer and the green sheet are printed simultaneously to form a capacitor layer 3 or a coil layer 4, and the green sheet is used as a substrate 2, and then the other side of the substrate 2 is heated at a sintering temperature. Print and bake a low magnetic layer or dielectric layer,
By forming the coil layer 4 or the capacitor layer 3, it is possible to improve the adhesion and strength between the substrate 2 and both layers 3 and 4 after firing. Since this green sheet is fired simultaneously with the sintering of the layer having a high sintering temperature to form the substrate 2, firing of only the green sheet can be omitted.
また誘電体層と磁性体層の焼結温度が殆んど同じ場合に
は、両層の焼成を同時に行うことができる。Further, when the dielectric layer and the magnetic layer have almost the same sintering temperature, both layers can be fired at the same time.
尚、上記フィルタ１においては、外部と接続されない端
子電極１３．１４を省略するとともに、該端子電極１３
．１４に対応するスルーホール８゜９を基板の端面では
なく基板の内部に設けることができる。In addition, in the filter 1, the terminal electrodes 13 and 14 which are not connected to the outside are omitted, and the terminal electrodes 13 and 14 are omitted.
．． A through hole 8.9 corresponding to 14 can be provided inside the substrate instead of on the end face of the substrate.
次に第５図乃至第９図は、他の回路構成を備えたフィル
タを示すものである。Next, FIGS. 5 to 9 show filters with other circuit configurations.
このフィルタ２１は、第５図に示すように、誘電体又は
磁性体よりなる基板２２と、該基板２２の片面に多層印
刷してなるコンデンサ層２３と、基板２２の他面に多層
印刷してなるコイル層２４と、両層２３，２４を端面接
続する前記フィルタ２１の両端に設けた断面略半円形の
スルーホール２５．２６．２７と、各スルーホール２５
，２６゜２７に連設する前記コンデンサ層２３上面に設
けられた端子電極２８，２９，３０、及び基板２２に穿
設された基板内スルーホール３１（第６図及び第７図参
照）とから構成される。As shown in FIG. 5, this filter 21 includes a substrate 22 made of a dielectric or magnetic material, a capacitor layer 23 printed in multiple layers on one side of the substrate 22, and a capacitor layer 23 printed in multiple layers on the other side of the substrate 22. through-holes 25, 26, 27 with a substantially semicircular cross section provided at both ends of the filter 21 connecting both layers 23 and 24 at their ends, and each through-hole 25.
, 26° 27, and terminal electrodes 28, 29, 30 provided on the upper surface of the capacitor layer 23, and through holes 31 in the substrate 22 (see FIGS. 6 and 7). configured.
前記コンデンサ層２３は、前記実施例同様に電極層と誘
電体層とにより形成されるもので、このコンデンサｒ＠
２３には、第６図に示すように、スルーホール２５．２
６を結ぶ回路にコンデンサＣ１１とコイルＬＳが直列に
、またスルーホール２７と基板内スルーホール３１とを
結ぶ回路にコンデンサＣ１２がそれぞれ多層印刷されて
いる。The capacitor layer 23 is formed of an electrode layer and a dielectric layer as in the embodiment described above, and this capacitor r@
23 has a through hole 25.2 as shown in FIG.
A capacitor C11 and a coil LS are printed in series on the circuit connecting the through hole 27 and the through hole 31 in the substrate, and a capacitor C12 is printed in multiple layers on the circuit connecting the through hole 27 and the through hole 31 in the substrate.
また前記コイル層２４には、第７図に示すように、スル
ーホール２５．２６を結ぶ回路にコイルＬｌｌが、また
スルーホール２６と基板内スルーホール３１とを結ぶ回
路にコイルＬ１２とコンデンサＣ８が並列にそれぞれ多
層印刷されている。Further, in the coil layer 24, as shown in FIG. 7, a coil Lll is connected to the circuit connecting the through holes 25 and 26, and a coil L12 and a capacitor C8 are connected to the circuit connecting the through hole 26 and the through hole 31 in the board. Each layer is printed in parallel.
上記各コンデンサＣ１１．Ｃ１２，Ｃ３及びコイルＬｌ
１．Ｌ１２．ＬＳは、各スルーホール２５．２６．２７
と基板内スルーホール３１とにより基板２２を介して接
続される。従って前記フィルタ２１は、第８図に示すよ
うな等価回路を備えることができる。Each of the above capacitors C11. C12, C3 and coil Ll
1. L12. LS is each through hole 25.26.27
and are connected via the substrate 22 by through holes 31 in the substrate. Therefore, the filter 21 can be provided with an equivalent circuit as shown in FIG.
このフィルタ２１のコンデンサ層２３とコイル層２４も
、焼結温度の高い順に印刷及び焼成が行われ、それぞれ
に適した焼結温度で形成される。The capacitor layer 23 and coil layer 24 of this filter 21 are also printed and fired in descending order of sintering temperature, and are formed at a sintering temperature suitable for each.
このように、コンデンサ層２３は、一部にコイル部を有
するコンデンサ層としてもよく、同様にコイル層２４は
一部にコンデンサ部を有するコイル層としてもよい。ま
た端面のスルーホールは、任意の端面に、端子電極は端
面を含む任意の面に形成することができる。In this way, the capacitor layer 23 may be a capacitor layer having a coil portion in part, and similarly, the coil layer 24 may be a coil layer having a capacitor part in a part. Further, the through hole in the end surface can be formed in any desired end surface, and the terminal electrode can be formed in any surface including the end surface.
以上説明したように、本発明の電気回路用多層印刷フィ
ルタは、基板の表裏に設けるコンデンサ層とコイル層と
を、その焼成温度の高い順に多層印刷して焼成したので
、最適焼結温度で焼成したコンデンサ層とコイル層とを
有し、亀裂や断線等の無い、それぞれの本来の特性を生
かした電気回路用多層印刷フィルタを得ることができる
。As explained above, in the multilayer printed filter for electric circuits of the present invention, the capacitor layer and the coil layer provided on the front and back sides of the substrate are printed and fired in order of the highest firing temperature. It is possible to obtain a multilayer printed filter for electric circuits, which has a capacitor layer and a coil layer, which are free from cracks and disconnections, and which makes use of the original characteristics of each layer.
また本発明の方法によれば、基板の表裏に設けるコンデ
ンサ層とコイル層とを、その最適焼結温度で焼成するこ
とができるので、低い焼結温度を持つ層が高温に晒され
ることがなくなり、無理な膨張・収縮による変形に起因
する表面亀裂や内部断線の発生を防止することができる
。これにより、電気的特性に優れた材料を用いることが
可能となり、安定した性能の電気回路用多層印刷フィル
タを製造することができる。Furthermore, according to the method of the present invention, the capacitor layer and coil layer provided on the front and back sides of the substrate can be fired at their optimum sintering temperature, so that layers with a low sintering temperature are not exposed to high temperatures. It is possible to prevent surface cracks and internal disconnections caused by deformation due to forced expansion and contraction. This makes it possible to use materials with excellent electrical properties, and it is possible to manufacture a multilayer printed filter for electric circuits with stable performance.
さらに前記基板を、誘電体からなるグリーンシートとす
ることにより、基板の焼成を焼結温度の高い層の焼成と
同時に行うことができ、基板の焼成を省略できるととも
に、焼成後の基板とコンデンサ層及びコイル層との密着
性を向上させることができる。また両層を基板内スルー
ホール接続と端面接続とを併用して接続することにより
、各種パターンのフィルタを容易に得ることができる。Furthermore, by using the substrate as a green sheet made of a dielectric material, the substrate can be fired at the same time as the layer having a high sintering temperature, and the baking of the substrate can be omitted. And the adhesion with the coil layer can be improved. Furthermore, by connecting both layers using a combination of in-substrate through-hole connection and end surface connection, filters with various patterns can be easily obtained.
第１図乃至第４図は本発明の一実施例を示すもので、第
１図はフィルタの斜視図、第２図はコンデンサ層の回路
図、第３図はコイル層の回路図、第４図はスルーホール
に対応させたフィルタの等価回路図である。また第５図
乃至第８図は他の回路構成を備えたフィルタの実施例を
示すもので、第５図はフィルタの斜視図、第６図はコン
デンサ層の回路図、第７図はコイル層の回路図、第８図
はスルーホールに対応させたフィルタの等価回路図であ
る。
１．２１・・・フィルタ ２．’；：２・・・基板
３．２３・・・コンデンサ層 ４．２４・・・コイル
層５．６，７．８，９，２５，２６．２７・・・スルー
ホール １０，１１，１２，１３．１４，２８゜２９
．３０・・・端子電極 ３１・・・基板内スルーホー
ル ＣＩ、Ｃ２，Ｃ３，Ｃ４，Ｃ１１．Ｃ１２、Ｃ３
・・・コンデンサ Ｌ１．Ｌ２．Ｌ３．Ｌｌ１．Ｌ１
２．ＬＳ・・・コイル1 to 4 show one embodiment of the present invention, in which FIG. 1 is a perspective view of a filter, FIG. 2 is a circuit diagram of a capacitor layer, FIG. 3 is a circuit diagram of a coil layer, and FIG. The figure is an equivalent circuit diagram of a filter compatible with through holes. 5 to 8 show examples of filters with other circuit configurations. FIG. 5 is a perspective view of the filter, FIG. 6 is a circuit diagram of a capacitor layer, and FIG. 7 is a coil layer. FIG. 8 is an equivalent circuit diagram of a filter compatible with through holes. 1.21...Filter 2. ';:2... Board 3.23... Capacitor layer 4.24... Coil layer 5.6, 7.8, 9, 25, 26.27... Through hole 10, 11, 12, 13.14,28゜29
．． 30...Terminal electrode 31...Through hole in the board CI, C2, C3, C4, C11. C12, C3
...Capacitor L1. L2. L3. Ll1. L1
2. LS...Coil
Claims (6)
に導体層と誘電体層とを交互に印刷して焼成されたコン
デンサ層と、該基板の他面に導体層と磁性体層とを交互
に印刷して焼成されたコイル層とを有し、コンデンサ層
とコイル層とを基板を介して接続した電気回路用多層印
刷フィルタにおいて、前記誘電体層と磁性体層の焼結温
度の高い順に印刷焼成してコンデンサ層及びコイル層を
形成したことを特徴とする電気回路用多層印刷フィルタ
。1. A substrate made of a dielectric or magnetic material, etc., a capacitor layer formed by printing and firing conductor layers and dielectric layers alternately on one side of the substrate, and a conductor layer and a magnetic layer on the other side of the substrate. In a multilayer printed filter for an electric circuit, which has coil layers alternately printed and fired, and in which the capacitor layer and the coil layer are connected via a substrate, the sintering temperature of the dielectric layer and the magnetic layer is high. A multilayer printed filter for an electric circuit, characterized in that a capacitor layer and a coil layer are formed by sequentially printing and firing.
に印刷して焼成されたコンデンサ層と、該基板の他面に
導体層と磁性体層とを交互に印刷して焼成されたコイル
層とを有し、コンデンサ層とコイル層とを基板を介して
接続した電気回路用多層印刷フィルタにおいて、誘電体
からなるグリーンシートの片面に、前記誘電体層と磁性
体層のいずれか焼結温度の高い層を印刷し、該層とグリ
ーンシートとを同時に焼成してコンデンサ層あるいはコ
イル層を形成するとともに前記グリーンシートを基板と
成し、さらに、この基板の他面にいずれか焼結温度の低
い層を印刷して焼成し、コイル層あるいはコンデンサ層
を形成したことを特徴とする電気回路用多層印刷フィル
タ。2. A capacitor layer formed by alternately printing a conductor layer and a dielectric layer on one side of the substrate and firing it, and a capacitor layer formed by alternately printing a conductor layer and a magnetic layer on the other side of the substrate and firing it. In a multilayer printed filter for electric circuits having a coil layer and connecting the capacitor layer and the coil layer via a substrate, either the dielectric layer or the magnetic layer is baked on one side of a green sheet made of a dielectric material. A layer with a high sintering temperature is printed, and the layer and the green sheet are simultaneously fired to form a capacitor layer or a coil layer, and the green sheet is used as a substrate, and any one of the layers is sintered on the other side of the substrate. A multilayer printed filter for electric circuits characterized by printing and firing a low temperature layer to form a coil layer or a capacitor layer.
ル接続と端面接続とを併用して接続されていることを特
徴とする請求項１または２記載の電気回路用多層印刷フ
ィルタ。3. 3. The multilayer printed filter for electric circuits according to claim 1, wherein the coil layer and the capacitor layer are connected using a combination of in-substrate through-hole connection and end surface connection.
誘電体層とを交互に印刷してコンデンサ層を形成すると
ともに、該基板の他面に導体層と磁性体層とを交互に印
刷してコイル層を形成してなる電気回路用多層印刷フィ
ルタの製造方法において、前記基板の片面に、前記誘電
体層と磁性体層のいずれか焼結温度の高い層の印刷を行
って焼成し、次いで基板の他面にいずれか焼結温度の低
い層の印刷を行って焼成することを特徴とする電気回路
用多層印刷フィルタの製造方法。4. A capacitor layer is formed by alternately printing a conductor layer and a dielectric layer on one side of a substrate made of dielectric or magnetic material, and a conductor layer and a magnetic layer are alternately printed on the other side of the substrate. A method for manufacturing a multilayer printed filter for an electric circuit in which a coil layer is formed by printing a layer having a higher sintering temperature of either the dielectric layer or the magnetic layer on one side of the substrate and firing the layer, A method for manufacturing a multilayer printed filter for an electric circuit, which comprises printing a layer having a lower sintering temperature on the other surface of the substrate and then firing the layer.
コンデンサ層を形成するとともに、該基板の他面に導体
層と磁性体層とを交互に印刷してコイル層を形成してな
る電気回路用多層印刷フィルタにおいて、誘電体からな
るグリーンシートの片面に、前記誘電体層と磁性体層の
いずれか焼結温度の高い層の印刷を行い、該層とグリー
ンシートとを同時に焼成してグリーンシートを基板と成
し、次いで、この基板の他面にいずれか焼結温度の低い
層の印刷を行って焼成することを特徴とする電気回路用
多層印刷フィルタの製造方法。5. A capacitor layer is formed by alternately printing a conductor layer and a dielectric layer on one side of the substrate, and a coil layer is formed by alternately printing a conductor layer and a magnetic layer on the other side of the substrate. In a multilayer printed filter for electric circuits, either the dielectric layer or the magnetic layer, which has a higher sintering temperature, is printed on one side of a green sheet made of a dielectric material, and the layer and the green sheet are fired at the same time. A method for manufacturing a multilayer printed filter for an electric circuit, characterized in that a green sheet is used as a substrate, and then a layer having a lower sintering temperature is printed on the other side of the substrate and then fired.
ル接続と端面接続とを併用して接続することを特徴とす
る請求項４または５記載の電気回路用多層印刷フィルタ
の製造方法。6. 6. The method of manufacturing a multilayer printed filter for an electric circuit according to claim 4, wherein the coil layer and the capacitor layer are connected using a combination of in-substrate through-hole connection and end surface connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32562888A JP2769625B2 (en) | 1988-12-22 | 1988-12-22 | Method of manufacturing multilayer printed filter for electric circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32562888A JP2769625B2 (en) | 1988-12-22 | 1988-12-22 | Method of manufacturing multilayer printed filter for electric circuit |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30540997A Division JPH10145168A (en) | 1997-11-07 | 1997-11-07 | Multi-layer print filter for electric circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02170609A true JPH02170609A (en) | 1990-07-02 |
| JP2769625B2 JP2769625B2 (en) | 1998-06-25 |
Family
ID=18178979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32562888A Expired - Fee Related JP2769625B2 (en) | 1988-12-22 | 1988-12-22 | Method of manufacturing multilayer printed filter for electric circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2769625B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0480125U (en) * | 1990-11-27 | 1992-07-13 | ||
| US5430933A (en) * | 1993-06-24 | 1995-07-11 | Northern Telecom Limited | Method of manufacturing a multiple layer printed circuit board |
-
1988
- 1988-12-22 JP JP32562888A patent/JP2769625B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0480125U (en) * | 1990-11-27 | 1992-07-13 | ||
| US5430933A (en) * | 1993-06-24 | 1995-07-11 | Northern Telecom Limited | Method of manufacturing a multiple layer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2769625B2 (en) | 1998-06-25 |
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