JPH0216747A - Visual inspection of integrated circuit wafer - Google Patents
Visual inspection of integrated circuit waferInfo
- Publication number
- JPH0216747A JPH0216747A JP16733688A JP16733688A JPH0216747A JP H0216747 A JPH0216747 A JP H0216747A JP 16733688 A JP16733688 A JP 16733688A JP 16733688 A JP16733688 A JP 16733688A JP H0216747 A JPH0216747 A JP H0216747A
- Authority
- JP
- Japan
- Prior art keywords
- microscope
- chips
- wafer
- resin
- defective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011179 visual inspection Methods 0.000 title claims abstract description 18
- 230000002950 deficient Effects 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 238000007689 inspection Methods 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、集積回路ウェハの目視検査方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for visual inspection of integrated circuit wafers.
更に詳述すれば、本発明は、複数の集積回路チップが設
けられたウェハを顕微鏡を通して目視検査を行い不良チ
ップを選別する集積回路ウェハの目視検査方法に関する
ものである。More specifically, the present invention relates to a method for visually inspecting an integrated circuit wafer, in which a wafer provided with a plurality of integrated circuit chips is visually inspected through a microscope to select defective chips.
〈従来の技術〉
第２図は従来より一般に使用されている従来例の構成説
明図である。<Prior Art> FIG. 2 is a diagram illustrating the configuration of a conventional example that has been commonly used.
図において、１はウェハステージで、ウェハ２を載せた
まま、図のＸＹ力方向移動する。In the figure, reference numeral 1 denotes a wafer stage, which moves in the XY force directions shown in the figure while holding a wafer 2 thereon.
３は金属顕微鏡、３１は対物レンズである。3 is a metallurgical microscope, and 31 is an objective lens.
４はインカーである。4 is an inker.
以上の構成において、複数の集積回路チップが設けられ
たウェハ２を金属顕微鏡３を通して目視検査を行い不良
チップを選別する。In the above configuration, the wafer 2 on which a plurality of integrated circuit chips are provided is visually inspected through a metallurgical microscope 3 to select defective chips.
〈発明が解決しようとする課題〉
しかしながら、この様な装置においては、金属顕微鏡３
を用いて、比較的高倍率で、それぞれのチップの表面を
検査するなめに、対物レンズ３１とウェハ２の間隔が狭
く、インカー４を対物レンズ３１とウェハ２の間に入れ
る事が出来ない。<Problem to be solved by the invention> However, in such a device, the metallurgical microscope 3
In order to inspect the surface of each chip at relatively high magnification using the wafer 2, the distance between the objective lens 31 and the wafer 2 is narrow, and the inker 4 cannot be inserted between the objective lens 31 and the wafer 2.
このため、チップ不良を発見した場合には、それを記憶
しておき、次の位置ヘウエハ２を移動してからインカー
４でインキを打つ、インカー４の動作はまったく確認出
来ないために、インク切れや、インク量の過大、過少の
ため、目視検査をやり直さなければならない事がある。Therefore, if a defective chip is found, it is memorized, the wafer 2 is moved to the next position, and the inker 4 is applied with ink. The visual inspection may have to be repeated due to excessive or insufficient ink volume.
本発明は、この問題点を解決するものである。The present invention solves this problem.
本発明の目的は、不良チップを正確に選別しうる集積回
路ウェハの目視検査方法を提供するにある。An object of the present invention is to provide a visual inspection method for integrated circuit wafers that can accurately select defective chips.
く課題を解決するための手段〉
この目的を達成するために、本発明は、複数の集積回路
チップが設けられたウェハを顕微鏡を°通して目視検査
を行い不良チップを選別する集積回路ウェハの目視検査
方法において、
目視検査対象ウェハの検査面に硬化前透明な紫外線硬化
樹脂を塗付した後、顕微鏡で目視検査を行い、不良チッ
プ発見時に、前記顕微鏡を通してあるいは前記顕ｇ＆鏡
の近傍から斜めに紫外光を照射する照射手段により紫外
光を該不良チップに照射し、目視検査対象ウェハの全チ
ップ検査終了後、未硬化の紫外線硬化樹脂を洗浄除去し
て不良チップを選別する集積回路ウェハの目視検査方法
を採用したものである。Means for Solving the Problems> To achieve this object, the present invention provides an integrated circuit wafer inspection method in which a wafer provided with a plurality of integrated circuit chips is visually inspected through a microscope to select defective chips. In the visual inspection method, a transparent ultraviolet curing resin is applied before curing to the inspection surface of the wafer to be visually inspected, and then a visual inspection is performed using a microscope.When a defective chip is found, the wafer is inspected through the microscope or diagonally from near the microscope and mirror. The defective chips are irradiated with ultraviolet light by an irradiation means that irradiates ultraviolet light to the integrated circuit wafer, and after all chips of the wafer to be visually inspected are inspected, uncured ultraviolet curing resin is washed away and defective chips are sorted out. A visual inspection method was adopted.
く作用〉 以上の方法において、以下の手順で行う。Effect〉 The above method is performed in the following steps.
（１）まず、目視検査対象ウェハの検査面に硬化前透明
な紫外線硬化樹脂を塗付する。(1) First, a transparent ultraviolet curing resin is applied before curing to the inspection surface of a wafer to be visually inspected.
（２）顕微鏡で目視検査を行う。(2) Perform visual inspection using a microscope.
（３）不良チップ発見時に、顕微鏡を通してあるいは顕
微鏡の近傍から斜めに紫外光を照射する照射手段により
紫外光を不良チップに照射する。(3) When a defective chip is found, the defective chip is irradiated with ultraviolet light using an irradiation means that irradiates ultraviolet light obliquely through a microscope or from near the microscope.
（４）目視検査対象ウェハの全チップ検査終了後、未硬
化の紫外線硬化樹脂を洗浄除去して不良チンプを選別す
る。(4) After all chips of the wafer to be visually inspected are inspected, uncured ultraviolet curing resin is washed away and defective chimps are sorted out.
以下、実施例に基つき詳細に説明する。Hereinafter, a detailed explanation will be given based on examples.
〈実施例〉 第１図は本発明の一実施例の要部構成説明図である。<Example> FIG. 1 is an explanatory diagram of the main part of an embodiment of the present invention.
図において、第２図と同一記号の構成は同一機能を表わ
す。In the figure, structures with the same symbols as in FIG. 2 represent the same functions.
以下、第２図と相違部分のみ説明する。Hereinafter, only the differences from FIG. 2 will be explained.
３２は接眼レンズ、３３は可視光用光源、３４は紫外光
用光源である。32 is an eyepiece lens, 33 is a light source for visible light, and 34 is a light source for ultraviolet light.
３５は紫外線カツトフィルター、３６はハーフミラ−で
ある。35 is an ultraviolet cut filter, and 36 is a half mirror.
３７は紫外光用光源３４の光源口に設けられたシャッタ
ーである。37 is a shutter provided at the light source port of the ultraviolet light source 34.
３８はシャッター３７の開閉を制御する制御装置で、３
８１は制御装置３８の押しボタンスイッチである。38 is a control device that controls opening and closing of the shutter 37;
81 is a push button switch of the control device 38.
５はウェハ２上に塗付された硬化前透明な紫外線硬化樹
脂である。Reference numeral 5 denotes a transparent ultraviolet curing resin applied onto the wafer 2 before curing.
以上の構成において、以下の手順で実施される。In the above configuration, the following steps are performed.
（１）まず、目視検査対象ウェハ２の検査面に硬化前透
明な紫外線硬化樹脂５を塗付する。(1) First, a transparent ultraviolet curing resin 5 is applied before curing to the inspection surface of the wafer 2 to be visually inspected.
（２）顕微鏡３で目視検査を行う、この場合、シャター
３７は閉じたままにしておく。(2) Perform a visual inspection using the microscope 3, in which case the shutter 37 remains closed.
（３）不良チップ発見時に、シャター３７を開いて、紫
外光を照射し、紫外線硬化樹脂５を硬化させる。硬化す
る様子を顕微鏡３で確認する。(3) When a defective chip is found, the shutter 37 is opened and ultraviolet light is irradiated to cure the ultraviolet curing resin 5. Confirm the hardening state using a microscope 3.
（４）目視検査対象ウェハ２の全デツプ検査終了後、未
硬化の紫外線硬化樹脂を洗浄除去する。(4) After completing the entire depth inspection of the wafer 2 to be visually inspected, the uncured ultraviolet curing resin is washed and removed.
この結果、不良チップのみに、硬化した樹脂か残り、良
チップ、不良チップの判定が容易につく。As a result, it is easy to determine whether only defective chips have hardened resin remaining, good chips, or defective chips.
したがって、不良チップを正確、容易に選別する事がで
きる。Therefore, defective chips can be accurately and easily selected.
なお、前述の実施例では、紫外光用光源３４の開閉はシ
ャッター３７で行うと説明したが、これに限ることはな
く、例えば、紫外光用光源３４そのものをオンオフして
もよく、要するに、必要時に紫外光が得られればよい。In the above embodiment, it was explained that the ultraviolet light source 34 is opened and closed by the shutter 37, but the invention is not limited to this, and for example, the ultraviolet light source 34 itself may be turned on and off. Sometimes it is sufficient to obtain ultraviolet light.
また−顕微鏡３の光学系はそのままにしておき、顕微鏡
３の近傍から斜めに紫外光を当て、顕微鏡３で目視して
いるチップ上の紫外線硬化樹脂５を硬化させるようにし
てもよい。Alternatively, the optical system of the microscope 3 may be left as is, and ultraviolet light is applied obliquely from near the microscope 3 to harden the ultraviolet curing resin 5 on the chip that is visually observed with the microscope 3.
〈発明の効果〉
以上説明したように、本発明は、複数の集積回路チップ
が設けられなウェハを顕ＦＲ鏡を通して目視検査を行い
不良チップを選別する集積回路ウェハの目視検査方法に
おいて、
目視検査対象ウェハの検査面に硬化前透明な紫外線硬化
樹脂を塗付した後、イ微鏡で目視検査を行い、不良チッ
プ発見時に、前記ｍ微鏡を通してあるいは前記顕微鏡の
近傍から斜めに紫外光を照射する照射手段により紫外光
を該不良チップに照射し、目視検査対象ウェハの全チッ
プ検査終了後、未硬化の紫外線硬化樹脂を洗浄除去して
不良チップを選別する集積回路ウェハの目視検査方法を
採用した。<Effects of the Invention> As explained above, the present invention provides a visual inspection method for integrated circuit wafers in which a wafer not provided with a plurality of integrated circuit chips is visually inspected through a microscope FR to select defective chips. After coating the inspection surface of the target wafer with a transparent ultraviolet curable resin before hardening, perform a visual inspection with a microscope. When a defective chip is found, irradiate ultraviolet light diagonally through the microscope or from near the microscope. A visual inspection method for integrated circuit wafers is adopted in which the defective chips are irradiated with ultraviolet light using an irradiation means, and after all chips of the wafer to be visually inspected are inspected, uncured ultraviolet curing resin is washed away and defective chips are sorted out. did.
この結果、不良チップのみに、硬化した樹脂が残り、良
チップ、不良チップの判定か容易につく。As a result, the hardened resin remains only on defective chips, making it easy to determine whether the chips are good or defective.
したがって、不良チップを正確、容易に選別する事がで
きる。Therefore, defective chips can be accurately and easily selected.
従って、本発明によれば、不良チップを正確に選別しつ
る集積回路ウェハの目視検査方法を実現することか出来
る。Therefore, according to the present invention, it is possible to realize a visual inspection method for integrated circuit wafers that accurately selects defective chips.
第１図は本発明の一実施例の要部構成説明図、第２図は
従来より一般に使用されている従来例の構成説明図であ
る。
１・・・ウェハステージ、２・・・ＴＣウェハ、３・・
・顕微鏡、３１・・・対物レンズ、３２・・・接眼レン
ズ、３３・・・可視光用光源、３４・・・紫外光用光源
、３５・・・紫外線カツトフィルタ、３６・・・ハーフ
ミラ−１３７・・・シャッタ、３８・・・シャッタ開閉
の制御装置、３８１・・・押しボタンスイッチ、５・・
・紫外線硬化樹脂。FIG. 1 is an explanatory diagram of the main part configuration of an embodiment of the present invention, and FIG. 2 is an explanatory diagram of the configuration of a conventional example that has been generally used. 1... Wafer stage, 2... TC wafer, 3...
・Microscope, 31... Objective lens, 32... Eyepiece lens, 33... Light source for visible light, 34... Light source for ultraviolet light, 35... Ultraviolet cut filter, 36... Half mirror 137 ...Shutter, 38...Control device for shutter opening/closing, 381...Push button switch, 5...
・Ultraviolet curing resin.
Claims (1)
して目視検査を行い不良チップを選別する集積回路ウェ
ハの目視検査方法において、目視検査対象ウェハの検査
面に硬化前透明な紫外線硬化樹脂を塗付した後、顕微鏡
で目視検査を行い、不良チップ発見時に、前記顕微鏡を
通してあるいは前記顕微鏡の近傍から斜めに紫外光を照
射する照射手段により紫外光を該不良チップに照射し、
目視検査対象ウェハの全チップ検査終了後、未硬化の紫
外線硬化樹脂を洗浄除去して不良チップを選別する集積
回路ウェハの目視検査方法。In a visual inspection method for integrated circuit wafers in which a wafer with multiple integrated circuit chips is visually inspected through a microscope to select defective chips, a transparent ultraviolet curing resin is applied to the inspection surface of the wafer to be visually inspected before curing. After that, a visual inspection is performed with a microscope, and when a defective chip is found, the defective chip is irradiated with ultraviolet light by an irradiation means that irradiates ultraviolet light obliquely through the microscope or from near the microscope,
A visual inspection method for integrated circuit wafers in which, after all chips on the wafer to be visually inspected have been inspected, uncured ultraviolet curing resin is washed away and defective chips are sorted out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16733688A JPH0216747A (en) | 1988-07-05 | 1988-07-05 | Visual inspection of integrated circuit wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16733688A JPH0216747A (en) | 1988-07-05 | 1988-07-05 | Visual inspection of integrated circuit wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0216747A true JPH0216747A (en) | 1990-01-19 |
Family
ID=15847846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16733688A Pending JPH0216747A (en) | 1988-07-05 | 1988-07-05 | Visual inspection of integrated circuit wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0216747A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283488A (en) * | 1992-03-30 | 1993-10-29 | Nec Corp | Semiconductor device |
| US5925260A (en) * | 1997-01-02 | 1999-07-20 | Micron Technology, Inc. | Removal of polyimide from dies and wafers |
| JP2001349848A (en) * | 2000-06-12 | 2001-12-21 | Sony Corp | Inspection apparatus and method |
-
1988
- 1988-07-05 JP JP16733688A patent/JPH0216747A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283488A (en) * | 1992-03-30 | 1993-10-29 | Nec Corp | Semiconductor device |
| US5925260A (en) * | 1997-01-02 | 1999-07-20 | Micron Technology, Inc. | Removal of polyimide from dies and wafers |
| JP2001349848A (en) * | 2000-06-12 | 2001-12-21 | Sony Corp | Inspection apparatus and method |
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