JPH0216560Y2 - - Google Patents
Info
- Publication number
- JPH0216560Y2 JPH0216560Y2 JP12130581U JP12130581U JPH0216560Y2 JP H0216560 Y2 JPH0216560 Y2 JP H0216560Y2 JP 12130581 U JP12130581 U JP 12130581U JP 12130581 U JP12130581 U JP 12130581U JP H0216560 Y2 JPH0216560 Y2 JP H0216560Y2
- Authority
- JP
- Japan
- Prior art keywords
- socket hole
- electronic component
- floating lid
- connecting pin
- external electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000006378 damage Effects 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 description 8
- 230000003068 static effect Effects 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Elimination Of Static Electricity (AREA)
Description
【考案の詳細な説明】
本考案は電子装置の静電気障害防止構造に関す
るものであり、その目的とするところは、人体に
帯電した静電気の放電に起因する電子装置の故障
や破壊などの静電気障害を防止してその信頼性の
向上を図ることにある。[Detailed description of the invention] The present invention relates to a structure for preventing electrostatic damage to electronic equipment, and its purpose is to prevent electrostatic damage such as failure or destruction of electronic equipment caused by the discharge of static electricity charged in the human body. The objective is to prevent this and improve its reliability.
従来、電子装置に用いられる電子部品単独で、
人体に帯電される数千ボルトの静電気の放電に耐
えるものは稀であり、従つて部品の取扱いに注意
しながら機器を組み上げ、静電気放電から機器を
構成する電子部品を保護するために、ノイズ吸収
またはバイパス用の電子部品を配置する必要があ
り、回路の複雑化、大型化と共にコストアツプに
なるという問題があつた。特に多数の端子を有
し、かつその端子に接続された破壊レベルの低い
集積回路（以下ICと称する）に対する静電気障
害を防止するのは容易ではなく、また、ICに接
続され、かつユーザ側で触れることが可能な端子
については取扱いに注意を促すように機器に注意
書を記していることが多いが、静電気障害の防止
には充分ではなかつた。本考案は上記の点に鑑み
て為されたものである。 Traditionally, electronic components used in electronic devices alone
It is rare to find a device that can withstand the discharge of several thousand volts of static electricity that is charged to the human body.Therefore, equipment must be assembled with care when handling parts, and noise absorbers must be used to protect the electronic components that make up the equipment from static electricity discharge. Alternatively, it is necessary to arrange electronic components for bypass, which poses a problem in that the circuit becomes more complex and larger, and the cost increases. In particular, it is difficult to prevent electrostatic damage to integrated circuits (hereinafter referred to as ICs) that have a large number of terminals and have a low level of destruction and are connected to those terminals. Although precautions are often written on devices to urge caution when handling terminals that can be touched, this is not sufficient to prevent static electricity hazards. The present invention has been made in view of the above points.
以下、メモリ用ICのプログラム装置の実施例
について図を用いて説明する。第１図は全体構成
を示すブロツク図であり、１０はマイクロコンピ
ユータを用いた制御部、１１は書込プログラムを
入力するキースイツチ部、１２は書込プログラム
を蓄えるメモリ部、１３は表示部であり、このプ
ログラム装置Ａにプログラムを書込もうとするメ
モリICブロツク２が装着自在になつている。こ
のメモリICブロツク２の外面には作業者が把む
部分すなわちメモリICブロツク２の側面と底面
のピン受け孔２ａを除く部分とが連続する導電層
２ｂが形成されている。この導電層２ｂは例えば
メモリICブロツク２のケースを樹脂成形にて作
成した後、マスキングをして金属皮膜を無電解メ
ツキなどにより形成したものである。また、メモ
リICブロツク２の底面全面に導電性皮膜を形成
し、ピン受け孔２ａ内の各電極を底面から内部へ
沈ませて（例えば１mm）電気的に充分絶縁が保た
れるようにしても良い。第２図、第４図は要部を
示すもので、１は電子装置を収納する金属ケース
であり、ケース本体１ａおよびカバー１ｂとで形
成され、１６はIC１５や接続ピン４などが実装
されるプリント基板である。この金属ケース１に
は外付電子部品であるところのメモリICブロツ
ク２が装着されるソケツト孔３が穿設されてお
り、このソケツト孔３内にはメモリICブロツク
２に接続される接続ピン４が列設されている。５
は浮蓋であり、中央部に接続ピン４の貫通孔６が
穿設された絶縁材よりなる浮蓋５の側面の要所
（実施例では両側）と、装着される外付電子部品
２の外面の導電層２ａに接触する上面の要所とに
連続する導電部８を設けて形成されており、実施
例では導電部８は、絶縁材よりなる浮蓋本体５ａ
の両側面にそれぞれ配置した導電体にて構成さ
れ、この導電体の外側面にて孔３の内周面への摺
接部が形成されるとともに、上面にて外付電子部
品２の導電層２ｂへの接触部が形成されている。
この浮蓋５は周側面の導電部８がソケツト孔３の
内周面に摺接するようにしてソケツト孔３内に上
下動自在に配設される。７は浮蓋５を上方に付勢
する押上げばねであり、浮蓋５を押上げて浮蓋５
の上面を接続ピン４の上端よりも上方に位置させ
るようになつており、浮蓋５を下方に押圧するこ
とにより接続ピン４の上端が露出するようになつ
ている。９は接続ピン４の基部に固定されたスト
ツパーであり、押上げばね７はこのストツパー９
と浮蓋５との間に介装される。 Hereinafter, an embodiment of a memory IC programming device will be described with reference to the drawings. FIG. 1 is a block diagram showing the overall configuration, in which 10 is a control unit using a microcomputer, 11 is a key switch unit for inputting the writing program, 12 is a memory unit for storing the writing program, and 13 is a display unit. , a memory IC block 2 to which a program is to be written into the program device A is freely attachable. A conductive layer 2b is formed on the outer surface of the memory IC block 2. The part gripped by the operator, that is, the side surface of the memory IC block 2 and the part other than the pin receiving hole 2a on the bottom surface are continuous with each other. This conductive layer 2b is formed by, for example, forming the case of the memory IC block 2 by resin molding, then masking it, and then forming a metal film by electroless plating or the like. Alternatively, a conductive film may be formed on the entire bottom surface of the memory IC block 2, and each electrode in the pin receiving hole 2a may be sunk (for example, by 1 mm) from the bottom surface to maintain sufficient electrical insulation. good. Figures 2 and 4 show the main parts, where 1 is a metal case that houses the electronic device, and is formed by a case body 1a and a cover 1b, and 16 is where the IC 15, connection pins 4, etc. are mounted. It is a printed circuit board. This metal case 1 is provided with a socket hole 3 into which a memory IC block 2, which is an external electronic component, is attached.Inside this socket hole 3 is a connecting pin 4 connected to the memory IC block 2. are set up in a row. 5
is a floating lid, and the floating lid 5 is made of an insulating material and has a through hole 6 for a connecting pin 4 in the center thereof (both sides in the embodiment), and key points on the sides (on both sides in the embodiment) and an external electronic component 2 to be attached. It is formed by providing a conductive part 8 that is continuous with key points on the top surface that contact the conductive layer 2a on the outer surface, and in the embodiment, the conductive part 8 is connected to the floating lid body 5a made of an insulating material
The outer surface of the conductor forms a sliding contact portion with the inner circumferential surface of the hole 3, and the upper surface forms a conductive layer of the external electronic component 2. A contact portion to 2b is formed.
The floating lid 5 is disposed within the socket hole 3 so as to be vertically movable so that the conductive portion 8 on the circumferential side is in sliding contact with the inner peripheral surface of the socket hole 3. 7 is a push-up spring that urges the floating lid 5 upward;
The upper surface is positioned above the upper end of the connecting pin 4, and the upper end of the connecting pin 4 is exposed by pressing the floating lid 5 downward. 9 is a stopper fixed to the base of the connecting pin 4, and the push-up spring 7 is attached to this stopper 9.
and the floating lid 5.
第４図および第５図は他の実施例を示すもので
あり、浮蓋５の浮蓋本体を合成樹脂成形にて作製
し、必要部分にのみ無電解メツキによつて導電性
皮膜よりなる導電部８′を形成したものである。 4 and 5 show another embodiment, in which the floating lid body of the floating lid 5 is made by molding synthetic resin, and only the necessary parts are coated with a conductive film by electroless plating. A portion 8' is formed.
本考案は上述のように、電子装置を収納する金
属ケース上面に外付電子部品を装着するソケツト
孔を穿設し、ソケツト孔内に外付電子部品に接続
される接続ピンが立設された電子装置において、
中央部に接続ピンの貫通孔が穿設された絶縁材よ
りなる浮蓋の側面の要所と、装着される外付電子
部品の外面の導電層に接触する上面の要所とに連
続する導電部を設け、上記浮蓋を側面の導電部が
ソケツト孔内周面に摺接するようにしてソケツト
孔内に上下動自在に配設し、上記浮蓋を押上げば
ねにて上方に付勢することにより浮蓋の上面を接
続ピンの上端よりも上方に位置せしめ、浮蓋を下
方に押圧することにより接続ピンの上端部が露出
するようにしたから、通常時において接続ピンは
上方に付勢された浮蓋にて露出しないようにカバ
ーされることになつて接続ピンに人体が触れるこ
とがなく静電気障害は防止されており、また、帯
電した作業者が不用意に浮蓋を下方に押圧した場
合にあつても、浮蓋の上面から周側面に連続する
導電部を介して静電気が金属ケースに放電された
後、接続ピンに触れることになつて接続ピンへ静
電気が放電することがなく電子装置の静電気障害
が防止でき、電子装置の信頼性の向上を図ること
ができるという利点がある。 As mentioned above, the present invention has a socket hole for attaching an external electronic component to the upper surface of a metal case that houses an electronic device, and a connecting pin that is connected to the external electronic component is provided upright in the socket hole. In electronic equipment,
The floating lid is made of an insulating material with a through-hole for a connecting pin in its center, and has continuous electrical conductivity between key points on the side surface and key points on the top surface that contact the conductive layer on the outer surface of the external electronic component to be mounted. The floating lid is vertically movably disposed in the socket hole so that the conductive portion on the side surface is in sliding contact with the inner peripheral surface of the socket hole, and the floating lid is urged upward by a push-up spring. As a result, the upper surface of the floating cover is positioned above the upper end of the connecting pin, and by pressing the floating cover downward, the upper end of the connecting pin is exposed, so that the connecting pin is urged upward under normal conditions. This prevents electrostatic damage because the human body does not touch the connecting pins, and prevents a charged worker from inadvertently pressing the floating lid downwards. Even in such a case, static electricity will be discharged to the metal case through the conductive part that continues from the top surface of the floating lid to the peripheral side, and then the connection pin will be touched and static electricity will not be discharged to the connection pin. This has the advantage that electrostatic damage to electronic devices can be prevented and reliability of the electronic devices can be improved.
なお、外付電子部品としてケース外面の作業者
が把む部分（例えば側面）から底面に連続する導
電層が形成されたものを使用すれば、帯電した作
業者が外付電子部品を電子装置に装着する際に、
電子部品の導電層および浮蓋の導電部を介して静
電気が金属ケースに放電されることになつて電子
装置の静電気障害が防止できることになる。 Note that if you use an external electronic component that has a conductive layer that continues from the part of the outer surface of the case that the worker grasps (for example, the side surface) to the bottom surface, a charged worker can easily insert the external electronic component into the electronic device. When installing,
Static electricity is discharged to the metal case via the conductive layer of the electronic component and the conductive part of the floating lid, thereby preventing static electricity damage to the electronic device.
第１図は本考案一実施例のブロツク回路図、第
２図は同上の要部断面図、第３図は同上の要部上
面図、第４図は他の実施例の要部断面図、第５図
は同上の要部上面図である。
１は金属ケース、２は外付電子部品、３はソケ
ツト孔、４は接続ピン、５は浮蓋、６は貫通孔、
７は押上げばね、８は導電部である。
Fig. 1 is a block circuit diagram of one embodiment of the present invention, Fig. 2 is a sectional view of the main parts of the same, Fig. 3 is a top view of the main parts of the same, and Fig. 4 is a sectional view of the main parts of another embodiment. FIG. 5 is a top view of the main parts same as above. 1 is a metal case, 2 is an external electronic component, 3 is a socket hole, 4 is a connecting pin, 5 is a floating lid, 6 is a through hole,
7 is a push-up spring, and 8 is a conductive part.
Claims (1)
部品を装着するソケツト孔を穿設し、ソケツト孔
内に外付電子部品に接続される接続ピンが立設さ
れた電子装置において、中央部に接続ピンの貫通
孔が穿設された絶縁材よりなる浮蓋の側面の要所
と、装着される外付電子部品の外面の導電層に接
触する上面の要所とに連続する導電部を設け、上
記浮蓋を側面の導電部がソケツト孔内周面に摺接
するようにしてソケツト孔内に上下動自在に配設
し、上記浮蓋を押上げばねにて上方に付勢するこ
とにより浮蓋の上面を接続ピンの上端よりも上方
に位置せしめ、浮蓋を下方に押圧することにより
接続ピンの上端部が露出するようにして成ること
を特徴とする電子装置の静電気障害防止構造。 A socket hole for attaching an external electronic component is drilled on the top surface of a metal case housing the electronic device, and a connection pin for connecting to the external electronic component is installed in the socket hole to connect to the center of the electronic device. A conductive part is provided that is continuous with a key point on the side surface of the floating lid made of an insulating material in which a pin through hole is drilled, and a key point on the top surface that contacts the conductive layer on the outer surface of the external electronic component to be mounted. The floating lid is arranged vertically movably in the socket hole so that the conductive part on the side surface is in sliding contact with the inner circumferential surface of the socket hole, and the floating lid is biased upward by a push-up spring. A structure for preventing electrostatic damage to an electronic device, characterized in that the upper surface of the connecting pin is positioned above the upper end of the connecting pin, and the upper end of the connecting pin is exposed by pressing the floating cover downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12130581U JPS5826200U (en) | 1981-08-14 | 1981-08-14 | Electrostatic damage prevention structure for electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12130581U JPS5826200U (en) | 1981-08-14 | 1981-08-14 | Electrostatic damage prevention structure for electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5826200U JPS5826200U (en) | 1983-02-19 |
| JPH0216560Y2 true JPH0216560Y2 (en) | 1990-05-08 |
Family
ID=29915245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12130581U Granted JPS5826200U (en) | 1981-08-14 | 1981-08-14 | Electrostatic damage prevention structure for electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826200U (en) |
-
1981
- 1981-08-14 JP JP12130581U patent/JPS5826200U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5826200U (en) | 1983-02-19 |
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