JPH0216233B2 - - Google Patents

Info

Publication number: JPH0216233B2
Authority: JP; Japan
Prior art keywords: card; module; base material; manufacturing; card base
Prior art date: 1981-11-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP19163781A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5892597A (ja

Inventor

Koichi Okada

Seiichi Nishikawa

Teruaki Jo

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Dai Nippon Printing Co Ltd

Original Assignee

Dai Nippon Printing Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-11-28

Filing date

1981-11-28

Publication date

1990-04-16

1981-11-28 Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd

1981-11-28 Priority to JP56191637A priority Critical patent/JPS5892597A/ja

1983-06-01 Publication of JPS5892597A publication Critical patent/JPS5892597A/ja

1990-04-16 Publication of JPH0216233B2 publication Critical patent/JPH0216233B2/ja

Status Granted legal-status Critical Current

Links

238000000034 method Methods 0.000 claims description 24
239000000463 material Substances 0.000 claims description 21
238000004519 manufacturing process Methods 0.000 claims description 15
229910000838 Al alloy Inorganic materials 0.000 claims description 9
BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 9
239000003822 epoxy resin Substances 0.000 claims description 7
229920000647 polyepoxide Polymers 0.000 claims description 7
229910052751 metal Inorganic materials 0.000 claims description 6
239000002184 metal Substances 0.000 claims description 6
239000004593 Epoxy Substances 0.000 claims description 5
239000011521 glass Substances 0.000 claims description 5
238000004382 potting Methods 0.000 claims description 5
239000000758 substrate Substances 0.000 claims description 5
239000000853 adhesive Substances 0.000 claims description 4
230000001070 adhesive effect Effects 0.000 claims description 4
238000000465 moulding Methods 0.000 claims description 3
238000012545 processing Methods 0.000 claims description 3
229910052782 aluminium Inorganic materials 0.000 claims 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
238000007639 printing Methods 0.000 description 3
238000004080 punching Methods 0.000 description 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
239000004020 conductor Substances 0.000 description 2
238000010030 laminating Methods 0.000 description 2
238000003475 lamination Methods 0.000 description 2
238000007650 screen-printing Methods 0.000 description 2
239000010935 stainless steel Substances 0.000 description 2
229910001220 stainless steel Inorganic materials 0.000 description 2
239000004925 Acrylic resin Substances 0.000 description 1
229920000178 Acrylic resin Polymers 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000011889 copper foil Substances 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
229920006332 epoxy adhesive Polymers 0.000 description 1
239000003292 glue Substances 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
239000011229 interlayer Substances 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
238000007645 offset printing Methods 0.000 description 1
238000007747 plating Methods 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
238000011160 research Methods 0.000 description 1
238000003860 storage Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
238000012546 transfer Methods 0.000 description 1

Landscapes

Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
Credit Cards Or The Like (AREA)

JP56191637A 1981-11-28 1981-11-28 Ｉｃカ−ドの製造方法 Granted JPS5892597A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP56191637A JPS5892597A (ja)	1981-11-28	1981-11-28	Ｉｃカ−ドの製造方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP56191637A JPS5892597A (ja)	1981-11-28	1981-11-28	Ｉｃカ−ドの製造方法

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4068322A Division JPH07164787A (ja)	1992-03-26	1992-03-26	Ｉｃカードの製造方法

Publications (2)

Publication Number	Publication Date
JPS5892597A JPS5892597A (ja)	1983-06-01
JPH0216233B2 true JPH0216233B2 (it)	1990-04-16

Family

ID=16277962

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP56191637A Granted JPS5892597A (ja)	1981-11-28	1981-11-28	Ｉｃカ−ドの製造方法

Country Status (1)

Country	Link
JP (1)	JPS5892597A (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5983285A (ja) *	1982-11-04	1984-05-14	Toppan Printing Co Ltd	カ−ド製造法
JPS61123597A (ja) *	1984-11-21	1986-06-11	大日本印刷株式会社	Ｉｃカ−ドの製造方法
JPS61157990A (ja) *	1984-12-29	1986-07-17	Kyodo Printing Co Ltd	Ｉｃカ−ド
JPH07123182B2 (ja) *	1986-05-20	1995-12-25	日立マクセル株式会社	半導体装置
JPH0755591B2 (ja) *	1987-11-25	1995-06-14	大日本印刷株式会社	Ｉｃカード
US5208450A (en) *	1988-04-20	1993-05-04	Matsushita Electric Industrial Co., Ltd.	IC card and a method for the manufacture of the same
JPH01152098A (ja) *	1988-09-08	1989-06-14	Dainippon Printing Co Ltd	Ｉｃカード用カード基材
JPH0964240A (ja)	1995-08-25	1997-03-07	Toshiba Corp	半導体装置および半導体装置の製造方法
JP3547127B2 (ja)	2001-04-09	2004-07-28	日本ベルボン精機工業株式会社	カメラ用支持具
US11200385B2 (en) *	2018-09-27	2021-12-14	Apple Inc.	Electronic card having an electronic interface
US11571766B2 (en)	2018-12-10	2023-02-07	Apple Inc.	Laser marking of an electronic device through a cover

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5283132A (en) *	1975-12-31	1977-07-11	Cii	Portable card for electric signal processor and method of fabricating same
JPS536491A (en) *	1976-07-01	1978-01-20	Kanegafuchi Chem Ind Co Ltd	Frothing compositon
JPS5556647A (en) *	1978-10-19	1980-04-25	Cii Honeywell Bull	Flat package for at least one integrated circuit device
JPS5556639A (en) *	1978-10-19	1980-04-25	Cii	Strip for carrying device for processing electric signal and method of manufacturing same
US4216577A (en) *	1975-12-31	1980-08-12	Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme)	Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
JPS5626451A (en) *	1979-05-17	1981-03-14	Gao Ges Automation Org	Identification card having ic chip and method of manufacturing same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS50107097U (it) *	1974-02-07	1975-09-02

1981
- 1981-11-28 JP JP56191637A patent/JPS5892597A/ja active Granted

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5283132A (en) *	1975-12-31	1977-07-11	Cii	Portable card for electric signal processor and method of fabricating same
US4216577A (en) *	1975-12-31	1980-08-12	Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme)	Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
JPS536491A (en) *	1976-07-01	1978-01-20	Kanegafuchi Chem Ind Co Ltd	Frothing compositon
JPS5556647A (en) *	1978-10-19	1980-04-25	Cii Honeywell Bull	Flat package for at least one integrated circuit device
JPS5556639A (en) *	1978-10-19	1980-04-25	Cii	Strip for carrying device for processing electric signal and method of manufacturing same
US4264917A (en) *	1978-10-19	1981-04-28	Compagnie Internationale Pour L'informatique Cii-Honeywell Bull	Flat package for integrated circuit devices
JPS5626451A (en) *	1979-05-17	1981-03-14	Gao Ges Automation Org	Identification card having ic chip and method of manufacturing same

Also Published As

Publication number	Publication date
JPS5892597A (ja)	1983-06-01

Publication	Publication Date	Title
JP4241147B2 (ja)	2009-03-18	Ｉｃカードの製造方法
JPH0852968A (ja)	1996-02-27	非接触カードの製造方法および非接触カード
WO1989001873A1 (en)	1989-03-09	Integrated circuit device and method of producing the same
CN108885709B (zh)	2022-06-14	制造芯片卡和芯片卡天线支撑件的方法
JP2000182017A (ja)	2000-06-30	接触型非接触型共用ｉｃカードおよびその製造方法
JPH11195096A (ja)	1999-07-21	非接触電子カード及びその製造方法
JPS6230096A (ja)	1987-02-09	支持体に集積回路を取付けする方法、その方法により組立てた装置および超小型電子回路装置を備えるカ−ド
JPH0216233B2 (it)	1990-04-16
JPS6347265B2 (it)	1988-09-21
JPH0216234B2 (it)	1990-04-16
JPH0324383Y2 (it)	1991-05-28
JP3769332B2 (ja)	2006-04-26	Ｉｃカードの製造方法
JPH07164787A (ja)	1995-06-27	Ｉｃカードの製造方法
JPH0216235B2 (it)	1990-04-16
JPH05509267A (ja)	1993-12-22	携帯可能なデータ媒体装置の製造方法
JPS6134687A (ja)	1986-02-18	Ｉｃカ−ド
JP2000151061A (ja)	2000-05-30	電子回路用基板、電子回路およびその製造方法
JP2010097459A (ja)	2010-04-30	Ｉｃカード
JP4489409B2 (ja)	2010-06-23	Ｉｃカード用ｉｃモジュールの形成方法とｉｃカード用ｉｃモジュール
JP2661101B2 (ja)	1997-10-08	Ｉｃカード
JPS60178589A (ja)	1985-09-12	Ｉｃカ−ド及びその製造方法
JPS62135393A (ja)	1987-06-18	Ｉｃモジユ−ル
JPS62227796A (ja)	1987-10-06	Ｉｃカ−ド
JPH0530198B2 (it)	1993-05-07
JPS60164884A (ja)	1985-08-27	Ｉｃカ−ドの製造方法