JPH02161302A - Shape measuring instrument - Google Patents
Shape measuring instrumentInfo
- Publication number
- JPH02161302A JPH02161302A JP31374388A JP31374388A JPH02161302A JP H02161302 A JPH02161302 A JP H02161302A JP 31374388 A JP31374388 A JP 31374388A JP 31374388 A JP31374388 A JP 31374388A JP H02161302 A JPH02161302 A JP H02161302A
- Authority
- JP
- Japan
- Prior art keywords
- light
- slit
- psd
- measured
- spot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 238000005259 measurement Methods 0.000 abstract description 21
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 4
- 238000011549 displacement method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 210000003625 skull Anatomy 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はスリット又は複数のスポット光を用いた形状測
定装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a shape measuring device using a slit or a plurality of spot lights.
（従来の技術〕
三角測量を用いた形状測定にはスポット光を投影する方
法がある。(Prior Art) Shape measurement using triangulation includes a method of projecting spot light.
第５図のように光源１より光点をレンズ２を介Ｌ＝
（Ｄ：投・受光部間の距離、Ｆ：受光レンズと受光セン
サ間の距離、Ｘ：受光センサの電極より光の入射位置ま
での距離）より測定対象物３までの距離りを求めるとい
う方法である。As shown in Figure 5, the light point is transmitted from the light source 1 through the lens 2 L = (D: distance between the light emitting and light receiving parts, F: distance between the light receiving lens and the light receiving sensor, In this method, the distance to the object to be measured 3 is determined from the distance to the measured object (distance to the position).
然しなからこのような方法では測定精度を上げるため直
径数１０μｍ〜１ｍｍ程度の点光源で測定しているため
に、例えば回路パターン直接描画装置における基板表面
の形状計測等のような広い範囲の全面を隈無く計測する
ような場合にはＸ−Ｙステージ等を用いて測定の都度測
定対象物を移動するか、センサの方を走査するなどの必
要があり、測定に時間がか＼る欠点がある。However, in order to increase the measurement accuracy, this method uses a point light source with a diameter of several tens of micrometers to 1 mm, so it is difficult to measure the entire surface of a wide area, such as when measuring the shape of a board surface in a circuit pattern direct drawing device. When measuring everything thoroughly, it is necessary to use an X-Y stage, etc. to move the object to be measured each time, or to scan the sensor, which has the disadvantage that the measurement takes time. be.
この測定時間を短縮する方法として光切断法（スリット
光投影法）がある。これは第６回に示す如く、投影する
パターンをスポット光からスリット光６に一次元拡張し
て測定の高速化を図ったものである。There is a light cutting method (slit light projection method) as a method for shortening this measurement time. As shown in Part 6, this is an attempt to speed up the measurement by expanding the projected pattern one-dimensionally from the spot light to the slit light 6.
なお、点線で示す枠内が受光センサ５の取り込める範囲
を概略水している。Note that the frame indicated by the dotted line roughly represents the range that the light receiving sensor 5 can capture.
スポット光を用いる第５図の光点変位法では光点毎に１
点、１点測定していたが、光切断法ではスポット源を一
次元拡張した線光源と二次元受光センサで一遍に測定す
ることができ、光点変位法のような測定対象物やセンサ
の移動走査が不要なため、より高速に測定することが可
能であるが、光切断法では光源としてスリット光（線光
源）を用いるため、受光には二次元の受光センサを用い
ねばならない。この二次元受光センサとしては通常、Ｃ
ＯＤ等の二次元ディジタルイメージセンサが用いられる
。二次元ＣＣＤセンサ５ａは例えばインクライン型のＣ
ＯＤとして第７図（ａ）に示すようにＩＣチップ上にホ
トダイオード７を二次元アレイに配置したものであるた
め、情報を出力するのに各ホトダイオード（画素）の１
つ１つの内容を読みだし走査しなくてはならず、一定の
検出時間が必要となる。In the light spot displacement method shown in Figure 5, which uses spot light, each light spot has 1
Previously, measurements were taken at a single point, but with the light section method, measurements can be made at once using a line light source, which is a one-dimensional extension of the spot source, and a two-dimensional light receiving sensor. Since no moving scanning is required, faster measurement is possible, but since the optical cutting method uses a slit light (line light source) as a light source, a two-dimensional light receiving sensor must be used to receive the light. This two-dimensional light receiving sensor usually uses C
A two-dimensional digital image sensor such as an OD is used. The two-dimensional CCD sensor 5a is, for example, an incline type CCD sensor.
Since the OD is a two-dimensional array of photodiodes 7 arranged on an IC chip as shown in FIG.
Each content must be read out and scanned, and a certain amount of detection time is required.
また、第７開山）に示すようにスリット光６の反射光が
レンズ４を介して二次元ＣＣＤセンサ５ａのホトダイオ
ード７ａ、７ｂに当たると、デジタル信号Ｐ出力となり
、見掛は上ホトダイオード７ａ、７ｂがオンになりホト
ダイオード７ａ、７ｂの中心Ｅが出力信号となる。一方
、スリット光６の反射光の中心はＣであるから、両者の
間にｅの誤差が出てしまう。従って、形状測定の精度を
高めるには受光センサの分解能を高めることが必要なた
め、ＣＯＤの画素のビット数を増やさなくてはならず、
それにつれてＣＯＤの走査時間も増して測定が遅くなっ
てしまう。In addition, as shown in Figure 7), when the reflected light of the slit light 6 hits the photodiodes 7a and 7b of the two-dimensional CCD sensor 5a through the lens 4, it becomes a digital signal P output, and it appears that the upper photodiodes 7a and 7b are When turned on, the center E of the photodiodes 7a and 7b becomes an output signal. On the other hand, since the center of the reflected light of the slit light 6 is C, an error of e appears between the two. Therefore, in order to improve the accuracy of shape measurement, it is necessary to increase the resolution of the light receiving sensor, so the number of bits of the COD pixel must be increased.
Correspondingly, the COD scanning time also increases, making measurement slow.
このように、測定精度を高めようとすると測定時間が長
くなり、測定時間の短縮を図ると精度が悪化するという
問題があるために測定の高速化は困難であった。As described above, it has been difficult to increase the speed of measurement because there is a problem in that trying to increase measurement accuracy increases measurement time, and trying to shorten measurement time deteriorates accuracy.
又スポット光の検出素子としてはＰＳＤ （半導体装置
検出器）があるが、これはＣＯＤと異なりアナログ型の
素子であり、分解能が高く、又読み出し走査が不要なた
め高速応答が可能である。Further, a PSD (semiconductor device detector) is used as a detection element for spot light, but unlike a COD, this is an analog type element, has high resolution, and does not require readout scanning, so high-speed response is possible.
第８図は半導体装置検出器（−次元ＰＳＤ）８の断面説
明図であり、両面が均一な抵抗層により形成されており
、抵抗層の両端に信号取り出し用の一対の電極Ａ、Ｂが
設けられて、光電効果により光電流を生成する。画電極
Ａ、 Ｂの距離をｌとし、電極Ａより光の入射位置ま
での距離をＸとすれば光の入射位置で発生した光生成電
流Ｉｏは、夫々の電極までの距離に逆比例するように分
割されて取り出されるため光の入射位置を測定すること
ができる。FIG. 8 is an explanatory cross-sectional view of a semiconductor device detector (-dimensional PSD) 8, in which both sides are formed of a uniform resistance layer, and a pair of electrodes A and B for signal extraction are provided at both ends of the resistance layer. and generates a photocurrent due to the photoelectric effect. If the distance between picture electrodes A and B is l, and the distance from electrode A to the light incident position is X, then the photogenerated current Io generated at the light incident position is inversely proportional to the distance to each electrode. Since the light is divided into two parts and extracted, the incident position of the light can be measured.
然しなから、ＰＳＤではスポット光の位置検出しかでき
ないため、光点変位法には盛んに使われているもの＼光
切断法には用いることができなかった。However, since PSD can only detect the position of spot light, it cannot be used for the light cutting method, which is widely used for the light spot displacement method.
本発明のスリット又は複数のスポット光を用いた形状測
定装置は上記のような欠点を除くようにしたものである
。The shape measuring device using a slit or a plurality of spot lights according to the present invention is designed to eliminate the above-mentioned drawbacks.
本発明の形状測定装置は幅の細い一次元半導体装置検出
器（Ｐ Ｓ Ｄ）を幅方向に複数並列せしめて受光セン
サを形成せしめ、この受光センサの幅方向に沿って被対
象物よりのスリット又は複数のスポット反射光を受光せ
しめるようにしたことを特徴とする。The shape measuring device of the present invention has a plurality of narrow one-dimensional semiconductor device detectors (PSD) arranged in parallel in the width direction to form a light receiving sensor, and a slit from the object to be measured is formed along the width direction of the light receiving sensor. Alternatively, it is characterized in that a plurality of spot reflected lights are received.
本発明のスリット又は複数のスポット光を用いた形状測
定装置によれば高い分解能で高速に形状が測定されるよ
うになる。According to the shape measuring device using a slit or a plurality of spot lights of the present invention, shapes can be measured at high speed with high resolution.
以下図面によって本発明の詳細な説明する。 The present invention will be explained in detail below with reference to the drawings.
本発明においては第１図に示すようにシ゛リコン基板の
表面側に露光したパターンの上に不純物を拡散させて形
成した幅の細い（幅が細ければ不純物が均一にできるた
め精度が向上する）−次元ＰＳＤ８ａを幅方向に複数並
列して設け、光源としてスリット又は複数のスポット光
を用い、各ＰＳＤ８ａの両端の電極Ａ（ＩＡＩ、 ＩＡ
２ ・・・ＩＡｎ）及びＢ（ＩＢＩ、 ＩＢ２ ・
・・ＩＢｎ）より出力を取り出し、例えば第２図（ａ）
に示す回路に加える。In the present invention, as shown in Fig. 1, a narrow width pattern is formed by diffusing impurities on a pattern exposed on the front side of a silicon substrate (the narrower the width, the more uniform the impurities are, improving accuracy). A plurality of -dimensional PSDs 8a are arranged in parallel in the width direction, a slit or a plurality of spot lights are used as a light source, and electrodes A (IAI, IA) at both ends of each PSD 8a are provided.
2...IAn) and B(IBI, IB2 ・
...IBn), for example, as shown in Fig. 2(a).
Add to the circuit shown in .
第２（ａ）図において９，１０はプリアンプ、１１はア
ナログスイッチ、ｌｌａはバッファアンプ、１２はサン
プルホールド回路、１３はアナログ／デジタル変換回路
、１４は入力ポート、１５はＣＰＵ、１６は出力ボート
、１７は光源ドライバ、１８は入出力ボートで、モード
設定或いはステータス表示部を入力すると共に、測定値
を表示するための不図示の出力表示部が接続される。ま
た、１９はスリット板である。光源１からの光はレンズ
２、スポット板１９によりスリット光となり、測定対象
物３上に投射される。測定対象物３上のスリット光の反
射光は受光レンズ４を介してＰＳＤ８ａの受光面上に結
像され、そのＰＳＤＢａ上のスポット光の位置変位より
測定対象物３の表面形状を測定することができる（図示
の点線部は、投射したスリット光及び受光した反射スリ
ット光を示す）。更に、上記のスリット板１９の代わり
に第２図（ｂ）に示すような複数のスポット孔を有する
スポット板１９ａ等を使用してもよい（図示の０部は、
投射したスポット光及び受光した反射スポット光を示す
）。In Fig. 2(a), 9 and 10 are preamplifiers, 11 is an analog switch, lla is a buffer amplifier, 12 is a sample hold circuit, 13 is an analog/digital conversion circuit, 14 is an input port, 15 is a CPU, and 16 is an output port. , 17 is a light source driver, and 18 is an input/output board, to which a mode setting or status display section is input, and an output display section (not shown) for displaying measured values is connected. Further, 19 is a slit plate. The light from the light source 1 is turned into slit light by the lens 2 and the spot plate 19, and is projected onto the object to be measured 3. The reflected light of the slit light on the measurement object 3 is imaged on the light receiving surface of the PSD 8a via the light receiving lens 4, and the surface shape of the measurement object 3 can be measured from the positional displacement of the spot light on the PSDBa. (The illustrated dotted line indicates the projected slit light and the received reflected slit light.) Furthermore, instead of the slit plate 19 described above, a spot plate 19a having a plurality of spot holes as shown in FIG. 2(b) or the like may be used (part 0 in the figure is
(shows the projected spot light and the received reflected spot light).
また、上記の実施例では、−次元ＰＳＤ８ａを幅方向に
複数並列して設けたが、第３図及び第４図に示すものは
２ｍｍピッチのような広間隔測定を行う場合に適用され
る他の実施例である。即ち、第３図は、−次元ＰＳＤ８
ａを夫々所定間隔に並列したものである。然しなから、
第３図において、測定対象物３の形状、レンズ４の精度
や傾き等によりレンズ４を通した光が一次元ＰＳＤＢａ
上に精度良（受光出来ないような場合は、精度良く受光
出来るような個数、例えば４個の一次元ＰＳＤ８ｂを幅
方向に密着したグループを第４図に示すように夫々所定
間隔に並列しておくことにより、間隔の補正を行うこと
が出来る。In addition, in the above embodiment, a plurality of -dimensional PSDs 8a are provided in parallel in the width direction, but the ones shown in FIGS. 3 and 4 are applicable to wide interval measurements such as 2 mm pitch. This is an example. That is, FIG. 3 shows -dimensional PSD8
a are arranged in parallel at predetermined intervals. Of course,
In Fig. 3, the light passing through the lens 4 is one-dimensional PSDBa due to the shape of the measurement object 3, the precision and inclination of the lens 4, etc.
(If the light cannot be received accurately, the number of one-dimensional PSDs 8b that can receive the light with high accuracy, for example, a group of four one-dimensional PSDs 8b, closely spaced in the width direction, are arranged in parallel at predetermined intervals as shown in Figure 4. By setting the distance, the interval can be corrected.
本発明のスリット又は複数のスポット光を用いた形状測
定装置は上記のような構成であるから例えばスリット、
又はスポット光の幅又は径が１００μｍであれば、各Ｐ
ＳＤＩ本の幅も１００μｍとすればこれによって光切断
方式のセンシングを行うことができ、高速、高分解能の
形状測定が可能となる。Since the shape measuring device of the present invention using a slit or a plurality of spot lights has the above configuration, for example, a slit,
Or, if the width or diameter of the spot light is 100 μm, each P
If the width of the SDI line is also 100 μm, optical cutting type sensing can be performed, and high-speed, high-resolution shape measurement becomes possible.
更に、分解能を向上させるには、各の幅をスリット又は
スポット光の幅又は径よりも小さくすれば良い。Furthermore, in order to improve the resolution, each width may be made smaller than the width or diameter of the slit or spot light.
上記のように本発明のスリット又はスポット光を用いた
形状測定装置によれば高分解能を有せしめ得るアナログ
型素子を用い、走査することなく高速度で形状測定が可
能となる大きな利益がある。As described above, the shape measuring device using a slit or spot light according to the present invention has the great advantage of being able to measure shapes at high speed without scanning by using an analog type element that can have high resolution.
第１図は本発明の形状測定装置に用いる受光センサの説
明図、第２図は本発明の形状測定装置の回路図であり、
同図（ａ）は光源側にスリット板を設けた時の回路図、
同図（′ｂ）は光源側にスポット板を設けた時の回路図
、第３図及び第４図は第１図に示す受光センサの他の実
施例を夫々示す説明図、第５図は従来の光点変位法を用
いた形状測定装置の説明図、第６図は従来のスリット光
を用いた形状測定装置の説明図、第７図（ａ）及び（ｂ
）はＣＣＤセンサの説明図とスリット光の反射光による
精度誤差に関する説明図、第８図はＰＳＤセンサの説明
図である。
ｌ・・・光源、２．４・・・レンズ、３・・・測定対象
物、５・・・受光センサ、６・・・スリット光、７・・
・ホトダイオード、８． ８ａ、 ８ｂ・・・半導体
装置検出器（−次元ＰＳＤ）、９゜１０・・・プリアン
プ、１１・・・アナログスイッチ、１２・・・サンプル
ホールド回路、１３・・・アナログ／デジタル変換回路
、１４・・・入力ポート、１５・・・ＣＰＵ、１６・・
・出力ボート、１７・・・光源ドライバ、１８・・・入
出力ボート、１９・・・スリット板、１９ａ・・・スポ
ット板、Ａ、Ｂ・・・電極。
為
回
あ
目（ａ）
垢
菌
ＩＡ ｌ８３Ａ
ｎ ｆｅｎあ
凹FIG. 1 is an explanatory diagram of a light receiving sensor used in the shape measuring device of the present invention, and FIG. 2 is a circuit diagram of the shape measuring device of the present invention.
Figure (a) is a circuit diagram when a slit plate is provided on the light source side.
Figure ('b) is a circuit diagram when a spot plate is provided on the light source side, Figures 3 and 4 are explanatory diagrams showing other embodiments of the light receiving sensor shown in Figure 1, and Figure 5 is a circuit diagram when a spot plate is provided on the light source side. An explanatory diagram of a shape measuring device using a conventional light spot displacement method, FIG. 6 is an explanatory diagram of a shape measuring device using a conventional slit light, and FIGS. 7(a) and (b)
) is an explanatory diagram of a CCD sensor and an explanatory diagram regarding accuracy errors due to reflected light of slit light, and FIG. 8 is an explanatory diagram of a PSD sensor. l...Light source, 2.4...Lens, 3...Measurement object, 5...Light receiving sensor, 6...Slit light, 7...
・Photodiode, 8. 8a, 8b... Semiconductor device detector (-dimensional PSD), 9°10... Preamplifier, 11... Analog switch, 12... Sample hold circuit, 13... Analog/digital conversion circuit, 14 ...Input port, 15...CPU, 16...
- Output boat, 17... Light source driver, 18... Input/output boat, 19... Slit plate, 19a... Spot plate, A, B... Electrode. Tamekai Ame (a) Skull bacteria IA l83A
n fen concave
Claims (1)
方向に複数並列せしめて受光センサを形成せしめ、この
受光センサの幅方向に沿って被対象物よりのスリット又
は複数のスポット反射光を受光せしめるようにしたこと
を特徴とする形状測定装置。(1) A plurality of narrow one-dimensional semiconductor device detectors (PSD) are arranged in parallel in the width direction to form a light receiving sensor, and a slit or a plurality of spots of reflected light from the target object are formed along the width direction of the light receiving sensor. A shape measuring device characterized by being configured to receive light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31374388A JPH02161302A (en) | 1988-12-14 | 1988-12-14 | Shape measuring instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31374388A JPH02161302A (en) | 1988-12-14 | 1988-12-14 | Shape measuring instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02161302A true JPH02161302A (en) | 1990-06-21 |
Family
ID=18044995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31374388A Pending JPH02161302A (en) | 1988-12-14 | 1988-12-14 | Shape measuring instrument |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02161302A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0567195A (en) * | 1991-09-05 | 1993-03-19 | Matsushita Electric Ind Co Ltd | Shape measuring instrument |
| JPH0567197A (en) * | 1991-09-05 | 1993-03-19 | Matsushita Electric Ind Co Ltd | Shape measuring instrument |
| JP2004037274A (en) * | 2002-07-03 | 2004-02-05 | Sumitomo Osaka Cement Co Ltd | Height measuring apparatus and monitoring device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6044810A (en) * | 1983-08-22 | 1985-03-11 | Matsushita Electric Ind Co Ltd | Device for detecting position of spot light |
-
1988
- 1988-12-14 JP JP31374388A patent/JPH02161302A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6044810A (en) * | 1983-08-22 | 1985-03-11 | Matsushita Electric Ind Co Ltd | Device for detecting position of spot light |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0567195A (en) * | 1991-09-05 | 1993-03-19 | Matsushita Electric Ind Co Ltd | Shape measuring instrument |
| JPH0567197A (en) * | 1991-09-05 | 1993-03-19 | Matsushita Electric Ind Co Ltd | Shape measuring instrument |
| JP2004037274A (en) * | 2002-07-03 | 2004-02-05 | Sumitomo Osaka Cement Co Ltd | Height measuring apparatus and monitoring device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU748251B2 (en) | Method and system for imaging an object with a plurality of optical beams | |
| US4659936A (en) | Line width measuring device and method | |
| CN109346492A (en) | Line scan image sensor pixel array and body surface defect inspection method | |
| JP4215220B2 (en) | Surface inspection method and surface inspection apparatus | |
| JPH02161302A (en) | Shape measuring instrument | |
| JPH09196624A (en) | Method and apparatus for measurement of very small size | |
| JP3609559B2 (en) | Position detecting element and distance sensor | |
| JPH06258040A (en) | Laser displacement meter | |
| JP2609270B2 (en) | Length measurement method using CCD camera | |
| JP2571694B2 (en) | Light receiving position detecting device using optical fiber for level survey staff | |
| US4077723A (en) | Method of measuring thickness | |
| US20050002044A1 (en) | Method for determination of the level of two or more measurement points, and an arrangement for this purpose | |
| JPS59164910A (en) | Distance measuring apparatus | |
| JP2522191B2 (en) | IC lead height measuring device | |
| JP2512871B2 (en) | Pattern measuring device | |
| JPS6361110A (en) | High-speed three-dimensional measuring method and device | |
| JPH0665964B2 (en) | Displacement measuring method and device | |
| JPS623609A (en) | Range finder | |
| JPH01242906A (en) | Linearizing method by light cutting method | |
| JPH0552517A (en) | Speckle displacement meter | |
| JPH1183453A (en) | Micro-form measuring device | |
| JP2675051B2 (en) | Optical non-contact position measuring device | |
| JP3319666B2 (en) | Edge detection device | |
| JPH07234116A (en) | Warpage rate measuring method for plate material | |
| JPH08247735A (en) | Device for inspecting terminal of electronic component |