JPH0215594A - Manufacture of electroluminescence device - Google Patents
Manufacture of electroluminescence deviceInfo
- Publication number
- JPH0215594A JPH0215594A JP63166563A JP16656388A JPH0215594A JP H0215594 A JPH0215594 A JP H0215594A JP 63166563 A JP63166563 A JP 63166563A JP 16656388 A JP16656388 A JP 16656388A JP H0215594 A JPH0215594 A JP H0215594A
- Authority
- JP
- Japan
- Prior art keywords
- pctfe
- bag
- opening portion
- opening
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005401 electroluminescence Methods 0.000 title claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 claims abstract description 18
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 claims abstract description 16
- -1 polychloro-trifluoroethylene Polymers 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 16
- 230000004927 fusion Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 15
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 238000000354 decomposition reaction Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- KXJGSNRAQWDDJT-UHFFFAOYSA-N 1-acetyl-5-bromo-2h-indol-3-one Chemical compound BrC1=CC=C2N(C(=O)C)CC(=O)C2=C1 KXJGSNRAQWDDJT-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical group [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電界発光〔工Ｖクトロルミネセンス（以下、Ｅ
Ｌと称す）〕ヲ利用した表示装置の新規な製造法に関す
る。Detailed Description of the Invention (Industrial Application Field) The present invention relates to electroluminescence (hereinafter referred to as electroluminescence).
(hereinafter referred to as L)
（従来の技術）
ＥＬ装ｒ１ｔは面光源として表示、照明、テレビ等への
適用が可能でめり、ガラスヤプラスチックのような透明
基板上に透明電極を設け、その上にＺｎＳ等の螢光体粉
末をスチレン樹脂、アクリル樹脂等の＃ｌｔ率が大きく
誘′鑞損失の少ない合成樹脂と混合してスプレー法等に
よ５１［Ｉ形成することによりＥＬ）ｍｔ−設け、更に
上部電極ｔ−設けた所謂「粉末ＥＬ装置」、或いは透明
基板１１に透明電極を設け、更に下部絶縁ノー、ＥＬ＃
、上部絶縁ノ！！１′ｓ？よび上部電極を順次蒸着法で
形成した所謂「薄膜ＥＬ装置」等が知られている。(Prior art) EL devices can be applied to displays, lighting, televisions, etc. as a surface light source.A transparent electrode is provided on a transparent substrate such as glass or plastic, and a fluorescent material such as ZnS is placed on top of the transparent electrode. The body powder is mixed with a synthetic resin having a high #lt ratio and low dielectric loss, such as styrene resin or acrylic resin, and a spray method or the like is used to form 51 [I (EL) mt-. A so-called "powder EL device" is provided, or a transparent electrode is provided on the transparent substrate 11, and a lower insulation layer, EL#
, upper insulation! ! 1's? A so-called "thin film EL device" in which a top electrode and an upper electrode are sequentially formed by a vapor deposition method is known.
ところで、かようなＥＬ装置の５４命は主として湿気に
より左右されることが明らかにされており、このため、
粉末ＥＬ装置、薄膜ＥＬ装ｖｊｔは防湿性の優れ九ポリ
クロロトリフルオロエチレン（以下。By the way, it has been revealed that the life of such an EL device is mainly affected by humidity, and for this reason,
Powder EL device and thin film EL device VJT have excellent moisture resistance.
ＰＣＴＦＥと称す）により披糧している。(referred to as PCTFE).
しかして、ＰＣＴＦＥによる被＆は、ＰＣＴＦＥ フ
ィルム２枚の間にＥＬ装置に体を配置し、全体をホット
プレス等により力ロ熱加圧する方法により行なっている
。Therefore, the coating with PCTFE is carried out by placing the body in an EL device between two PCTFE films, and applying forceful heat to the whole body using a hot press or the like.
（発明が解決しようとする課題）
しかしながら、上記方法によるときは、 ＰＣＴＦＥの
融点（約２１０℃）以上に昇温させなければならず、こ
の高温がＥＬ装置基体に作用し、ＥＬ層等を形成する成
分の変質１分解等が懸念されるばかりでなく、融着部に
気泡を生ずることがあり２この気泡による機械的強度ｆ
防湿性の低”Ｆを招くこともあった。(Problem to be Solved by the Invention) However, when using the above method, the temperature must be raised above the melting point of PCTFE (approximately 210°C), and this high temperature acts on the EL device substrate, causing the formation of the EL layer, etc. Not only is there a concern about deterioration and decomposition of the components, but also bubbles may be formed in the fused portion.2 The mechanical strength due to these bubbles is
This sometimes resulted in low moisture resistance.
従って１本発明はＰＣＴＦＥ ＫよるＥＬ装置基体の被
覆時に、該基体に作用する熱を最小限とし、ＥＬ層等全
構成する成分の変質１分解を阻止し得る有用な方法ケ提
供することを目的とする。Therefore, an object of the present invention is to provide a useful method for coating an EL device substrate with PCTFE K, which can minimize the heat acting on the substrate and prevent deterioration and decomposition of all constituent components such as the EL layer. shall be.
（課題を解決する几めの手段）
本発明はＥＬ装置の新規な製造法に係り、ＰＣＴＦＥか
ら成る袋状物を形成し、この袋状物内にＥＬ装置基体を
挿入し１次いで収装状物の開口部を熱融着により閉鎖す
ることを特徴とするものである。(Elaborate Means for Solving the Problems) The present invention relates to a novel method for manufacturing an EL device, in which a bag-like object made of PCTFE is formed, an EL device substrate is inserted into the bag-like object, and then an EL device is formed into a housing. It is characterized by closing the opening of the object by heat fusion.
本発明の方法においては、先ずＰＣＴＦＥ製の袋状物が
形成される。この袋状物は１例えば（ａ）ＰＣＴＦＥフ
ィルム２枚ｔｌ−ｉｔね合わせ、その三辺をヒートシー
ルすることにより、１つの開口部を有する袋状物とする
方法、 （ｂ） ＰＣＴＦＥフィルム２枚ｔ−ｔｆ１合
わせ、その対向する２辺をヒートシールすることにより
、２つの開口部を有する筒状の袋状物とする方法０等に
より得られる。In the method of the present invention, first a pouch made of PCTFE is formed. This bag-like object can be produced by one method, for example: (a) two sheets of PCTFE film are folded together and the three sides are heat-sealed to form a bag-like object having one opening; (b) two sheets of PCTFE film are By aligning t-tf1 and heat-sealing the two opposing sides, a cylindrical bag having two openings can be obtained by method 0 or the like.
本発明においては、上記の如き方法により傅られた袋状
物内に、その開口部からＥＬ装置基体が挿入され１次い
で開口部が閉鎖される。この開口部の閉鎖作業は、全体
を加熱するようなホットプレス法を採用せず、開口部の
みを加熱融着する方法（例えば、ヒートシーラーにより
開口部のみ全加熱して融着する方法）を採用するものと
する。In the present invention, the EL device substrate is inserted through the opening into the bag-like object, which is opened by the method described above, and then the opening is closed. To close this opening, instead of using a hot press method that heats the entire opening, a method of heating and fusing only the opening (for example, a method of heating and fusing only the opening with a heat sealer) is used. shall be adopted.
本発明はこのようにＰＣＴＦＥ袋状物の開口部全熱融着
により閉鎖するものであり、融、ｔＷｋ容易にするため
、 ＰＣＴＦＥ袋状物の内周面にホントメルト接着剤
層を設けておくことヤ、核袋状物内周面に接着処理（コ
ロナ放［＠理、スパッタエツチング処理等）を施すこと
もできる。In this way, the present invention closes the opening of a PCTFE bag by full heat fusion, and in order to facilitate melting, a true melt adhesive layer is provided on the inner peripheral surface of the PCTFE bag. Alternatively, an adhesive treatment (corona radiation treatment, sputter etching treatment, etc.) may be applied to the inner peripheral surface of the nuclear bag.
なｐ、ＥＬ装置基体としては特ｉｃ限定されず、種々の
ものを使用し得る。例えば、透明プラスチック基材の片
面上に透明電極１発光体層、絶縁層および背面電極を順
次積層せしめたものを具体例として挙げることができる
。The substrate for the EL device is not particularly limited to IC, and various substrates can be used. For example, a specific example is one in which a transparent electrode, a light emitter layer, an insulating layer, and a back electrode are sequentially laminated on one side of a transparent plastic base material.
（実施例） 以下１本発明の実施例Ｖこついて述べる。(Example) Embodiment V of the present invention will be described below.
実施例
厚さ７５μ亀の透明なポリエチレンテレフタレートフィ
ルムの片面上に、Ｓｎ含有量がＩＯ重重量であるＩｎ−
Ｓｎ合金金ターゲットとして用い、酸素との反応性マグ
ネトロンスパッタリング法により、厚さ２００ Ａの透
明導電Ｊ−から成る透明電極全形成する。Example: On one side of a 75μ thick transparent polyethylene terephthalate film, an In-
A transparent electrode consisting of transparent conductive J- with a thickness of 200 A was entirely formed by using a Sn alloy gold target as a reactive magnetron sputtering method with oxygen.
その後、バインダーとしてのシアノエチルセルロースの
１七トン溶液に、４１光体粉末金分散させ。Thereafter, 41-photon powder gold was dispersed in a 17-ton solution of cyanoethylcellulose as a binder.
この液を透明電極上にスクリーン印刷法により塗布し、
６０℃で１２０分間加熱し、更に温度を１５０℃にと昇
せしめ２分間加熱することによシ、厚さ６０μ愼の発光
体ノーを形成する。なお、上記螢光体粉末としては硫化
亜鉛を主成分とする粉末を用い。This liquid is applied onto the transparent electrode by screen printing method,
By heating at 60° C. for 120 minutes, and then increasing the temperature to 150° C. and heating for 2 minutes, a 60 μm thick phosphor layer is formed. Note that the phosphor powder used is a powder whose main component is zinc sulfide.
該粉末とシアノエチルセルロースとの配合比（重量比）
は８４ ： １６とした。Mixing ratio (weight ratio) of the powder and cyanoethyl cellulose
The ratio was 84:16.
次いで１発元体層上に前記と同じシアノエチルセルロー
スのアセトン溶液にチタン酸バリウム粉末を分散せしめ
て塗布する。なｐ、チタン酸バリウムとシアンエチルセ
ルロースとの配合比（重量比）はｌ：１とした。Next, barium titanate powder is dispersed in the same acetone solution of cyanoethylcellulose as described above and applied onto the one-shot base layer. The blending ratio (weight ratio) of barium titanate and cyanethylcellulose was 1:1.
その後、温度６０℃で１２０分間加熱しアセトンの大部
分を除去し、厚さ２００μｍのアルミニウム箔を載置し
、温度をｌ ５ Ｑ ’Ｃにと昇せしめ、２分間加熱す
ることにより１発光体１−に、に絶縁Ｊ−全形成せしめ
ると共に、該絶縁ノー上にアルミニウム箔（背面電極）
′ｆ：密着させて、ＥＬ装置基体を得る。Thereafter, most of the acetone was removed by heating at a temperature of 60°C for 120 minutes, a 200 μm thick aluminum foil was placed, the temperature was raised to l 5 Q 'C, and heating was performed for 2 minutes to produce one luminescent material. 1-, the insulation J- is completely formed, and an aluminum foil (back electrode) is placed on the insulation J-
'f: Bring them into close contact to obtain an EL device substrate.
一方、これとは別に厚さ２００μｍのＰＣＴＦＥフィル
ム２枚を重ね合わせ、その３辺をヒートシーラーにより
加熱融着しく２５０℃、１分間）、１つの開口部を有す
る袋状物金得る。Separately, two PCTFE films each having a thickness of 200 .mu.m were stacked on top of each other, and their three sides were heat-sealed using a heat sealer at 250.degree. C. for 1 minute to obtain a bag-like metal having one opening.
この袋状物の開口部から前記ＥＬ装を基体を挿入し１次
いで該開口部のみをヒートクーラにより熱融着しく２５
０℃、１分間）、ＥＬ装置を得た。The base body of the EL device is inserted through the opening of the bag-like object, and then only the opening is heat-sealed using a heat cooler.
0° C. for 1 minute) to obtain an EL device.
このＥＬ装置は熱融着時における装置基体の変質１分解
等を生じておらず、瀞命の長いものであった。This EL device did not undergo any deterioration or decomposition of the device substrate during heat fusion, and had a long lifespan.
比較例
実施例で用いたＰＣＴＦＥ −ｙイルム２枚の間にＥＬ
装置基体（実施例に用いたと同じもの）全配置し、全体
をホットプレス機ＶＣより、温度２５０℃。Comparative Example EL was placed between the two PCTFE-y films used in the example.
The entire apparatus base (the same one used in the example) was placed, and the whole was heated at 250°C using a hot press machine VC.
圧力３０ Ｋｇ／ｃ４の条件で１分間加熱加圧し、フィ
ルム端縁全周を熱融着し、ＥＬ装置金得た。The film was heated and pressed for 1 minute at a pressure of 30 kg/c4 to heat-seal the entire edge of the film to obtain an EL device.
このＥＬ装置は熱融着作業時にＥＬ装置基体に高熱が作
用して訃り、そのため寿命が短かいものであった。This EL device suffered from high heat acting on the EL device substrate during the heat-sealing operation, resulting in a short lifespan.
（発明の効果）
本発明は上記のようＶＣ構成されて訃り、ＥＬ装置基体
を挿入したＰＣＴＦＥ袋状物の閉鎖に際し。(Effects of the Invention) The present invention is applied to the closure of a PCTFE bag having a VC structure as described above, into which an EL device substrate is inserted.
該袋状物の開口部のみを加熱するようにしたので。This is because only the opening of the bag-like object is heated.
ＥＬ装置基体への熱の作用を最小限にでき、該基体の変
質５分解等全防止し得る特徴を有する。It has the characteristics of being able to minimize the effect of heat on the EL device substrate and completely preventing deterioration and decomposition of the substrate.
時計出願人 日Ｍ＊気工業株式会社 代表者謙居五朗watch applicant NichiM*ki Kogyo Co., Ltd. Representative Goro Kengo
Claims (1)
成し、この袋状物内に電界発光装置基体を挿入し、次い
で該袋状物の開口部を熱融着により閉鎖することを特徴
とする電界発光装置の製造法。Electroluminescence characterized by forming a bag-like object made of polychlorotrifluoroethylene, inserting an electroluminescent device substrate into the bag-like object, and then closing an opening of the bag-like object by heat fusion. Method of manufacturing the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63166563A JPH0215594A (en) | 1988-07-04 | 1988-07-04 | Manufacture of electroluminescence device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63166563A JPH0215594A (en) | 1988-07-04 | 1988-07-04 | Manufacture of electroluminescence device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215594A true JPH0215594A (en) | 1990-01-19 |
Family
ID=15833583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63166563A Pending JPH0215594A (en) | 1988-07-04 | 1988-07-04 | Manufacture of electroluminescence device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215594A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0532946A (en) * | 1991-07-31 | 1993-02-09 | Lintec Corp | Releasable tacky adhesive polymer |
-
1988
- 1988-07-04 JP JP63166563A patent/JPH0215594A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0532946A (en) * | 1991-07-31 | 1993-02-09 | Lintec Corp | Releasable tacky adhesive polymer |
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