JPH02154434A - Resin-seal molding of electronic component - Google Patents
Resin-seal molding of electronic componentInfo
- Publication number
- JPH02154434A JPH02154434A JP63309743A JP30974388A JPH02154434A JP H02154434 A JPH02154434 A JP H02154434A JP 63309743 A JP63309743 A JP 63309743A JP 30974388 A JP30974388 A JP 30974388A JP H02154434 A JPH02154434 A JP H02154434A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- cavity
- resin material
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 116
- 229920005989 resin Polymers 0.000 claims abstract description 116
- 239000000463 material Substances 0.000 claims abstract description 59
- 238000007789 sealing Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C2045/14672—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame moulding with different depths of the upper and lower mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
- B29C2045/2712—Serial gates for moulding articles in successively filled serial mould cavities
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、例えば、ＩＣ等の電子部品を熱硬化性樹脂
材料により封１Ｆ成形する方法の改良に係り、特に、樹
脂成形用金型のキャビティ内に嵌装セットした電子部品
におけるホンディングワイヤの変形・断線等の弊害を効
率良く且つ確実に防止するように改善したものに関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a method for sealing and molding electronic components such as ICs with a thermosetting resin material, and in particular, to improvement of a mold for resin molding. The present invention relates to an improved device that efficiently and reliably prevents disadvantages such as deformation and disconnection of a bonding wire in an electronic component fitted and set in a cavity.
電子部品を熱硬化性樹脂材料にて封止成形するために、
従来より、トランスファ樹脂成形方法及びその金型装置
が採用されている。In order to seal and mold electronic components with thermosetting resin materials,
Conventionally, transfer resin molding methods and mold apparatuses have been employed.
この装置く第５図参照）には、例えば、通常、固定側の
上型１と、該固定上型］、に対設した可動側の下型２と
、該固定及び可動両型（１・２）のＰ、Ｌ（バーティン
クライン）面に対設した電子部品の樹脂封止成形用キャ
ビティ（３・４）と、上型１側に配置した樹脂材料供給
用のボッＩ・と、該ポット内に嵌装させる樹脂材料加圧
用のプランジャーと、該ポットとキャビティ（４）との
間を連通させた溶融樹脂材料５の移送用通路６が備えら
れている。This device (see Fig. 5) usually includes, for example, an upper mold 1 on a fixed side, a lower mold 2 on a movable side opposite to the fixed upper mold, and both the fixed and movable molds (1 and 2). 2) cavities (3 and 4) for resin sealing molding of electronic components placed opposite to each other on the P and L (bar tink line) surfaces; A plunger for pressurizing the resin material fitted into the pot and a passage 6 for transferring the molten resin material 5 communicating between the pot and the cavity (4) are provided.
また、これによる電子部品の樹脂封止成形は次のように
して行なわれる。Moreover, the resin sealing molding of the electronic component is carried out as follows.
まず、上下両型（１・２）を型開きして、下型２のＰ、
Ｌ面における所定位置に電子部品７を装着したリードフ
レーム８をセットすると共に、この状態で、下型２を上
動させて該両型（１・２）の型締めを行ない、次に、ポ
ット内に樹脂材料を供給すると共に、これをプランジャ
ーにて加圧する。このとき、上記樹脂材料は両型（１・
２）に備えたヒータにより加熱溶融化され且つプランジ
ャーにより加圧されて、ポットから移送用通路６を通し
て両キャビティ（３・４）内に注入充填される。従って
、所要のキュアタイム後に両型（１・２）を型開きして
、該両キャビティ内及び移送用通路内の硬化樹脂成形体
を離型させることにより、両キャビティ（３・４）内の
電子部品７を該両キャビティの形状に対応して成形され
る樹脂成形体（モールドパッケージ）内に封止成形する
ことができるものである。First, open both the upper and lower molds (1 and 2), P of the lower mold 2,
The lead frame 8 with the electronic component 7 mounted thereon is set at a predetermined position on the L surface, and in this state, the lower mold 2 is moved upward to clamp the two molds (1 and 2), and then the pot is A resin material is supplied into the chamber and pressurized with a plunger. At this time, the above resin material is used for both types (1 and 1).
It is heated and melted by the heater provided in step 2) and pressurized by the plunger, and is injected and filled into both cavities (3 and 4) from the pot through the transfer passage 6. Therefore, by opening both molds (1 and 2) after the required curing time and releasing the cured resin moldings in both cavities and the transfer passage, the molds in both cavities (3 and 4) are released. The electronic component 7 can be sealed and molded within a resin molded body (mold package) that is molded to correspond to the shapes of the two cavities.
ところで、上記した樹脂封止成形においては、通常、上
下両キャビティの断面深さを夫々等しく設定する第一の
方法が採用される。By the way, in the resin sealing molding described above, the first method is usually adopted in which the cross-sectional depths of both the upper and lower cavities are set to be equal.
また、電子部品のより確実な樹脂封止成形を目的として
、例えば、一方のキャビティにおける断面深さを他方の
ものよりも深く形成すると共に、この断面深さの深いキ
ャビティ側に電子部品を嵌装セットして樹脂封止成形を
行なうことにより、該キャビティ内で成形される肉厚状
の樹脂成形体内に電子部品を封止成形しようとする第二
の方法（第５図参照）を採用することができる上記した
第一の方法においては、両キャビティの空間部が夫々等
しく構成されることから、該両キャビティ内に加圧注入
された溶融樹脂材料の流動・充填作用も夫々同時的に行
なわれる。しかしながら、この樹脂の性質上、溶融樹脂
材料が所要の流動性を有している間に両キャビティ内に
迅速に加圧注入しなければならないが、その反面、該両
キャビティ内に注入された溶融樹脂材料の流動速度は、
電子部品におけるチップ電極とリードフレームにおける
外部リードとを電気的に接続させるボンディングワイヤ
を変形・断線させることがないような低い数値に設定す
る必要がある。このため、全体的な樹脂成形サイクルタ
イムが長くなって樹脂封止成形効率を低下させる要因と
なり、更に、溶融樹脂材料に対して所定の加圧移送力、
若しくは、所定の樹脂圧を得ることができないときは、
上記両キャビティ内の樹脂未充填状態が発生したり、樹
脂成形体ｔこボイドが形成されて耐湿性を損なう等、こ
の種の樹脂封止成形品の品質及び信頼性を低下させると
云った問題がある。In addition, for the purpose of more reliable resin sealing molding of electronic components, for example, one cavity is formed with a deeper cross-sectional depth than the other, and the electronic component is fitted into the cavity side with the deeper cross-sectional depth. The second method (see Fig. 5) is adopted, in which electronic components are sealed and molded in a thick resin molded body molded within the cavity by setting and performing resin sealing molding. In the first method described above, since the spaces in both cavities are configured equally, the flow and filling action of the molten resin material injected under pressure into both cavities is performed simultaneously. . However, due to the nature of this resin, it is necessary to rapidly inject the molten resin material into both cavities under pressure while it has the required fluidity. The flow rate of resin material is
It is necessary to set the value to a low value so that the bonding wire that electrically connects the chip electrode of the electronic component and the external lead of the lead frame will not be deformed or disconnected. For this reason, the overall resin molding cycle time becomes longer, which is a factor that reduces the resin sealing molding efficiency.
Or, if the specified resin pressure cannot be obtained,
Problems that deteriorate the quality and reliability of this type of resin-sealed molded product, such as the resin being unfilled in both cavities and voids forming in the resin molding, impairing moisture resistance. There is.
また、上記第二の方法のように、両キャビティの一方（
３）側の断面深さＬを他方（４）側の断面深さｌよりも
深く形成すると云う主な目的は、上記したボンディング
ワイヤ７□が所要のループ高さを有することから、電子
部品７を嵌装セットさせる側のキャビティ３の断面深さ
Ｌを深く形成して、電子部品７（ボンディングワイヤ７
１）を該キャビティ３内で成形される肉厚状の樹脂成形
体内に確実に封止成形しようとするものであるが、第５
図に示すように、上下両型（１・２）のＰ、Ｉ、面に対
設した断面深さＬ−βの異なる両キャビティ（３・４）
内に溶融樹脂材料５を加圧注入して該両キャビティ内に
嵌装セットしたリードフレーム８上の電子部品７を樹脂
封止成形する。場合においては、次のような樹脂封止成
形上の問題がある。Also, as in the second method above, one of both cavities (
The main purpose of forming the cross-sectional depth L on the 3) side to be deeper than the cross-sectional depth L on the other (4) side is because the bonding wire 7 □ has the required loop height. The cross-sectional depth L of the cavity 3 on the side where the electronic component 7 (bonding wire 7
1) is reliably sealed and molded in the thick resin molded body molded within the cavity 3.
As shown in the figure, both cavities (3 and 4) with different cross-sectional depths L-β are installed opposite the P, I and surfaces of both upper and lower types (1 and 2).
A molten resin material 5 is injected into the cavities under pressure, and an electronic component 7 on a lead frame 8 fitted and set in both cavities is resin-sealed and molded. In this case, the following problems arise in resin sealing molding.
即ち、広い空間部として構成される断面深さＬの深いキ
ャビティ３側に流入された溶融樹脂材料５１の流動速度
は、これよりも狭い空間部として構成される断面深さｐ
の浅いキャビティ４側に流入した溶融樹脂材料５□の流
動速度よりも早くなり、更に、該両キャビティ内に注入
された溶融樹脂材料（５１・５２）は所要の粘性を有し
ていることとも相俟て、断面深さＬの深いキャビティ３
側に嵌装セットされている電子部、品のボンディングワ
イヤ７１は、流動速度が早められた上記溶融樹脂材料５
１によって変形・断線されることになるため、この種の
樹脂封止成形品の品質及び信頼性を低下させると云った
重大な問題がある。That is, the flow velocity of the molten resin material 51 flowing into the deep cavity 3 side with the cross-sectional depth L, which is configured as a wide space, is greater than the flow velocity of the molten resin material 51, which is formed as a narrower space.
The flow rate is faster than that of the molten resin material 5□ that has flowed into the shallow cavity 4 side, and furthermore, the molten resin material (51, 52) injected into both cavities has the required viscosity. Together, a deep cavity 3 with a cross-sectional depth L
The bonding wire 71 of the electronic parts and products fitted and set on the side is made of the above-mentioned molten resin material 5 whose flow speed has been accelerated.
1 causes deformation and disconnection, which poses a serious problem of degrading the quality and reliability of this type of resin-sealed molded product.
本発明は、上述したような従来の問題点に対処して、電
子部品の全体をホイドが存在しない高密度の樹脂成形体
内に確実に封止成形すると共に、キャビティ内に注入さ
れた溶融樹脂材料の流動速度に起因してホンティンクワ
イヤが変形 断線されるのを効率良く且つ確実に防止し
て、高品質性及び高信頼性を備えたこの種の樹脂封止成
形品を成形することができる電子部品の樹脂封止成形方
法を提供することを目的とするものである。The present invention addresses the above-mentioned conventional problems and reliably seals and molds the entire electronic component in a high-density resin molded body without any voids. This type of resin-sealed molded product with high quality and high reliability can be molded by efficiently and reliably preventing the wire from being deformed or broken due to the flow velocity of the wire. The object of the present invention is to provide a method for resin-sealing and molding electronic components.
本発明に係る電子部品の樹脂封止成形方法は、樹脂成形
用金型におけるＰ、Ｌ面に断面深さの異なるキャビティ
を対設すると共に、その断面深さの浅い方のキャビティ
側にリードフレーム上に装着した電子部品を嵌装セラ１
〜し、且つ、この状態て該金型を型締めして、該キャビ
ティ内に溶融樹脂材料を加圧注入することにより、上記
リードフレーム上の電子部品を樹脂封止成形することを
特徴とするものである。In the resin molding method for electronic components according to the present invention, cavities with different cross-sectional depths are provided oppositely on the P and L surfaces of a resin mold, and a lead frame is placed on the side of the cavity with the shallower cross-sectional depth. Insert the electronic components mounted on the top
...and in this state, the mold is clamped and a molten resin material is injected into the cavity under pressure, thereby molding the electronic component on the lead frame with resin. It is something.
又、本発明に係るマＩ〜リックス型電子部品の樹脂封止
成形方法は、樹脂成形用金型におけるＰ、Ｌ面に断面深
さの異なる所要複数個のキャビティを対設し、且つ、該
各キャビティ間を中間ゲートを介して連通させると共に
、その断面深さの浅い方の各キャビティ内にリードフレ
ーム上に装着した電子部品を夫々嵌装セットし、且つ、
この状態で該金型を型締めして、該各キャビティ内に溶
融樹脂材料を加圧注入することにより、上記リードフレ
ーム上の電子部品を樹脂封止成形することを特徴とする
ものである。Further, the method for resin sealing molding of a matrix type electronic component according to the present invention includes arranging a required plurality of cavities having different cross-sectional depths on the P and L surfaces of a resin molding die, and Each cavity is communicated through an intermediate gate, and electronic components mounted on a lead frame are fitted and set in each cavity with a shallower cross-sectional depth, and
In this state, the mold is clamped and a molten resin material is injected into each cavity under pressure, thereby molding the electronic component on the lead frame with resin.
本発明方法によれは、リードフレーム上の電子部品は断
面深さの浅いキャビティ側に嵌装セットされているので
、該キャビティ内における溶融樹脂材料の流動速度は遅
くなり、従って、電子部品におけるホンディングワイヤ
を変形・断線すると云った弊害を効率良く且つ確実に防
止することができるものである。According to the method of the present invention, since the electronic component on the lead frame is fitted and set on the side of the cavity with a shallow cross-sectional depth, the flow rate of the molten resin material in the cavity is slow, and therefore, the electronic component in the electronic component is fitted and set. This makes it possible to efficiently and reliably prevent problems such as deformation and breakage of the ding wire.
また、電子部品を嵌装セットさせたキャビティ側におけ
る溶融樹脂材料の流動速度を遅くすることができるため
、全体的な樹脂成形時間を短縮化しても、電子部品にお
けるホンディングワイヤの変形・断線を効率良く且つ確
実に防止することかできると共に、該キャビティ内にお
ける高密度の樹脂封止成形を行なうことかできる。In addition, the flow speed of the molten resin material on the cavity side where the electronic components are fitted and set can be slowed down, so even if the overall resin molding time is shortened, the deformation and disconnection of the bonding wire in the electronic components can be reduced. This can be efficiently and reliably prevented, and high-density resin sealing molding can be performed within the cavity.
従って、上記したポンチインクワイヤの変形断線防止作
用と共に、両キャビティ内に注入された溶融樹脂材料に
対して所定の加圧力を加え得て樹脂成形体を高密度成形
すると云う最も重要な樹脂成形作用条件が得られるもの
である。Therefore, in addition to the above-mentioned action to prevent deformation and disconnection of the punch ink wire, the most important resin molding action is to apply a predetermined pressing force to the molten resin material injected into both cavities and mold the resin molded body with high density. The conditions can be obtained.
以下、本発明を第１図乃至第４図に示す実施例図に基つ
いて説明する。Hereinafter, the present invention will be explained based on the embodiment diagrams shown in FIGS. 1 to 4.
第１図には、固定側の上型１１とこれに対設した可動側
の下型１２とから構成されている樹脂封止成形用金型４
の型締状態が示されている。In FIG. 1, a mold 4 for resin sealing molding is composed of an upper mold 11 on the fixed side and a lower mold 12 on the movable side disposed opposite thereto.
The mold clamping state is shown.
また、該固定及び可動両型（１］１．２）のＰ、Ｌ面に
はキャビティ （１３・１４）が対設されており、また
、該上下両型（１１・１２）のいずれか−万態には樹脂
材料供給用のボット及び該ポット内に嵌装させる樹脂材
料加圧用のプランジャー（図示なし）が配置されており
、更に、該ボッ）・とキャビティ１４との間には溶融樹
脂材料１５の移送用通路１６が配設されている。更に、
上記した上型キャビティ１３の断面深さ！２１は、下型
キャビティ１４の断面深さＬｌよりも浅くなるように形
成されている。In addition, cavities (13 and 14) are provided oppositely on the P and L surfaces of both the fixed and movable molds (1] 1.2), and either of the upper and lower molds (11, 12) - A bot for supplying resin material and a plunger (not shown) for pressurizing the resin material to be fitted into the pot are arranged in all cases, and furthermore, between the bot and the cavity 14, there is a bot for melting the resin material. A passage 16 for transferring the resin material 15 is provided. Furthermore,
The above-mentioned cross-sectional depth of the upper mold cavity 13! 21 is formed to be shallower than the cross-sectional depth Ll of the lower mold cavity 14.
次に、上記した金型を用いてリードフレーム１８上の電
子部品１７を樹脂封止成形する場合について説明する。Next, a case where the electronic component 17 on the lead frame 18 is resin-sealed using the above-mentioned mold will be described.
ます、上下両型（１１・１２）を型開きして、下型１２
のＰ、Ｌ面における所定位置に電子部品１７を装着した
リードフレーム１８を嵌装セットする。このとき、第１
図に示すように、リードフレーム１８上の電子部品１７
を断面深さρ１の浅い上型キャビティ１３側に嵌装させ
る。Next, open both the upper and lower molds (11 and 12) and place the lower mold 12.
The lead frame 18 with the electronic component 17 mounted thereon is fitted and set at predetermined positions on the P and L sides of the lead frame 18 . At this time, the first
As shown in the figure, electronic components 17 on lead frame 18
is fitted into the shallow upper mold cavity 13 side with a cross-sectional depth ρ1.
次に、この状態で、下型１２を上動させて該」１下両型
（１１・１２）の型締めを行なうと共に、ポット内に樹
脂材料を供給してこれをプランジャーにて加圧する。こ
のとき、該ポット内の樹脂材料は該両型に備えたヒータ
により加熱溶融化されると共にプランジャーにより加圧
されるから、該溶融樹脂材料１５はポットから移送用通
路１６を通して上下両キャビティ （１３・１４）内に
加圧注入され且つ充填される。従って、所要のキュアタ
イム後において該両型を型開きして、」二下両キャビテ
ィ （１３１４）内及び移送用通路１６内の硬化樹脂成
形体を離型させることにより、該両キャビティ内の電子
部品１７を該両キャビティの形状に対応して成形される
樹脂成形体内に封止成形することがてきる。Next, in this state, the lower mold 12 is moved upward to clamp both lower molds (11 and 12), and a resin material is supplied into the pot and pressurized with a plunger. . At this time, the resin material in the pot is heated and melted by the heaters provided in both molds and pressurized by the plunger, so the molten resin material 15 passes from the pot through the transfer passage 16 into both the upper and lower cavities ( 13 and 14) and filled under pressure. Therefore, by opening both molds after the required curing time and releasing the cured resin moldings in the two lower cavities (1314) and the transfer passage 16, the electrons in the two cavities can be released. The component 17 can be sealed and molded within a resin molded body that is molded to correspond to the shapes of the two cavities.
ところで、上下両キャピテイ （］３・１４）内に加圧
注入された溶融樹脂材料（１５，・１５□）による電子
部品１７の樹脂封止成形は、電子部品１７か断面深さρ
１の浅い上型キャビティ１３側に嵌装セラ１〜されてい
ることに基づいて、次のような作用 効果が得られるも
のである。By the way, resin sealing molding of the electronic component 17 using the molten resin material (15, .
Based on the fact that the cellars 1 to 1 are fitted on the side of the shallow upper mold cavity 13, the following effects can be obtained.
即ち、該両キャビティ （１３・１４）内に加圧注入さ
れた溶融樹脂材料（１５１・１５２）の内、狭い空間部
として構成される断面深さｐｌの浅い上型キャビティ１
３側に流入した溶融樹脂材料１５２の流動速度は、これ
よりも広い空間部として構成される断面深さ１．１の深
いキャビティ１４側に流入した溶融樹脂材料１５．の流
動速度よりも遅・くなる。That is, of the molten resin material (151, 152) injected under pressure into both cavities (13, 14), the upper mold cavity 1 with a shallow cross-sectional depth pl constituted as a narrow space.
The flow velocity of the molten resin material 152 that has flowed into the molten resin material 15. The flow rate is slower than that of the flow rate.
従って、上記両キャビティ （１３１４）内に注入され
た溶融樹脂材料（１５□ １５□）は所要の粘性を有し
ているが、例えば、溶融樹脂材料１５を該両キャビティ
内へ加圧移送する時間を短縮化しても、即ち、所要の流
動性を有する状態の溶融樹脂材料１５を迅速に加圧移送
しても、断面深さρ１の浅い上型キャビティ１３側に流
入された溶融樹脂材料１５２の流動速度を遅くすること
かてきるから、結局、該溶融樹脂材料１５２によって」
−型キヤビテイ１３側に嵌装セラ１〜されている電子部
品１７、特に、そのホンティンクワイヤ１７１を変形・
断線すると云った弊害を効率良く防止てきるものである
。Therefore, although the molten resin material (15□ 15□) injected into both cavities (1314) has the required viscosity, for example, the time required to pressurize and transfer the molten resin material 15 into the two cavities (1314) is limited. Even if the molten resin material 15 having the required fluidity is quickly transferred under pressure, the molten resin material 152 flowing into the shallow upper mold cavity 13 side with the cross-sectional depth ρ1 Since the flow rate can be slowed down, the molten resin material 152
- Deform or deform the electronic components 17 fitted on the mold cavity 13 side, especially the real wires 171.
This effectively prevents the harmful effects of wire breakage.
云い換えると、電子部品１７を嵌装セラ１〜させた上型
キャビティ１３側における溶融樹脂材料１５２の流動速
度を遅くすることかてきるため、全体的な樹脂成形時間
の短縮化を目的として、溶融樹脂材料１５の加圧移送速
度を早めても、電子部品１７におけるボンデインク′ワ
イヤ］７Ｉの変形 断線を効率良く且つ確実に防止する
ことができると共に、該両キャビティ （１３・１４）
内におりる高密度の樹脂封止成形を行なうことがてきる
ものである。In other words, since it is possible to slow down the flow rate of the molten resin material 152 on the side of the upper mold cavity 13 in which the electronic component 17 is fitted, the process is performed with the aim of shortening the overall resin molding time. Even if the pressurized transfer speed of the molten resin material 15 is increased, it is possible to efficiently and reliably prevent deformation and disconnection of the bonding ink wire 7I in the electronic component 17, and also to prevent both cavities (13 and 14).
This allows for high-density resin sealing molding to be carried out inside.
なお、このとき、断面深さＬｌの深い下型キャビティ１
４側に流入された溶融樹脂材料１５１の流動速度は、断
面深さ１１の浅い上型キャビティ１３側に流入した溶融
樹脂材料１５２の流動速度よりも早められるが、この作
用が上記電子部品１７に対して悪影響を与えることはな
い。In addition, at this time, the deep lower mold cavity 1 with a cross-sectional depth Ll
The flow velocity of the molten resin material 151 that has flowed into the upper mold cavity 13 side having a shallow cross-sectional depth 11 is faster than the flow velocity of the molten resin material 152 that has flowed into the upper mold cavity 13 side, which has a shallow cross-sectional depth of 11. It will not have any negative impact on.
即ち、上記した下型キャビティ１４内に早く流入される
溶融樹脂材料１５１は、該下型キャピテイ１４内を流動
しながらリードフレーム１８の空隙を通して上型キャビ
ティ１３側にも流入しようとする。That is, the molten resin material 151 that quickly flows into the lower mold cavity 14 described above tends to flow into the upper mold cavity 13 side through the gap in the lead frame 18 while flowing inside the lower mold cavity 14 .
しかしながら、このとき、」二型キャビデイ１３側にも
遅れて溶融樹脂材料１５２か流入・流動するので、結局
、上型キャビティ１３側に流入しようとする溶融樹脂材
料１５１の作用は、下型キャビデイ１４内での樹脂充填
作用が上型キャビティ１３内ての樹脂充填作用よりも先
行して行なわれると云う過程において、恰も、」二型キ
ャビティ１３側に流入された溶融樹脂材料１５゜の流動
作用を抑制するように作用することになる。このため、
例えば、一方の溶融樹脂材料（１５］）が他方の溶融樹
脂材料（１５２）の流入・流動作用を完全に阻止すると
云った弊害を生しることなく、該−Ｊ＝型キャビティ１
３側に流入された溶融樹脂材料１５２の流動速度を更に
遅らせる作用を得ることかできるものである。However, at this time, the molten resin material 152 also flows into the second mold cavity 13 side with a delay, so that the action of the molten resin material 151 that tries to flow into the upper mold cavity 13 side is affected by the lower mold cavity 14 side. In the process in which the resin filling action in the upper mold cavity 13 is carried out before the resin filling action in the upper mold cavity 13, the flow action of the molten resin material 15° flowing into the second mold cavity 13 side is It will act as a suppressor. For this reason,
For example, one molten resin material (15) does not completely prevent the other molten resin material (152) from flowing into the mold cavity 1.
It is possible to obtain the effect of further slowing down the flow rate of the molten resin material 152 flowing into the third side.
従って、上述したように、」１記電子部品におけるホン
ティングワイヤ１７□の変形・断線を防止する作用と共
に、上下両キャビティ （１３・１４）内に注入された
溶融樹脂材料（１５、・１５２）に対して所定の加圧力
く樹脂圧）を加え得て樹脂成形体を高密度に、即ち、ボ
イドが形成されない樹脂成形体を成形すると云う最も重
要な樹脂成形作用 効果か確実に得られることになるも
のである。Therefore, as described above, the molten resin material (15, 152) injected into both the upper and lower cavities (13, 14) has the effect of preventing deformation and disconnection of the hunting wire 17□ in the electronic component 1. The most important effect of resin molding, which is to apply a predetermined pressure (resin pressure) to the resin molded body and mold the resin molded body with high density, that is, to form a resin molded body without forming voids, can be reliably obtained. It is what it is.
また、本発明は、上述した実施例に限定されるものでは
なく、本発明の趣旨を逸脱しない範囲内で、必要に応し
て、任意に且つ適宜に変更・選択して採用できるもので
ある。Furthermore, the present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately modified and selected as necessary without departing from the spirit of the present invention. .
即ち、本発明方法は、特に、断面深さの浅いＪＴのキャ
ビティ側にリードフレーム上に装着した電子部品を嵌装
セラ１〜すると云った点にあり、従って、実質的にこの
ような成形条件か得られる電子部品の樹脂封止成形方法
であればよい。That is, the method of the present invention is particularly characterized in that the electronic components mounted on the lead frame are mounted on the cavity side of the JT having a shallow cross-sectional depth using a fitting cellar 1, and therefore, substantially such molding conditions are required. Any method for resin-sealing and molding an electronic component that can be obtained may be used.
例えば、第２図に示すものは、リードフレームにおける
電子部品１７の装着用タブ１９１部分を所要範囲（例え
ば、該リードフレームの厚み分）だけ凹ませてワイヤー
ポンティング位置を若干下けるように構成したリードフ
レーム１つの利用例であるか、このようなリードフレー
ム１９を用いることによって、該タブ１．９＋部分にお
ける樹脂成形体の肉厚を厚くすることかできる。For example, the one shown in FIG. 2 is configured so that the tab 191 for mounting the electronic component 17 on the lead frame is recessed by a required range (e.g., the thickness of the lead frame) so that the wire ponting position is slightly lowered. By using such a lead frame 19, the thickness of the resin molded body at the tab 1.9+ portion can be increased.
また、第３図に示すものは、金型におけるＰ、Ｌ面に所
要複数個のキャヒテイを対設すると共に、該各キャビテ
ィ間を中間ゲー１〜２０を介して連通させて構成した、
所謂、マトリックス型電子部品の樹脂封止成形用金型と
そのリードフレーム２１の利用例であるか、本発明方法
によれは、前述したように、溶融樹脂材料１５の加圧移
送速度を早めることかてきるのて、溶融樹脂材料１５が
所要の流動性を有する間にこれを樹脂成形用金型の最終
端部におけるキャビティ内に確実に注入充填するため、
該溶融樹脂材料を迅速に加圧移送しなければならないと
云った制約を受けるこの種の樹脂成形条件に極めて好都
合なものである。In addition, the one shown in FIG. 3 is constructed by providing a plurality of cavities facing each other on the P and L surfaces of the mold, and communicating between the cavities through intermediate gates 1 to 20.
This is an example of the use of a mold for resin-sealing molding of a so-called matrix type electronic component and its lead frame 21, and according to the method of the present invention, as described above, the pressurized transfer speed of the molten resin material 15 can be increased. Next, in order to reliably inject and fill the molten resin material 15 into the cavity at the final end of the resin mold while it has the required fluidity,
This is extremely convenient for this type of resin molding conditions, which are subject to the restriction that the molten resin material must be rapidly transferred under pressure.
また、第１図乃至第３図に示す各実施例においては、リ
ードフレーム１８・１つを金型側に搬送供給する場合、
該リードフレーム１８１９上に装着した電子部品１７が
上面側となるように設定されるのが通例であるため、こ
れに対応して、該電子部品１７を嵌装セラ１−する断面
深さの浅い方のキャヒテイを」二型キャビティ１３側と
して構成した場合を夫々示している。しかしながら、場
合によっては、上記リードフレーム１８１９上に装着し
た電子部品１７か下面側となるように設定することもあ
り、従って、このときは、第４図に示すように、金型に
おりる下型キャビティ１４側の断面深さρ１が浅くなる
ように設定ずれはよい。また、該実施例においても、第
２図及び第３図に示したり一トフレーム１８・１９及び
その金型構成を採用できることは明らかである。Furthermore, in each of the embodiments shown in FIGS. 1 to 3, when one lead frame 18 is transported and supplied to the mold side,
Since it is customary that the electronic component 17 mounted on the lead frame 1819 is placed on the upper surface side, the depth of the cross section of the electronic component 17 in the mounting cell 1 is shallow. A case is shown in which one of the two cavities is configured as the type 2 cavity 13 side. However, in some cases, the electronic component 17 mounted on the lead frame 1819 may be placed on the bottom side, so in this case, as shown in FIG. The setting deviation should be such that the cross-sectional depth ρ1 on the mold cavity 14 side becomes shallow. It is clear that the frames 18 and 19 and their mold configurations shown in FIGS. 2 and 3 can also be employed in this embodiment.
なお、第２図乃至第４図において、第１図と実質的に同
し構成部材のものには、夫々間し符号を付している。Note that in FIGS. 2 to 4, components that are substantially the same as those in FIG. 1 are designated by respective reference numerals.
また、第２図乃至第４図に示す各実施例においても、第
１図に示した前実施例のものと実質的に同じ作用・効果
が得られるものである。Further, in each of the embodiments shown in FIGS. 2 to 4, substantially the same functions and effects as those of the previous embodiment shown in FIG. 1 can be obtained.
本発明方法によれば、電子部品の全体をボイドが存在し
ない高密度の樹脂成形体内に確実に封止成形することが
できると共に、キャビティ内に注入された溶融樹脂材料
の流動速度に起因して、電子部品、特に、そのボンディ
ングワイヤが変形断線される等の弊害を効率良く且つ確
実に防止することができる。According to the method of the present invention, it is possible to reliably seal and mold the entire electronic component in a high-density resin molded body without any voids, and due to the flow rate of the molten resin material injected into the cavity. It is possible to efficiently and reliably prevent problems such as deformation and disconnection of electronic components, especially their bonding wires.
従って、耐湿性・耐久性を向上させて、高品質性及び高
信頼性を備えたこの種の樹脂封止成形品を成形し得る電
子部品の樹脂封止成形方法を提供することができると云
った優れた実用的な効果を奏するものである。Therefore, it is possible to provide a resin encapsulation molding method for electronic components that can improve moisture resistance and durability, and mold this type of resin encapsulation molded product with high quality and reliability. It has excellent practical effects.
第１図は、本発明方法を説明するための電子部品の樹脂
封止成形用金型要部の一部切欠縦断正面図であり、その
型締状態を示している。
第２図乃至第４図は゛、他の実施例を示すものであり、
第２図は電子部品の樹脂封止成形用金型要部の一部切欠
縦断正面図、第３図はマトリックス型電子部品の樹脂封
止成形用金型要部の一部切欠縦断正面図、第４図は電子
部品の樹脂封止成形用金型要部の一部切欠縦断正面図で
、いずれもその型締状態を示している。
第５図は、従来方法を、説明するための電子部品の樹脂
封止成形用金型要部の一部切欠縦断正面図であり、その
型締状態を示している。
〔符号の説明〕
１１ ・・上 型
１２ ・・・下 型
１３ ・・キャビティ
１４ ・・・キャビティ
（ｌ
ｌ
・・・溶融樹脂材料
・・・溶融樹脂材料
・・・溶融樹脂材料
・・・移送用通路
・・・電子部品
・・・ボンディングワイ
・・・リードフレーム
・・・リードフレーム
・・・タ ブ
・・・中間ゲート
・・・リードフレーム
・・・断面深さ
・・・断面深さ
ヤFIG. 1 is a partially cutaway longitudinal sectional front view of the main part of a mold for resin-sealing molding of electronic components for explaining the method of the present invention, and shows the mold in a clamped state. 2 to 4 show other embodiments,
Fig. 2 is a partially cutaway longitudinal sectional front view of the main part of a mold for resin sealing molding of electronic components, and Fig. 3 is a partially cutaway vertical front view of the main part of a mold for resin sealing molding of matrix-type electronic parts. FIG. 4 is a partially cutaway longitudinal sectional front view of the main part of a mold for resin-sealing molding of electronic components, both of which show the mold in a closed state. FIG. 5 is a partially cutaway longitudinal sectional front view of the main part of a mold for resin-sealing molding of electronic components to explain the conventional method, and shows the mold in a clamped state. [Explanation of symbols] 11... Upper mold 12... Lower mold 13... Cavity 14... Cavity (l l... Molten resin material... Molten resin material... Molten resin material... Transfer Passageway...Electronic components...Bonding wire...Lead frame...Lead frame...Tab...Intermediate gate...Lead frame...Cross section depth...Cross section depth
Claims (2)
なるキャビティを対設すると共に、その断面深さの浅い
方のキャビティ側にリードフレーム上に装着した電子部
品を嵌装セットし、且つ、この状態で該金型を型締めし
て、該キャビティ内に溶融樹脂材料を加圧注入すること
により、上記リードフレーム上の電子部品を樹脂封止成
形することを特徴とする電子部品の樹脂封止成形方法。(1) P. in resin molding mold. Opposite cavities with different cross-sectional depths are provided on the L side, and the electronic component mounted on the lead frame is fitted and set in the cavity side with the shallower cross-sectional depth, and in this state, the mold is molded. A method for resin-sealing an electronic component, characterized in that the electronic component on the lead frame is molded with a resin by tightening the lead frame and injecting a molten resin material under pressure into the cavity.
なる所要複数個のキャビティを対設し、且つ、該各キャ
ビティ間を中間ゲートを介して連通させると共に、その
断面深さの浅い方の各キャビティ内にリードフレーム上
に装着した電子部品を夫々嵌装セットし、且つ、この状
態で該金型を型締めして、該各キャビティ内に溶融樹脂
材料を加圧注入することにより、上記リードフレーム上
の電子部品を樹脂封止成形することを特徴とするマトリ
ックス型電子部品の樹脂封止成形方法。(2) P. in resin molding mold. A required plurality of cavities with different cross-sectional depths are provided oppositely on the L surface, and the cavities are communicated through an intermediate gate, and a cavity on the lead frame is placed in each cavity with a shallower cross-sectional depth. The mounted electronic components are fitted and set, the mold is clamped in this state, and molten resin material is injected into each cavity under pressure, thereby molding the electronic components on the lead frame into resin. A resin encapsulation molding method for matrix-type electronic components, which is characterized by encapsulation molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309743A JP2598988B2 (en) | 1988-12-06 | 1988-12-06 | Resin sealing molding method for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309743A JP2598988B2 (en) | 1988-12-06 | 1988-12-06 | Resin sealing molding method for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02154434A true JPH02154434A (en) | 1990-06-13 |
| JP2598988B2 JP2598988B2 (en) | 1997-04-09 |
Family
ID=17996764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63309743A Expired - Lifetime JP2598988B2 (en) | 1988-12-06 | 1988-12-06 | Resin sealing molding method for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2598988B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
| US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
| JP2003112335A (en) * | 2001-10-02 | 2003-04-15 | Sony Corp | Method for manufacturing resin sealed type molded part and resin sealed type molded part |
| US7523914B2 (en) * | 2005-07-01 | 2009-04-28 | Yin Yu Chang | High-hardness and corrosion-tolerant integrated circuit packing mold |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217651A (en) * | 1984-04-13 | 1985-10-31 | Hitachi Ltd | Semiconductor device |
| JPS61150225A (en) * | 1984-12-24 | 1986-07-08 | Toshiba Corp | Manufacture of semiconductor device |
| JPS63143824A (en) * | 1986-12-08 | 1988-06-16 | Hitachi Ltd | Molding die |
-
1988
- 1988-12-06 JP JP63309743A patent/JP2598988B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217651A (en) * | 1984-04-13 | 1985-10-31 | Hitachi Ltd | Semiconductor device |
| JPS61150225A (en) * | 1984-12-24 | 1986-07-08 | Toshiba Corp | Manufacture of semiconductor device |
| JPS63143824A (en) * | 1986-12-08 | 1988-06-16 | Hitachi Ltd | Molding die |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
| US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
| US5484274A (en) * | 1992-11-24 | 1996-01-16 | Neu Dynamics Corp. | Encapsulation molding equipment |
| JP2003112335A (en) * | 2001-10-02 | 2003-04-15 | Sony Corp | Method for manufacturing resin sealed type molded part and resin sealed type molded part |
| US7523914B2 (en) * | 2005-07-01 | 2009-04-28 | Yin Yu Chang | High-hardness and corrosion-tolerant integrated circuit packing mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2598988B2 (en) | 1997-04-09 |
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