JPH0214750U - - Google Patents

Info

Publication number
JPH0214750U
JPH0214750U JP9308588U JP9308588U JPH0214750U JP H0214750 U JPH0214750 U JP H0214750U JP 9308588 U JP9308588 U JP 9308588U JP 9308588 U JP9308588 U JP 9308588U JP H0214750 U JPH0214750 U JP H0214750U
Authority
JP
Japan
Prior art keywords
semiconductor device
metal wire
protective element
leads
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9308588U
Other languages
Japanese (ja)
Other versions
JPH0433630Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988093085U priority Critical patent/JPH0433630Y2/ja
Publication of JPH0214750U publication Critical patent/JPH0214750U/ja
Application granted granted Critical
Publication of JPH0433630Y2 publication Critical patent/JPH0433630Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Emergency Protection Circuit Devices (AREA)
  • Fuses (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る一実施例の保護素子の構
成を示す図、第２図Ａ〜Ｆは本実施例の保護素子
の製造工程を説明する図、第３図は保護素子の金
属線の材質による電流と表面温度の変化を示す図
、第４図Ａ，Ｂは本考案に係る他の実施例の金属
板打ち抜き形状を示す図、第５図は第４図Ａに示
すリード形状とした時の保護素子のモールド状態
を示す図である。 図中、１…半導体装置用保護素子、１１…金属
線、１２，１３…リード線、１４…モールドパツ
ケージ、１５…孔部、２１…金属板、２２…打ち
抜き部である。 Figure 1 is a diagram showing the configuration of a protection element according to an embodiment of the present invention, Figures 2 A to F are diagrams explaining the manufacturing process of the protection element of this embodiment, and Figure 3 is a metal wire of the protection element. Figures 4A and 4B are diagrams showing the shape of a punched metal plate according to another embodiment of the present invention, and Figure 5 shows the lead shape shown in Figure 4A and the shape of the lead shown in Figure 4A. It is a figure which shows the mold state of a protection element when it does. In the figure, 1... protective element for semiconductor device, 11... metal wire, 12, 13... lead wire, 14... mold package, 15... hole, 21... metal plate, 22... punching part.

Claims (1)

【実用新案登録請求の範囲】 (1) 基板に装着され半導体装置の過電流破壊を
防止する半導体装置用保護素子であつて、対を成
すリード先端部近傍の所定位置間に略６６０°Ｃ
より低い融点温度の金属線を張設し、前記両リー
ド両端が導出するよう前記金属線及び前記リード
を樹脂によりモールドしてなることを特徴とする
面実装用半導体装置用保護素子。 (2) 金属線をアルミニウム線または重量比０．
１％〜２％の珪素を含有するアルミニウム線とす
ることを特徴とする請求項第１項記載の面実装用
半導体装置用保護素子。[Claims for Utility Model Registration] (1) A protection element for a semiconductor device that is attached to a substrate and prevents overcurrent damage to the semiconductor device, which has a temperature of approximately 660° between predetermined positions near the tips of a pair of leads.
1. A protective element for a surface-mounted semiconductor device, characterized in that a metal wire having a lower melting point temperature is stretched, and the metal wire and the lead are molded with resin so that both ends of the leads are led out. (2) The metal wire is an aluminum wire or the weight ratio is 0.
2. The protective element for a surface-mounted semiconductor device according to claim 1, wherein the protective element is an aluminum wire containing 1% to 2% silicon.
JP1988093085U 1988-07-15 1988-07-15 Expired JPH0433630Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988093085U JPH0433630Y2 (en) 1988-07-15 1988-07-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988093085U JPH0433630Y2 (en) 1988-07-15 1988-07-15

Publications (2)

Publication Number Publication Date
JPH0214750U true JPH0214750U (en) 1990-01-30
JPH0433630Y2 JPH0433630Y2 (en) 1992-08-12

Family

ID=31317535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988093085U Expired JPH0433630Y2 (en) 1988-07-15 1988-07-15

Country Status (1)

Country Link
JP (1) JPH0433630Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018097986A (en) * 2016-12-09 2018-06-21 矢崎総業株式会社 Fixing structure of conductor unit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958734A (en) * 1982-09-27 1984-04-04 松下電器産業株式会社 Chip type fuse and method of producing same
JPS59141648U (en) * 1983-03-14 1984-09-21 ロ−ム株式会社 Protection elements for semiconductor devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958734A (en) * 1982-09-27 1984-04-04 松下電器産業株式会社 Chip type fuse and method of producing same
JPS59141648U (en) * 1983-03-14 1984-09-21 ロ−ム株式会社 Protection elements for semiconductor devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018097986A (en) * 2016-12-09 2018-06-21 矢崎総業株式会社 Fixing structure of conductor unit
US10158204B2 (en) 2016-12-09 2018-12-18 Yazaki Corporation Fixing structure of conductor unit

Also Published As

Publication number Publication date
JPH0433630Y2 (en) 1992-08-12

Similar Documents

Publication Publication Date Title
JPH0214750U (en)
JPH0214751U (en)
JPS59141648U (en) Protection elements for semiconductor devices
JPH0249140U (en)
JPH027680U (en)
JPS6042735U (en) semiconductor equipment
JPH021862Y2 (en)
JPH033752U (en)
JPH0286148U (en)
JPS62144042U (en)
JPH02113303U (en)
JPH0179842U (en)
JPS62152456U (en)
JPH01118457U (en)
JPH03122543U (en)
JPH02137219U (en)
JPH03106740U (en)
JPH0317636U (en)
JPH01133748U (en)
JPS63134548U (en)
JPS6437058U (en)
JPS5961543U (en) semiconductor equipment
JPH0273223U (en)
JPS6196557U (en)
JPH0339856U (en)