JPH0213742U - - Google Patents
Info
- Publication number
- JPH0213742U JPH0213742U JP9194888U JP9194888U JPH0213742U JP H0213742 U JPH0213742 U JP H0213742U JP 9194888 U JP9194888 U JP 9194888U JP 9194888 U JP9194888 U JP 9194888U JP H0213742 U JPH0213742 U JP H0213742U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- wiring board
- printed wiring
- lead
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connecting Device With Holders (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る電子部品実装構造の一実
施例を示す分解斜視図、第２図は第１図の実装完
了後の斜視図、第３図は第２図の正面図、第４図
は第１図の印刷配線板の裏面を示す平面図、第５
図は従来の電子部品実装構造を示す分解斜視図、
第６図は第５図の印刷配線板の裏面を示す平面図
、第７図は第５図の実装完了後の斜視図である。
１……電子部品、２……電子部品のリード、３
……ソケツト、４ａ……第１のリード、４ｂ……
第２のリード、５……印刷配線板、６，１１……
配線パターン、７，９，１０……ランド、８……
貫通孔。
Fig. 1 is an exploded perspective view showing one embodiment of an electronic component mounting structure according to the present invention, Fig. 2 is a perspective view after the mounting of Fig. 1 is completed, Fig. 3 is a front view of Fig. 2, and Fig. 4 The figure is a plan view showing the back side of the printed wiring board in Figure 1, and Figure 5.
The figure is an exploded perspective view showing a conventional electronic component mounting structure.
6 is a plan view showing the back side of the printed wiring board shown in FIG. 5, and FIG. 7 is a perspective view of the printed wiring board shown in FIG. 5 after completion of mounting. 1...Electronic components, 2...Leads for electronic components, 3
...Socket, 4a...First lead, 4b...
Second lead, 5...Printed wiring board, 6, 11...
Wiring pattern, 7, 9, 10... land, 8...
Through hole.
Claims (1)
する電子部品実装構造において、前記電子部品の
リードに接続され、前記印刷配線板の表面に形成
された配線パターン上のランドに半田付けされる
第１のリードと、前記印刷配線板に貫通挿入され
半田付けされる第２のリードとを、それぞれ前記
ソケツトに設けたことを特徴とする電子部品実装
構造。 In an electronic component mounting structure in which an electronic component is mounted on a printed wiring board via a socket, a first wire is connected to a lead of the electronic component and is soldered to a land on a wiring pattern formed on a surface of the printed wiring board. An electronic component mounting structure characterized in that the socket is provided with a lead and a second lead that is inserted through the printed wiring board and soldered to the socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9194888U JPH062276Y2 (en) | 1988-07-13 | 1988-07-13 | Electronic component mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9194888U JPH062276Y2 (en) | 1988-07-13 | 1988-07-13 | Electronic component mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0213742U true JPH0213742U (en) | 1990-01-29 |
| JPH062276Y2 JPH062276Y2 (en) | 1994-01-19 |
Family
ID=31316405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9194888U Expired - Lifetime JPH062276Y2 (en) | 1988-07-13 | 1988-07-13 | Electronic component mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH062276Y2 (en) |
-
1988
- 1988-07-13 JP JP9194888U patent/JPH062276Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH062276Y2 (en) | 1994-01-19 |