JPH0213475B2 - - Google Patents
Info
- Publication number
- JPH0213475B2 JPH0213475B2 JP22458785A JP22458785A JPH0213475B2 JP H0213475 B2 JPH0213475 B2 JP H0213475B2 JP 22458785 A JP22458785 A JP 22458785A JP 22458785 A JP22458785 A JP 22458785A JP H0213475 B2 JPH0213475 B2 JP H0213475B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- board
- substrate
- screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 105
- 238000007650 screen-printing Methods 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000007639 printing Methods 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- GUIJLPKNGJMXKV-AZUAARDMSA-N rod-188 Chemical compound C1=CC(C)=CC=C1S(=O)(=O)N1[C@@H]([C@H]2OC(=O)CC2)C2=CC=CC=C2CC1 GUIJLPKNGJMXKV-AZUAARDMSA-N 0.000 description 2
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22458785A JPS6284871A (ja) | 1985-10-08 | 1985-10-08 | プリント基板スクリ−ン印刷機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22458785A JPS6284871A (ja) | 1985-10-08 | 1985-10-08 | プリント基板スクリ−ン印刷機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6284871A JPS6284871A (ja) | 1987-04-18 |
| JPH0213475B2 true JPH0213475B2 (ko) | 1990-04-04 |
Family
ID=16816068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22458785A Granted JPS6284871A (ja) | 1985-10-08 | 1985-10-08 | プリント基板スクリ−ン印刷機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284871A (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6505553B2 (en) | 2000-04-24 | 2003-01-14 | Fuji Machine Mfg. Co., Ltd | Screen printing method and screen printing apparatus |
| US6870745B2 (en) | 2001-04-23 | 2005-03-22 | Fuji Machine Mfg. Co., Ltd. | Printed-board supporting device, electric-component mounting system, and process of manufacturing printed-circuit board |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0825265B2 (ja) * | 1988-06-17 | 1996-03-13 | 富士機械製造株式会社 | スクリーン印刷機 |
| JP2557747B2 (ja) * | 1991-02-12 | 1996-11-27 | 三洋電機株式会社 | スクリーン印刷機 |
| JP4764019B2 (ja) * | 2005-01-26 | 2011-08-31 | グローリー株式会社 | 循環式硬貨入出金機 |
| JP5700951B2 (ja) | 2010-04-27 | 2015-04-15 | 富士機械製造株式会社 | スクリーン印刷機 |
| DE112011101481B4 (de) | 2010-04-27 | 2023-06-07 | Fuji Corporation | Siebdruckmaschine |
| CN102858539B (zh) | 2010-04-27 | 2015-04-01 | 富士机械制造株式会社 | 丝网印刷生产线及丝网印刷方法 |
| CN102658714B (zh) * | 2012-06-04 | 2014-01-08 | 江苏超威电源有限公司 | 蓄电池用全自动印刷机 |
-
1985
- 1985-10-08 JP JP22458785A patent/JPS6284871A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6505553B2 (en) | 2000-04-24 | 2003-01-14 | Fuji Machine Mfg. Co., Ltd | Screen printing method and screen printing apparatus |
| US6870745B2 (en) | 2001-04-23 | 2005-03-22 | Fuji Machine Mfg. Co., Ltd. | Printed-board supporting device, electric-component mounting system, and process of manufacturing printed-circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6284871A (ja) | 1987-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |