JPH0212944A - Sheet enlarging apparatus for manufacture of semiconductor device - Google Patents
Sheet enlarging apparatus for manufacture of semiconductor deviceInfo
- Publication number
- JPH0212944A JPH0212944A JP63164321A JP16432188A JPH0212944A JP H0212944 A JPH0212944 A JP H0212944A JP 63164321 A JP63164321 A JP 63164321A JP 16432188 A JP16432188 A JP 16432188A JP H0212944 A JPH0212944 A JP H0212944A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- pellets
- adhesive sheet
- ring
- rollers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 239000008188 pellet Substances 0.000 claims abstract description 31
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Dicing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置製造用シート拡大装置に関し、特に
複数の切込み線で分離された複数のペレット相互間に所
定の隙間を与える半導体装置製造用シート拡大装置に関
する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a sheet enlarging device for semiconductor device manufacturing, and particularly for semiconductor device manufacturing that provides a predetermined gap between a plurality of pellets separated by a plurality of score lines. The present invention relates to a sheet enlarging device.
従来、この種の半導体装置製造用シート拡大装置は、第
３図に示すように、台ＩＡの上にセットされたリング２
Ａ上に、縦方向及び横方向のそれぞれ複数本の切込み線
で分離された複数のペレット１１Ａが貼付けられた粘着
シート１０を載せ、この粘着シート１０の周辺端部を拡
大治具７で挟んでこの拡大治具７を下に押し下げること
により、又は台ＩＡを上に押し上げることにより、粘着
シート１０を全方向に拡大し、各ペレット１１Ａの相互
間隔を拡げる構造となっていた。Conventionally, this type of sheet enlarging apparatus for manufacturing semiconductor devices has a ring 2 set on a stand IA, as shown in FIG.
An adhesive sheet 10 on which a plurality of pellets 11A separated by a plurality of vertical and horizontal score lines are pasted is placed on A, and the peripheral edge of this adhesive sheet 10 is sandwiched between the enlarging jig 7. By pushing down the enlarging jig 7 or pushing up the stand IA, the adhesive sheet 10 is enlarged in all directions, and the mutual spacing between the pellets 11A is increased.
上述した従来の半導体装置製造用シート拡大装置は、粘
着シート１０の周辺端部を挟んでリング２Ａの上面より
押し下げることによって粘着シート１０を全方向に拡大
する構造となっているので、粘着シート１０の材質によ
ってはリング２Ａとの摩擦が大きく、拡大治具７とリン
グ２Ａとの間の粘着シート１０だけが伸び易い一方、リ
ング２＾上の粘着シートは伸びに＜＜、ベレット１１＾
の相互間隔が十分に得られないという欠点があった。The conventional sheet expanding apparatus for manufacturing semiconductor devices described above has a structure in which the adhesive sheet 10 is expanded in all directions by sandwiching the peripheral edge of the adhesive sheet 10 and pressing down from the upper surface of the ring 2A. Friction with the ring 2A is large depending on the material of the ring 2A, and only the adhesive sheet 10 between the enlarging jig 7 and the ring 2A tends to stretch, while the adhesive sheet on the ring 2^ does not easily stretch.
There was a drawback that sufficient mutual spacing could not be obtained.
また、リング２Ａとの摩擦が小さい粘着シート１０を使
用した場合においても、ベレット寸法が幅１關前後、長
さ１０〜１００ｍｍの長尺である場合には、短辺間に最
低限度のベレット相互間隔（０，４〜０．５關）を得る
為には全体の拡大率を大きくしなければならず、長辺方
向の引っばりに耐えられず、第４図に示すように、亀裂
１４が生じ、次工程のマウント装置では使用できないと
いう欠点があった。In addition, even when using the adhesive sheet 10 that has low friction with the ring 2A, if the pellet size is a long one with a width of about 1 inch and a length of 10 to 100 mm, there is a minimum amount of mutual contact between the pellets between the short sides. In order to obtain the spacing (0.4 to 0.5 degrees), the overall magnification ratio must be increased, and the crack 14 cannot withstand the tension in the long side direction, as shown in Figure 4. This has the disadvantage that it cannot be used in the mounting device of the next process.
本発明の目的は、粘着シートの材質に関係なく必要なベ
レット相互間隔を得るとこができ、かつ短辺、長辺の寸
法が極端に異る場合でもそれぞれ必要なベレット相互間
隔を得ることができる半導体装置製造用シート拡大装置
を提供することにある。An object of the present invention is to be able to obtain the required spacing between the pellets regardless of the material of the adhesive sheet, and to obtain the required spacing between the pellets even if the dimensions of the short side and long side are extremely different. An object of the present invention is to provide a sheet enlarging device for manufacturing semiconductor devices.
本発明の半導体装置製造用シート拡大装置は、互いに交
差する少なくとも２方向のそれぞれ複数本の切込み線で
分離された複数のベレットが貼付けられた粘着シートの
前記各切込み線に対する垂直方向の両端を両面から挟ん
で回転し、前記粘着シートを前記各切込み線に対する垂
直方向にそれぞれ引伸して前記各ベレット相互間に所定
の寸法の隙間を与える複数のローラーと、これらローラ
ーの回転を前記粘着シートの引伸し方向ごとに独立して
駆動制御する複数のローラー駆動部とを有している。The sheet enlarging apparatus for manufacturing semiconductor devices of the present invention has a pressure-sensitive adhesive sheet on which a plurality of bullets are attached, separated by a plurality of score lines in at least two directions intersecting with each other, on both sides in a direction perpendicular to each score line. a plurality of rollers that pinch and rotate from each other and stretch the adhesive sheet in a direction perpendicular to each of the score lines to provide a gap of a predetermined size between each of the pellets, and the rotation of these rollers is controlled in the stretching direction of the adhesive sheet It has a plurality of roller drive units whose drive is controlled independently for each roller drive unit.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）、（ｂ）はそれぞれ本発明の一実施例を示
す平面図及び断面図である。FIGS. 1(a) and 1(b) are a plan view and a sectional view, respectively, showing an embodiment of the present invention.
粘着シート１０の上面側の粘着面には、複数本の縦方向
及び横方向の切込み線１２により分離された複数のベレ
ット１１が貼付けられている。A plurality of pellets 11 separated by a plurality of vertical and horizontal score lines 12 are attached to the upper adhesive surface of the adhesive sheet 10 .
ベレット１１が貼付けられた粘着シート〕０は、台１上
にセットされたリング２上に載せられる。The adhesive sheet [0] with the pellet 11 attached thereon is placed on a ring 2 set on a stand 1.
ローラー３ＸＡ〜３ＸＤ１３ＹＡ〜３ＹＤは、リング２
上に載せられた粘着シート１０の横方向及び縦方向の両
端を両面から挟んで回転し、粘着シー１〜１０を横方向
及び縦方向にそれぞれ引伸して各ベレット１１相互間に
所定の寸法の隙間１３を与える。Rollers 3XA to 3XD13YA to 3YD are ring 2
Both horizontal and vertical ends of the adhesive sheet 10 placed on top are held in between and rotated, and the adhesive sheets 1 to 10 are stretched horizontally and vertically to create a gap of a predetermined size between each pellet 11. Give 13.
ローラー駆動部４ｘ 、４Ｙは、回転伝達部５ｘ。The roller drive units 4x and 4Y are rotation transmission units 5x.
５Ｙを介してローラー３ＸＡ〜３ＸＤ１３ＹＡ〜３ｙｏ
の回転を、粘着シート１０の引伸し方向ごと、即ち横方
向、縦方向ごとに独立して駆動制御する。Roller 3XA~3XD13YA~3yo via 5Y
The rotation of the adhesive sheet 10 is driven and controlled independently for each direction in which the adhesive sheet 10 is stretched, that is, for each horizontal direction and vertical direction.
シートクランプ治具６は、粘着シート１０を引伸した後
、周辺を粘着シート１０に押し付けて接着し、ローラー
３ＸＡ〜３ＸＤ１３ＹＡ〜３Ｙｔ）から粘着シート１０
が開放されても粘着、シート１０が縮んで元に戻らない
ようにして次工程へ渡す。After stretching the adhesive sheet 10, the sheet clamp jig 6 presses and adheres the periphery to the adhesive sheet 10, and removes the adhesive sheet 10 from the rollers 3XA to 3XD13YA to 3Yt).
Even if the sheet 10 is released, it is adhesive and the sheet 10 is not shrunk and returned to its original state before being passed on to the next process.
粘着シート１０に貼付けられたベレット１１が第１図に
示すようにほぼ正方形で縦方向、横方向同一本数の切込
み線１２で分離されているような場合には、ローラー駆
動部４ｘ 、４ｖにより、粘着シート１０が横方向、縦
方向共同−比率で拡大されるように制御する。When the pellets 11 attached to the adhesive sheet 10 are approximately square as shown in FIG. 1 and separated by the same number of cut lines 12 in the vertical and horizontal directions, the roller drive units 4x and 4v The pressure sensitive adhesive sheet 10 is controlled to be enlarged in the horizontal and vertical directions at the same ratio.
また、第２図（ａ）に示すように、短辺、長辺の寸法が
大幅に異なり、異なる本数の縦方向、横方向の切込み線
１２で分離されているベレット１１、、 Ａに対しては
、ローラー駆動部４ｘ 、４ｙにより、粘着シー）１０
の横方向、縦方向の拡大率を変え、第２図（ｂ）に示す
ように、ベレット１１Ａ相互間の横方向、縦方向の隙間
１３がそれぞれ所定の寸法になるように制御する。In addition, as shown in FIG. 2(a), for the pellets 11, A, which have significantly different short and long side dimensions and are separated by different numbers of vertical and horizontal score lines 12. The roller drive units 4x and 4y create an adhesive sheet) 10
The magnification ratios in the horizontal and vertical directions are changed to control the horizontal and vertical gaps 13 between the pellets 11A to respective predetermined dimensions, as shown in FIG. 2(b).
短辺、長辺の寸法が大幅に異なるベレットの例としては
リニアセンサがあり、このリニアセンサはホトダイオー
ドが一列に１００〜１０，０００個配利きれているため
、その寸法は１ｍｍＸ（５〜１００）朋程度とかなりの
長尺となる。このようなベレットに対しては横方向、縦
方向の拡大率は大幅に変える必要がある。An example of a pellet with significantly different short and long side dimensions is a linear sensor. This linear sensor has 100 to 10,000 photodiodes arranged in a row, so its dimensions are 1 mm x (5 to 100 ) It is quite long, about the size of a friend. For such a pellet, the horizontal and vertical magnification ratios need to be changed significantly.
このように、本実施例によると、粘着シート１０をリン
グ２の上面に対して平行方向に引伸すので粘着シート１
０とリング２との摩擦が軽減れ、粘着シート１０の材質
に関係なく必要なペレット相互間の隙間１３を得ること
ができる。As described above, according to this embodiment, since the adhesive sheet 10 is stretched in the direction parallel to the upper surface of the ring 2, the adhesive sheet 1
0 and the ring 2 is reduced, and the necessary gap 13 between the pellets can be obtained regardless of the material of the adhesive sheet 10.
また、横方向、縦方向の拡大率が独立して制御できるの
で、短辺、長辺の寸法が極端に異なるペレットに対して
も亀裂を生じることなく横方向。In addition, the expansion ratios in the horizontal and vertical directions can be controlled independently, so even pellets with extremely different short and long sides can be expanded in the horizontal direction without cracking.
縦方向共必要な隙間１３を得ることができる。Necessary gaps 13 can be obtained both in the vertical direction.
以上説明したように本発明は、粘着シートのペレットの
各切込み線に対する垂直方向の両端を両面からローラー
で挟み、これらローラーの回転を各方向ごとに独立して
駆動制御し粘着シートを拡大する構成とすることにより
、粘着シートとリングとの摩擦が軽減されるので粘着シ
ートの材質に関係なく必要なペレット相互間の隙間を得
ることができ、また、各方向の拡大率が独立して制御で
きるので、短辺、長辺の寸法が極端に異なるペレットの
場合でも亀裂を生じることなくそれぞれ必要な隙間を得
ることができる効果がある。As explained above, the present invention has a configuration in which both ends of a pressure-sensitive adhesive sheet pellet in a direction perpendicular to each score line are sandwiched between rollers from both sides, and the rotation of these rollers is independently driven and controlled in each direction to expand the pressure-sensitive adhesive sheet. By doing so, the friction between the adhesive sheet and the ring is reduced, so the necessary gap between the pellets can be obtained regardless of the material of the adhesive sheet, and the expansion rate in each direction can be controlled independently. Therefore, even in the case of pellets whose short and long sides have extremely different dimensions, it is possible to obtain the necessary gaps without causing cracks.
第１図（ａ）、（ｂ）はそれぞれ本発明の一実施例を示
す平面図及び断面図、第２図（ａ）。
（ｂ）はそれぞれ第１図に示された実施例を短辺、長辺
の寸法が極端に異なるペレットに対して適用したときの
粘着テープ拡大前、拡大後の平面図、第３図は従来の半
導体装置製造用シート拡大装置の一例を示す断面図、第
４図は従来の半導体装置製造用シート拡大装置の課題を
説明するための平面図である。
１．１＾・・・台、２２＾・・・リング、３ＸＡ〜３×
Ｄ。
３ＹＡ〜３ＹＤ・・・ローラー、４ｘ、４ｙ−ローラー
駆動部、５Ｘ、５Ｙ・・・回転伝達部、６・・・シート
クランプ治具、７・・・拡大治具、１０・・・粘着シー
ト、１１．１１Ａ・・・ペレット、１２・・・切込み線
、１３・・・隙間、１４・・・亀裂。FIGS. 1(a) and 1(b) are a plan view and a sectional view showing an embodiment of the present invention, and FIG. 2(a) is a plan view and a cross-sectional view, respectively, showing an embodiment of the present invention. (b) is a plan view before and after the adhesive tape is expanded when the embodiment shown in FIG. FIG. 4 is a cross-sectional view showing an example of a sheet enlarging apparatus for manufacturing semiconductor devices, and FIG. 4 is a plan view for explaining problems with the conventional sheet enlarging apparatus for manufacturing semiconductor devices. 1.1^...stand, 22^...ring, 3XA~3X
D. 3YA to 3YD... Roller, 4x, 4y-roller drive unit, 5X, 5Y... Rotation transmission unit, 6... Sheet clamp jig, 7... Enlargement jig, 10... Adhesive sheet, 11.11A...Pellet, 12...Score line, 13...Gap, 14...Crack.
Claims (1)
込み線で分離された複数のペレットが貼付けられた粘着
シートの前記各切込み線に対する垂直方向の両端を両面
から挟んで回転し、前記粘着シートを前記各切込み線に
対する垂直方向にそれぞれ引伸して前記各ペレット相互
間に所定の寸法の隙間を与える複数のローラーと、これ
らローラーの回転を前記粘着シートの引伸し方向ごとに
独立して駆動制御する複数のローラー駆動部とを有する
ことを特徴とする半導体装置製造用シート拡大装置。A pressure-sensitive adhesive sheet to which a plurality of pellets separated by a plurality of score lines in at least two directions intersecting each other are pasted is rotated while holding both ends of the pressure-sensitive adhesive sheet in a direction perpendicular to each score line from both sides. a plurality of rollers that stretch each pellet in a direction perpendicular to the score line to provide a gap of a predetermined size between the pellets, and a plurality of roller drives that drive and control the rotation of these rollers independently for each direction in which the adhesive sheet is stretched. What is claimed is: 1. A sheet enlarging device for semiconductor device manufacturing, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63164321A JPH0212944A (en) | 1988-06-30 | 1988-06-30 | Sheet enlarging apparatus for manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63164321A JPH0212944A (en) | 1988-06-30 | 1988-06-30 | Sheet enlarging apparatus for manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0212944A true JPH0212944A (en) | 1990-01-17 |
Family
ID=15790935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63164321A Pending JPH0212944A (en) | 1988-06-30 | 1988-06-30 | Sheet enlarging apparatus for manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0212944A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140009033A (en) * | 2012-07-12 | 2014-01-22 | 가부시기가이샤 디스코 | Tape expanding apparatus |
| CN103681292A (en) * | 2012-09-24 | 2014-03-26 | 株式会社迪思科 | Band expanding device |
| CN104103585A (en) * | 2013-04-15 | 2014-10-15 | 株式会社迪思科 | Tape expanding device |
| JP2016072437A (en) * | 2014-09-30 | 2016-05-09 | 株式会社ディスコ | Expansion device, and breaking method for adhesive sheet |
| JP2016111229A (en) * | 2014-12-08 | 2016-06-20 | リンテック株式会社 | Separation device and separation method |
| JP2016127125A (en) * | 2014-12-26 | 2016-07-11 | リンテック株式会社 | Spacing device and spacing method |
| JP2016127123A (en) * | 2014-12-26 | 2016-07-11 | リンテック株式会社 | Spacing device and spacing method |
| KR20170113271A (en) * | 2016-04-01 | 2017-10-12 | 가부시기가이샤 디스코 | Expansion device |
| JP2018006448A (en) * | 2016-06-29 | 2018-01-11 | 株式会社ディスコ | Expansion device and expansion method |
| CN115458443A (en) * | 2022-09-26 | 2022-12-09 | 颀中科技（苏州）有限公司 | Wafer expanding device for chip packaging |
-
1988
- 1988-06-30 JP JP63164321A patent/JPH0212944A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140009033A (en) * | 2012-07-12 | 2014-01-22 | 가부시기가이샤 디스코 | Tape expanding apparatus |
| CN103545238A (en) * | 2012-07-12 | 2014-01-29 | 株式会社迪思科 | Tape expanding apparatus |
| CN103681292A (en) * | 2012-09-24 | 2014-03-26 | 株式会社迪思科 | Band expanding device |
| KR20140040013A (en) * | 2012-09-24 | 2014-04-02 | 가부시기가이샤 디스코 | Tape expanding apparatus |
| CN104103585A (en) * | 2013-04-15 | 2014-10-15 | 株式会社迪思科 | Tape expanding device |
| JP2016072437A (en) * | 2014-09-30 | 2016-05-09 | 株式会社ディスコ | Expansion device, and breaking method for adhesive sheet |
| JP2016111229A (en) * | 2014-12-08 | 2016-06-20 | リンテック株式会社 | Separation device and separation method |
| JP2016127125A (en) * | 2014-12-26 | 2016-07-11 | リンテック株式会社 | Spacing device and spacing method |
| JP2016127123A (en) * | 2014-12-26 | 2016-07-11 | リンテック株式会社 | Spacing device and spacing method |
| KR20170113271A (en) * | 2016-04-01 | 2017-10-12 | 가부시기가이샤 디스코 | Expansion device |
| JP2018006448A (en) * | 2016-06-29 | 2018-01-11 | 株式会社ディスコ | Expansion device and expansion method |
| CN115458443A (en) * | 2022-09-26 | 2022-12-09 | 颀中科技（苏州）有限公司 | Wafer expanding device for chip packaging |
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