JPH0211769Y2 - - Google Patents
Info
- Publication number
- JPH0211769Y2 JPH0211769Y2 JP4392984U JP4392984U JPH0211769Y2 JP H0211769 Y2 JPH0211769 Y2 JP H0211769Y2 JP 4392984 U JP4392984 U JP 4392984U JP 4392984 U JP4392984 U JP 4392984U JP H0211769 Y2 JPH0211769 Y2 JP H0211769Y2
- Authority
- JP
- Japan
- Prior art keywords
- element body
- board
- leads
- conductor pattern
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 15
- 238000004804 winding Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
【考案の詳細な説明】
本考案はパルストランス、ワイドバンドトラン
ス、デイレイライン等のように巻線を用いて素子
本体を形成し、そのリードを外部端子に接続して
ある小型電子部品の構造に関する。[Detailed description of the invention] This invention relates to the structure of small electronic components such as pulse transformers, wideband transformers, delay lines, etc., in which the element body is formed using windings and the leads are connected to external terminals. .
従来のこの種の電子部品は、第１図の断面図に
示すようにケース１の内部に弾性保護材で包んだ
状態の素子本体２を収納し、ケース１の側面に固
定してある外部端子３に素子本体２のリード４を
接続して全体を樹脂封止したり、第２図の断面図
に示すように素子本体５の収納してあるケース６
の底面内部に外部端子７を突出させ、その外部端
子７にリード８を接続しケース６の上側の開口面
を樹脂封止した構造である。第１図、第２図にお
いて樹脂封止部分は１点鎖線で囲んである。 As shown in the cross-sectional view of FIG. 1, this type of conventional electronic component houses an element body 2 wrapped in an elastic protective material inside a case 1, and external terminals fixed to the side surface of the case 1. 3, the leads 4 of the element body 2 are connected to the case 6 in which the element body 5 is housed, and the whole body is sealed with resin.
It has a structure in which an external terminal 7 is projected inside the bottom surface of the case 6, a lead 8 is connected to the external terminal 7, and the upper opening surface of the case 6 is sealed with resin. In FIGS. 1 and 2, the resin-sealed portion is surrounded by a chain line.
このように従来は素子本体の外側に種々の形状
のケースがあり、又外部端子をケースに固定する
からケースの断面の厚みを厚くして強度を増さね
ばならない。従つて素子本体の全体形状に対する
大きさ、つまり実装容積が小さくなる。又素子本
体のリードを外部端子にからげて接続するので組
立の自動化が難かしい。さらに外部端子への接続
の仕方によつてはリードが交差して短絡や断線事
故を生ずる場合もある。 As described above, conventional cases have various shapes outside the element body, and since external terminals are fixed to the case, the cross-sectional thickness of the case must be increased to increase its strength. Therefore, the size of the element body relative to the overall shape, that is, the mounting volume is reduced. Furthermore, since the leads of the element body are connected to external terminals by twisting them, it is difficult to automate the assembly. Furthermore, depending on how the terminals are connected to external terminals, the leads may cross, resulting in a short circuit or disconnection.
本考案の目的は従来の欠点を改善し、実装容積
を大きくして全体形状を小さくすると共に自動化
に適した小型電子部品の構造を提供することにあ
る。 The purpose of the present invention is to improve the conventional drawbacks, increase the mounting volume, reduce the overall shape, and provide a structure of a small electronic component suitable for automation.
本考案の小型電子部品は巻線してある素子本体
を係止部を設けた弾性保護材で包み、その係止部
を基板に設けた固定手段に取付けると共に基板の
側辺に固定してある外部端子に素子本体のリード
を接続し、外部端子の一部を露呈させた状態で全
体を樹脂封止してあることを特徴とする。 In the small electronic component of the present invention, the wire-wound element body is wrapped in an elastic protective material with a locking part, and the locking part is attached to a fixing means provided on the board and fixed to the side of the board. It is characterized in that the lead of the element body is connected to the external terminal, and the whole is sealed with resin with a part of the external terminal exposed.
以下パルストランスを例にとり本考案の小型電
子部品の実施例を示す第３図、第４図を参照しな
がら説明する。第３図は封止に用いた樹脂を除い
た場合の正面図であり、第４図は分解斜視図であ
る。 Hereinafter, a pulse transformer will be described as an example, with reference to FIGS. 3 and 4, which show embodiments of the small electronic component of the present invention. FIG. 3 is a front view with the resin used for sealing removed, and FIG. 4 is an exploded perspective view.
第３図、第４図において、１０は巻線を巻回し
てあるトロイダルコア１１を内部に包んでいるシ
リコンゴム等からなる弾性保護材、１２は合成樹
脂等からなる平担な四角形の基板、１３は外部端
子である。 In FIGS. 3 and 4, reference numeral 10 denotes an elastic protective material made of silicone rubber or the like that encloses a toroidal core 11 around which a winding wire is wound, 12 a flat rectangular substrate made of synthetic resin, etc.; 13 is an external terminal.
基板１２の中央には貫通孔１４が形成され、対
向する側辺には外部端子１３の垂直部分１５を嵌
め込むための凹部１６が形成されている。４個の
凹部１６が片側の側辺にあるが、夫々の凹部１６
には基板１２の内部に延在する細い切溝１７を形
成してある。この切溝１７はトロイダルコア１１
の巻線のリード１８を挾み込む役割をする。凹部
１６と切溝１７の周辺には導体パターン１９が形
成してある。なお基板１２の材質はセラミツクで
もよい。 A through hole 14 is formed in the center of the substrate 12, and a recess 16 into which the vertical portion 15 of the external terminal 13 is fitted is formed in the opposite side. There are four recesses 16 on one side, and each recess 16
A narrow groove 17 extending inside the substrate 12 is formed in the substrate 12 . This kerf 17 is the toroidal core 11
It serves to sandwich the lead 18 of the winding. A conductive pattern 19 is formed around the recess 16 and the cut groove 17. Note that the material of the substrate 12 may be ceramic.
弾性保護材１０の形状はほぼ直方体であるが、
一面に係止部２０を設けてある。係止部２０は一
面から円柱状に突出し先端を鍔状に広くすると共
に鍔状の部分を基板１２の貫通孔１４の大きさよ
りもわずかに広くしてある。そして係止部２０の
先端を弾性的に変形させて貫通孔１４に通して基
板１２の表面に出すことにより素子本体であるト
ロイダルコア１１を包んでいる弾性保護材１０は
裏面に固定される。基板１２は係止部２０の先端
と係止部２０の設けてある弾性保護材１０の一面
で挾まれるが、この一面に接着剤を塗布して固定
してもよい。リード１８は切溝１７に挿入し、導
体パターン１９に半田付けすることにより外部端
子１３に接続される。リード１８や外部端子１３
と導体パターン１９との接続は通常半田付けによ
り行われるが溶接することもできる。そして外部
端子１３を露呈させた状態で全体をデユアルイン
ラインパツケージにより樹脂封止する。第３図で
は１点鎖線で囲んで熱硬化した樹脂部分を表して
ある。なお外部端子と基板との接続部分は第５図
や第６図の部分拡大斜視図に示すようにしてもよ
い。 The shape of the elastic protective material 10 is approximately a rectangular parallelepiped,
A locking portion 20 is provided on one side. The locking part 20 protrudes from one surface in a cylindrical shape, and has a wide tip end shaped like a flange, and the flange-shaped part is made slightly wider than the size of the through hole 14 of the substrate 12. Then, by elastically deforming the tip of the locking part 20 and passing it through the through hole 14 to expose it to the surface of the substrate 12, the elastic protective material 10 surrounding the toroidal core 11, which is the element main body, is fixed to the back surface. The substrate 12 is held between the tip of the locking part 20 and one surface of the elastic protective material 10 on which the locking part 20 is provided, but it may be fixed by applying an adhesive to this one surface. The lead 18 is inserted into the cut groove 17 and connected to the external terminal 13 by soldering to the conductive pattern 19. Lead 18 and external terminal 13
The connection between the conductor pattern 19 and the conductor pattern 19 is usually made by soldering, but welding can also be used. Then, the entire structure is sealed with resin using a dual in-line package with the external terminals 13 exposed. In FIG. 3, the thermoset resin portion is shown surrounded by a chain line. Note that the connecting portion between the external terminal and the board may be shown in the partially enlarged perspective view of FIG. 5 or FIG. 6.
第５図の基板３０の側辺には切溝３１だけが形
成してあり、先端を水平にした外部端子３２が切
溝３１の周辺の導体パターン３３に接続される。
第４図のような凹部は存在しない。 Only a kerf 31 is formed on the side of the substrate 30 in FIG. 5, and an external terminal 32 with a horizontal tip is connected to a conductor pattern 33 around the kerf 31.
There are no recesses as shown in FIG.
第６図は外部端子４０の先端を上下に段違いに
して、段違い部分４１を凹部４２に嵌め込み、基
板４５を挾んだ状態で凹部４２と切溝４３の周辺
の導体パターン４４に外部端子４０が接続され
る。 FIG. 6 shows that the tip of the external terminal 40 is vertically stepped, the stepped part 41 is fitted into the recess 42, and the external terminal 40 is inserted into the conductor pattern 44 around the recess 42 and the cut groove 43 with the board 45 sandwiched between them. Connected.
第７図は導体パターンの別の実施例を示す基板
の部分平面図である。基板５０の側辺には外部端
子を嵌め込むための凹部と巻線のリードを挾み込
むための切溝が形成してある。しかし第４図の基
板１２とは異り、導体パターンは凹部と切溝の周
辺に夫々独立して形成してある。そして切溝５１
Ａの周辺の導体パターン５２Ａが凹部５３Ｂの周
辺の導体パターン５４Ｂに接続し、切溝５１Ｂの
周辺の導体パターン５２Ｂが凹部５３Ａの周辺の
導体パターン５４Ａに接続する。同様にして切溝
５１Ｃの周辺の導体パターン５２Ｃが凹部５３Ｄ
の周辺の導体パターン５４Ｄに接続し、切溝５１
Ｄの周辺の導体パターン５２Ｄが凹部５３Ｃの周
辺の導体パターン５４Ｃに接続する。つまり切溝
の周辺の導体パターンは切溝の続く凹部とは別の
凹部の周辺の導体パターンに接続している。等価
的な記号で表してある巻線５５のリード５６Ａ、
リード５６Ｂは夫々切溝５１Ａ、切溝５１Ｂに挾
み込まれ、巻線５７のリード５６Ｃ、リード５６
Ｄは夫々切溝５１Ｃ、切溝５１Ｄに挾み込まれ
る。これによつて、リード５６Ａ、リード５６Ｂ
は夫々凹部５３Ｂ、凹部５３Ａの図示されていな
い外部端子に接続し、リード５６Ｃ、リード５６
Ｄは夫々凹部５３Ｄ、凹部５３Ｃの外部端子に接
続する。客先の仕様により巻線のリードに接続す
る外部端子の位置がそのリードの挾まれる切溝に
続く凹部に存在しないように規定される場合でも
このように導体パターンを形成することにより、
リード５６Ａとリード５６Ｂ、リード５６Ｃとリ
ード５６Ｄは真直ぐ引出して切溝に挾むだけでよ
く夫々交差することはない。 FIG. 7 is a partial plan view of a substrate showing another embodiment of the conductor pattern. The sides of the substrate 50 are formed with recesses into which external terminals are fitted and grooves into which winding leads are inserted. However, unlike the substrate 12 shown in FIG. 4, the conductive patterns are formed independently around the recesses and the kerfs. and kerf 51
The conductor pattern 52A around A is connected to the conductor pattern 54B around the recess 53B, and the conductor pattern 52B around the kerf 51B is connected to the conductor pattern 54A around the recess 53A. Similarly, the conductor pattern 52C around the cut groove 51C is formed into the recess 53D.
is connected to the conductor pattern 54D around the kerf 51.
The conductor pattern 52D around D is connected to the conductor pattern 54C around the recess 53C. In other words, the conductor pattern around the kerf is connected to a conductor pattern around a recess different from the recess to which the kerf continues. Lead 56A of winding 55, represented by equivalent symbols;
The leads 56B are inserted into the grooves 51A and 51B, respectively, and the leads 56C and 56 of the winding 57
D is inserted into the kerf 51C and the kerf 51D, respectively. As a result, the leads 56A and 56B
are connected to external terminals (not shown) in the recess 53B and recess 53A, respectively, and the lead 56C and the lead 56
D are connected to external terminals of the recess 53D and recess 53C, respectively. By forming the conductor pattern in this way, even if the customer's specifications stipulate that the position of the external terminal connected to the winding lead is not in the recess next to the kerf where the lead is held,
The leads 56A and 56B, and the leads 56C and 56D can be simply pulled out straight and inserted into the grooves without intersecting each other.
以上述べたように本考案の小型電子部品はケー
スや収納部を有するベースを用いることなく素子
本体を基板に固定することができる。素子本体と
外部端子との接続は基板の導体パターンにより行
われる。弾性保護材で包まれた素子本体は複数あ
つても無論よい。従つて実装容積が大きくなり、
全体形状を小さくできる。又外部端子はリードフ
レームを用いて形成することが可能であるし、リ
ードを外部端子にからげる必要もないから自動化
が容易である。又素子本体のリードを外部端子に
接続する時にリードが交差することもなく信頼性
が向上する。 As described above, in the small electronic component of the present invention, the element body can be fixed to the substrate without using a case or a base having a storage section. Connections between the element body and external terminals are made by conductor patterns on the substrate. Of course, there may be a plurality of element bodies wrapped with the elastic protective material. Therefore, the mounting volume becomes large,
The overall shape can be made smaller. Furthermore, the external terminals can be formed using a lead frame, and there is no need to tie the leads to the external terminals, so automation is easy. Furthermore, when connecting the leads of the element body to external terminals, the leads do not cross each other, improving reliability.
本考案は素子本体が巻線したトロイダルコアで
あるパルストランスを例にとり説明したが、素子
本体の内部構造を実施例に限定する必要はなく、
少くとも素子本体の一部を巻線を用いて構成して
ある種々の小型電子部品に応用し得ることは明ら
かである。 Although the present invention has been explained by taking as an example a pulse transformer in which the element body is a toroidal core wound with wires, it is not necessary to limit the internal structure of the element body to the embodiment.
It is clear that the present invention can be applied to various small electronic components in which at least a part of the element body is constructed using a winding.
第１図と第２図は従来の小型電子部品の断面
図、第３図は本考案の小型電子部品の実施例を示
す正面図、第４図は第３図の分解斜視図、第５図
と第６図は外部端子と基板の接続部分を示す部分
拡大斜視図、第７図は導体パターンの別の実施例
を示す基板の部分平面図である。
１０：弾性保護材、１１：トロイダルコア、１
２，３０，４５，５０：基板、１３，３２，４
０：外部端子、１４：貫通孔、１６，４２，５３
Ａ，５３Ｂ，５３Ｃ，５３Ｄ：凹部、１７，３
１，４３，５２Ａ，５２Ｂ，５２Ｃ，５２Ｄ：切
溝、１８：リード、１９，３３，４４，５２Ａ，
５２Ｂ，５２Ｃ，５２Ｄ，５４Ａ，５４Ｂ，５４
Ｃ，５４Ｄ：導体パターン、２０：係止部。
Figures 1 and 2 are sectional views of conventional small electronic components, Figure 3 is a front view showing an embodiment of the small electronic component of the present invention, Figure 4 is an exploded perspective view of Figure 3, and Figure 5. and FIG. 6 is a partially enlarged perspective view showing the connecting portion between the external terminal and the board, and FIG. 7 is a partial plan view of the board showing another embodiment of the conductor pattern. 10: Elastic protective material, 11: Toroidal core, 1
2, 30, 45, 50: substrate, 13, 32, 4
0: External terminal, 14: Through hole, 16, 42, 53
A, 53B, 53C, 53D: recess, 17, 3
1, 43, 52A, 52B, 52C, 52D: Cut groove, 18: Lead, 19, 33, 44, 52A,
52B, 52C, 52D, 54A, 54B, 54
C, 54D: conductor pattern, 20: locking part.
Claims (1)
保護材で包み、その係止部を基板に設けた固定
手段に取付けると共に、基板の側辺に固定して
ある外部端子に素子本体のリードを接続し、外
部端子の一部を露呈させた状態で全体を樹脂封
止してあることを特徴とする小型電子部品。 (2) 基板の側辺には素子本体のリードを挾み込む
ための該基板の内部に延在する切溝が形成して
あり、素子本体は切溝の周辺に設けられている
導体パターンを介して外部端子に接続している
実用新案登録請求の範囲第１項記載の小型電子
部品。[Scope of Claim for Utility Model Registration] (1) Wrap the wound element body with an elastic protective material provided with a locking part, attach the locking part to a fixing means provided on the board, and attach it to the side of the board. A small electronic component characterized in that the leads of the element body are connected to external terminals fixed to the device, and the entire body is sealed with resin with a part of the external terminals exposed. (2) A cut groove is formed on the side of the board that extends inside the board for inserting the leads of the element body, and the element body has a conductor pattern provided around the cut groove. A small electronic component according to Claim 1 of the Utility Model Registration Claim, which is connected to an external terminal via a small electronic component.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4392984U JPS60156712U (en) | 1984-03-27 | 1984-03-27 | small electronic components |
| US06/715,177 US4628148A (en) | 1984-03-27 | 1985-03-20 | Encapsulated electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4392984U JPS60156712U (en) | 1984-03-27 | 1984-03-27 | small electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60156712U JPS60156712U (en) | 1985-10-18 |
| JPH0211769Y2 true JPH0211769Y2 (en) | 1990-04-03 |
Family
ID=30556050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4392984U Granted JPS60156712U (en) | 1984-03-27 | 1984-03-27 | small electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60156712U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0519933Y2 (en) * | 1988-06-23 | 1993-05-25 |
-
1984
- 1984-03-27 JP JP4392984U patent/JPS60156712U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60156712U (en) | 1985-10-18 |
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