JPH02109357A - Manufacture of clad plate for plastic molding - Google Patents
Manufacture of clad plate for plastic moldingInfo
- Publication number
- JPH02109357A JPH02109357A JP26259888A JP26259888A JPH02109357A JP H02109357 A JPH02109357 A JP H02109357A JP 26259888 A JP26259888 A JP 26259888A JP 26259888 A JP26259888 A JP 26259888A JP H02109357 A JPH02109357 A JP H02109357A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- parts
- materials
- clad plate
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000010137 moulding (plastic) Methods 0.000 title 1
- 239000000463 material Substances 0.000 claims abstract description 27
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 16
- 229910000640 Fe alloy Inorganic materials 0.000 claims abstract description 8
- 238000000137 annealing Methods 0.000 claims abstract description 8
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract description 23
- 239000000956 alloy Substances 0.000 abstract description 23
- 229910003271 Ni-Fe Inorganic materials 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 6
- 238000003466 welding Methods 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract description 3
- 238000005096 rolling process Methods 0.000 abstract description 3
- 238000005304 joining Methods 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000005097 cold rolling Methods 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
利用産業分野
この発明は、プラスチックモールド用クラッド板の製造
方法に係り、特に、CuまたはCu合金板からなる基板
表面の中央部長手方向に、連続的にまたは非連続的にN
i30〜50%含有Fe合金板を被着してなるプラスチ
ックモールド用クラッド板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Application This invention relates to a method for manufacturing a clad plate for a plastic mold. niN
The present invention relates to a method of manufacturing a clad plate for a plastic mold by covering an Fe alloy plate containing 30 to 50% i.
背景技術
プラスチックモールド用封着合金には、一般的に42%
Ni−Fe合金が用いられ、大容量用としてはCu合金
板が用いられている。Background technology Sealing alloys for plastic molds generally contain 42%
A Ni-Fe alloy is used, and a Cu alloy plate is used for large capacity applications.
前記42%Ni−Fe合金は、半導体のSiチップと熱
膨張係数が近似していることにより、よく使用されてい
るが、封着されるプラスチックとの熱膨張係数差が大き
く、また熱伝導性があまりよくない欠点がある。The 42% Ni-Fe alloy is often used because its coefficient of thermal expansion is similar to that of semiconductor Si chips, but it has a large difference in coefficient of thermal expansion from the plastic to which it is sealed, and also has poor thermal conductivity. However, there is a drawback that it is not very good.
また、CuあるいはCu合金は、プラスチックとの熱膨
張係数が近似し、熱伝導性のすぐれている利点はあるが
、Siチップと熱膨張係数差が大きい問題がある。Furthermore, although Cu or Cu alloy has the advantage of having a thermal expansion coefficient similar to that of plastic and excellent thermal conductivity, it has the problem of a large difference in thermal expansion coefficient from that of a Si chip.
そこで、かかる熱膨張差問題を解消する目的で、従来、
42%Ni−Fe合金板または36%Ni−Fe合金を
芯材とし、その両面にCuまたはCu合金を被着したク
ラッド板が提案されている。Therefore, in order to solve this problem of thermal expansion difference, conventionally,
A clad plate has been proposed in which a 42% Ni-Fe alloy plate or a 36% Ni-Fe alloy is used as a core material, and Cu or a Cu alloy is coated on both sides of the core material.
今日ではさらに、前記クラッド板の低コスト化がとみに
要望されるようになり、最近、42%Ni−Fe合金、
及びCuまたはCu合金の特性、利点を兼備えたリード
フし・−ム4;Aとして、半導体のSiチップ載置部に
Siの熱膨張係数の近似するNi−Fe系合金を、それ
以外の部分にCuまたはCu合金を用いたプラスチック
モールド用リードフレーム材が提案(特開昭62−13
6059号公報)されている。しかし、このリードフレ
ーム材を安価に提供する製造方法は提案されていなかっ
た。Nowadays, there is a growing demand for lowering the cost of the clad plate, and recently, 42% Ni-Fe alloy,
As for lead frame 4 A, which has the characteristics and advantages of Cu or Cu alloy, a Ni-Fe alloy having a coefficient of thermal expansion similar to that of Si is used for the Si chip mounting part of the semiconductor, and the other parts are A lead frame material for plastic molds using Cu or Cu alloy was proposed (Japanese Patent Laid-Open No. 62-13
No. 6059). However, no manufacturing method for providing this lead frame material at low cost has been proposed.
発明の目的
この発明は、Siチップ載置部にNi−Fe系合金τ、
それ以外の部分にCuまたはCu合金を用いたリードフ
レーム旧に用いられるクラッド板を1氏コストで、かつ
能率良く製造する方法を提供することを目的としている
。Purpose of the Invention This invention provides a Si chip mounting portion with a Ni-Fe alloy τ,
It is an object of the present invention to provide a method for efficiently manufacturing a clad plate used in an old lead frame in which Cu or Cu alloy is used in other parts at a cost of 1 mil.
発明の概要
この発明は、
CuまたはCu合金からなる基板の少なくとも1主面の
中央部の長手方向に、
被着利科のNi30〜50%含有Fe合合板の断面寸法
にほぼ等しい大きさの溝部を機械加工またはロール加工
等により、連続的にまたは非連続的に形成し、
その後、前記溝部内に被着月料のNi30〜50%含有
Fe合金板を挿入して冷間圧接し。Summary of the Invention This invention provides a groove portion having a size approximately equal to the cross-sectional dimension of Fe plywood containing 30 to 50% Ni to be adhered, in the longitudinal direction of at least one main surface of a substrate made of Cu or a Cu alloy. is formed continuously or discontinuously by machining or roll processing, and then a Fe alloy plate containing 30 to 50% Ni as a deposit is inserted into the groove and cold welded.
さらに、600℃〜1050℃に加熱して拡散焼鈍する
ことを特徴とするプラスチックモールド用クラッド板の
製造方法である。Furthermore, the method for manufacturing a clad plate for a plastic mold is characterized in that diffusion annealing is performed by heating to 600°C to 1050°C.
この発明にて得られたクラッド板は、これを所要寸法に
打抜加工、あるいはエツチング加工してリードフレーム
材を得ることができる。The clad plate obtained by this invention can be punched or etched to a required size to obtain a lead frame material.
例えば、前j己被着材料が連続的に基板に配設された縞
状クラッド板の場合は、被着材料にり・1して直角方向
に2方向に多数のリードビンをとるDIP(dual
1nline package )用のリードフレーム
材を得ることができる。For example, in the case of a striped clad plate in which the adherend material is continuously disposed on the substrate, DIP (dual
1nline package) can be obtained.
また、非連続的に被着材料を配設した島状クラッド板か
らは、被着材料に対して直角方向に4方向に多数のり−
ドピンをとるQFP(quad flatpackag
e )用のリードフレーム材を得ることができる。In addition, from the island-shaped clad plate on which the adherend material is disposed discontinuously, a large number of adherends are formed in four directions perpendicular to the adherend material.
QFP (quad flatpackag) that takes dopin
Lead frame material for e) can be obtained.
発明の構成
この発明において、破着イ]料をNi30〜50%含有
Fea金とするのは、Ni30%未満では熱膨張係数が
大きくなり、また、Ni50%を超えるとやはり同様で
、Siチップの熱膨張との差が大きくなるためであり、
好ましいNi−Fe合金は、42%N1−Fe合金であ
る。Structure of the Invention In this invention, the reason why the bonding material is Fea gold containing 30 to 50% Ni is that if the Ni content is less than 30%, the coefficient of thermal expansion becomes large. This is because the difference with thermal expansion becomes larger.
A preferred Ni-Fe alloy is a 42% N1-Fe alloy.
また、基板表面に形成される溝部寸法は、被着月科の断
面寸法にほぼ等しいことが好ましい。Further, it is preferable that the dimension of the groove formed on the substrate surface is approximately equal to the cross-sectional dimension of the attached moon.
冷間圧延時の圧下率は30%〜70%、好ましくは50
%〜60%である。The rolling reduction during cold rolling is 30% to 70%, preferably 50%.
% to 60%.
また、拡散焼鈍条件としては、
600 ”(、’〜]050℃に1分〜60分が好まし
く、600”C未満では接合が不十分であり、1050
’Cを超えると、Cuが溶けるので好ましくない。In addition, the diffusion annealing conditions are preferably 1 minute to 60 minutes at 600"(,'~)050°C; below 600"C, bonding is insufficient;
If it exceeds 'C, Cu will melt, which is not preferable.
この発明によるクラッド板は、打抜加工してリードフレ
ーム材を得る場合、基板表面に被着する異材質による打
抜歪発生を防止するため、被着材料は基板の両面に被着
することが好ましい。When the clad plate according to the present invention is punched to obtain a lead frame material, the material to be adhered to can be applied to both sides of the substrate in order to prevent the generation of punching distortion due to different materials adhering to the surface of the substrate. preferable.
発明の効果
この発明の製造方法により、DIP、 QFP用リーす
フレーム材に最適の縞クラッド板を効率よく安価に製造
することができる。Effects of the Invention By the manufacturing method of the present invention, it is possible to efficiently and inexpensively manufacture a striped clad plate that is most suitable for a leash frame material for DIP and QFP.
また、この発明によるクラッド板は、基板のCuまたは
Cu合会合板プラスチックとの熱膨張係数差が、従来用
いられた42%Ni−Fe合金に比し、小さいため、熱
歪が少なく、温度によるプラスチックとの密着性の変化
が小さく、さらに、熱伝導率も良好のため熱放敗性も大
きい利点があり、また、Siチップの載14部となるN
i30〜50%含有Fe合金は、Siチップとの熱膨張
係数が近似し、めっき性も良好なため、理想的なリード
フレーム材を得ることができる。In addition, the clad plate according to the present invention has a smaller difference in coefficient of thermal expansion with the Cu or Cu bonded plate plastic of the substrate, compared to the conventionally used 42% Ni-Fe alloy, so there is less thermal distortion and It has the advantage that there is little change in adhesion with plastic, and it also has good thermal conductivity, so it has great heat dissipation properties.
Since the Fe alloy containing 30 to 50% i has a thermal expansion coefficient similar to that of the Si chip and has good plating properties, it is possible to obtain an ideal lead frame material.
図面に基づ〈発明の開示
第1図はこの発明の製造方法を示す合金帯の長手方向の
工程説明図である。ここでは被着材料が連続的に基板に
配設された縞状のクラッド板の場合について説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a process explanatory diagram in the longitudinal direction of an alloy strip showing the manufacturing method of the present invention. Here, the case of a striped clad plate in which the adherend material is continuously disposed on the substrate will be described.
第1図において、まず、巻戻したCu合金帯(1)の両
面の中央部に、被着材料の断面とほぼ同一の寸法溝部を
加工ロール(2)にて圧延加工するか、あるいは図示し
ないが、機械加工して形成する。In FIG. 1, first, a groove with dimensions almost the same as the cross section of the adherend material is formed in the center of both sides of the unwound Cu alloy strip (1) by rolling with a processing roll (2), or (not shown). is formed by machining.
その後、加熱炉(3)にて還元雰囲気中で焼鈍し、前記
合金帯表面の清浄化処理を施す。Thereafter, the alloy strip is annealed in a reducing atmosphere in a heating furnace (3) to perform a cleaning treatment on the surface of the alloy strip.
さらに、冷間圧接すべき被着旧料の被着予定部分を′ツ
イヤブラシ(4)にてrrr[摩して清浄化する。Furthermore, the part to be coated with the old material to be cold-welded is cleaned by rubbing with a gloss brush (4).
溝清浄後、被着利科の30〜50%Ni含有Fe合金板
(5)を舟戻しながら前記溝部内に挿入し、圧接ロール
(6)にて冷間圧延して接合を完了する。After cleaning the groove, a 30-50% Ni-containing Fe alloy plate (5) to be bonded is inserted into the groove while being returned to the boat, and cold rolled with a pressure roll (6) to complete the bonding.
そ[−で、加熱炉(7)に′C1600”C〜1050
”Cの温度範囲で拡散焼鈍を行い、Cu合金帯(1)の
両面の中央部の1そ手方向に前記Ni−Fe合金板の接
合を完全にし′C縞状のクラッド板(8)得る。Then, heat the heating furnace (7) to 'C1600''C~1050.
Diffusion annealing is performed in a temperature range of C to completely bond the Ni-Fe alloy plate in one direction in the center of both sides of the Cu alloy strip (1) to obtain a striped clad plate (8). .
また、さらに、得られたクラッド板を所要の;1法、形
状に調整するため、少なくとも1回の冷間圧延を施し、
その後、クラッド板内に不均一に残存する内部歪を除去
するため、800℃以下で熱処理したり、800℃以下
で加熱しながら、縞状クランド仮に張力を付り、して、
矯正を行うこともできる。Furthermore, in order to adjust the obtained clad plate to the required shape and shape, cold rolling is performed at least once,
After that, in order to remove the internal strain unevenly remaining in the clad plate, heat treatment is performed at a temperature below 800°C, or while heating at a temperature below 800°C, tension is temporarily applied to the striped clad plate.
Corrections can also be made.
実施例
板厚0.8mmX幅40mmのCu合金板を巻戻しなが
ら、所要凸状を有する加工ロールによる圧延で、前記C
u合金板両面の中央部に被着材料の42%Ni−Fe合
金板の断面寸法に近似する溝寸法0.15mmX 15
.5mmの溝形成を行った。Example While unwinding a Cu alloy plate with a thickness of 0.8 mm and a width of 40 mm, the above C
Groove size 0.15 mm x 15, which approximates the cross-sectional dimension of the 42% Ni-Fe alloy plate as the adherend material, in the center of both sides of the u alloy plate.
.. A groove of 5 mm was formed.
その後、還元雰囲気中で焼鈍後、表面を清浄化処理した
。Thereafter, the surface was cleaned after annealing in a reducing atmosphere.
次に、前記Cu合金板の溝部に、板厚0.]、5mmX
輻15mrnの42%Ni−Fe合金を巻戻しながら挿
入し、圧接ロールにより、圧下率60%にて冷間圧接を
行く)な。Next, in the groove portion of the Cu alloy plate, a plate thickness of 0. ], 5mmX
A 42% Ni-Fe alloy with a width of 15 mrn was inserted while being unwound, and cold welding was performed using a pressure roll at a reduction rate of 60%.
その後、雰囲気H2ガスまたはFr2十N2混合ガス中
にて、1000℃、3分の拡散焼鈍を行い、縞状クラッ
ド板を得た。Thereafter, diffusion annealing was performed at 1000° C. for 3 minutes in an atmosphere of H2 gas or a mixed gas of 20 Fr to obtain a striped clad plate.
この発明による縞クラッド板は、Cu基板−4Lに42
%Ni−Fe合金を圧接するが、その圧接部(N7.の
熱膨張係数は20℃〜300Cの範囲内で、8.0〜1
1.0xlO−6であり、Cu基4反は16〜18xl
O−6であった。The striped clad plate according to the present invention has a thickness of 42 mm on a Cu substrate-4L.
%Ni-Fe alloy is pressure welded, but the thermal expansion coefficient of the pressure welded part (N7.
1.0xlO-6, Cu group 4 is 16-18xl
It was O-6.
一方、Siチップの熱膨張係数は9〜l1xlO−6、
プラス千ツクの熱膨張係数は16〜1.8xlO−6で
アF)、この発明の製造方法による”縞状クラッド板を
用いることにより、特性のすぐれたリードフレーム材が
71られることか明らかである。On the other hand, the thermal expansion coefficient of the Si chip is 9~l1xlO-6,
The coefficient of thermal expansion of plastic is 16 to 1.8xlO-6 (AF), and it is clear that by using the striped clad plate according to the manufacturing method of this invention, a lead frame material with excellent properties can be obtained. be.
第1図はこの発明の製造方法を示す合金帯の長Tノj向
の工程説明図である。
l・・Cu合金)ir、2・・・加工ロール、3・・・
加熱炉、4・・ワイー′フラジ、5・・・30〜50%
Ni含有Fe合金板、6山圧接ロール、7・・・加熱炉
、8山クラッド板。
第1コFIG. 1 is a process explanatory diagram of the length T-j direction of the alloy strip showing the manufacturing method of the present invention. l...Cu alloy)ir, 2...processing roll, 3...
Heating furnace, 4... Y'Fragi, 5... 30-50%
Ni-containing Fe alloy plate, 6 ridge pressure welding roll, 7... heating furnace, 8 ridge clad plate. 1st piece
Claims (1)
中央部の長手方向に、被着材料のNi30〜50%含有
Fe合金板の断面寸法にほぼ等しい溝部を連続的または
非連続的に形成し、その後、前記溝部に前記被着材料を
挿入して冷間圧接し、さらに、拡散焼鈍することを特徴
とするプラスチックモールド用クラッド板の製造方法。[Claims] 1. In the longitudinal direction of at least one main surface of a substrate made of Cu or a Cu alloy, a groove portion approximately equal to the cross-sectional dimension of the Fe alloy plate containing 30 to 50% Ni, which is the adherend material, is formed continuously or A method of manufacturing a clad plate for a plastic mold, comprising discontinuously forming the clad plate, then inserting the adherend material into the groove, cold-pressing the material, and further diffusion annealing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26259888A JPH02109357A (en) | 1988-10-18 | 1988-10-18 | Manufacture of clad plate for plastic molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26259888A JPH02109357A (en) | 1988-10-18 | 1988-10-18 | Manufacture of clad plate for plastic molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02109357A true JPH02109357A (en) | 1990-04-23 |
Family
ID=17378023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26259888A Pending JPH02109357A (en) | 1988-10-18 | 1988-10-18 | Manufacture of clad plate for plastic molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02109357A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5574310A (en) * | 1991-05-17 | 1996-11-12 | Fujitsu Limited | Semiconductor package for surface mounting with reinforcing members on support legs |
US5831332A (en) * | 1991-05-17 | 1998-11-03 | Fujitsu Limited | Semiconductor package for surface mounting |
US6266503B1 (en) | 1998-08-31 | 2001-07-24 | Canon Kabushiki Kaisha | Method for attaching electrostatic photosensitive drum method for replacing electrophotographic photosensitive drum and process cartridge |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4919769A (en) * | 1972-02-26 | 1974-02-21 | ||
JPS57121265A (en) * | 1981-01-20 | 1982-07-28 | Daido Steel Co Ltd | Pressure welding method of strip for lead frame |
JPS60242653A (en) * | 1984-05-16 | 1985-12-02 | Daido Steel Co Ltd | Composite material for lead frame |
-
1988
- 1988-10-18 JP JP26259888A patent/JPH02109357A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4919769A (en) * | 1972-02-26 | 1974-02-21 | ||
JPS57121265A (en) * | 1981-01-20 | 1982-07-28 | Daido Steel Co Ltd | Pressure welding method of strip for lead frame |
JPS60242653A (en) * | 1984-05-16 | 1985-12-02 | Daido Steel Co Ltd | Composite material for lead frame |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5574310A (en) * | 1991-05-17 | 1996-11-12 | Fujitsu Limited | Semiconductor package for surface mounting with reinforcing members on support legs |
US5831332A (en) * | 1991-05-17 | 1998-11-03 | Fujitsu Limited | Semiconductor package for surface mounting |
US5861669A (en) * | 1991-05-17 | 1999-01-19 | Fujitsu Limited | Semiconductor package for surface mounting |
US6266503B1 (en) | 1998-08-31 | 2001-07-24 | Canon Kabushiki Kaisha | Method for attaching electrostatic photosensitive drum method for replacing electrophotographic photosensitive drum and process cartridge |
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