JPH0197570A - Diamond grinding material for metal bond grinding stone - Google Patents
Diamond grinding material for metal bond grinding stoneInfo
- Publication number
- JPH0197570A JPH0197570A JP25310887A JP25310887A JPH0197570A JP H0197570 A JPH0197570 A JP H0197570A JP 25310887 A JP25310887 A JP 25310887A JP 25310887 A JP25310887 A JP 25310887A JP H0197570 A JPH0197570 A JP H0197570A
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- grinding
- metal bond
- material layer
- carbon material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 48
- 239000010432 diamond Substances 0.000 title claims abstract description 48
- 239000002184 metal Substances 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 23
- 238000000227 grinding Methods 0.000 title abstract description 30
- 239000000463 material Substances 0.000 title abstract description 17
- 239000004575 stone Substances 0.000 title abstract description 5
- 239000003575 carbonaceous material Substances 0.000 claims abstract description 13
- 239000003082 abrasive agent Substances 0.000 claims description 26
- 239000006061 abrasive grain Substances 0.000 claims description 16
- 229910021385 hard carbon Inorganic materials 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 5
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 10
- 229910052799 carbon Inorganic materials 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000004567 concrete Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- -1 tile Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はコンクリート、石は、スレート、タイル、ガラ
ス、セラミックス、フェライト、超硬金属等硬質材料の
加工用メタルボンドダイヤモンド砥石の製造に使用する
ダイヤモンド砥材に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is used for manufacturing a metal-bonded diamond grinding wheel for processing hard materials such as concrete, stone, slate, tile, glass, ceramics, ferrite, and cemented carbide. Regarding diamond abrasive materials.
ダイヤモンドは天然の鉱物中で最も高硬質であることの
性質を利用し、上記各種硬質材料の加工用砥石の砥材と
して広く使用されている。Utilizing the property that diamond is the hardest among natural minerals, it is widely used as an abrasive material for grinding wheels for processing the various hard materials mentioned above.
しかしながら、ダイヤモンドは他物質と接着し難いため
、ダイヤモンド砥石を作製する場合のダイヤモンド砥粒
の保持は、通常、ボンド材に機械的に埋め込む方法が一
般的に用いられている。However, since diamond is difficult to adhere to other substances, a method of mechanically embedding diamond abrasive grains in a bonding material is generally used to hold diamond abrasive grains when manufacturing a diamond whetstone.
そして、メタルボンドダイヤモンド砥石による研削は、
一部ボンド面から露出したダイヤモンド砥粒で研削作用
が行われるため、ダイヤモンド砥粒のボンドによる保持
力が砥石の寿命に大きな影響をもたらす。Grinding with a metal bond diamond grinding wheel is
Since the grinding action is performed by the diamond abrasive grains partially exposed from the bond surface, the holding power of the diamond abrasive grains by the bond has a large effect on the life of the grindstone.
研削砥石におけるボンド材の主要な役割は、（１）砥材
の保持
（２）砥材埋まり込み防止のための支持（３）砥石の摩
耗速度コントロール
の３点にある。The bond material in a grinding wheel has three main roles: (1) holding the grinding material, (2) supporting the grinding material to prevent it from being embedded, and (3) controlling the wear rate of the grinding wheel.
ところが、単一の結合剤でこれらの３つの役割を同時に
調整することは非常に難しい。たとえば、砥石の切味向
上のためには軟質のボンド材を使用して砥石の摩耗速度
を大きくするのが一般的であるが、同時に砥材の保持力
及び砥材の支持力が低下し、逆に切味向上が達成できな
いという問題があった。However, it is extremely difficult to simultaneously adjust these three roles with a single binding agent. For example, in order to improve the sharpness of a whetstone, it is common to use a soft bond material to increase the wear rate of the whetstone, but at the same time, the holding power of the abrasive material and the supporting force of the abrasive material are reduced. On the other hand, there was a problem in that it was not possible to improve the cutting quality.
このため、たとえば、特開昭５５−６５０７５号公報。For this reason, for example, Japanese Patent Application Laid-open No. 55-65075.
特開昭５６−３９８６２号公報等に記載のように、レジ
ンボンド用砥材として、電着、スパッタリング、化学蒸
着、電解メツキ、無電解メツキ等によって、Ｎｉ、 Ｃ
ｕ、 Ｔｉ を被覆したメタルコート砥材が開発され、
物理的、化学的に砥材の保持強度の向上が図られている
。As described in Japanese Unexamined Patent Publication No. 56-39862, Ni, C, etc. can be applied as an abrasive material for resin bonding by electrodeposition, sputtering, chemical vapor deposition, electrolytic plating, electroless plating, etc.
A metal-coated abrasive material coated with u and Ti has been developed,
Efforts have been made to physically and chemically improve the holding strength of the abrasive material.
・：抛明が解決しようとする問題点〕
しかしながら、上記従来のメタルコート砥材は、■ 被
覆材とダイヤモンド砥材との間には基本的に化学的結合
がないため、被覆膜のダイヤモンド表面に対する接着強
度が低く、砥材の保持力が充分でない、
■ 金属結合剤の場合、被覆材は焼結時の熱によって周
辺の金属結合剤中に拡散し、極端な場合被覆層が消失し
てしまうことがある、
■ 従来のメタルコート材は、素地の結合剤（メタルボ
ンド）と硬度９強度的な差が小さく、ダイヤモンド砥粒
の保持力向上の効果が少ない。・：Problems that Hakumei is trying to solve] However, with the conventional metal coated abrasive materials mentioned above, ■ Since there is basically no chemical bond between the coating material and the diamond abrasive material, the diamond in the coating film The adhesion strength to the surface is low, and the holding power of the abrasive material is not sufficient. ■ In the case of a metal bond, the coating material will diffuse into the surrounding metal bond due to the heat during sintering, and in extreme cases, the coating layer may disappear. ■ Conventional metal coating materials have a small difference in hardness and strength from the base bond (metal bond), and are less effective in improving the holding power of diamond abrasive grains.
等の欠点があった。There were other drawbacks.
本発明の目的は、このような従来のメタルコーティング
によるダイヤモンド砥材保持の欠点を解消し、ダイヤモ
ンド砥粒のメタルボンドによる保持力を改善することに
ある。An object of the present invention is to eliminate the drawbacks of holding diamond abrasive materials by conventional metal coatings and to improve the holding power of diamond abrasive grains by metal bonding.
Ｃ問題点を解決するための手段〕
本発明は、ダイヤモンドの形状変化の手段として用いら
れているダイヤモンドの気相合成において知られている
ように、ダイヤモンド砥粒への炭素の付着性が比較的良
好である点に着目して完成したもので、ダイヤモンド砥
粒表面にダイヤモンド状硬質炭素材を形成してなるダイ
ヤモンド砥はを使用することによって上記目的を達成し
たものである。Means for Solving Problem C] As is known in the vapor phase synthesis of diamond, which is used as a means of changing the shape of diamond, the present invention is characterized in that the adhesion of carbon to diamond abrasive grains is relatively low. It was completed with attention to its good characteristics, and the above object was achieved by using a diamond abrasive in which a diamond-like hard carbon material was formed on the surface of diamond abrasive grains.
本発明において、適用するダイヤモンド砥粒としては、
通常径のものが使用でき、また、上記従来のメタルコー
ティングを施した砥粒にも適用できる。In the present invention, the diamond abrasive grains to be applied include:
Abrasive grains with a normal diameter can be used, and the abrasive grains can also be applied to the conventional metal-coated abrasive grains mentioned above.
ダイヤモンド砥材の被覆材としては、「セラミックス２
１ （１９８６） Ｎｏ、 ６ Ｊに記載のダイヤモン
ドの気相合成によって得られたＩ−カーボンとして知ら
れているダイヤモンド状硬質カーボンを用いる。As a coating material for diamond abrasive material, “Ceramics 2
1 (1986) No. 6 J, diamond-like hard carbon known as I-carbon obtained by vapor phase synthesis of diamond is used.
また、被覆方法としては、ダイヤモンド砥粒に直接被覆
を形成する場合には、高周波スパッタリング法を適用し
、また砥粒がメタルコートされている場合には直流スパ
ッタリング法を適用する。Further, as a coating method, when forming a coating directly on the diamond abrasive grains, a high frequency sputtering method is applied, and when the abrasive grains are coated with a metal, a DC sputtering method is applied.
更に、メタンと水素を混合したガスを用い、化学反応に
よってダイヤモンド粒子に炭素被覆を被覆する化学蒸着
法等任意の方法を用いることもできる。Furthermore, any method such as a chemical vapor deposition method in which diamond particles are coated with a carbon coating through a chemical reaction using a gas mixture of methane and hydrogen can also be used.
このダイヤモンド砥材の炭素質被覆材の厚みは、メタル
ボンドに対する密着性に顕著に影響する。The thickness of the carbonaceous coating material of this diamond abrasive material significantly affects the adhesion to the metal bond.
著しく薄い場合は密着性の向上の効果が認められず、ま
た、１ｗｎ以上と厚い被覆を施したものは密着性能はむ
しろ低下し、被覆面よりの剥離が起こり、２〜５ｐの膜
厚の場合がとくにを効である。If it is extremely thin, no effect of improving adhesion will be observed, and if the coating is thicker than 1wn, the adhesion performance will actually deteriorate and peeling from the coated surface will occur, and if the coating is 2 to 5p thick, This is especially effective.
このように、ダイヤモンド状炭素材を被覆したダイヤモ
ンド砥材によってメタルボンドとの接着効果に適した界
面を形勢することができ、焼成時にダイヤモンド粒子と
ダイヤモンド状カーボンが同素体要素を有し、そのため
相互拡散が容易で接着効果が増大する。In this way, the diamond abrasive material coated with the diamond-like carbon material can form an interface suitable for the adhesive effect with the metal bond, and during firing, the diamond particles and the diamond-like carbon have an allotrope element, so that mutual diffusion occurs. It is easy to bond and increases the adhesion effect.
また、ダイヤモンド状炭素材として、合成過程の微細な
ダイヤモンド粒を分散させたダイヤモンド状炭素材は、
それ自体も、砥材として作用し、製作した砥石の研削能
を上げると共に、砥材そのもののメタルボンドとの結合
性を上げることができる。In addition, as a diamond-like carbon material, a diamond-like carbon material in which fine diamond particles are dispersed during the synthesis process is
The abrasive material itself acts as an abrasive material, increasing the grinding ability of the manufactured whetstone and improving the bonding ability of the abrasive material itself with the metal bond.
高周波スパッタ装置でターゲットに黒鉛板を用い、Ｉ
Ｘ １Ｏ−２Ｔｏｒｒのアルゴンと水素ガスによる混合
ガス雰囲気として、ダイヤモンド粒子を機械的に振動（
１０サイクル／分）させるようにした２００℃の基盤上
に設置し、ｌ−カーボン（ダイヤモンド状硬質カーボン
）を２ ｕ！ｎＭ Ｍさせた。この工具を、切り込み深
さ５ＱｍＪ 送り速度２．０ ｍ／ｍｉｎ のコンク
リートの研削試験に適用した。Using a graphite plate as a target in a high-frequency sputtering device, I
The diamond particles were mechanically vibrated (
It was installed on a 200°C substrate with a temperature of 10 cycles/min), and l-carbon (diamond-like hard carbon) was applied at 2 u! I made nM M. This tool was applied to a concrete grinding test with a cutting depth of 5 QmJ and a feed rate of 2.0 m/min.
上記ブレードの比較のために、このｌ−カーボンの被覆
を行わない従来砥材を用いて切断ブレードを作製した。For comparison with the above blade, a cutting blade was prepared using a conventional abrasive material that was not coated with l-carbon.
第１図は、これら本発明による砥石と従来の砥石の研削
の結果を示す図である。同図に示すように、本発明のダ
イヤモンド砥粒を用いた切断ブレードは従来のものと比
較して、耐用で３５％向上し、テスト機械の消費電力も
３４％低いことが確認できた。機械の消費電力が少ない
ことは、同一作業をより少ないパワーで行うことを示し
、切断プレートの切味が良いことを示す。FIG. 1 is a diagram showing the results of grinding using the grindstone according to the present invention and the conventional grindstone. As shown in the figure, it was confirmed that the cutting blade using the diamond abrasive grains of the present invention had 35% improved durability and 34% lower power consumption in the test machine compared to the conventional one. Lower power consumption of the machine means that the same work can be done with less power, which means that the cutting plate is sharper.
実施例に示すように、本発明によるダイヤモンド質硬質
炭素を被覆した砥材は、ダイヤモンド砥材に対する結合
性と共に、ボンドメタルとの結合性もきわめて良く、研
削加工中のダイヤモンド砥材の剥離が少なく、研削特性
の優れた、長寿命のメタルボンドのダイヤモンド工具を
得ることができる。As shown in the examples, the abrasive material coated with diamond hard carbon according to the present invention has extremely good bonding properties to the diamond abrasive material as well as bond metal, and the diamond abrasive material hardly peels off during grinding. , a metal-bonded diamond tool with excellent grinding properties and long life can be obtained.
第１図は、本発明のダイヤモンド砥材と従来の砥材の効
果の比較を示す図でみる。FIG. 1 is a diagram showing a comparison of the effects of the diamond abrasive material of the present invention and a conventional abrasive material.
Claims (1)
層を形成して成ることを特徴とするメタルボンド砥石用
ダイヤモンド砥材。 ２、ダイヤモンド状硬質炭素材層がダイヤモンド状硬質
炭素材の薄膜であることを特徴とする特許請求の範囲第
１項に記載のメタルボンド砥石用ダイヤモンド砥材。 ３、ダイヤモンド状硬質炭素材層が粒状ダイヤモンド状
硬質炭素材の集合体であることを特徴とする特許請求の
範囲第１項に記載のメタルボンド砥石用ダイヤモンド砥
材。[Claims] 1. A diamond abrasive material for a metal bond grindstone, characterized in that a diamond-like hard carbon material layer is formed on the surface of diamond abrasive grains. 2. The diamond abrasive material for a metal bonded grindstone according to claim 1, wherein the diamond-like hard carbon material layer is a thin film of a diamond-like hard carbon material. 3. The diamond abrasive material for a metal bonded grindstone according to claim 1, wherein the diamond-like hard carbon material layer is an aggregate of granular diamond-like hard carbon materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25310887A JPH0197570A (en) | 1987-10-06 | 1987-10-06 | Diamond grinding material for metal bond grinding stone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25310887A JPH0197570A (en) | 1987-10-06 | 1987-10-06 | Diamond grinding material for metal bond grinding stone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197570A true JPH0197570A (en) | 1989-04-17 |
Family
ID=17246608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25310887A Pending JPH0197570A (en) | 1987-10-06 | 1987-10-06 | Diamond grinding material for metal bond grinding stone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197570A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010502458A (en) * | 2006-08-30 | 2010-01-28 | スリーエム イノベイティブ プロパティズ カンパニー | Abrasive article and method with extended life |
| CN104479423A (en) * | 2014-12-30 | 2015-04-01 | 桂林创源金刚石有限公司 | Process of plating diamond surface with composite film |
| JP2015229197A (en) * | 2014-06-03 | 2015-12-21 | 株式会社ジェイテクト | Method of manufacturing vitrified bond grindstone and the vitrified bond grindstone |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828230A (en) * | 1981-08-17 | 1983-02-19 | Morinaga & Co Ltd | Detection of caramelizing of candies |
| JPS62152677A (en) * | 1985-12-25 | 1987-07-07 | Toshiba Tungaloy Co Ltd | Manufacture of grindstone |
-
1987
- 1987-10-06 JP JP25310887A patent/JPH0197570A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828230A (en) * | 1981-08-17 | 1983-02-19 | Morinaga & Co Ltd | Detection of caramelizing of candies |
| JPS62152677A (en) * | 1985-12-25 | 1987-07-07 | Toshiba Tungaloy Co Ltd | Manufacture of grindstone |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010502458A (en) * | 2006-08-30 | 2010-01-28 | スリーエム イノベイティブ プロパティズ カンパニー | Abrasive article and method with extended life |
| US8377158B2 (en) | 2006-08-30 | 2013-02-19 | 3M Innovative Properties Company | Extended life abrasive article and method |
| JP2015229197A (en) * | 2014-06-03 | 2015-12-21 | 株式会社ジェイテクト | Method of manufacturing vitrified bond grindstone and the vitrified bond grindstone |
| CN104479423A (en) * | 2014-12-30 | 2015-04-01 | 桂林创源金刚石有限公司 | Process of plating diamond surface with composite film |
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