JPH0189779U - - Google Patents
Info
- Publication number
- JPH0189779U JPH0189779U JP18630387U JP18630387U JPH0189779U JP H0189779 U JPH0189779 U JP H0189779U JP 18630387 U JP18630387 U JP 18630387U JP 18630387 U JP18630387 U JP 18630387U JP H0189779 U JPH0189779 U JP H0189779U
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- printed wiring
- multilayer printed
- wiring board
- layer board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
図面は本考案の多層プリント配線板の一実施例
を示す横断面図である。
１……内層板、３，４，１１，１２，１３，１
４……導体層、５，６……プリプレグ、７，８…
…外層板、１５，１６……外層板スルーホール、
１７……樹脂、１８……パツド、１９……表面実
装部品。
The drawing is a cross-sectional view showing an embodiment of the multilayer printed wiring board of the present invention. 1... Inner layer plate, 3, 4, 11, 12, 13, 1
4... Conductor layer, 5, 6... Prepreg, 7, 8...
...outer layer plate, 15, 16...outer layer plate through hole,
17...resin, 18...pad, 19...surface mount component.
Claims (1)
て、スルーホールを有する外層板を積層してなる
多層プリント配線板において、前記スルーホール
内に前記プリプレグの樹脂が充填されて形成され
たブラインドビアホールの上に、部品搭載用のパ
ツドを形成して成ることを特徴とする多層プリン
ト配線板。 In a multilayer printed wiring board in which an outer layer board having through holes is laminated on one or both sides of an inner layer board via prepreg, a blind via hole formed by filling the through hole with resin of the prepreg is used. , a multilayer printed wiring board characterized by forming pads for mounting components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18630387U JPH0189779U (en) | 1987-12-07 | 1987-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18630387U JPH0189779U (en) | 1987-12-07 | 1987-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189779U true JPH0189779U (en) | 1989-06-13 |
Family
ID=31477534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18630387U Pending JPH0189779U (en) | 1987-12-07 | 1987-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189779U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04239194A (en) * | 1991-01-11 | 1992-08-27 | Rohm Co Ltd | Printed board |
| JP2012074577A (en) * | 2010-09-29 | 2012-04-12 | Hitachi Chem Co Ltd | Multi-layer wiring substrate with svh |
-
1987
- 1987-12-07 JP JP18630387U patent/JPH0189779U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04239194A (en) * | 1991-01-11 | 1992-08-27 | Rohm Co Ltd | Printed board |
| JP2012074577A (en) * | 2010-09-29 | 2012-04-12 | Hitachi Chem Co Ltd | Multi-layer wiring substrate with svh |