JPH0186268U - - Google Patents
Info
- Publication number
- JPH0186268U JPH0186268U JP18264887U JP18264887U JPH0186268U JP H0186268 U JPH0186268 U JP H0186268U JP 18264887 U JP18264887 U JP 18264887U JP 18264887 U JP18264887 U JP 18264887U JP H0186268 U JPH0186268 U JP H0186268U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit device
- circuit board
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に係る混成集積回路
装置の実装状態の説明図、第２図は第１図を部分
的に拡大した斜視図、第３図は同装置の外部接続
リードの下端部の説明図、第４図は従来の混成集
積回路装置の実装状態の説明図、第５図は第４図
を部分的に拡大して示す斜視図である。
２１…混成集積回路基板、２２，２３…電子部
品、２５ａ，２５ｂ…ランド部、２６，３１…半
田層、２７…外部接続リード、２７ａ…弾性部、
２８…混成集積回路装置、２９…マザー回路基板
、３０…導体パターン。
Fig. 1 is an explanatory diagram of a mounted state of a hybrid integrated circuit device according to an embodiment of the present invention, Fig. 2 is a partially enlarged perspective view of Fig. 1, and Fig. 3 is an illustration of the external connection lead of the device. FIG. 4 is an explanatory diagram of the mounting state of the conventional hybrid integrated circuit device, and FIG. 5 is a partially enlarged perspective view of FIG. 4. 21... Hybrid integrated circuit board, 22, 23... Electronic component, 25a, 25b... Land part, 26, 31... Solder layer, 27... External connection lead, 27a... Elastic part,
28... Hybrid integrated circuit device, 29... Mother circuit board, 30... Conductor pattern.
Claims (1)
挟持し他端がマザー回路基板に固定される外部接
続リードとを具備した混成集積回路装置において
、前記外部接続リードの前記マザー回路基板と接
続すべき先端部分に屈曲により形成された弾性部
が設けられていることを特徴とする混成集積回路
装置。 In a hybrid integrated circuit device comprising a hybrid integrated circuit board and an external connection lead having one end sandwiching an edge of the board and the other end fixed to the mother circuit board, the external connection lead is connected to the mother circuit board. 1. A hybrid integrated circuit device, characterized in that an elastic portion formed by bending is provided at a tip end portion of the hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18264887U JPH0186268U (en) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18264887U JPH0186268U (en) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186268U true JPH0186268U (en) | 1989-06-07 |
Family
ID=31474094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18264887U Pending JPH0186268U (en) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186268U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0381672U (en) * | 1989-12-09 | 1991-08-21 |
-
1987
- 1987-11-30 JP JP18264887U patent/JPH0186268U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0381672U (en) * | 1989-12-09 | 1991-08-21 |