JPH0158955U - - Google Patents
Info
- Publication number
- JPH0158955U JPH0158955U JP15425187U JP15425187U JPH0158955U JP H0158955 U JPH0158955 U JP H0158955U JP 15425187 U JP15425187 U JP 15425187U JP 15425187 U JP15425187 U JP 15425187U JP H0158955 U JPH0158955 U JP H0158955U
- Authority
- JP
- Japan
- Prior art keywords
- flat pack
- solder resist
- coated
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の実施例のフラツトパツクIC
を基板にはんだ付けした状態を示す縦断面図、第
2図は従来のフラツトパツクICを基板にはんだ
付けした状態を示す縦断面図、第3図は従来のフ
ラツトパツクICのリード間にはんだ付きシヨー
トした状態を示す斜視図である。
1……フラツトパツクIC、2……リード、3
……ソルダーレジスト、4……プリント板、5…
…パツド、6……はんだ、7……はんだ粒。
Figure 1 shows a flat pack IC according to an embodiment of the present invention.
Figure 2 is a vertical cross-sectional view showing a conventional flat pack IC soldered to a circuit board, Figure 3 is a vertical cross-sectional view showing a conventional flat pack IC soldered to a circuit board, and Figure 3 shows a conventional flat pack IC soldered between the leads. It is a perspective view showing a state. 1... Flat pack IC, 2... Lead, 3
...Solder resist, 4...Printed board, 5...
...Pad, 6...Solder, 7...Solder grain.
Claims (1)
子を有するフラツトパツクIC。 A flat pack IC with lead terminals whose bases are coated with solder resist.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15425187U JPH0158955U (en) | 1987-10-07 | 1987-10-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15425187U JPH0158955U (en) | 1987-10-07 | 1987-10-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0158955U true JPH0158955U (en) | 1989-04-13 |
Family
ID=31430820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15425187U Pending JPH0158955U (en) | 1987-10-07 | 1987-10-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0158955U (en) |
-
1987
- 1987-10-07 JP JP15425187U patent/JPH0158955U/ja active Pending