JPH0158925U - - Google Patents

Info

Publication number
JPH0158925U
JPH0158925U JP15480387U JP15480387U JPH0158925U JP H0158925 U JPH0158925 U JP H0158925U JP 15480387 U JP15480387 U JP 15480387U JP 15480387 U JP15480387 U JP 15480387U JP H0158925 U JPH0158925 U JP H0158925U
Authority
JP
Japan
Prior art keywords
electronic component
chip electronic
lead terminal
thermosetting adhesive
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15480387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15480387U priority Critical patent/JPH0158925U/ja
Publication of JPH0158925U publication Critical patent/JPH0158925U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bおよびc,dはそれぞれ本考案の
一実施例を示すチツプ電子部品の側面図および底
面図、第2図は本考案によるチツプ電子部品の印
刷配線板への実装状態図である。 1…チツプ電子部品、2a,2b…板状リード
端子、3a,3b…熱硬化性接着剤、4…印刷配
線板、5…クリームハンダ。
Figures 1a, b, c, and d are side and bottom views of a chip electronic component according to an embodiment of the present invention, respectively, and Figure 2 is a diagram showing how the chip electronic component according to the present invention is mounted on a printed wiring board. be. DESCRIPTION OF SYMBOLS 1... Chip electronic component, 2a, 2b... Plate lead terminal, 3a, 3b... Thermosetting adhesive, 4... Printed wiring board, 5... Cream solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 板状リード端子の底面部の少なくとも一部に熱
硬化性接着剤を塗布することを特徴とするチツプ
電子部品。
A chip electronic component characterized in that a thermosetting adhesive is applied to at least a portion of the bottom surface of a plate-shaped lead terminal.
JP15480387U 1987-10-09 1987-10-09 Pending JPH0158925U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15480387U JPH0158925U (en) 1987-10-09 1987-10-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15480387U JPH0158925U (en) 1987-10-09 1987-10-09

Publications (1)

Publication Number Publication Date
JPH0158925U true JPH0158925U (en) 1989-04-13

Family

ID=31431863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15480387U Pending JPH0158925U (en) 1987-10-09 1987-10-09

Country Status (1)

Country Link
JP (1) JPH0158925U (en)

Similar Documents

Publication Publication Date Title
JPH0158925U (en)
JPS63178374U (en)
JPH0385682U (en)
JPS6338368U (en)
JPH03102762U (en)
JPS61134080U (en)
JPS6262464U (en)
JPS61119957U (en)
JPS61182076U (en)
JPH0375546U (en)
JPS61153373U (en)
JPS6240884U (en)
JPH0173969U (en)
JPH0351861U (en)
JPH0213771U (en)
JPS63159874U (en)
JPS60125765U (en) printed wiring board
JPH0221754U (en)
JPS63185222U (en)
JPS63115256U (en)
JPH0286175U (en)
JPH0241470U (en)
JPS6222871U (en)
JPS62106489U (en)
JPS6169862U (en)