JPH0148349B2 - - Google Patents

Info

Publication number: JPH0148349B2
Authority: JP; Japan
Prior art keywords: solution; concentration; ferric; nickel plating; copper
Prior art date: 1983-12-02
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP25554484A

Other languages

English (en)

Japanese (ja)

Other versions

JPS60138075A (ja

Inventor

Ei Aashireshi Donarudo

Daburyu Kurain Roi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

OMI International Corp

Original Assignee

OMI International Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-12-02

Filing date

1984-12-03

Publication date

1989-10-18

1984-12-03 Application filed by OMI International Corp filed Critical OMI International Corp

1985-07-22 Publication of JPS60138075A publication Critical patent/JPS60138075A/ja

1989-10-18 Publication of JPH0148349B2 publication Critical patent/JPH0148349B2/ja

Status Granted legal-status Critical Current

Links

PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 102
239000000243 solution Substances 0.000 claims description 65
238000000034 method Methods 0.000 claims description 58
238000007747 plating Methods 0.000 claims description 52
229910052759 nickel Inorganic materials 0.000 claims description 51
239000003999 initiator Substances 0.000 claims description 50
VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims description 32
229910001447 ferric ion Inorganic materials 0.000 claims description 32
239000000758 substrate Substances 0.000 claims description 32
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 30
239000010949 copper Substances 0.000 claims description 30
229910052802 copper Inorganic materials 0.000 claims description 29
239000007864 aqueous solution Substances 0.000 claims description 19
239000008139 complexing agent Substances 0.000 claims description 13
239000010970 precious metal Substances 0.000 claims description 13
229910021645 metal ion Inorganic materials 0.000 claims description 10
229910000510 noble metal Inorganic materials 0.000 claims description 9
230000001172 regenerating effect Effects 0.000 claims description 9
238000005530 etching Methods 0.000 claims description 8
150000002500 ions Chemical class 0.000 claims description 7
238000011109 contamination Methods 0.000 claims description 6
230000001590 oxidative effect Effects 0.000 claims description 5
238000001556 precipitation Methods 0.000 claims description 5
150000001875 compounds Chemical class 0.000 claims description 3
238000007654 immersion Methods 0.000 claims description 3
239000002244 precipitate Substances 0.000 claims description 3
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
229910052760 oxygen Inorganic materials 0.000 claims description 2
239000001301 oxygen Substances 0.000 claims description 2
230000005587 bubbling Effects 0.000 claims 1
239000007789 gas Substances 0.000 claims 1
239000000463 material Substances 0.000 claims 1
238000011069 regeneration method Methods 0.000 claims 1
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 29
229910052763 palladium Inorganic materials 0.000 description 15
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
230000002378 acidificating effect Effects 0.000 description 8
239000000203 mixture Substances 0.000 description 8
-1 organometallic ion Chemical class 0.000 description 8
229910000881 Cu alloy Inorganic materials 0.000 description 7
230000000977 initiatory effect Effects 0.000 description 7
UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 6
239000004033 plastic Substances 0.000 description 5
229920003023 plastic Polymers 0.000 description 5
230000004913 activation Effects 0.000 description 4
229910052751 metal Inorganic materials 0.000 description 4
239000002184 metal Substances 0.000 description 4
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
230000008901 benefit Effects 0.000 description 3
JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 3
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
238000004140 cleaning Methods 0.000 description 3
238000000576 coating method Methods 0.000 description 3
229940044631 ferric chloride hexahydrate Drugs 0.000 description 3
XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
NQXWGWZJXJUMQB-UHFFFAOYSA-K iron trichloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].Cl[Fe+]Cl NQXWGWZJXJUMQB-UHFFFAOYSA-K 0.000 description 3
238000003756 stirring Methods 0.000 description 3
239000000126 substance Substances 0.000 description 3
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical class [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
230000003213 activating effect Effects 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
239000003638 chemical reducing agent Substances 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
239000002131 composite material Substances 0.000 description 2
229910001431 copper ion Inorganic materials 0.000 description 2
ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
230000006866 deterioration Effects 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000007772 electroless plating Methods 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
229910052742 iron Inorganic materials 0.000 description 2
239000007788 liquid Substances 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
238000006386 neutralization reaction Methods 0.000 description 2
230000020477 pH reduction Effects 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
238000006722 reduction reaction Methods 0.000 description 2
239000011347 resin Substances 0.000 description 2
229920005989 resin Polymers 0.000 description 2
RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
ZNBNBTIDJSKEAM-UHFFFAOYSA-N 4-[7-hydroxy-2-[5-[5-[6-hydroxy-6-(hydroxymethyl)-3,5-dimethyloxan-2-yl]-3-methyloxolan-2-yl]-5-methyloxolan-2-yl]-2,8-dimethyl-1,10-dioxaspiro[4.5]decan-9-yl]-2-methyl-3-propanoyloxypentanoic acid Chemical compound C1C(O)C(C)C(C(C)C(OC(=O)CC)C(C)C(O)=O)OC11OC(C)(C2OC(C)(CC2)C2C(CC(O2)C2C(CC(C)C(O)(CO)O2)C)C)CC1 ZNBNBTIDJSKEAM-UHFFFAOYSA-N 0.000 description 1
KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
229910000570 Cupronickel Inorganic materials 0.000 description 1
239000004677 Nylon Substances 0.000 description 1
239000004721 Polyphenylene oxide Substances 0.000 description 1
239000004793 Polystyrene Substances 0.000 description 1
229910000831 Steel Inorganic materials 0.000 description 1
NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
239000002253 acid Substances 0.000 description 1
150000007513 acids Chemical class 0.000 description 1
239000012190 activator Substances 0.000 description 1
238000013019 agitation Methods 0.000 description 1
239000012298 atmosphere Substances 0.000 description 1
MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
238000010531 catalytic reduction reaction Methods 0.000 description 1
239000013522 chelant Substances 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
229910001430 chromium ion Inorganic materials 0.000 description 1
239000000356 contaminant Substances 0.000 description 1
YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
RQRVBGYBUCMNBU-UHFFFAOYSA-N copper;prop-2-enenitrile Chemical compound [Cu].C=CC#N RQRVBGYBUCMNBU-UHFFFAOYSA-N 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
229960003280 cupric chloride Drugs 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
238000006731 degradation reaction Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
229910000378 hydroxylammonium sulfate Inorganic materials 0.000 description 1
238000011065 in-situ storage Methods 0.000 description 1
229910052500 inorganic mineral Inorganic materials 0.000 description 1
238000010907 mechanical stirring Methods 0.000 description 1
239000011707 mineral Substances 0.000 description 1
238000005065 mining Methods 0.000 description 1
230000003472 neutralizing effect Effects 0.000 description 1
LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 1
229920001778 nylon Polymers 0.000 description 1
150000002894 organic compounds Chemical class 0.000 description 1
239000007800 oxidant agent Substances 0.000 description 1
150000002941 palladium compounds Chemical class 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
229920000090 poly(aryl ether) Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
229920006380 polyphenylene oxide Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
230000001376 precipitating effect Effects 0.000 description 1
238000002203 pretreatment Methods 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
239000011780 sodium chloride Substances 0.000 description 1
229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
KEAYESYHFKHZAL-IGMARMGPSA-N sodium-23 atom Chemical compound [23Na] KEAYESYHFKHZAL-IGMARMGPSA-N 0.000 description 1
239000010959 steel Substances 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
230000003746 surface roughness Effects 0.000 description 1
239000002699 waste material Substances 0.000 description 1
239000000080 wetting agent Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)

JP25554484A 1983-12-02 1984-12-03 無電解ニッケルめっき用イニシエタ水溶液及び再生方法 Granted JPS60138075A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US55641783A	1983-12-02	1983-12-02
US556417		1983-12-02

Publications (2)

Publication Number	Publication Date
JPS60138075A JPS60138075A (ja)	1985-07-22
JPH0148349B2 true JPH0148349B2 (fr)	1989-10-18

Family

ID=24221260

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP25554484A Granted JPS60138075A (ja)	1983-12-02	1984-12-03	無電解ニッケルめっき用イニシエタ水溶液及び再生方法

Country Status (4)

Country	Link
JP (1)	JPS60138075A (fr)
CA (1)	CA1232104A (fr)
DE (1)	DE3443471A1 (fr)
GB (1)	GB2150601B (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE69507926T2 (de) *	1994-04-28	1999-09-16	Koninkl Philips Electronics Nv	Verfahren zur erzeugung eines kupferbildes auf einer aus elektrisch nichtleitendem material bestehenden platte mittels eines photolithographischen verfahrens
CN100342058C (zh) *	2005-11-01	2007-10-10	桂林工学院	塑料表面化学镀镍无钯活化液配方及工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1145285A (en) *	1965-03-17	1969-03-12	Nat Res Dev	Improvements relating to the deposition of metals
US3902908A (en) *	1973-03-21	1975-09-02	Macdermid Inc	Catalyst system for activating surfaces prior to electroless deposition

1984
- 1984-11-28 CA CA000468840A patent/CA1232104A/fr not_active Expired
- 1984-11-29 DE DE19843443471 patent/DE3443471A1/de active Granted
- 1984-12-03 GB GB08430429A patent/GB2150601B/en not_active Expired
- 1984-12-03 JP JP25554484A patent/JPS60138075A/ja active Granted

Also Published As

Publication number	Publication date
JPS60138075A (ja)	1985-07-22
GB2150601B (en)	1987-06-03
CA1232104A (fr)	1988-02-02
DE3443471A1 (de)	1985-06-13
DE3443471C2 (fr)	1987-01-02
GB2150601A (en)	1985-07-03
GB8430429D0 (en)	1985-01-09

Legal Events

Date	Code	Title	Description
2004-10-18	LAPS	Cancellation because of no payment of annual fees

Publication	Publication Date	Title
US4814205A (en)	1989-03-21	Process for rejuvenation electroless nickel solution
CA1144432A (fr)	1983-04-12	Methode de traitement de substrats en polymere avant leur plaquage
EP0913502B1 (fr)	2006-05-31	Procede d'electrodeposition de produit moule en plastique, non conducteur
US3682786A (en)	1972-08-08	Method of treating plastic substrates and process for plating thereon
JP3929399B2 (ja)	2007-06-13	無電解金属めっきのための方法
JP6195857B2 (ja)	2017-09-13	非導電性プラスチック表面の金属化方法
JP6622712B2 (ja)	2019-12-18	非導電性プラスチック表面を金属化するための組成物及び方法
US4448811A (en)	1984-05-15	Oxidizing agent for acidic accelerator in electroless metal plating process
JP6246139B2 (ja)	2017-12-13	非導電性プラスチック表面の金属化方法
US3962497A (en)	1976-06-08	Method for treating polymeric substrates prior to plating
EP3168326B2 (fr)	2023-09-20	Procédé de placage de résine
JPH06128757A (ja)	1994-05-10	アルミニウムおよびアルミニウム合金の処理の為の改良された亜鉛酸塩溶液およびその処理方法
EP1988192B1 (fr)	2012-12-05	Procédé d'application d'un revêtement métallique sur un substrat non conducteur
KR20200134345A (ko)	2020-12-01	무전해 도금의 전처리용 조성물, 무전해 도금의 전처리 방법, 무전해 도금 방법
JP4109615B2 (ja)	2008-07-02	合成物質電気メッキ用基板の活性化方法
EP2305856A1 (fr)	2011-04-06	Processus d'application d'un revêtement métallique sur un substrat non conducteur
US3769061A (en)	1973-10-30	Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
JPH0148349B2 (fr)	1989-10-18
JP2001316831A (ja)	2001-11-16	亜鉛置換処理液
JPH0741956A (ja)	1995-02-10	樹脂製物品への金属コーティング接着の改善
CA1058457A (fr)	1979-07-17	Procede de sensibilisation de la surface d'articles non-metalliques pour le revetement non electrolytique
JPS58118832A (ja)	1983-07-15	酸性促進化剤に対する酸化剤
JP4789361B2 (ja)	2011-10-12	誘電体表面上に導電層を製造する方法
GB2109013A (en)	1983-05-25	Metallic impurity control for electroless copper plating
US3862850A (en)	1975-01-28	Electroless gold plating on refractory metals