JPH0145193B2 - - Google Patents
Info
- Publication number
- JPH0145193B2 JPH0145193B2 JP56039991A JP3999181A JPH0145193B2 JP H0145193 B2 JPH0145193 B2 JP H0145193B2 JP 56039991 A JP56039991 A JP 56039991A JP 3999181 A JP3999181 A JP 3999181A JP H0145193 B2 JPH0145193 B2 JP H0145193B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- lead wire
- printed circuit
- bare
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- 238000004904 shortening Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 13
- 238000002360 preparation method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Description
【発明の詳細な説明】
本発明は、ビニール被覆より線等のリード線を
プリント基板に接続する方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting lead wires, such as vinyl-coated stranded wires, to printed circuit boards.
ビニール被覆より線をプリント基板に接続する
場合、従来には第１，２図に示すような方法が用
いられていた。 When connecting a vinyl-coated stranded wire to a printed circuit board, a method as shown in FIGS. 1 and 2 has conventionally been used.
第１図のものは、プリント基板１に予めピン２
を立てて半田３により導電箔４に接続しておき、
これにリード線５の先端の裸線６を巻き付け、半
田７によつて接続する方法である。しかし、この
場合にはピン２が必要でコスト高になり、また、
ピン２の植設やリード線５の巻き付け等の作業工
数が多くて作業性が悪い等の問題があつた。 The one in Figure 1 has pins 2 on the printed circuit board 1 in advance.
Stand it upright and connect it to the conductive foil 4 with solder 3.
This is a method in which a bare wire 6 at the tip of a lead wire 5 is wound around this and connected with solder 7. However, in this case, pin 2 is required, which increases the cost, and
There were problems such as poor workability due to the large number of man-hours involved in installing the pins 2 and winding the lead wires 5.
また、第２図のものは、プリント基板８の孔９
にリード線１０の先端の裸線１１を挿入し、半田
１２によつて導電箔１３に接続する方法である。
しかし、この場合にも、半田付けをする前にリー
ド線１０が抜けやすく、半田付け時まで抜けない
ように保持しておく必要があつてやはり作業性が
悪く、しかも、完成後にも抜けやすくて信頼性が
劣るという欠点がある。 In addition, the one in FIG. 2 shows the hole 9 of the printed board 8.
In this method, a bare wire 11 at the tip of a lead wire 10 is inserted into the lead wire 10 and connected to a conductive foil 13 with solder 12.
However, in this case as well, the lead wire 10 tends to come off before soldering, and it is necessary to hold it so that it does not come out until soldering, resulting in poor workability. The drawback is that it is less reliable.
そこで、本発明はかかる従来の欠点を全て解消
して、作業性良くしかも確実にリード線をプリン
ト基板に接続することができ、さらに、作業の一
部を自動化することも容易にできる接続方法を提
供することを目的とするものである。 Therefore, the present invention has developed a connection method that eliminates all of these conventional drawbacks, allows for efficient and reliable connection of lead wires to printed circuit boards, and also allows for easy automation of some of the work. The purpose is to provide
以下、本発明につき、その一実施例の工程を示
す図面を参照して詳細に説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to drawings showing the steps of an embodiment thereof.
第３図はそのリード線準備工程の概要を示し、
まず供給リール１４から取り出したビニール線等
のリード線１５をカツター（図示せず）で適当な
長さに切断する。次いで、被覆カツター１６によ
つてその絶縁被覆のみを切断し、先端部分の絶縁
被覆１７をチヤツクでつかむ等して除去すること
により複数本の裸線１８を露出させる。そして、
その裸線１８の先端を点熔接電極１９によつて熔
接する等して一体に結束する。この状態を第４図
ａに示す。２０が結束部である。さらに、尖端を
有するピン２１と受具２２を用いそのピン２１を
裸線１８の中央部分に突き立てる等して、裸線１
８を２分し略リング状に形成する。この状態を第
４図ｂに示す。２３が略リング状部である。以上
がリード線１５の準備工程で、この工程は第３図
の如くして容易に自動装置化することができるの
で、簡単にかつ低コストに実施できる。 Figure 3 shows an overview of the lead wire preparation process.
First, a lead wire 15 such as a vinyl wire taken out from the supply reel 14 is cut to an appropriate length using a cutter (not shown). Next, only the insulation coating is cut by the insulation cutter 16, and the insulation coating 17 at the tip is removed by grasping it with a chuck, thereby exposing the plurality of bare wires 18. and,
The ends of the bare wires 18 are welded together using a point welding electrode 19 to bind them together. This state is shown in FIG. 4a. 20 is a binding part. Furthermore, by using a pin 21 with a pointed end and a holder 22, and sticking the pin 21 into the center of the bare wire 18, the bare wire 18 is
Divide 8 into two and form into a roughly ring shape. This state is shown in FIG. 4b. 23 is a substantially ring-shaped portion. The above is the preparation process for the lead wire 15, and since this process can be easily automated as shown in FIG. 3, it can be carried out easily and at low cost.
そして、かかる準備をしたリード線１５を用い
第５図のように、プリント基板２４には予め挿入
用の長方形状の孔２５をあけておき、プリント基
板２４の一方の面からこの孔２５に略リング状部
２３を挿入する。このとき、孔２５の長さを略リ
ング状部２３の外幅よりも若干小さくしておけ
ば、略リング状部２３を孔２５に弾性的に圧入す
ることができ、挿入後には半田付けまでの間、さ
らには半田付け後にも容易に抜け出てしまうこと
のないように保持させることができる。 Then, using the prepared lead wire 15, as shown in FIG. Insert the ring-shaped part 23. At this time, if the length of the hole 25 is made slightly smaller than the outer width of the approximately ring-shaped portion 23, the approximately ring-shaped portion 23 can be elastically press-fitted into the hole 25, and after insertion, the soldering process can be completed. During soldering, it can be held so that it will not easily fall out even after soldering.
最後に、第６図のように、プリント基板２４の
他方の面において半田付けをし、半田２６により
リード線１５を導電箔２７に接続する。この半田
付けはデイツピング半田付け、フロー半田付け等
の自動半田付け工程によつて行なうことができ、
その場合にも、上述のようにリード線１５の略リ
ング状部２３を孔２５に圧入していることによつ
て自動半田付け工程でプリント基板２４をコンベ
ア等により搬送するときにも抜け出てしまうおそ
れがなく、信頼性を向上することができる。 Finally, as shown in FIG. 6, soldering is performed on the other surface of the printed circuit board 24, and the lead wire 15 is connected to the conductive foil 27 with the solder 26. This soldering can be performed by an automatic soldering process such as date-ping soldering or flow soldering.
In that case, because the substantially ring-shaped portion 23 of the lead wire 15 is press-fitted into the hole 25 as described above, it may come out even when the printed circuit board 24 is conveyed by a conveyor or the like during the automatic soldering process. There is no risk, and reliability can be improved.
このように、本発明の接続方法によれば、リー
ド線の準備工程や半田付け工程の各工程を容易に
自動化することができて作業効率を向上し低コス
トの接続工程を実現することができる。また、従
来のような巻付け工程が不要であるので、作業性
を向上することができる。さらに、接続工程途中
においてリード線が抜け出てしまうことがないの
で、正確に接続することができ、信頼性を大幅に
向上することができる。なお、被覆単線の先端部
分の被覆を除去してその裸線部分を略Ｕ字状にフ
オーミングしてプリント基板の孔に圧入すること
も考えられるがこの場合には裸線が単線であり、
かつＵ字状であるために素材的、形状的にばね性
が弱く、半田付け時、あるいはプリント基板の移
送過程でリード線の抜けが発生することがある。
これに比し本発明はより線を２分してリング状に
フオーミングしたものであるため素材的、形状的
に大きなばね性を得られ、プリント基板に対する
確実なリード線の保持力を得ることができるもの
である。 As described above, according to the connection method of the present invention, each process of lead wire preparation process and soldering process can be easily automated, improving work efficiency and realizing a low-cost connection process. . Further, since the conventional winding process is not necessary, workability can be improved. Furthermore, since the lead wire does not come out during the connection process, accurate connection can be achieved and reliability can be greatly improved. It is also possible to remove the coating from the tip of the covered solid wire, form the bare wire into a substantially U-shape, and press fit it into the hole of the printed circuit board, but in this case, the bare wire is a single wire,
Moreover, since it is U-shaped, the springiness is weak due to the material and shape, and the lead wire may come off during soldering or during the process of transferring the printed circuit board.
In contrast, in the present invention, since the stranded wire is divided into two and formed into a ring shape, it is possible to obtain great springiness due to the material and shape, and it is possible to obtain a reliable holding force of the lead wire to the printed circuit board. It is possible.
第１図ａ，ｂおよび第２図ａ，ｂは従来のリー
ド線接続方法により接続した状態を示す斜視図お
よび断面図、第３図は本発明のリード線接続方法
におけるリード線準備工程の概要を示す側面図、
第４図ａ，ｂはその準備工程におけるリード線を
示す側面図、第５図ａ，ｂおよび第６図ａ，ｂは
そのリード線を用いた接続状態を示す斜視図およ
び断面図である。
１５……リード線、１６……被覆カツター、１
７……被覆、１８……裸線、１９……点熔接電
極、２０……結束部、２１……ピン、２２……受
具、２３……略リング状部、２４……プリント基
板、２５……孔、２６……半田、２７……導電
箔。
Figures 1a, b and 2a, b are perspective views and cross-sectional views showing the state in which the lead wires are connected by the conventional lead wire connecting method, and Figure 3 is an overview of the lead wire preparation process in the lead wire connecting method of the present invention. A side view showing the
FIGS. 4a and 4b are side views showing the lead wires in the preparation process, and FIGS. 5a and 6b and 6 a and b are perspective views and sectional views showing the connection state using the lead wires. 15...Lead wire, 16...Coated cutter, 1
7... Coating, 18... Bare wire, 19... Point welding electrode, 20... Binding part, 21... Pin, 22... Receiver, 23... Approximately ring-shaped part, 24... Printed circuit board, 25 ... hole, 26 ... solder, 27 ... conductive foil.
Claims (1)
縁被覆を除去して複数本の裸より線を露出させ、
その裸より線の先端を熔接等の結束手段により結
束し、上記裸より線の部分を２分して略リング状
に形成し、上記略リング状にした裸より線の外幅
よりも長さを短かくしてプリント基板に設けた孔
に上記裸より線の略リング状部を一方の面から圧
入し、上記プリント基板の他方の面において上記
略リング状部を導電箔に半田付けするようにした
ことを特徴とするリード線接続方法。1 Remove the insulation coating at the tip of the covered stranded wire as a lead wire to expose multiple bare stranded wires,
The tips of the bare stranded wires are bound by a binding means such as welding, and the part of the bare stranded wire is divided into two to form a substantially ring shape, and the length is longer than the outer width of the substantially ring-shaped bare stranded wire. The substantially ring-shaped portion of the bare stranded wire is press-fitted from one side into a hole provided in the printed circuit board by shortening the length, and the substantially ring-shaped portion is soldered to a conductive foil on the other surface of the printed circuit board. A lead wire connection method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56039991A JPS57152688A (en) | 1981-03-18 | 1981-03-18 | Method of connecting lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56039991A JPS57152688A (en) | 1981-03-18 | 1981-03-18 | Method of connecting lead wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57152688A JPS57152688A (en) | 1982-09-21 |
| JPH0145193B2 true JPH0145193B2 (en) | 1989-10-02 |
Family
ID=12568395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56039991A Granted JPS57152688A (en) | 1981-03-18 | 1981-03-18 | Method of connecting lead wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57152688A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298187U (en) * | 1985-12-10 | 1987-06-23 |
-
1981
- 1981-03-18 JP JP56039991A patent/JPS57152688A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57152688A (en) | 1982-09-21 |
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