JPS5838622Y2 - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5838622Y2 JPS5838622Y2 JP1977125078U JP12507877U JPS5838622Y2 JP S5838622 Y2 JPS5838622 Y2 JP S5838622Y2 JP 1977125078 U JP1977125078 U JP 1977125078U JP 12507877 U JP12507877 U JP 12507877U JP S5838622 Y2 JPS5838622 Y2 JP S5838622Y2
- Authority
- JP
- Japan
- Prior art keywords
- mounting hole
- wiring board
- printed wiring
- lead wire
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
この考案は印刷配線板上に多数取付けられる電子部品の
半田付は前に於ける脱離を防止する印刷配線板に関する
。[Detailed Description of the Invention] This invention relates to a printed wiring board that prevents a large number of electronic components mounted on the printed wiring board from coming off before soldering.
通常印刷配線板に抵抗、コンデンサ、トランスフ等の電
子部品を取付ける場合、これら電子部品の各リード線を
印刷配線板の取付穴に作業者の手または機械によって挿
入し、さらにこれら各リード線を一度に半田付けする所
謂自動半田付は法が採られている。Normally, when installing electronic components such as resistors, capacitors, and transformers on a printed wiring board, each lead wire of these electronic components is inserted into the mounting hole of the printed wiring board by hand or by machine, and then each lead wire is connected once. The so-called automatic soldering, which involves soldering to
ところで上記印刷配線板に各電子部品を半田付けする場
合、特に作業者の手によって電子部品を印刷配線板に挿
入した場合、印刷配線板から挿入済みの電子部品が脱離
するのを防止するためリード線を印刷配線板の半田付面
で略々直角に折り曲げて仮止めするかもしくは予備半田
付けを行って仮止めする方法が採られている。By the way, when each electronic component is soldered to the printed wiring board, especially when the electronic component is inserted into the printed wiring board by hand by an operator, it is necessary to prevent the inserted electronic component from detaching from the printed wiring board. The lead wires are temporarily fixed by bending them at a substantially right angle on the soldering surface of the printed wiring board, or the lead wires are temporarily fixed by preliminary soldering.
この方法は例えば手で折り曲げる場合は非常に時間がか
かり昔た勘にたよるきらいがあるためどうしても仕上が
りにバラツキがある。For example, if this method is folded by hand, it is very time consuming and tends to rely on old intuition, so the finished product will inevitably vary.
一方予備半田付けを行う場合には自動半田マシンの中で
一工程増設する必要がある等、作業および品質の両面に
於て大きな欠点を有していた。On the other hand, when performing preliminary soldering, it is necessary to add one step to the automatic soldering machine, which has major drawbacks in terms of both work and quality.
この考案は上記欠点を解消する優れた印刷配線板を提供
するものである、
以下第１図乃至第４図に示すこの考案の実施例について
説明する。This invention provides an excellent printed wiring board that eliminates the above-mentioned drawbacks. Examples of this invention shown in FIGS. 1 to 4 will be described below.
図に於て１はガラスエポキシ、ベークライト等からなる
硬質の絶縁基板、２はこの絶縁基板１上に印刷配線され
所定の電気回路網を構成する配線用導電体（以下導電体
と称す）、３はこの導電体２の所定位置に上記絶縁基板
１を貫通するよう穿設された部品取付穴でその外周部は
放射状に延びている。In the figure, 1 is a hard insulating substrate made of glass epoxy, Bakelite, etc., 2 is a wiring conductor (hereinafter referred to as a conductor) printed on this insulating substrate 1 and constitutes a predetermined electric circuit network, 3 is a component mounting hole drilled through the insulating substrate 1 at a predetermined position of the conductor 2, and the outer periphery of the hole extends radially.
つ１り取付穴の小径３ａは電子部品４のリード線４ａと
略々同一径でありまたその小径の取付穴３ａと連なった
放射状の部分の穴３ｂの最外径は上記小径の取付穴３ａ
の径＋（０，２〜０．５）間の寸法をなしている。The small diameter 3a of the mounting hole 3a is approximately the same diameter as the lead wire 4a of the electronic component 4, and the outermost diameter of the hole 3b in the radial part connected to the small diameter mounting hole 3a is the same as the diameter of the lead wire 4a of the electronic component 4.
diameter + (0.2 to 0.5).
すなわち、上記部品取付穴３とリード線４ａ、それに部
品取付穴３の周りに位置する導電体２の間には概略次式
を満足するが如く構成されている。That is, the relationship between the component mounting hole 3, the lead wire 4a, and the conductor 2 located around the component mounting hole 3 is constructed so as to roughly satisfy the following equation.
リード線４ａの径−ｄ。Diameter -d of lead wire 4a.
ｄｏ汝ｄ小径の取付穴３ａの径−ｄ とすると ｄ
１＝ｄ＋ （０，２〜０．５） 放射状穴３ｂの径
＝ｄ１導電体２の径−ＤＤ≧２ｄｌ
筐た５は上記各々リード線４ａが上記部品取付穴３に挿
入された後電気的に接続するとともに引張り強度を保持
させる半田である。If the diameter of the small diameter mounting hole 3a is −d, then d
1=d+ (0,2~0.5) Diameter of radial hole 3b=d1 Diameter of conductor 2-DD≧2dl The casing 5 is electrically connected after each lead wire 4a is inserted into the component mounting hole 3. It is a solder that maintains tensile strength while connecting to the wire.
以上のように構成された印刷配線板に於て電子部品４の
取付けは、先ず電子部品４のリード線４ａを小径の取付
穴３ａに挿入する。To attach the electronic component 4 to the printed wiring board configured as described above, first, the lead wire 4a of the electronic component 4 is inserted into the small diameter attachment hole 3a.
なお前記の如くリード線４ａの径ｄｏと小径の取付穴３
ａの径ｄは略々同一径であるためリード線挿入後は、該
部品４を係止できる。As mentioned above, the diameter do of the lead wire 4a and the small diameter mounting hole 3
Since the diameters a and d are approximately the same diameter, the component 4 can be locked after the lead wire is inserted.
さらに次の半田付は前にニッパ−若しくは自動のリード
カッターでリード線４ａの印刷配線板の半田付面に突出
した不用な部分をカッティングする。Furthermore, before the next soldering, use nippers or an automatic lead cutter to cut off the unnecessary portion of the lead wire 4a protruding from the soldering surface of the printed wiring board.
その後自動半田付マシンによって正式半田付けをする。After that, formal soldering is performed using an automatic soldering machine.
すなわち係止された電子部品４のリード線４ａの半田付
は小径の取付穴３ａに連なる放射状穴３ｂの径が半田付
に最も理想的な寸法に形成されているので半田５が放射
状穴３ｂを介してリード線４ａ、導電体２の間に程よく
濡れて確実な電気的接続がなされるのである。That is, when soldering the lead wire 4a of the locked electronic component 4, the diameter of the radial hole 3b connected to the small-diameter mounting hole 3a is formed to the most ideal dimension for soldering, so the solder 5 can easily connect the radial hole 3b. Through this, the lead wire 4a and the conductor 2 are moderately wetted and a reliable electrical connection is established.
このようにこの考案によれば取付穴に挿入される電子部
品のリード線は取付穴に挿入するのみで硬質絶縁基板に
一時的に係止できるので従来の如く予備半田工程やリー
ド線の折り曲げ等のわずられしい作業から解放され、又
、その取付穴の周囲に取付穴と連なりリード線径より小
なる、放射状に延びる穴を設けているので、簡単にしか
も確実な半田付けがなされる等実用面に於て多大の効果
をもたらすものである。In this way, according to this invention, the lead wires of electronic components that are inserted into the mounting holes can be temporarily locked to the hard insulating board just by inserting them into the mounting holes, so there is no need to perform a preliminary soldering process or bend the lead wires as in the past. In addition, since there are radially extending holes around the mounting hole that are smaller than the lead wire diameter, soldering can be done easily and reliably. This brings about great effects in practical terms.
第１図はこの考案の一実施例を示す印刷配線板の斜視図
、第２図は第１図■−■線による部分断面図、第３図は
第１図の■−■線による部分断面図、第４図は電子部品
取付穴の部分拡大図である。
図に於て１は絶縁基板、２は導電体、３は取付穴、３ａ
は小径取付穴、３ｂは放射状穴、４は電子部品、４ａは
リード線、５は半田である。
尚、各図中同一符号は同一部分を示す。Fig. 1 is a perspective view of a printed wiring board showing an embodiment of this invention, Fig. 2 is a partial sectional view taken along the line ■-■ in Fig. 1, and Fig. 3 is a partial sectional view taken along the line ■-■ in Fig. 1. 4 are partially enlarged views of the electronic component mounting holes. In the figure, 1 is an insulating board, 2 is a conductor, 3 is a mounting hole, and 3a
3b is a radial hole, 4 is an electronic component, 4a is a lead wire, and 5 is a solder. Note that the same reference numerals in each figure indicate the same parts.
Claims (1)
定の電気回路網を構成する配線用導電体と、この導電体
の所定部分と接続し得る如く上記導電体、硬質絶縁基板
を各々貫通して形成された電子部品装着用の取付穴とを
有するものにおいて、上記取付穴を上記電子部品のリー
ド線が挿入して係止し得るように形成すると共に、該取
付穴の周囲に、上記取付穴と連なり上記リード線径より
小さい放射状に延びる穴を穿設したことを特徴とする印
刷配線板。A hard insulating substrate, a wiring conductor printed on the insulating substrate constituting a predetermined electrical circuit network, and penetrating each of the conductor and the hard insulating substrate so as to be able to connect to a predetermined portion of the conductor. and a mounting hole for mounting an electronic component, the mounting hole is formed so that the lead wire of the electronic component can be inserted and locked therein, and the mounting hole is formed with the A printed wiring board characterized in that a radially extending hole is formed which is connected to the mounting hole and is smaller than the diameter of the lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977125078U JPS5838622Y2 (en) | 1977-09-17 | 1977-09-17 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977125078U JPS5838622Y2 (en) | 1977-09-17 | 1977-09-17 | printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5451361U JPS5451361U (en) | 1979-04-09 |
| JPS5838622Y2 true JPS5838622Y2 (en) | 1983-09-01 |
Family
ID=29085666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977125078U Expired JPS5838622Y2 (en) | 1977-09-17 | 1977-09-17 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5838622Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5234950U (en) * | 1975-09-04 | 1977-03-11 |
-
1977
- 1977-09-17 JP JP1977125078U patent/JPS5838622Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5451361U (en) | 1979-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20160029117A (en) | Printed circuit board with side access termination pads | |
| JPS5838622Y2 (en) | printed wiring board | |
| JP4406187B2 (en) | Surface mount type coil device | |
| JP2723077B2 (en) | Electronic circuit device and electronic component mounting method | |
| JPS6350860Y2 (en) | ||
| JPS5821190Y2 (en) | connection device | |
| JPS5943651Y2 (en) | printed wiring board | |
| JPH06349561A (en) | Method of soldering lead terminal to wiring board | |
| JPH0673868U (en) | Cable connection structure for electronic components | |
| JPH03252192A (en) | Hybrid integrated circuit component and assembly thereof | |
| JPS5935995Y2 (en) | Covered wire end processing equipment | |
| JP2525104B2 (en) | Resin-impregnated paper capacitor core and manufacturing method thereof | |
| JP2001326443A (en) | Method of mounting electrical component | |
| JPS5849660Y2 (en) | jumper wire | |
| JP3275512B2 (en) | Printed circuit boards and terminals | |
| JPS60140914A (en) | Noise filter | |
| JPS5923437Y2 (en) | Electrical component mounting equipment on printed wiring boards | |
| JPS5864090A (en) | Method of producing wiring device | |
| JP2606905Y2 (en) | Coaxial cable fixing bracket | |
| JPH08204292A (en) | Electronic parts mounting board, electronic parts mounting jig, and electronic parts mounting method | |
| JPH07161518A (en) | Connection structure of surface mounting coil | |
| JPS58118188A (en) | Printed circuit board unit | |
| JPH08321665A (en) | Printed board | |
| JPS63197308A (en) | Manufacture of signal line filter | |
| JPS62241281A (en) | Pin jack fitting method |