JPH0132658B2 - - Google Patents
Info
- Publication number
- JPH0132658B2 JPH0132658B2 JP58028617A JP2861783A JPH0132658B2 JP H0132658 B2 JPH0132658 B2 JP H0132658B2 JP 58028617 A JP58028617 A JP 58028617A JP 2861783 A JP2861783 A JP 2861783A JP H0132658 B2 JPH0132658 B2 JP H0132658B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum alloy
- brazing
- package
- manufacturing
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000838 Al alloy Inorganic materials 0.000 claims description 22
- 238000005219 brazing Methods 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 238000005336 cracking Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
Description
【発明の詳細な説明】
(1) 発明の技術分野
本発明はマイクロ波用増幅器のアルミニウム合
金パツケージの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a method of manufacturing an aluminum alloy package for a microwave amplifier.
(2) 技術の背景
従来のマイクロ波用増幅器のパツケージは、周
知のように鉄系材料、主としてステンレス鋼が用
いられて製作されている。ところがステンレス鋼
は熱伝導性が悪いため高出力増幅器の発熱に原因
してパツケージ内の回路素子を損傷することが
屡々である。また重量も大である。(2) Background of the Technology As is well known, conventional microwave amplifier packages are manufactured using iron-based materials, mainly stainless steel. However, since stainless steel has poor thermal conductivity, the heat generated by high-power amplifiers often damages circuit elements within the package. It is also heavy.
このためステンレス鋼に代えて、軽量且つ熱伝
導性の良いアルミニウムを利用したパツケージが
注目されている。 For this reason, packages using aluminum, which is lightweight and has good thermal conductivity, are attracting attention instead of stainless steel.
(3) 従来技術と問題点
従来のアルミニウム合金パツケージにおいて、
ケースにカバーを気密封止する場合、アルミニウ
ムが熱伝導性が良いため全体的に高温度にさらす
ろう付け法などの封止法を採用することができ
ず、結局パルスレーザによる溶接法に依存しなけ
ればならない。ところがアルミ合金パツケージの
レーザ溶接は、アルミニウム合金の熱伝導が良好
すぎて、急冷効果により溶接部にクラツクが生じ
るという欠点があつた。(3) Conventional technology and problems In the conventional aluminum alloy package,
When sealing the cover to the case, aluminum has good thermal conductivity, so it is not possible to use a sealing method such as brazing that exposes the entire product to high temperatures, so we end up relying on pulsed laser welding. There must be. However, laser welding of aluminum alloy packages has the drawback that the heat conductivity of the aluminum alloy is too good and cracks occur in the welded area due to the rapid cooling effect.
(4) 発明の目的
本発明は上記従来の欠点に鑑み、アルミ合金パ
ツケージの気密封止をレーザ溶接により安定して
行なうことができるアルミ合金パツケージの製造
方法を提供することを目的とするものである。(4) Purpose of the Invention In view of the above-mentioned conventional drawbacks, the object of the present invention is to provide a method for manufacturing an aluminum alloy package that can stably hermetically seal the aluminum alloy package by laser welding. be.
(5) 発明の構成
そしてこの目的は本発明によれば、アルミ合金
パツケージのケースとカバーをレーザ溶接して気
密封止するアルミ合金パツケージの製造方法にお
いて、カバーにはSi4〜12.5％及び残部Alよりな
る、ろう材を積層してなるアルミ合金ブレージン
グシートを用い、そのろう側がケース側に接する
ように配置してレーザ溶接により気密封止するこ
とを特徴とするアルミ合金パツケージの製造方法
を提供することによつて達成される。(5) Structure of the Invention According to the present invention, there is provided a method for manufacturing an aluminum alloy package in which the case and cover of the aluminum alloy package are hermetically sealed by laser welding. To provide a method for manufacturing an aluminum alloy package, characterized in that an aluminum alloy brazing sheet made of laminated brazing filler metal is used, the brazing sheet is arranged so that the brazing side is in contact with the case side, and the package is hermetically sealed by laser welding. This is achieved by
(6) 発明の実施例 以下本発明実施例を図面によつて詳述する。(6) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明によるアルミ合金パツケージの
製造方法を説明するための図であり、ａは溶接前
のケース及びカバーの斜視図、ｂはケースとカバ
ーのレーザ溶接中を示す。両図において、１はア
ルミ又はアルミ合金のケース、１ａはその入出力
端子孔、２はカバー、２ａはそのろう材部、３は
レーザ光源、４は集光レンズ、５はレーザ光をそ
れぞれ示している。 FIG. 1 is a diagram for explaining the method of manufacturing an aluminum alloy package according to the present invention, in which a is a perspective view of the case and cover before welding, and b is a diagram showing the case and cover during laser welding. In both figures, 1 is an aluminum or aluminum alloy case, 1a is its input/output terminal hole, 2 is a cover, 2a is its brazing material, 3 is a laser light source, 4 is a condenser lens, and 5 is a laser beam. ing.
本実施例は図に示す如くカバー２には、アルミ
合金ブレージングシートを用い、ケース１との対
向面にろう材側２ａがくるように配置し、ｂ図の
如くレーザ光５をろう材部２ａに照射して溶接す
るのである。 In this embodiment, as shown in the figure, an aluminum alloy brazing sheet is used for the cover 2, which is arranged so that the brazing metal side 2a faces the surface facing the case 1, and the laser beam 5 is directed to the brazing metal part 2a as shown in figure b. Welding is done by irradiating the
第２図はブレージングシートのろう材部のSi量
を変化させたときの溶接割れの頻度を実験により
求めた図である。溶接条件としてはパルス幅４〜
５ｍＳ、パルスレート15〜20pps、平均出力250
〜350W、溶接速度４〜６mm／secで行ない、レー
ザビームは集光レンズを用いて直径0.3mmに集光
し、溶接はArガス雰囲気中で行なつた。この結
果からSi量が４〜12.5％の間では溶接割れが発生
しないことがわかつた。さらに溶接部はAl−Si
の共晶合金となつており高い熱間強度を有してい
た。 FIG. 2 is a diagram showing the frequency of weld cracking determined experimentally when the amount of Si in the brazing metal portion of the brazing sheet was varied. The welding conditions are pulse width 4~
5mS, pulse rate 15-20pps, average output 250
Welding was performed at ~350 W and a welding speed of 4 to 6 mm/sec, the laser beam was focused to a diameter of 0.3 mm using a condenser lens, and welding was performed in an Ar gas atmosphere. From this result, it was found that weld cracking did not occur when the Si content was between 4% and 12.5%. Furthermore, the welded part is Al-Si
It was a eutectic alloy with high hot strength.
第３図はブレージングシートのろう材Si量を
7.5％に一定したときのろう材部の厚さと溶接割
れの関係を求めた図であり、溶接条件は第２図の
ときと同様とした。結果は図の如くろう材部の厚
さが400〜500μｍの時溶接割れは認められず、そ
れより薄い場合には溶接割れが発生している。ま
た500μｍ以上になるとレーザのビーム径が0.3mm
であるためろう材のみが溶ける状態となり母材が
溶接に関与せず気密性が保たれなくなる。 Figure 3 shows the amount of brazing filler metal Si in the brazing sheet.
This figure shows the relationship between the thickness of the filler metal part and weld cracking when the thickness is constant at 7.5%, and the welding conditions were the same as in Figure 2. As shown in the figure, no welding cracks were observed when the thickness of the filler metal part was 400 to 500 μm, and welding cracks occurred when the thickness was thinner. Also, if the diameter is 500μm or more, the laser beam diameter will be 0.3mm.
Therefore, only the filler metal melts, and the base metal does not participate in welding, making it impossible to maintain airtightness.
以上の結果よりろう材のSi量４〜12.5％、厚さ
400〜500μｍでパツケージを作成したところ実用
上全く問題のない10-10atm・c.c.／ｓ以上の高い
気密性が得られた。また溶接割れも皆無であり高
い信頼性が得られた。 From the above results, the amount of Si in the filler metal is 4 to 12.5%, and the thickness
When a package was made with a thickness of 400 to 500 .mu.m, a high airtightness of 10 -10 atm.cc/s or more was obtained, which poses no practical problem. Furthermore, there were no weld cracks and high reliability was obtained.
(7) 発明の効果
以上、詳細に説明したように本発明のアルミ合
金パツケージの製造方法は、そのカバーにブレー
ジングシートを使用することにより溶接割れがな
く、且つ高い気密性のパツケージが得られるとい
つた効果大なるものである。(7) Effects of the Invention As explained above in detail, the method for manufacturing an aluminum alloy package of the present invention has the advantage that by using a brazing sheet for the cover, a package with no welding cracks and high airtightness can be obtained. The effect is huge.
第１図は本発明によるアルミ合金パツケージの
製造方法を説明するための図、第２図はろう材の
Si量と溶接割れ頻度との関係を示した図、第３図
はろう材部の厚さと溶接割れとの関係を示した図
である。
図面において、１はケース、２はカバー、２ａ
はろう材部、３はレーザ光源、４は集光レンズ、
５はレーザ光をそれぞれ示す。
Figure 1 is a diagram for explaining the method of manufacturing an aluminum alloy package according to the present invention, and Figure 2 is a diagram for explaining the method of manufacturing an aluminum alloy package according to the present invention.
FIG. 3 is a diagram showing the relationship between the amount of Si and the frequency of weld cracking, and FIG. 3 is a diagram showing the relationship between the thickness of the brazing metal part and weld cracking. In the drawings, 1 is a case, 2 is a cover, and 2a
3 is a laser light source, 4 is a condenser lens,
5 each indicates a laser beam.
Claims (1)
ーザ溶接して気密封止するアルミ合金パツケージ
の製造方法において、カバーにはアルミ合金板の
一方の面に、Si4〜12.5％及び残部Alよりなるろ
う材を積層してなるアルミ合金ブレージングシー
トを用い、そのろう側がケース側に接するように
配置してレーザ溶接により気密封止することを特
徴とするアルミ合金パツケージの製造方法。 ２ 前記ブレージングシートのろう材部の厚さが
400〜500μｍであることを特徴とする特許請求の
範囲第１項記載のアルミ合金パツケージの製造方
法。[Claims] 1. A method for manufacturing an aluminum alloy package in which the case and the cover of the aluminum alloy package are hermetically sealed by laser welding, and the cover includes 4 to 12.5% Si and the balance Al on one side of an aluminum alloy plate. A method for manufacturing an aluminum alloy package, characterized in that an aluminum alloy brazing sheet made of laminated brazing filler metals is arranged so that the braze side is in contact with the case side, and hermetically sealed by laser welding. 2 The thickness of the brazing metal part of the brazing sheet is
The method for manufacturing an aluminum alloy package according to claim 1, wherein the thickness is 400 to 500 μm.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58028617A JPS59161052A (en) | 1983-02-24 | 1983-02-24 | Manufacture of aluminum alloy package |
| EP83307418A EP0117352A1 (en) | 1983-02-24 | 1983-12-06 | A process for welding aluminium-based elements and a welded assembly |
| US07/012,156 US4760240A (en) | 1983-02-24 | 1987-02-09 | Process for laser welding of aluminum based elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58028617A JPS59161052A (en) | 1983-02-24 | 1983-02-24 | Manufacture of aluminum alloy package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59161052A JPS59161052A (en) | 1984-09-11 |
| JPH0132658B2 true JPH0132658B2 (en) | 1989-07-10 |
Family
ID=12253507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58028617A Granted JPS59161052A (en) | 1983-02-24 | 1983-02-24 | Manufacture of aluminum alloy package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59161052A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6031247A (en) * | 1983-08-01 | 1985-02-18 | Fujitsu Ltd | Manufacture of aluminum alloy package |
| JPS63184356A (en) * | 1987-01-26 | 1988-07-29 | Mitsubishi Metal Corp | Sealing plate with window frame-shaped brazin filler metal for semiconductor package |
| US5519184A (en) * | 1994-05-20 | 1996-05-21 | Litton Systems, Inc. | Reusable laser welded hermetic enclosure and method |
-
1983
- 1983-02-24 JP JP58028617A patent/JPS59161052A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59161052A (en) | 1984-09-11 |
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