JPH01318298A - Electronic component automatic mounting device - Google Patents
Electronic component automatic mounting deviceInfo
- Publication number
- JPH01318298A JPH01318298A JP63150676A JP15067688A JPH01318298A JP H01318298 A JPH01318298 A JP H01318298A JP 63150676 A JP63150676 A JP 63150676A JP 15067688 A JP15067688 A JP 15067688A JP H01318298 A JPH01318298 A JP H01318298A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- electronic component
- pattern
- deviation
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 claims abstract description 40
- 238000012937 correction Methods 0.000 claims abstract description 29
- 238000003909 pattern recognition Methods 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 9
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子機器の回路を構成する回路基板にす、ブ型
の電子部品を装着する電子部品自動装着装置に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an automatic electronic component mounting device for mounting square-shaped electronic components onto a circuit board constituting a circuit of an electronic device.
従来の技術
第１１図に示す接着剤塗布と電子部品装着を同時に行う
型式の電子部品自動装着装置は、載置された回路基板２
ａ 、２ｂを矢印ＸおよびＹ方向に移動して位置決めす
るＸ−Ｙテーブル６と、このｘ−ｙテーブル６の近傍に
設置され矢印Ｚ方向に移動可能な部品棚１とＸ−Ｙテー
ブル５と部品棚１との間に配置され矢印Ｑ方向に回転側
シ出しをするターンテーブル４と、その外周に配置され
た上下動可能な複数の装着チャック３．ターンテーブル
４の外周に設置された電子部品１９の位置決め治具４２
と電子部品１９を回路基板２に固定するだめの接着剤塗
布ヘッド４４より構成されている。BACKGROUND ART The electronic component automatic mounting device of the type shown in FIG.
an X-Y table 6 for moving and positioning a and 2b in the directions of arrows X and Y; a parts shelf 1 and an X-Y table 5 installed near this x-y table 6 and movable in the direction of arrow Z; A turntable 4 disposed between the parts shelf 1 and the turntable 4 for rotating in the direction of the arrow Q, and a plurality of mounting chucks 3 disposed around the outer periphery thereof and movable up and down. A positioning jig 42 for the electronic component 19 installed on the outer periphery of the turntable 4
and an adhesive application head 44 for fixing the electronic component 19 to the circuit board 2.
電子部品自動装着装置では各種電子部品１９を搭載した
部品棚１が２軸方向に移動可能とな−ており、人の位置
で選択された電子部品１９を装着チャック３で吸着する
。ターンテーブル４がＱ方向に回転しＢの位置で電子部
品１９を位置決め治具４２の位置決め爪１４によって装
着チャック３のセンターに位置決めする。次にＤの位置
までターンテーブル４が回転しＸ−Ｙテーブル６によっ
てＤの位置まで回路基板２ａの電子部品装着用パターン
９をもってくる。第１４図に示すようにプッシャー４６
により装着チャ・ツク３が押され、回路基板２ａの電子
部品装着用パターン９の上に電子部品１９を装着する。In the automatic electronic component mounting apparatus, a component shelf 1 on which various electronic components 19 are mounted is movable in two axes, and a mounting chuck 3 picks up the selected electronic component 19 at a person's position. The turntable 4 rotates in the Q direction, and at position B, the electronic component 19 is positioned at the center of the mounting chuck 3 by the positioning claw 14 of the positioning jig 42. Next, the turntable 4 rotates to the position D, and the electronic component mounting pattern 9 of the circuit board 2a is brought to the position D by the X-Y table 6. Pusher 46 as shown in FIG.
The mounting chuck 3 is pushed, and the electronic component 19 is mounted on the electronic component mounting pattern 9 of the circuit board 2a.
また同時にＰの位置で接着剤塗布ヘッド４４によってＸ
−Ｙテーブル上６の装着へ・ノドと接着剤塗布ヘッド４
４の距離に保れた回路基板２ｂの電子部品装着用パター
ン９′に接着剤を塗布する。At the same time, at the position P, the adhesive application head 44
-To install on Y table top 6・Groove and adhesive application head 4
Adhesive is applied to the electronic component mounting pattern 9' of the circuit board 2b maintained at a distance of 4.
発明が解決しようとする課題
このような従来の電子部品自動装着装置では次のような
欠点があった。Problems to be Solved by the Invention The conventional electronic component automatic mounting apparatus has the following drawbacks.
■ 機械的な電子部品位置決め治具の代りに電子部品パ
ターン認識装置を取付けた場合、Ｘ−Ｙテーブル６で電
子部品の吸着ずれ量を補正する必要があり、その時発生
した移動量だけ、接着剤塗布ポイントより回路基板の電
子部品装着用パターンがずれてしまう。■ When an electronic component pattern recognition device is installed instead of a mechanical electronic component positioning jig, it is necessary to correct the amount of adsorption deviation of the electronic components using the X-Y table 6, and the adhesive The pattern for mounting electronic components on the circuit board shifts from the application point.
■ 装着ポイント、塗布ポイントと装着側、塗布側の電
子部品装着用パターンのずれ量が大きいとき、装着品質
を保つことが困難となる。■ When the amount of deviation between the mounting point or application point and the electronic component mounting pattern on the mounting side or coating side is large, it becomes difficult to maintain the mounting quality.
■ 電子部品の位置決めが位置決め爪による機械的な位
置決めのため、部品に対して負担をかけている。また電
子部品形状が対称でなければならないため、非対称形状
の電子部品が装着できない。■ Positioning of electronic components is done mechanically using positioning claws, which puts a strain on the components. Furthermore, since the shape of the electronic component must be symmetrical, an asymmetrically shaped electronic component cannot be mounted.
課題を解決するための手段
そして、上記課題を解決する本発明の技術的手段は、電
子部品を位置決めするためのパターン認識カメラへ接着
剤を塗布する基板と電子部品を装着する基板のパターン
ずれを別々に検出するパターン位置検出用カメラ２台、
電子部品のΔθずれを補正するΔθ補正機構、および塗
布ヘッドを外部動力によりＸ−Ｙ方向に指令されたデー
タにもとづく一定量だけ移動する位置補正付接着剤塗布
ヘッドを搭載する構成としたものである。Means for Solving the Problems The technical means of the present invention for solving the above problems is to prevent pattern misalignment between a board on which adhesive is applied to a pattern recognition camera for positioning electronic parts and a board on which electronic parts are mounted. Two cameras for detecting pattern position separately,
It is equipped with a Δθ correction mechanism that corrects the Δθ deviation of electronic components, and an adhesive application head with position correction that moves the application head by a fixed amount based on commanded data in the X-Y direction using external power. be.
作用 この技術的手段による作用は次のようになる。action The effect of this technical means is as follows.
すなわち、電子部品パターン認識カメラにより電子部品
装着ポイントと電子部品のずれ量を検出し、基板のパタ
ーン位置検出用カメラにより、装着側の装着ポイントと
電子部品装着用パターンのずれ。That is, an electronic component pattern recognition camera detects the amount of deviation between the electronic component mounting point and the electronic component, and a circuit board pattern position detection camera detects the deviation between the mounting side mounting point and the electronic component mounting pattern.
塗布側の塗布ポイントと電子部品装着用パターンのずれ
を別々に検出し、装着部では電子部品の吸着ずれ量Δθ
はΔθ補正機構により補正し、装着ポイントと電子部品
の吸着ずれ量と装着ポイントと装着側の”１Ｅ子部品装
着用パターンのずれ量をＸ−Ｙテーブルで補正し、塗布
側ではＸ−Ｙテーブルで補正されたずれ量と塗布ポイン
トと塗布側の電子部品装着用パターンのずれ量を位置補
正付接着剤塗布ヘッドによシ補正し、装着動作と塗布動
作を同時に行うことにより、電子部品の吸着ずれを修正
でき正確な装着ができ、また電子部品の位置補正も外形
形状の規制でなく回転により角度を補正するため電子部
品にキズ等を与えずしかもその形状が非対称形のものま
で装着できる。The misalignment between the coating point on the coating side and the electronic component mounting pattern is detected separately, and the mounting section detects the amount of adsorption misalignment Δθ of the electronic component.
is corrected by the Δθ correction mechanism, and the amount of adsorption deviation between the mounting point and the electronic component and the deviation between the mounting point and the "1E child component mounting pattern on the mounting side" are corrected using the X-Y table, and the X-Y table is used on the coating side. The amount of deviation corrected by the adhesive application head with position correction and the amount of deviation between the application point and the pattern for installing electronic components on the application side are corrected by the adhesive application head with position correction, and by performing the installation operation and application operation simultaneously, the electronic components can be attracted Misalignment can be corrected and accurate mounting is possible, and since the position of electronic components is corrected by rotating the angle rather than restricting the external shape, it is possible to mount even asymmetrical electronic components without causing scratches on the electronic components.
実施例
まず、本発明における電子部品自動装着装置の基本的な
構成を第１図、第２図に示す。電子部品装着機構と位置
補正付接着剤塗布ヘッド２４を設け、電子部品装着部と
接着剤塗布部の一定距離離れた位置にパターン位置検出
用カメラ７．７′を２台設けている。Embodiment First, the basic configuration of an electronic component automatic mounting apparatus according to the present invention is shown in FIGS. 1 and 2. An electronic component mounting mechanism and an adhesive application head 24 with position correction are provided, and two cameras 7, 7' for pattern position detection are provided at positions separated by a certain distance between the electronic component mounting section and the adhesive application section.
この’ｉ［子部品自動装着装置は載置された回路基板１
ｇ１Ｌ 、１ ａｂを矢印ＸおよびＹ方向に移動して位
置決めするＸ−Ｙテーブル１０と、このＸ−！テーブル
１ｏの近傍に設置され矢印２方向（矢印Ｘ方向と同方向
）Ｋ移動可能な部品棚８と、上記Ｘ−Ｙテーブル１ｏと
部品棚８との間に配置され矢印Ｘ方向に回転割り出しを
するターンテーブル１１と、このターンテーブル１１の
複数個所に増付けられた回転可能なホルダー２３と、そ
のホルダー２３の外周に配置された上下動可能な装着チ
ャック１３と、装着方向選択駆動系１６および上下動可
能な電子部品のパターン認識カメラ１６゜パターン認識
による電子部品１９のかたむきθを補正するΔθ補正機
構１７と、電子部品１９を回路基板１８１Ｌ 、 １８
ｂ上に固定するだめの接着剤の塗布位置補正が可能な位
置補正付接着剤塗布へリド２４とから構成されている。This 'i[Sub-component automatic mounting device]
The X-Y table 10 moves and positions g1L, 1ab in the arrow X and Y directions, and this X-! A parts shelf 8 is installed near the table 1o and is movable in the arrow 2 direction (the same direction as the arrow a turntable 11, a rotatable holder 23 added to a plurality of locations on the turntable 11, a vertically movable mounting chuck 13 disposed on the outer periphery of the holder 23, a mounting direction selection drive system 16, and A vertically movable electronic component pattern recognition camera 16° A Δθ correction mechanism 17 for correcting the tilt θ of the electronic component 19 by pattern recognition, and a circuit board 181L, 18 for connecting the electronic component 19 to the
b, and an adhesive application lid 24 with position correction capable of correcting the application position of the adhesive to be fixed on the surface.
次に動作を説明する。Next, the operation will be explained.
第１図においてＸの位置で部品棚８にある電子部品１９
を吸着し、Ｆの位置で電子部品１９の装着方向のデータ
に基づいて駆動される装着方向選択駆動系１６で電子部
品１９を吸着している装着チャック１３を回転させ、装
着方向の選択を行い、ＦＮＧの位置でパターン認識カメ
ラ１６を上下動させて電子部品１９の高さに合わせて焦
点調整を行う。Electronic components 19 located on component shelf 8 at position X in FIG.
At position F, the mounting chuck 13 that is sucking the electronic component 19 is rotated by the mounting direction selection drive system 16, which is driven based on the data on the mounting direction of the electronic component 19, and the mounting direction is selected. , the pattern recognition camera 16 is moved up and down at the FNG position to adjust the focus to match the height of the electronic component 19.
第３図はパターン認識カメラ１“６で電子部品１９の位
置を映したもので、装着チャック１３のセンターＬと電
子部品１９のセンターＶのずれ量Ｃ（ベクトルｆａ ）
と電子部品１９の傾きΔθを求める。FIG. 3 shows the position of the electronic component 19 captured by the pattern recognition camera 1"6, and shows the amount of deviation C (vector fa) between the center L of the mounting chuck 13 and the center V of the electronic component 19.
and the inclination Δθ of the electronic component 19 is determined.
第４図はＧ位置のパターン認識カメラ１６の正面図であ
る。パルスモータ２６が回転しタイミングベル）２６で
ポールネジ２７を回転させパターン認識カメラ１６を上
下させて、電子部品１９の厚みにより焦点調整を行う。FIG. 4 is a front view of the pattern recognition camera 16 at the G position. The pulse motor 26 rotates and the timing bell 26 rotates the pole screw 27 to move the pattern recognition camera 16 up and down to adjust the focus according to the thickness of the electronic component 19.
第５図はパターン認識カメラ１６の光源２２の構成図で
ある。Ｌ方向に出た光が反射板２１を通って同方向に出
て、電子部品１９を撮影できるようにしている。FIG. 5 is a configuration diagram of the light source 22 of the pattern recognition camera 16. The light emitted in the L direction passes through the reflection plate 21 and exits in the same direction, so that the electronic component 19 can be photographed.
第６図はＨ位置でのΔθ位置補正機構１７の正面図であ
る。パルスモータ２８．タイミングベルト２９によって
回転板３ｏが回転し装着チャック１３にΔθ回転を行い
、電子部品１９の吸着ずれ量Δθの補正を実施しＩの装
着ポイントまで電子部品１９をもっていく。FIG. 6 is a front view of the Δθ position correction mechanism 17 at the H position. Pulse motor 28. The rotary plate 3o is rotated by the timing belt 29, causing the mounting chuck 13 to rotate by Δθ, correcting the adsorption deviation amount Δθ of the electronic component 19, and bringing the electronic component 19 to the mounting point I.
第７図は接着剤塗布ポイントとパターンのずれ量が補正
できるように位置補正付接着剤塗布ヘッド２４のΔＹ補
正の構成図である。塗布ヘンドユニソトが支点３６を中
心に回転が可能になっており、Δτ用パルスモータ３８
が回転しカム３７０曲線によりレバー３６を上下動させ
ることにより先端の接着剤塗布ノズル３２を移動させ、
ΔＹ補正を行う。FIG. 7 is a configuration diagram of the ΔY correction of the adhesive application head 24 with position correction so that the amount of deviation between the adhesive application point and the pattern can be corrected. The coating hand unit is rotatable around the fulcrum 36, and the Δτ pulse motor 38
rotates and moves the lever 36 up and down according to the curve of the cam 370, thereby moving the adhesive application nozzle 32 at the tip,
Perform ΔY correction.
第８図に示すようにシャフト４３にホルダー３３が固定
され、ホルダー３３には接着剤シリンジ３１が３つ朋付
けられており、接着剤塗布ノズル３２を大中小３種類装
備している。接着剤塗布ノズル選択パルスモータ４０．
タイミングベルト４１によりシャフト４３．ホルダー３
３が回転し、接着剤塗布ノズル３２の選択が可能になっ
ている。As shown in FIG. 8, a holder 33 is fixed to the shaft 43, three adhesive syringes 31 are attached to the holder 33, and three types of adhesive application nozzles 32, large, medium and small, are equipped. Adhesive application nozzle selection pulse motor 40.
The timing belt 41 causes the shaft 43. Holder 3
3 rotates, and the adhesive application nozzle 32 can be selected.
この動きを利用して、塗布ノズル３２をΔＸだけ動かす
ようにする。このようにしてΔＹ、ΔＸ補正を塗布ノズ
ル３２に行い正規のデータ通りの位置に塗布ノズル３２
を動かし回路基板１８ｂ上に接着剤を塗布する。Using this movement, the application nozzle 32 is moved by ΔX. In this way, the ΔY and ΔX corrections are made to the coating nozzle 32, and the coating nozzle 32 is moved to the position according to the regular data.
to apply adhesive onto the circuit board 18b.
第９図のように装着ポイント！、塗布ポイントＪよシ／
Ａ（ベクトル量）だけ離れた位置にパターン位置検出用
カメラ７．７′を設ける。装着ポイント１．塗布ポイン
トＪのずれ量を求めるために回路基板１８＆ 、１ ａ
ｂをパターン位置検出用カメラ７．７′の下へ装着ポイ
ントＩ、塗布ポイントＪの位置ムだけ動かし、その位置
をＲ，Ｓとし、パターン位置検出用カメラ７．７′の下
にくるようにする。Attachment points as shown in Figure 9! , Application point J/
A pattern position detection camera 7.7' is provided at a position separated by A (vector amount). Installation point 1. In order to find the amount of deviation of the application point J, the circuit board 18 & , 1 a
Move b by the mounting point I and application point J position below the pattern position detection camera 7.7', and set the positions R and S so that they are below the pattern position detection camera 7.7'. do.
第１０図はその時のパターン位置検出用カメラ７．７′
でとらえた映像である。電子部品装着用パターン９．９
′とパターン位置検出用カメラ７゜７′のＲ，Ｓとのず
れ量ＩＩｓ、、ｌ５２（ベクトル量）を測定することが
できる。Figure 10 shows the pattern position detection camera 7.7' at that time.
This is a video captured by. Electronic component mounting pattern 9.9
The amount of deviation IIs, , l52 (vector amount) between R and S of the pattern position detection camera 7°7' can be measured.
そして第１１図のようにＸ−Ｙテーブル１０を−（／Ａ
＋ｌＢ、 ）＋Ｃだけ移動させることにより電子部品
装着用パターン９は装着チャック１３で装着ポイン）Ｉ
までもってきた電子部品１９の真下にくる。Then, as shown in Fig. 11, the X-Y table 10 is
By moving the electronic component mounting pattern 9 by +lB, )+C, the mounting chuck 13 moves the electronic component mounting pattern 9 to the mounting point)I
It will be right below the electronic component 19 that you brought up.
また、位置補正付接着剤塗布ヘッド２４ではｌム＋ＩＢ
２−（／Ａ＋ｌＢ、 ）＋Ｃ＝ｌＢ、−ＩＢ、 ＋Ｃ
だけずれてしまう。第１２図のように位置補正付接着剤
塗布ヘッド２４を” ２ １Ｂ ＋ ＋ Ｃに移動させ
ることにより電子部品装着パターン９′の真上にくるよ
うにする。In addition, in the adhesive application head 24 with position correction, lm + IB
2-(/A+lB, )+C=lB, -IB, +C
It's just off. As shown in FIG. 12, the adhesive application head 24 with position correction is moved to "2 1B + + C so that it is directly above the electronic component mounting pattern 9'.
そして装着動作と塗布動作を同時に行う。Then, the mounting operation and the application operation are performed simultaneously.
発明の効果
以上のように構成された本発明における電子部品自動装
着装置には下記のような効果があシ、今後広く業界で使
用されていくものと思われ、その産業性には大なるもの
がある。Effects of the Invention The electronic component automatic mounting device of the present invention configured as described above has the following effects, and is expected to be widely used in the industry in the future, and its industrial efficiency is significant. There is.
■ 装着ポイント、塗布ポイントと装着側、塗布側の電
子部品装着用パターンの各ずれ量をＸ−Ｙテーブル、位
置補正付接着剤塗布ヘッドによって補正するため、電子
部品を電子部品装着用パターンに正確に固定できる。■ Since the amount of misalignment between the mounting point, application point and the electronic component mounting pattern on the mounting side and coating side is corrected using the X-Y table and the adhesive dispensing head with position correction, the electronic components can be accurately aligned with the electronic component mounting pattern. It can be fixed to
■ パターン認識カメラに焦点調整機構を設は多装着ノ
ズルによシ、電子部品の高さに関係なく、多品種および
多形状の電子部品をこの装置−台で装着可能になる。- By providing a pattern recognition camera with a focus adjustment mechanism and using a multi-mounting nozzle, it becomes possible to mount a wide variety of electronic components and various shapes on this device, regardless of the height of the electronic components.
■ 機械的な位置決めからパターン認識方式による位置
決めにより電子部品に力をかけることなく非対称の電子
部品も装着可能になる。■ By changing positioning from mechanical positioning to pattern recognition, it is now possible to mount asymmetrical electronic components without applying force to the electronic components.
■ 本発明のパターン認識光源ユニットにより、装着チ
ャックを小さくすることができ微小子ノブ型電子部品も
装着可能となる。(2) With the pattern recognition light source unit of the present invention, the mounting chuck can be made smaller, and even minute knob-type electronic components can be mounted.
■ 電子部品の装着方向選択とΔ０補正を独立させて別
々のステーションで行っているためΔθ補正の精度が向
上し、装着の安定性の高いものとなる。(2) Since electronic component mounting direction selection and Δ0 correction are performed independently and at separate stations, the accuracy of Δθ correction is improved, resulting in high mounting stability.
■ Ｘ−Ｙテーブルを２つ設ける必要がなく、設備がコ
ンパクトになり、コストダウンも図れる。■ There is no need to install two X-Y tables, making the equipment more compact and reducing costs.
第１図は本発明の電子部品自動装着装置の一実施例を示
す平面図、第２図は同斜視図、第３図はパターン認識カ
メラによる電子部品の位置説明平面図、第４図はパター
ン認識カメラの構成図、第６図は同カメラの光源の構成
図、第６図はΔθ位置補正機構の構成図、第７図は位置
補正付接着剤塗布機構のΔＹの動きをあられした構成図
、第８図は同機構のΔＸの動きをあられした構成図、第
９図はパターン位置検出用カメラの配置図、第１０図は
パターン位置検出用カメラでのぞいた平面図、第１１図
は補正をかけた平面図、第１２図は同斜視図、第１３図
は従来の電子部品自動装着装置の平面図、第１４図は同
側面図である。
７．７′・・・・・・パターン位置検出カメラ、８・・
・・・・部品棚、９．９′・・・・・・電子部品装着用
パターン、１ｏ・・・・・・Ｘ−Ｙテーブル、１１・・
・・・・ターンテーブル、１２・・・・・・接着剤、１
３・・・・・・装着チャ・ツク、１６・・・・・・装着
方向選択駆動系、１６・・・・・・パターン認識カメラ
、１７・・・・・・Δθ補正機構、１８＆・・・・・・
回路基板、１８ｂ・・・・・・回路基板、１９・・・・
・・電子部品、２０・・・・・・カラー、２１・・・・
・・反射板、２２・・・・・・光源、２３・・・・・・
ホルダー、２４・・・・・・位置補正付接着剤塗布ヘッ
ド、２６・・・・・・パルスモータ、２６・・・・・・
タイミングベルト、２７・・・・・・ボールネジ、２８
・・・・・・パルスモータ、２９・・・・・・タイミン
グベルト、３０・・・・・・回転板、３１・・・・・・
接着剤シリンジ、３２・・・・・・接着剤塗布ノズル、
３３・・・・・・ホルダー、３４・・・・・・プツシに
＋、３６・・・・・・支点、３６・・・・・・レバー、
３７・・・・・・カム、３８・・・・・・ΔＹ４用パル
スモータ、３９・・・・・・上部ベース、４ｏ・・・・
・・接着剤塗布ノズル選択パルスモータ、４１・・・・
・・タイミングベルト、４３・・・・・・シャフト。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第３
図
１に４ 図
第５図
第６図
第１Ｏ因
＋・FIG. 1 is a plan view showing an embodiment of the electronic component automatic mounting apparatus of the present invention, FIG. 2 is a perspective view thereof, FIG. 3 is a plan view illustrating the position of electronic components using a pattern recognition camera, and FIG. 4 is a pattern The configuration diagram of the recognition camera, Figure 6 is the configuration diagram of the light source of the same camera, Figure 6 is the configuration diagram of the Δθ position correction mechanism, and Figure 7 is the configuration diagram showing the ΔY movement of the adhesive application mechanism with position correction. , Fig. 8 is a configuration diagram showing the movement of ΔX of the same mechanism, Fig. 9 is a layout diagram of the pattern position detection camera, Fig. 10 is a plan view seen with the pattern position detection camera, and Fig. 11 is a correction diagram. FIG. 12 is a perspective view of the same, FIG. 13 is a plan view of a conventional electronic component automatic mounting apparatus, and FIG. 14 is a side view of the same. 7.7'...Pattern position detection camera, 8...
...Parts shelf, 9.9'...Electronic component mounting pattern, 1o...X-Y table, 11...
...Turntable, 12...Adhesive, 1
3... Mounting chuck, 16... Mounting direction selection drive system, 16... Pattern recognition camera, 17... Δθ correction mechanism, 18 &...・・・・・・
Circuit board, 18b...Circuit board, 19...
...Electronic parts, 20...Color, 21...
...Reflector, 22...Light source, 23...
Holder, 24...Adhesive application head with position correction, 26...Pulse motor, 26...
Timing belt, 27...Ball screw, 28
...Pulse motor, 29...Timing belt, 30...Rotating plate, 31...
Adhesive syringe, 32...Adhesive application nozzle,
33... Holder, 34... Push +, 36... Fulcrum, 36... Lever,
37...Cam, 38...Pulse motor for ΔY4, 39...Upper base, 4o...
...Adhesive application nozzle selection pulse motor, 41...
...Timing belt, 43...Shaft. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 3
Figure 1 shows 4 Figure 5 Figure 6 Figure 1 O factor +・
Claims (2)
を同一装置内に有し、ＮＣ制御のＸ−Ｙテーブル上に２
枚の回路基板を保持し、接着剤塗布と電子部品装着を同
時に行う構成とし、上記仮固定用接着剤塗布ヘッドを外
部動力によりＸ−Ｙ方向に指令されたデータにもとづく
一定量だけ移動するように取付け、電子部品を位置決め
するためのパターン認識カメラにより電子部品と装着ポ
イントのずれ量を検出し、装着ヘッド内でΔθの補正を
行い、装着部では装着ポイントと電子部品のずれ量をＸ
−Ｙテーブルで補正し、塗布部ではＸ−Ｙテーブルで補
正されたずれ量を位置補正付接着剤塗布ヘッドにより補
正する構成とした電子部品自動装着装置。(1) The adhesive application head for temporary fixing and the electronic component mounting head are installed in the same device, and two
The circuit board is held, and adhesive application and electronic component mounting are performed simultaneously. The pattern recognition camera used to position the electronic component detects the amount of misalignment between the electronic component and the mounting point, the Δθ is corrected within the mounting head, and the mounting section calculates the amount of misalignment between the mounting point and the electronic component by
- An electronic component automatic mounting device configured to correct the amount of deviation using a Y-table, and correct the amount of deviation corrected using an X-Y table in an application section using an adhesive application head with position correction.
回路基板の電子部品装着用パターンずれ量を別々に検出
するパターン位置検出用カメラ２台を取付け、装着部で
は装着ポイントと電子部品のずれ量と装着ポイントと装
着側の電子部品装着用パターンのずれ量をＸ−Ｙテーブ
ルで補正し、塗布部ではＸ−Ｙテーブルで補正されたず
れ量と塗布ポイントと塗布側の電子部品装着用パターン
のずれ量を位置補正付接着剤塗布ヘッドにより補正する
構成とした請求項１記載の電子部品自動装着装置。(2) Two pattern position detection cameras are installed to separately detect the amount of deviation of the electronic component mounting pattern on the circuit board to which adhesive is applied and the circuit board to which electronic components are mounted. The amount of deviation, the mounting point, and the pattern for mounting electronic components on the mounting side are corrected using an X-Y table, and in the application section, the amount of deviation, the mounting point, and the pattern for mounting electronic components on the coating side are corrected using the X-Y table. 2. The automatic electronic component mounting apparatus according to claim 1, wherein the amount of pattern deviation is corrected by an adhesive application head with position correction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63150676A JPH07105626B2 (en) | 1988-06-17 | 1988-06-17 | Electronic component automatic mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63150676A JPH07105626B2 (en) | 1988-06-17 | 1988-06-17 | Electronic component automatic mounting device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7096381A Division JP2574663B2 (en) | 1995-04-21 | 1995-04-21 | Electronic component automatic mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01318298A true JPH01318298A (en) | 1989-12-22 |
| JPH07105626B2 JPH07105626B2 (en) | 1995-11-13 |
Family
ID=15502037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63150676A Expired - Lifetime JPH07105626B2 (en) | 1988-06-17 | 1988-06-17 | Electronic component automatic mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07105626B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008091668A (en) * | 2006-10-03 | 2008-04-17 | Tdk Corp | Manufacturing apparatus and manufacturing method of inductor component |
| JP2020061491A (en) * | 2018-10-11 | 2020-04-16 | パナソニックＩｐマネジメント株式会社 | Mounting system, mounting method, and mounting program |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745993A (en) * | 1980-09-03 | 1982-03-16 | Sanyo Electric Co | Device for automatically mounting electric part |
| JPS6028298A (en) * | 1983-07-27 | 1985-02-13 | 株式会社日立製作所 | Electronic part carrying device |
| JPS6218087A (en) * | 1985-07-17 | 1987-01-27 | ソニー株式会社 | Automatic electronic component inserter |
-
1988
- 1988-06-17 JP JP63150676A patent/JPH07105626B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745993A (en) * | 1980-09-03 | 1982-03-16 | Sanyo Electric Co | Device for automatically mounting electric part |
| JPS6028298A (en) * | 1983-07-27 | 1985-02-13 | 株式会社日立製作所 | Electronic part carrying device |
| JPS6218087A (en) * | 1985-07-17 | 1987-01-27 | ソニー株式会社 | Automatic electronic component inserter |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008091668A (en) * | 2006-10-03 | 2008-04-17 | Tdk Corp | Manufacturing apparatus and manufacturing method of inductor component |
| JP2020061491A (en) * | 2018-10-11 | 2020-04-16 | パナソニックＩｐマネジメント株式会社 | Mounting system, mounting method, and mounting program |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07105626B2 (en) | 1995-11-13 |
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