JPH01315977A - Manufacture of airtight terminal - Google Patents
Manufacture of airtight terminalInfo
- Publication number
- JPH01315977A JPH01315977A JP14892688A JP14892688A JPH01315977A JP H01315977 A JPH01315977 A JP H01315977A JP 14892688 A JP14892688 A JP 14892688A JP 14892688 A JP14892688 A JP 14892688A JP H01315977 A JPH01315977 A JP H01315977A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- outer ring
- metal outer
- plating
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000007747 plating Methods 0.000 claims abstract description 53
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 8
- 229910000510 noble metal Inorganic materials 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910000531 Co alloy Inorganic materials 0.000 description 3
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、金属外環にシールリードをガラス封着すると
共にアースリードを固着した気密端子の製造方法に関し
、詳しくは、金属外環と、シールリード及びアースリー
ドの表面に被着形成するメッキ層の形成方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for manufacturing an airtight terminal in which a seal lead is glass-sealed to a metal outer ring and a ground lead is fixed to the metal outer ring. The present invention relates to a method for forming a plating layer on the surfaces of a seal lead and a ground lead.
自動車の電装容器等の長期に亘り、高い気密性、耐腐食
性が要求される気密容器に使用される気密端子の一般的
従来例を第２図を参照して説明する。A general conventional example of an airtight terminal used in airtight containers that require high airtightness and corrosion resistance over a long period of time, such as electrical equipment containers for automobiles, will be described with reference to FIG.
同図において、（１）は、鉄や鉄・ニッケル・コバルト
合金製の金属外環で、２箇所にリード封着孔（ｌａ）
（ｌａ）を穿設しておく。（２）（２）は、前記リー
ド封着孔（ｌａ） （ｌａ）に貫通させた鉄・ニッケ
ル合金や鉄・ニッケル・コバルト合金製のシールリード
で、リード封着孔の部分はガラス（３）（３）にて気密
絶縁的に封止する。（４）は、前記２本のシールリード
（２）（２）の間に配置する鉄・ニッケル合金や鉄・ニ
ッケル・コバルト合金製のアースリードで、上端は金属
外環（１）の下面に溶接固定して、気密端子（５）が完
成する。尚、（６）は、金属外環（１）の上面にマウン
トする素子で、ワイヤボンディングにより、上記２本の
シールリード（２）（２）の上端部に電気的に接続する
。In the figure, (1) is a metal outer ring made of iron or iron-nickel-cobalt alloy, with lead sealing holes (la) in two places.
(la) is drilled in advance. (2) (2) is a seal lead made of iron-nickel alloy or iron-nickel-cobalt alloy that is penetrated through the lead sealing hole (la) (la), and the lead sealing hole portion is made of glass (3 ) (3) to seal in an airtight and insulating manner. (4) is a ground lead made of iron-nickel alloy or iron-nickel-cobalt alloy that is placed between the two seal leads (2) (2), and its upper end is attached to the bottom surface of the metal outer ring (1). The airtight terminal (5) is completed by welding and fixing. Note that (6) is an element mounted on the upper surface of the metal outer ring (1), and is electrically connected to the upper ends of the two seal leads (2) (2) by wire bonding.
このような気密端子（５）において、金属外環（１）や
シールリード（２）（２）及びアースリード（４）が素
地のままであると、長期使用において、表面から発錆に
よる腐食が始まり、気密端子（５）の気密性が損なわれ
る。そこで、金属外環（１）及び両リード（２）（２）
（４）には、ニッケル等で仕上メッキを施し、長期に亘
り、高い気密性や耐腐食性を維持している。In such an airtight terminal (5), if the metal outer ring (1), seal leads (2) (2), and ground lead (4) are left as they are, corrosion due to rust will occur from the surface during long-term use. The airtightness of the airtight terminal (5) is impaired. Therefore, the metal outer ring (1) and both leads (2) (2)
(4) is finished plated with nickel or the like to maintain high airtightness and corrosion resistance over a long period of time.
このメッキ法を第３図を参照して説明する。This plating method will be explained with reference to FIG.
同図において、（７）は床（８）上で紙面の裏面から表
面に一連に複数並ぶ処理槽で、各処理槽（７）内にメッ
キ液（９）又は洗浄水を収容する。（１０）は、多数の
スリット（１０ａ）を有する六角筒状のバレルで、処理
槽（７）内での回転動作と処理槽（７）内外への昇降動
作とをする。（１１）は、バレル（１０）を貫通支持す
る陰極の電極バーで、バレル（１０）から離れたところ
に陽極板〔図示せず〕を浸漬し、両電極間のメッキ液（
９）にメッキ電流を流す。In the figure, (7) denotes a plurality of processing tanks arranged in series from the back side to the front side of the paper on the floor (8), and each processing tank (7) stores a plating solution (9) or cleaning water. (10) is a hexagonal cylindrical barrel having a large number of slits (10a), and rotates within the processing tank (7) and moves up and down into and out of the processing tank (7). (11) is a cathode electrode bar that penetrates and supports the barrel (10). An anode plate (not shown) is immersed in a part away from the barrel (10), and the plating solution (
9) Apply plating current.
このような装置において、多数の気密端子（５）をバレ
ル（１０）内に収納し、バレル（１０）を処理槽（７）
内に下降すると、メッキ液（９）がスリン１１１０ａ）
からバレル（１０）内に浸入し、気密端子（５）はメッ
キ液（９）に浸漬される。両電極間にメッキ電流を流し
、バレル（１０）を回転させると、気密端子（５）がバ
レル（１０）内で転動し、また、メッキ電流が流れてい
るメッキ液（９）がスリット（１０ａ）を通して循環す
ることにより、気密端子（５）はメッキされる。気密端
子（５）にメッキが施されると、気密端子（５）を収納
したバレル（１ｏ）を洗浄水を収容した処理槽（７）内
に転送し、洗浄水内で気密端子（５）を水洗し、後工程
に送る。In such a device, a large number of airtight terminals (5) are housed in a barrel (10), and the barrel (10) is placed in a processing tank (7).
When the plating solution (9) descends into the surin 1110a)
The airtight terminal (5) is immersed in the plating solution (9). When a plating current is applied between both electrodes and the barrel (10) is rotated, the airtight terminal (5) rolls within the barrel (10), and the plating liquid (9) with the plating current flowing through the slit ( By circulating through 10a), the hermetic terminal (5) is plated. Once the airtight terminal (5) has been plated, the barrel (1o) containing the airtight terminal (5) is transferred into a treatment tank (7) containing washing water, and the airtight terminal (5) is removed in the washing water. is washed with water and sent to the subsequent process.
気密端子（５）へのメッキは、気密端子（５）の金属部
分が直接または他の金属部分を介して間接的に電極バー
（１１）に接触している際に行ねれる。このため、表面
積の大きい金属部分はどメッキされやすい。Plating to the airtight terminal (5) is performed when the metal part of the airtight terminal (5) is in contact with the electrode bar (11) directly or indirectly through another metal part. For this reason, metal parts with large surface areas are easily plated.
気密端子（５）は、金属外環（１）とアースリード（４
）とが電気的に接続され、シールリード（２）（２）は
ガラス（３）（３）にて電気的に絶縁されている。従っ
て、気密端子（５）をメッキ液（９）内でメッキするに
際して、金属外環（１）とアースリード（４）との表面
積は、絶縁状態にある１本ずつのシールリード（２）（
２）の表面積よりも格段に大きい。メッキ厚ば、被メッ
キ物の表面積に比例することから、金属外環（１）とア
ースリード（４）の表面のメッキ層が各シールリード（
２）（２）の表面のメッキ厚よりも厚くなる。ここで、
−括してメッキされた多数個の気密端子のシールリード
（２）の頂部、シールリード（２）の中間部、アースリ
ード（４）、金属外環（１）の各メッキ厚を第４図乃至
第７図の白丸で示す。The airtight terminal (5) is connected to the metal outer ring (1) and the ground lead (4).
) are electrically connected, and the seal leads (2) (2) are electrically insulated by glass (3) (3). Therefore, when plating the airtight terminal (5) in the plating solution (9), the surface area of the metal outer ring (1) and the earth lead (4) is smaller than that of each seal lead (2) (2) in an insulated state.
The surface area is much larger than 2). Since the thickness of the plating is proportional to the surface area of the object to be plated, the plating layer on the surface of the metal outer ring (1) and the earth lead (4) is
2) It becomes thicker than the surface plating thickness in (2). here,
- Figure 4 shows the plating thickness of the top of the seal lead (2), the middle part of the seal lead (2), the ground lead (4), and the metal outer ring (1) of the multiple airtight terminals plated together. These are indicated by white circles in FIG.
各図は横軸にメッキ厚を示し、縦軸にそのメッキ厚をも
った被メッキ物の個数を示す。従って、白丸の合計がメ
ッキされた個数となる。シールリード（２）（２）の頂
部は素子（６）とワイヤボンディングをしなければなら
ないから、所定の厚さのメッキを必要とする。しかし、
シールリード（２） （２）のメッキを所定の厚さに
すると、金属外環（１）とアースリード（４）とのメッ
キが必要以上に厚くなる。この結果、メッキが金、銀、
白金、パラジウム等の貴金属を多く用いるため、原価が
アンプするとともに、無駄である。また、アースリード
（４）へのメッキが必要以上に厚くなると、アースリー
ド（４）の外径が大きくなり、後工程においてアースリ
ード（４）をプリン１一基板〔図示せず〕の穴に嵌入し
難くなるという問題も生ずる。In each figure, the horizontal axis shows the plating thickness, and the vertical axis shows the number of objects to be plated with that plating thickness. Therefore, the total number of white circles is the number of plated pieces. Since the top of the seal lead (2) (2) must be wire-bonded to the element (6), plating to a predetermined thickness is required. but,
If the plating of the seal lead (2) (2) is made to a predetermined thickness, the plating of the metal outer ring (1) and the earth lead (4) will become thicker than necessary. As a result, plating is gold, silver,
Since a large amount of precious metals such as platinum and palladium are used, the cost increases and is wasteful. Also, if the plating on the ground lead (4) becomes thicker than necessary, the outer diameter of the ground lead (4) will increase, and in the later process, the ground lead (4) will be inserted into the hole in the printed circuit board (not shown). There also arises the problem that it becomes difficult to insert.
本発明は、上記問題点を解決するため、金属外環に穿設
したリード封着孔にシールリードを貫通してガラスで封
着すると共に、金属外環にアースリードの一端を固定し
、前記金属外環及び両リードにメッキ層を形成した気密
端子の製遣方法であって、金属外環にシールリードを力
゛ラス封着した気密封着体と、アースリードとに予め別
個にメッキ層を形成し、アースリードを金属外環に固定
するものである。In order to solve the above-mentioned problems, the present invention penetrates a seal lead into a lead sealing hole drilled in a metal outer ring and seals it with glass, and also fixes one end of the earth lead to the metal outer ring. A method for manufacturing an airtight terminal in which a plating layer is formed on a metal outer ring and both leads. The ground lead is fixed to the metal outer ring.
上記手段によれば、金属外環にガラス封着したシールリ
ードとアースリードとを別々にメッキすることにより、
それぞれの表面積の大きさに関係なく、路間じ厚さのメ
ッキ面を形成することができる。According to the above means, by separately plating the seal lead and the ground lead, which are glass-sealed to the metal outer ring,
Regardless of the size of each surface area, it is possible to form a plated surface as thick as the width of the plating.
本発明に係る一実施例を第１図（ａ）乃至（Ｃ）を参照
して説明する。但し、従来の技術において説明した部品
と同一部品は、同一符号を付してその説明は省略する。One embodiment of the present invention will be described with reference to FIGS. 1(a) to (C). However, parts that are the same as those described in the related art are designated by the same reference numerals, and the description thereof will be omitted.
本発明は、先ず、第１図（ａｌに示すように、金属外環
（１）のリード封着孔（ｌａ） （ｌａ）にシールリ
ード（２）（２）を貫通し、リード封着孔（ｌａ）
（ｌａ）にガラス（３）（３）にて気密絶縁的に封止し
た気密封着体（Ａ）を製作した後、従来と同様メッキ層
（９）内に浸漬し、金属外環（１）とシールリード（２
）、（２）の表面に所定厚さの貴金属メッキ層（１２ａ
）を形成する。In the present invention, first, as shown in FIG. (la)
After manufacturing the hermetically sealed body (A) which is hermetically and insulatively sealed with glass (3) (3) in (la), it is immersed in the plating layer (9) as before, and the metal outer ring (1 ) and seal lead (2
), a noble metal plating layer (12a) of a predetermined thickness is formed on the surface of (2).
) to form.
そして、第１図（ｂ）に示すように、上記金属外環（１
）及びシールリード（２）（２）へのメッキ層（１２ａ
）の形成とは別に、アースリード（４）のみをメッキ液
（９）内に浸漬し、アースリード（４）の表面に所定厚
さの貴金属メッキ層（１２ｂ ）を形成する。Then, as shown in FIG. 1(b), the metal outer ring (1
) and the plating layer (12a) on the seal lead (2) (2)
), only the ground lead (4) is immersed in a plating solution (9) to form a noble metal plating layer (12b) of a predetermined thickness on the surface of the ground lead (4).
金属外環（１）及びシールリード（２）（２）へのメッ
キ層（１２ａ）の形成と、アースリード（４）へのメッ
キ層（１２ｂ ）の形成とは別々に行うため、両メッキ
層（１２ａ）（１２ｂ）の厚さは路間−にすることがで
きる。Since the formation of the plating layer (12a) on the metal outer ring (1) and the seal leads (2) (2) and the formation of the plating layer (12b) on the earth lead (4) are performed separately, both plating layers The thicknesses of (12a) and (12b) can be set to -.
このように、別々にメッキ層（１２ａ）（１２ｂ）を形
成した後、アースリード（４）の上端を金属外環（１）
の下面に溶接固定すると、第１図（Ｃ１に示すような気
密端子（５）が完成する。After forming the plating layers (12a) and (12b) separately in this way, the upper end of the ground lead (4) is connected to the metal outer ring (1).
When it is welded and fixed to the lower surface of the terminal, an airtight terminal (5) as shown in FIG. 1 (C1) is completed.
この後、金属外環（１）の上面に素子（６）４マウント
し、この素子（６）とシールリード（２）（２）の上端
部とをワイヤポンデイレ′り゛により電気的に接続する
。After this, 4 elements (6) are mounted on the upper surface of the metal outer ring (1), and the elements (6) and the upper ends of the seal leads (2) (2) are electrically connected by a wire bridge. do.
ここで、シールリード（２）の頂部、シールリード（２
）の中間部、アースリード（４）、金属外環（１）の各
メッキ厚に対するその部品数を第４図乃至第７図の黒丸
で示す。従来の白丸と本発明の黒丸とを比べと、本発明
においては、シールリード（２）の頂部及び中間部、ア
ースリード（４）、金属外環（１）ともに、メッキ厚の
差が小さくなっていることがわかる。Here, the top of the seal lead (2), the top of the seal lead (2)
), the number of parts for each plating thickness of the middle part, the earth lead (4), and the metal outer ring (1) is shown by black circles in FIGS. 4 to 7. Comparing the conventional white circles and the black circles of the present invention, in the present invention, the difference in plating thickness is smaller for both the top and middle parts of the seal lead (2), the earth lead (4), and the metal outer ring (1). You can see that
本発明によれば、金属外環及びシールリードとアースリ
ードとを別々にメッキすることにしたため、両者のメッ
キ厚の差を減少乃至路間−にすることができる。従って
、両者ともに所望のメッキ厚を形成することにより、メ
ッキ厚の過剰をなくし、メッキ層形成のための貴金属の
使用量を減らして、製品の低廉化が図れる。また、アー
スリードのメッキ厚が必要以上に厚くならないため、プ
リント基板の穴への嵌入にも支障がなくなる。According to the present invention, since the metal outer ring, the seal lead, and the earth lead are plated separately, the difference in plating thickness between the two can be reduced or evened out. Therefore, by forming a desired plating thickness for both, it is possible to eliminate excessive plating thickness, reduce the amount of precious metal used for forming the plating layer, and reduce the cost of the product. Further, since the plating thickness of the ground lead does not become thicker than necessary, there is no problem in fitting the ground lead into the hole of the printed circuit board.
第１図（ａ）乃至（Ｃ）は本発明に係る気密端子の製造
工程について説明するための気密封着体、アースリード
および気密端子の縦断面図である。
第２図は気密端子の一例を示す縦断面図、第３図は、気
密端子にメッキを施す装置の概略図である。
第４図はシールリードの頂部のメッキ厚を示す分布図、
第５図はシールリードの中間部のメッキ厚を示す分布図
、第６図はアースリードのメッキ厚を示す分布図、第７
図は金属外環のメッキ厚を示す分布図である。
（１） −金属外環、 （ｌａ） −リード封着孔
、（２”） −シールリード、（３） −ガラス、（４
） −アースリード、（５） −気密端子、（１２ａ）
（１２ｂＬ−一−メッキ層、（Ａ）−気密封着体。
特 許 出 願 人 関西日本電気株式会社代
理 人 江 原 省 吾烙緊
＼FIGS. 1A to 1C are vertical sectional views of an airtight seal, an earth lead, and an airtight terminal for explaining the manufacturing process of an airtight terminal according to the present invention. FIG. 2 is a longitudinal sectional view showing an example of an airtight terminal, and FIG. 3 is a schematic diagram of an apparatus for plating the airtight terminal. Figure 4 is a distribution diagram showing the plating thickness on the top of the seal lead.
Figure 5 is a distribution diagram showing the plating thickness at the middle part of the seal lead, Figure 6 is a distribution diagram showing the plating thickness of the earth lead, and Figure 7 is a distribution diagram showing the plating thickness at the middle part of the seal lead.
The figure is a distribution diagram showing the plating thickness of the metal outer ring. (1) - Metal outer ring, (la) - Lead sealing hole, (2”) - Seal lead, (3) - Glass, (4
) - Earth lead, (5) - Airtight terminal, (12a)
(12bL--Plated layer, (A)-Hermetically sealed body. Patent applicant: Kansai NEC Co., Ltd.
Rijin, Gangwon Province
Claims (1)
を貫通してガラスで封着すると共に、金属外環にアース
リードの一端を固定し、前記金属外環及び両リードにメ
ッキ層を形成した気密端子の製造方法であって、 金属外環にシールリードをガラス封着した気密封着体と
、アースリードとに予め別個にメッキ層を形成し、アー
スリードを金属外環に固定することを特徴とする気密端
子の製造方法。(1) A seal lead is passed through the lead sealing hole drilled in the metal outer ring and sealed with glass, and one end of the ground lead is fixed to the metal outer ring, and a plating layer is applied to the metal outer ring and both leads. A method for manufacturing an airtight terminal with a metal outer ring formed with a seal lead sealed in glass, a plating layer being formed separately on the ground lead and the airtight seal, and the ground lead fixed to the metal outer ring. A method for manufacturing an airtight terminal, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14892688A JPH01315977A (en) | 1988-06-15 | 1988-06-15 | Manufacture of airtight terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14892688A JPH01315977A (en) | 1988-06-15 | 1988-06-15 | Manufacture of airtight terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01315977A true JPH01315977A (en) | 1989-12-20 |
Family
ID=15463753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14892688A Pending JPH01315977A (en) | 1988-06-15 | 1988-06-15 | Manufacture of airtight terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01315977A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11128074B2 (en) * | 2017-09-20 | 2021-09-21 | Huawei Technologies Co., Ltd. | Electrical connector, mobile terminal, and electrical connector manufacturing method |
-
1988
- 1988-06-15 JP JP14892688A patent/JPH01315977A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11128074B2 (en) * | 2017-09-20 | 2021-09-21 | Huawei Technologies Co., Ltd. | Electrical connector, mobile terminal, and electrical connector manufacturing method |
| US11626702B2 (en) | 2017-09-20 | 2023-04-11 | Huawei Technologies Co., Ltd. | Electrical connector, mobile terminal, and electrical connector manufacturing method |
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