JPH01313970A - Lead pin for semiconductor device and its manufacture - Google Patents
Lead pin for semiconductor device and its manufactureInfo
- Publication number
- JPH01313970A JPH01313970A JP14769988A JP14769988A JPH01313970A JP H01313970 A JPH01313970 A JP H01313970A JP 14769988 A JP14769988 A JP 14769988A JP 14769988 A JP14769988 A JP 14769988A JP H01313970 A JPH01313970 A JP H01313970A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead pin
- bin
- caulking
- silver solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000004065 semiconductor Substances 0.000 title claims description 26
- 239000000463 material Substances 0.000 claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 238000005219 brazing Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 5
- 230000002950 deficient Effects 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 5
- 239000004332 silver Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 本発明を以下の順序に従って説明する。[Detailed description of the invention] The present invention will be explained in the following order.
Ａ、産業上の利用分野
Ｂ１発明の概要
Ｃ１従来技術［第４図、第５図］
Ｄ０発明が解決しようとする問題点
Ｅ１問題点を解決する手段
Ｆ１作用
Ｇ、実施例［第１図乃至第３図］
Ｈ１発明の効果
（Ａ、産業上の利用分野ン
本発明は半導体集積回路（ｒｃ）、大規模集積回路（Ｌ
Ｓ Ｉ ）等の半導体装置に用いる半導体装置用リード
ピンとその製造方法に関するものである。A. Industrial field of application B1 Overview of the invention C1 Prior art [Figs. 4 and 5] D0 Problems to be solved by the invention E1 Means for solving the problems F1 Effects G. Examples [Figs. 1 to 5] Figure 3] H1 Effects of the invention (A. Industrial application field) The present invention is applicable to semiconductor integrated circuits (RC), large-scale integrated circuits (L
The present invention relates to lead pins for semiconductor devices used in semiconductor devices such as S I ) and a method for manufacturing the same.
（Ｂ、発明の概要）
本発明は、一端面にロウ材を固着した半導体装置用のり
−ドピンの製造工数の低減、省力化、不良率の低減を図
り、低価格化を実現するため、リードピンの端面に凹部
を形成し、ロウ材をカシメによって上記端面に固着する
ようにしたものである。(B. Summary of the Invention) The present invention aims to reduce the number of manufacturing steps, save labor, and reduce the defective rate of a glued pin for semiconductor devices in which a brazing material is fixed to one end surface. A concave portion is formed in the end surface, and the brazing material is fixed to the end surface by caulking.
（Ｃ，従来技術）［第４図、第５図］
ＩＣ，ＬＳＩは従来はデュアル・イン・パッケージ型の
ものが多かったが、近年プラグ・イン・パッケージ型の
ものが増える傾向が現われ、これが将来の主流になると
考えられる。(C, Prior Art) [Figures 4 and 5] Conventionally, many ICs and LSIs were of the dual-in package type, but in recent years there has been a trend toward more plug-in package types, and this It is thought that it will become mainstream in the future.
そして、プラグ・イン・パッケージ型のＩＣ１ＬＳＩに
はリードピンとして第４図に示すように頭部ａに銀ロウ
ｂを固着したものが用いられる傾向にある。というのは
、セラミックパッケージのニッケルメッキされたメタラ
イズ膜上に銀ロウを介してリードピンを置き電気炉中に
パッケージを通してロウ付けするという従来のり−ドビ
ンの取付方法によればリードピンの取付位置にバラツキ
が生じる等問題が多く、リードピン自身に予め銀ロウを
付けておく方が好ましいということが認識されるように
なったからである。There is a tendency for plug-in package type IC1LSIs to use lead pins having silver solder b fixed to the head a as shown in FIG. 4. This is because the conventional method of attaching lead pins, in which the lead pins are placed on the nickel-plated metallized film of the ceramic package via silver solder and then brazed through the package in an electric furnace, causes variations in the attachment positions of the lead pins. This is because it has come to be recognized that it is preferable to apply silver solder to the lead pin itself in advance, as this causes many problems.
ところで、従来の銀ロウ付きの半導体装置用リードピン
、即ち、第４図に示すように先を大きくしてつくった頭
部ａの表面に銀ロウｂをロウ付けしたものは、第５図（
Ａ）乃至（Ｃ）に示すようにつくられた。同図に従って
具体的に説明すると、同図（Ａ）に示すように頭部ａを
大きくしたり−ドピンを用意し、該リードピンを立て、
次いで同図（Ｂ）に示すようにリードピンの頭部ａ上に
チップ状に形成された銀ロウｂを置き、その状態のまま
リードピンを電気炉に通して加熱して同図（Ｃ）に示す
ように銀ロウｂがリードピンの頭部８表面にロウ付けさ
れた状態にするのである。By the way, a conventional lead pin for a semiconductor device with silver solder, that is, one in which silver solder b is soldered to the surface of a head a made with a large tip as shown in FIG.
They were made as shown in A) to (C). To explain in detail according to the same figure, as shown in the same figure (A), the head a is enlarged, a lead pin is prepared, the lead pin is set up,
Next, as shown in the same figure (B), a silver solder b formed in the shape of a chip is placed on the head a of the lead pin, and in that state, the lead pin is passed through an electric furnace and heated, as shown in the same figure (C). In this way, the silver solder b is brazed to the surface of the head 8 of the lead pin.
（Ｄ、発明が解決しようとする問題点）ところで、従来
の銀ロウ付きの半導体装置用リードビンには、製造が面
倒で、不良が生じ易いという問題があった。この点につ
いて具体的に説明すると、リードピンをつくる場合、治
具に多数のリードピンを立てて並べ、チップ状に予め切
断しておいた銀ロウｂを１つずつリードピンの頭部ａの
表面に置き、その後コンベアによってその治具を電気炉
内に通すことが必要であった。従って、第１にリードピ
ンを１つ１つ治具に並べる作業が必要であり、第２にそ
の並べたリードピンの頭部ａに銀ロウｂを置く作業が必
要であり、これらの作業は一般に手作業で行われ、コス
ト低減を妨げる要因となっている。(D. Problems to be Solved by the Invention) By the way, conventional lead bins for semiconductor devices with silver solder have the problem that manufacturing is troublesome and defects are likely to occur. To explain this point specifically, when making lead pins, a large number of lead pins are lined up in a jig, and silver solder b cut into chip shapes is placed one by one on the surface of the head a of the lead pin. , then it was necessary to pass the jig into the electric furnace by means of a conveyor. Therefore, firstly, it is necessary to line up the lead pins one by one on a jig, and secondly, it is necessary to place silver solder b on the heads a of the lined up lead pins, and these tasks are generally performed manually. This is done during work and is a factor that hinders cost reduction.
そして、銀ロウｂの取り付は位置にバラツキが生じ易く
１位置ずれによって銀ロウｂのロウ付けの仕方が異なり
不良品が発生する割合が非常に多い。しかも、銀ロウｂ
を正しい位置に置いても電気炉に通しているうちに振動
、衝撃等によって銀ロウｂの位置が狂ってしまい。その
結果不良品になることも少なくなかった。従って、品質
管理が難しく、また材料の無駄も多くなるという問題も
あ７た。Furthermore, when attaching the silver solder b, variations in position tend to occur, and a deviation of one position causes a difference in the method of soldering the silver solder b, resulting in a very high rate of defective products. Moreover, silver wax b
Even if silver solder B is placed in the correct position, the position of silver solder B may become misaligned due to vibrations, shocks, etc. while passing it through the electric furnace. As a result, many products were defective. Therefore, there were also problems in that quality control was difficult and there was a lot of wasted material.
そこで、本発明は省力化を図り、高品質の半導体装置用
リードビンを簡単に製造し、リードピンの低価格化に寄
与することを目的とする。Therefore, an object of the present invention is to save labor, easily manufacture a high-quality lead bin for a semiconductor device, and contribute to lowering the cost of lead pins.
（Ｅ、問題点を解決する手段）
Ｌ記問題点を解決するため、本発明はリードピンの端面
に凹部を形成し、ロウ材をカシメによって上記端面に固
着するものである。(E. Means for Solving the Problem) In order to solve the problem L, the present invention forms a recess on the end face of the lead pin, and fixes the brazing material to the end face by caulking.
（Ｆ、作用）
本発明によれば、リードピンの端面に凹部を形成したう
えでロウ材をカシメるので、電気炉に通して加熱する必
要がなく、従って電気炉に通しているうちにロウ材が位
置ずれを起すというような不良の発生する余地がない。(F. Effect) According to the present invention, since the recess is formed on the end face of the lead pin and then the solder metal is caulked, there is no need to heat the solder metal by passing it through an electric furnace. There is no room for defects such as misalignment.
勿論、凸部の形成、ロウ材のカシメは自動機によって自
動的に行うことができるので著しい省力化ができるだけ
でなく１品質も非常に安定し、不良率も低くなり、延い
てはリードピンの低価格化を図ることができる。Of course, the formation of the protrusions and the caulking of the brazing material can be done automatically by an automatic machine, which not only allows for significant labor savings, but also provides extremely stable quality and a low defect rate, which in turn leads to a reduction in the number of lead pins. It is possible to reduce the price.
そして、リードピンの凹部が形成された端面にロウ材を
カシメることによってロウ材の一部が凸部となって四部
に嵌合するようにできるので、口ウ材の凸部がリードビ
ンの頭部の凹部から抜ける虞れが少なく、ロウ材がリー
ドピンから取れる不良の発生する虞れも少ない。従って
、リードピンの信頼度も高くすることができる。Then, by caulking the brazing material to the end face of the lead pin where the concave part is formed, a part of the brazing material becomes a convex part and can fit into the four parts, so that the convex part of the mouth material becomes the top of the lead bin. There is less risk of the lead pin falling out of the recess, and there is also less risk of failure in which the solder metal comes off from the lead pin. Therefore, the reliability of the lead pin can also be increased.
（Ｇ、実施例）［第１図乃至第３図］ 以下、本発明を図示実施例に従って詳細に説明する。(G, Example) [Figures 1 to 3] Hereinafter, the present invention will be explained in detail according to illustrated embodiments.
第１図は本発明半導体装置用リードビンの一つの実施例
１を示す断面図である。図において、２はリードビン本
体で、断面形状が円形又は矩形のコバール（鉄、ニッケ
ル、コバルトの合金からなる。商品名）からなる。３は
リードビン本体２の−・端部に形成された頭部で、その
表面４の中央部には先窄みの凹部５が存在している。FIG. 1 is a sectional view showing one embodiment 1 of the lead bin for semiconductor devices of the present invention. In the figure, 2 is a lead bin main body, which is made of Kovar (composed of an alloy of iron, nickel, and cobalt; trade name) and has a circular or rectangular cross section. Reference numeral 3 denotes a head formed at the - end of the lead bin main body 2, and a concave portion 5 with a tapered end is present in the center of the surface 4 of the head.
６はリードビン本体２の頭部３の表面にカシメにより固
着された銀ロウで、その一部が上記四部５内に緊密強固
に嵌合した凸部７となフており、該凸部７は上記凹部５
が先窄みになっていることに対応して先が拡がった形状
になっている。A silver solder 6 is fixed to the surface of the head 3 of the lead bin main body 2 by caulking, and a part of it is a convex part 7 that is tightly and firmly fitted into the four parts 5, and the convex part 7 is Said recess 5
The shape of the tip is widened to correspond to the constriction of the tip.
このような半導体装置用リードビンは、リードビン本体
２の先が窄んだ凹部５にロウ材６の先が拡がった凸部７
が嵌合しているので、リードビン本体２からロウ材６が
取れる虞れがない。Such a lead bin for semiconductor devices has a concave part 5 with a narrowed end of the lead bin body 2 and a convex part 7 with a widened end of the brazing material 6.
Since they are fitted, there is no risk of the brazing material 6 coming off from the lead bin body 2.
第２図（Ａ）乃至（Ｇ）は第１図に示した半導体装置用
リードビンの製造方法の一例を順に示す断面図である。FIGS. 2A to 2G are cross-sectional views sequentially showing an example of a method for manufacturing the lead bin for a semiconductor device shown in FIG. 1.
同図（Ａ）に示すように、金型８にその下側からリード
ビン形成用の線材９を通し、該線材９の先端を形成すべ
きリードビン本体２の長さに応じた長さ（頭部がつぶれ
る分最終的なリードビン本体２の長さよりも長い）だけ
金型８から上方へ突出させる。そして、せん断により切
断して１個のリードビン本体２を線材９から分離し、こ
のリードビン本体２を第２図（Ｂ）に示すように上記金
型８とは別の金型１０に上端から入れる。該金型１０に
は下からストッパ１１が挿入され、該ストッパ１１によ
ってリードビン本体２はその上端部が所定の長さ金型１
０から突出した状態に保たれる。As shown in FIG. 8A, a wire rod 9 for forming a lead bottle is passed through the mold 8 from the lower side, and the tip of the wire rod 9 is lengthened to a length corresponding to the length of the lead bottle body 2 to be formed (head part). (longer than the final length of the lead bin main body 2) to protrude upward from the mold 8. Then, one lead bin body 2 is separated from the wire 9 by cutting by shearing, and this lead bin body 2 is placed from the upper end into a mold 10 different from the mold 8 as shown in FIG. 2(B). . A stopper 11 is inserted into the mold 10 from below, and the stopper 11 allows the lead bin main body 2 to have a predetermined length at its upper end.
It is kept in a state that stands out from 0.
次に、第２図（Ｃ）に示すように、下端面の中央に凸部
１２を有する型１３でリードビン本体２の金型１０から
突出している上端部を強圧する。すると、型１３によっ
てリードピン２の上端部が圧潰されて頭部３が形成され
ると共に、型１３の凸部１２によって頭部３の表面中央
部に凹部５が形成される。該凹部５はこの段階では先窄
みにはなっていない。Next, as shown in FIG. 2(C), the upper end of the lead bin main body 2 protruding from the mold 10 is strongly pressed using a mold 13 having a convex portion 12 at the center of the lower end surface. Then, the upper end of the lead pin 2 is crushed by the mold 13 to form the head 3, and the convex portion 12 of the mold 13 forms a recess 5 in the center of the surface of the head 3. The recess 5 is not tapered at this stage.
次に、型１３をリードビン本体２から遠去け、次いで、
別のところで銀ロウの線材から切断することにより小ブ
ロツク状化して得た銀ロウ片６を第２図（Ｄ）に示すよ
うにリードビン本体２の頭部３表面４上に置く。Next, move the mold 13 away from the lead bin body 2, and then
A silver solder piece 6 obtained by cutting a silver solder wire into small blocks is placed on the head 3 surface 4 of the lead bin main body 2 as shown in FIG. 2(D).
次に、同図（Ｅ）に示すようにカシメ用の金型１４を用
いて銀ロウ片６をリードビン本体２の頭部３にカシメる
。すると、銀ロウ片６の一部が′ リードビン本体２
の頭部３表面の凹部５内に嵌り込んで凸部７となる。そ
して、このカシメの際に凹部５は先窄み形状に変形し、
それに嵌り込んだ凸部７は光拡がり形状になる。従って
、銀ロウ片６かリードビン本体２から剥れ落ちる虞れは
ない。Next, as shown in FIG. 3E, the silver solder piece 6 is crimped onto the head 3 of the lead bin body 2 using a crimping die 14. Then, a part of the silver solder piece 6 is attached to the lead bin body 2.
It fits into the recess 5 on the surface of the head 3 to form a protrusion 7. Then, during this caulking, the recess 5 is deformed into a tapered shape,
The convex portion 7 fitted into it becomes a light-spreading shape. Therefore, there is no risk that the silver solder piece 6 will peel off from the lead bin body 2.
次に、第２図（Ｆ）に示すように、成形用金型１５で銀
ロウ片６を強圧して凸球面状に整形する０ １６は金型
１３の下端面に形成された整形用凹球面である。Next, as shown in FIG. 2(F), the silver solder piece 6 is pressed hard with the molding die 15 to shape it into a convex spherical shape. It is spherical.
その後、第２図（Ｇ）に示すようにストッパ１１でリー
トビンｌを突き上げてリードピン１を金型１０からイジ
ェクトすると１．つのリードピンＩが完成することにな
る。Thereafter, as shown in FIG. 2(G), when the lead pin 1 is ejected from the mold 10 by pushing up the lead pin 1 with the stopper 11, 1. Two lead pins I will be completed.
この半導体装置用リードビン１の製造は自動機によって
ほんの数秒という短時間内に自動的に行うことができる
。そして、多数の半導体装置用リードビン！、１、・・
・の製造を間断なく順次連続的に行うことができる。従
って、省力化を図り、量産性を高めることが出来る。即
ち、１つ１つビンセット等でリードピンを治具に並べ、
その頭部上に銀ロウ片をやはりビンセットで並べるとい
う面倒な手作業は必要でないので省力化、量産性の向上
を図ることができるのである。そして、自動機を用いて
自動的に銀ロウをリードビン本体の頭部上に置くので銀
ロウの位置ずれの虞れが全くなく、不良率の低減を図る
ことができ、品質の向上を図ることができるのである。This lead bin 1 for semiconductor devices can be automatically manufactured in a short period of just a few seconds using an automatic machine. And a large number of lead bins for semiconductor devices! ,1,...
・can be manufactured sequentially and continuously without interruption. Therefore, it is possible to save labor and improve mass productivity. That is, line up the lead pins one by one on a jig using a bin set, etc.
Since there is no need for the troublesome manual work of arranging the silver solder pieces on the head using a set of bottles, it is possible to save labor and improve mass production. Since the silver solder is automatically placed on the head of the lead bin body using an automatic machine, there is no risk of the silver solder being misaligned, reducing the defective rate and improving quality. This is possible.
第３図は本発明半導体装置用のリードビンの別の実施例
を示す断面図である。FIG. 3 is a sectional view showing another embodiment of a lead bin for a semiconductor device according to the present invention.
この半導体装置用のリードビン１は、リードビン本体２
の頭部３に形成された凹部５が先窄みではなく、基（も
と）の部分から先の部分に至るまで断面の形状、大きさ
が略同じになっている。This lead bin 1 for semiconductor devices has a lead bin main body 2.
The recess 5 formed in the head 3 of the head 3 is not tapered, but has substantially the same cross-sectional shape and size from the base to the tip.
従って、カシメによってその凹部５に緊密に嵌合された
銀ロウ４の凸部７も、基（もと）の部分から先の部分に
至るまで断面の形状、大きさが略同じになっている。Therefore, the convex part 7 of the silver solder 4 that is tightly fitted into the concave part 5 by caulking also has approximately the same cross-sectional shape and size from the base part to the tip part. .
半導体装置用のリードビン１を第１図に示すようにした
りあるいは第３図に示すようにしたりすることはリード
ビンｌを製造する過程におけるカシメの際［第２図（Ｅ
）参照］にカシメ用の型１４で銀ロウ６をリードビン本
体２に加圧するときの圧力の強さを加減することにより
行うことができ、その圧力を弱くすることにより第３図
に示すように、圧力を強くすることにより第１図に示す
ようにすることができる。第３図に示した半導体装置用
のり−ドピンによれば、銀ロウ６のリードビン本体２か
らの剥れ強度が第１図に示した半導体装置用リードビン
の場合よりも若干低下するが、充分な剥れ強度は得られ
る。そして、省力化、高品質化、低価格化を図ることが
できる点でも第１図に示した実施例と特に本質的には差
異がない。Configuring the lead bin 1 for semiconductor devices as shown in FIG. 1 or as shown in FIG.
)] can be done by adjusting the strength of the pressure when pressurizing the silver solder 6 onto the lead bin body 2 with the crimping die 14. By weakening the pressure, the crimping can be performed as shown in FIG. 3. , by increasing the pressure, it can be achieved as shown in FIG. According to the glued pin for semiconductor devices shown in FIG. 3, the peeling strength of the silver solder 6 from the lead bin body 2 is slightly lower than that of the lead bin for semiconductor devices shown in FIG. Peel strength can be obtained. Also, there is essentially no difference from the embodiment shown in FIG. 1 in that labor saving, high quality, and low cost can be achieved.
（Ｈ，発明の効果）
以上に述べたところから明らかなように、本発明によれ
ば、半導体装置用リードビンの製造の省力化を図り、量
産性を高めそれによって低価格化を図り、更には品質の
向上、信頼性の向上を図ることができる(H. Effects of the Invention) As is clear from the above description, the present invention saves labor in manufacturing lead bins for semiconductor devices, improves mass productivity, and thereby lowers prices. It is possible to improve quality and reliability.
第１図は本発明半導体装置用リードビンの一つの実施例
を示す断面図、第２図（Ａ）乃至（Ｇ）は本発明半導体
装置用リードビンの製造方法の一つの実施例を順に示す
断面図、第３図は本発明半導体装置用リードビンの別の
実施例を示す断面図、第４図は半導体装置用リードビン
の従来例を示す断面図、第５図は（Ａ）乃至（Ｃ）は半
導体装置用リードビンの製造方法の従来例を順に示す断
面図である。
符号の説明
１・・・半導体装置用リードビン、
２・・・リードビン本体。
４・・・リードビン本体の一端面、
５・・・凹部、６・・・ロウ材、
７・・・ロウ材の凸部、
１３・・・凸部を有する型。
ニジ−１
一〜ｅ Ｌｎ （０） ｆｆｉ
−Ｎ豐いωト
二 ｐ ト
：′５FIG. 1 is a cross-sectional view showing one embodiment of the lead bin for semiconductor devices of the present invention, and FIGS. 2(A) to (G) are cross-sectional views sequentially showing one embodiment of the method for manufacturing the lead bin for semiconductor devices of the present invention. , FIG. 3 is a sectional view showing another embodiment of the lead bin for semiconductor devices of the present invention, FIG. 4 is a sectional view showing a conventional example of the lead bin for semiconductor devices, and FIG. 1A and 1B are cross-sectional views sequentially showing a conventional example of a method for manufacturing a lead bin for an apparatus. Explanation of symbols 1... Lead bin for semiconductor devices, 2... Lead bin body. 4... One end surface of lead bin main body, 5... Concave portion, 6... Brazing material, 7... Convex portion of brazing material, 13... Mold having a convex portion. Niji-1 1~e Ln (0) ffi -N 豐いωto2 p ト:'5
Claims (2)
部に緊密強固に嵌合せしめられて固着されている ことを特徴とする半導体装置用リードピン(1) A semiconductor device having a concave portion on one end surface, and a brazing material having a convex portion on the end surface, the convex portion being tightly and firmly fitted into the concave portion and fixed thereto. lead pin for
凹部を形成し、 次いで、上記リードピンの上記端面にロウ材をカシメる
ことにより該ロウ材の一部を上記凹部に嵌合する凸部に
してリードピンの一端面へのロウ材の固着を為す ことを特徴とする請求項（１）に記載の半導体装置用リ
ードの製造方法(2) A mold having a convex portion is strongly pressed against one end surface of the lead pin to form a recess, and then a portion of the brazing material is fitted into the recess by caulking the solder material to the end surface of the lead pin. The method for manufacturing a lead for a semiconductor device according to claim (1), characterized in that the brazing material is fixed to one end surface of the lead pin as a convex portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14769988A JPH01313970A (en) | 1988-06-14 | 1988-06-14 | Lead pin for semiconductor device and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14769988A JPH01313970A (en) | 1988-06-14 | 1988-06-14 | Lead pin for semiconductor device and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01313970A true JPH01313970A (en) | 1989-12-19 |
Family
ID=15436257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14769988A Pending JPH01313970A (en) | 1988-06-14 | 1988-06-14 | Lead pin for semiconductor device and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01313970A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003022504A3 (en) * | 2001-09-07 | 2003-10-23 | Newfrey Llc | Soldering method for metallic fastening elements |
-
1988
- 1988-06-14 JP JP14769988A patent/JPH01313970A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003022504A3 (en) * | 2001-09-07 | 2003-10-23 | Newfrey Llc | Soldering method for metallic fastening elements |
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