JPH01303797A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPH01303797A
JPH01303797A JP13265388A JP13265388A JPH01303797A JP H01303797 A JPH01303797 A JP H01303797A JP 13265388 A JP13265388 A JP 13265388A JP 13265388 A JP13265388 A JP 13265388A JP H01303797 A JPH01303797 A JP H01303797A
Authority
JP
Japan
Prior art keywords
solder
transistor
metal wire
wire mesh
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13265388A
Other languages
Japanese (ja)
Inventor
Yutaka Yamagishi
裕 山岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13265388A priority Critical patent/JPH01303797A/en
Publication of JPH01303797A publication Critical patent/JPH01303797A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain a solder joining high in reliability by a method wherein a metal wire mesh excellent in a solder wetting property is interposed between an electrode and a transistor of a substrate as a solder reinforcing material. CONSTITUTION:A thick film silver-palladium electrode 2 is formed on an alumina substrate 1 through printing, and a transistor 5 used as a power transistor of a power circuit is mounted flat on the electrode 2 interposing a metal wire mesh 4 between them. And the metal wire mesh 4 is formed through such a manner that a marketting solder absorbing wire is cut conforming to the size of the transistor 5. A soldering method, such as a solder printing method or a mesh receiving soldering method, is used for soldering and the both the methods are capable of joining and possessed of a self-aligning effect, so that the deviation of a transistor 5 mounting position does not need to be corrected. By these processes, solder containing a metal wire mesh is excellent in strength and almost free from cracks even if a thermal stress is applied. And even if cracks occur, the disconnection hardly happens as a metal wire mesh is interposed.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、パワートランジスタ等の大形で発熱性を有す
る部品を、ハンダによシ面付けして構成されるハイブリ
ッド集積回路（以下、ＩＣと言う）に関し、特に、ハン
ダ面付けの信頼性が優れたハイブリッドＩＣに関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit (hereinafter referred to as IC In particular, it relates to hybrid ICs with excellent solder surface reliability.

〔従来の技術〕[Conventional technology]

従来、モールドトランジスタのハンダ面付は方法は、電
極にハンダペーストを印刷した後にトランジスタを搭載
し、リフローするものが主流であった。この方法による
と、トランジスタの自重によ）リフロー後のハンダ厚み
はα１〜α５ｍｍ程度となる。Conventionally, the mainstream method for applying solder to molded transistors has been to print solder paste on the electrodes, mount the transistor, and then reflow. According to this method, the solder thickness after reflow (depending on the weight of the transistor) is approximately α1 to α5 mm.

ところで、従来におけるハンダ付けの信頼性向上を図っ
た例としては、例えば特開昭６１−１５２０９１号公報
及び特開昭６１−１５２０９２号公報に記載されている
ように、引き出し導体リード接属部を補強したものがあ
るが、しかし、トランジスタのヘッダ面付は部について
考慮されたものは見当たらない。By the way, as an example of improving the reliability of conventional soldering, for example, as described in JP-A-61-152091 and JP-A-61-152092, the connection part of the lead conductor is There are some reinforcements, but I haven't found any that take into consideration the mounting of the transistor on the header surface.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記した従来技術においては温度の変動に対する耐久性
について配慮がさｎていなかった。すなわち、電源スィ
ッチＯＮとＯＦＦで基板全体の温度が異な力、さらに、
セラミック基板とモールドトランジスタのヘッダ部であ
る銅ベースとの熱膨腸率が異なるため、それらの間に挾
まｎたハンダに熱ストレスが加わシ、比較的短時間でハ
ンダクラックが発生し、さらに断線及びトランジスタ脱
落に至シ、実使用に耐え難い場合もあった。In the prior art described above, no consideration was given to durability against temperature fluctuations. In other words, the temperature of the entire board differs depending on whether the power switch is turned on or off, and
Because the thermal expansion coefficients of the ceramic substrate and the copper base, which is the header part of the molded transistor, are different, heat stress is applied to the solder sandwiched between them, causing solder cracks to occur in a relatively short period of time. In some cases, this resulted in wire breakage and transistors falling out, making it difficult to withstand actual use.

そこで、本発明の目的は、温度サイクルによるハンダ劣
化が少ないトランジスタの面付は構造を有したハイブリ
ッドＩＣを提供することにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a hybrid IC having a structure in which transistors are mounted on a surface with little solder deterioration due to temperature cycles.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的は、ハンダの補強材としてハンダ濡れ性のよい
金属ワイヤーによるメツシュを、セラミック基板の電極
とトランジスタとの間に挿入して、・・ンダ付けを行う
ことにより達成される。The above object is achieved by inserting a mesh of metal wire with good solder wettability as a reinforcing material for the solder between the electrode of the ceramic substrate and the transistor, and performing soldering.

〔作用〕[Effect]

金属メツシュを含んだハンダは鉄筋コンクＩＪ　＋トと
同じ構造であシ、ハンダ単体に比べてその強度の点で優
れている。そのため熱ストレスが加わった場合でもハン
ダ単体に比べてクラックが入りにくい。また、もしクラ
ックが生じても金属メツシーがあるため断線に至ること
がないうえ、この金属メツシュの材料として延性の高い
金属を使用す扛ば、外側からノ・ンダクラツクが入って
も金属メツシュがクラックの進行を緩和し、トランジス
タ脱落に生じにくくなる。さらに、金属メツシュの厚み
分だけハンダも浮くな）、これはハンダクラックを減少
させるのに大きな効果がある。Solder containing metal mesh has the same structure as reinforced concrete IJ+, and is superior in strength to solder alone. Therefore, even when heat stress is applied, cracks are less likely to occur compared to solder alone. In addition, even if a crack occurs, it will not lead to wire breakage because of the metal mesh, and if a highly ductile metal is used as the material for this metal mesh, the metal mesh will crack even if a crack enters from the outside. The progress of this process is slowed down, making it less likely that transistors will fall out. Furthermore, the solder does not float due to the thickness of the metal mesh), which has a great effect on reducing solder cracks.

〔実施例〕〔Example〕

以下、本発明の一実施例を図によシ説明する０図におい
て、１はアルミナ基板、２は銀−パラジウＡ　（Ａｇ−
Ｐｄ　）　ｗＬ極、３はハンダ、４は金属メツシュ、５
はトランジスタ、５ａはトランジスタ５のヘッダ部、５
ｂはトランジスタ５の引き出し導体、である。Hereinafter, in Figure 0 for explaining one embodiment of the present invention with reference to the drawings, 1 is an alumina substrate, 2 is a silver-palladium A (Ag-
Pd) wL pole, 3 is solder, 4 is metal mesh, 5
is a transistor, 5a is a header part of transistor 5, 5
b is a lead-out conductor of the transistor 5.

本実施例において、基板には厚み（１８ｍｍのアルミナ
基板１上に厚膜銀−パラジウム（Ａｇ−ｐａ）電極２が
印刷形成されているものを使用し、七詐に電源回路に使
用するパワートランジスタとしてトランジスタ５を面付
けした０また、金属メツシュ４には、市販のハンダ吸い
取＃）線をトランジスタ５の大きさに合わせて切断した
ものを用いた。In this example, the substrate used is an alumina substrate 1 with a thickness of 18 mm and a thick film silver-palladium (Ag-pa) electrode 2 printed on it. Further, as the metal mesh 4, a commercially available solder absorbing wire cut to match the size of the transistor 5 was used.

また、ハンダ付は方法としては、ハンダペースト印刷と
メツシュ迎いハンダの２通勺を試みたが、いずれの方法
でも接続可能であった。また、セルフアライメントの効
果もあ〕、トランジスタ５の搭載位置ずれを直す必要が
ないことも確認された◎さらに、本実施例において、金
属メツシー４として使用したハンダ吸い取シ線は、銅メ
ツシユにハンダメツキと７ラツクス塗布が施されておシ
、ハンダ付けは容易であった。なお、面付は部の金属メ
ツシュ４とハンダ５のトータル厚みＨｎ、ａ〜１、０　
ｍｍであり、温度サイクルに対する耐性も得られた。In addition, we tried two methods of soldering: solder paste printing and mesh soldering, but connection was possible with either method. It was also confirmed that there was a self-alignment effect] and that there was no need to correct the mounting position shift of the transistor 5. Furthermore, in this example, the solder wicking wire used as the metal mesh 4 was attached to the copper mesh. It was solder-plated and coated with 7 lux, making it easy to solder. In addition, for imposition, the total thickness of the metal mesh 4 and solder 5 is Hn, a ~ 1, 0.
mm, and resistance to temperature cycles was also obtained.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、金属メツシュを補強材として、セラミ
ック基板の電極上にモールドトランジスタをハンダで強
固に面付けを行うことができるうえ、温度変化に対して
も耐性があるため、信頼性の高いハンダ接合が得られる
。耐温度サイクルについては、試験条件やトランジスタ
の大きさ等によシ異なるが、おおよそ従来の６倍以上の
寿命が確保できる。According to the present invention, a molded transistor can be firmly soldered onto the electrode of a ceramic substrate using a metal mesh as a reinforcing material, and is also resistant to temperature changes, resulting in high reliability. A solder joint is obtained. The temperature cycle resistance varies depending on the test conditions and the size of the transistor, but it can ensure a lifespan that is approximately six times longer than that of conventional products.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の一実施例としてのハイブリッドＩＣの断面
を示す断面図である。 １・・・アルミナ基板、２・・・銀−パラジウム（Ａｇ
−ｐａ）電極、３・・・ハンダ、４・・・金属メツシュ
、５・・・トランジスタ、５ａ・・・トランジスタのヘ
ッダ部、５ｂ・・・トランジスタの引き出し導体。The figure is a sectional view showing a cross section of a hybrid IC as an embodiment of the present invention. 1... Alumina substrate, 2... Silver-palladium (Ag
-pa) Electrode, 3...Solder, 4...Metal mesh, 5...Transistor, 5a...Transistor header portion, 5b...Transistor lead conductor.

Claims (2)

【特許請求の範囲】[Claims] １．セラミック基板の電極上にトランジスタをハンダに
て面付けして構成されるハイブリッド集積回路において
、前記電極とトランジスタとの間に、ハンダ濡れ性を有
する金属メッシュを配置し、該金属メッシュと共に前記
トランジスタをハンダにて面付けすることを特徴とする
ハイブリッド集積回路。1. In a hybrid integrated circuit configured by mounting a transistor on an electrode of a ceramic substrate with solder, a metal mesh having solder wettability is arranged between the electrode and the transistor, and the transistor is mounted together with the metal mesh. A hybrid integrated circuit characterized by surface mounting using solder. ２．請求項１に記載のハイブリッド集積回路において、
前記金属メッシュは、その材質が銅であることを特徴と
するハイブリッド集積回路。2. The hybrid integrated circuit according to claim 1,
The hybrid integrated circuit is characterized in that the metal mesh is made of copper.
JP13265388A 1988-06-01 1988-06-01 Hybrid integrated circuit Pending JPH01303797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13265388A JPH01303797A (en) 1988-06-01 1988-06-01 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13265388A JPH01303797A (en) 1988-06-01 1988-06-01 Hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPH01303797A true JPH01303797A (en) 1989-12-07

Family

ID=15086352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13265388A Pending JPH01303797A (en) 1988-06-01 1988-06-01 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPH01303797A (en)

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