JPH01287131A - Epoxy resin composition for semiconductor sealing and curing accelerator - Google Patents
Epoxy resin composition for semiconductor sealing and curing acceleratorInfo
- Publication number
- JPH01287131A JPH01287131A JP6724488A JP6724488A JPH01287131A JP H01287131 A JPH01287131 A JP H01287131A JP 6724488 A JP6724488 A JP 6724488A JP 6724488 A JP6724488 A JP 6724488A JP H01287131 A JPH01287131 A JP H01287131A
- Authority
- JP
- Japan
- Prior art keywords
- curing accelerator
- epoxy resin
- curing
- resin composition
- encapsulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 19
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 19
- 239000000203 mixture Substances 0.000 title claims abstract description 14
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 238000007789 sealing Methods 0.000 title 1
- 239000003094 microcapsule Substances 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims abstract description 7
- 239000011256 inorganic filler Substances 0.000 claims abstract description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 5
- 238000005538 encapsulation Methods 0.000 claims description 7
- 238000010828 elution Methods 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 239000010680 novolac-type phenolic resin Substances 0.000 claims 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract description 8
- 229920003986 novolac Polymers 0.000 abstract description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract description 4
- 239000005011 phenolic resin Substances 0.000 abstract description 4
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 abstract description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- 239000004640 Melamine resin Substances 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002775 capsule Substances 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- -1 triazole compound Chemical class 0.000 description 1
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は硬化性と常温での貯蔵安定性に優れる半導体封
止用エポキシ樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an epoxy resin composition for semiconductor encapsulation that has excellent curability and storage stability at room temperature.
一般に半導体封止用エポキシ樹脂組成物においては硬化
性を向上させるのに硬化促進剤を使用している。この為
常温で放置すると硬化が徐々にすすみ流動性が劣る等の
欠点があり、通常低温での輸送あるいは低温保管等によ
り硬化性と貯蔵安定性の両立を図ってきた。Generally, in epoxy resin compositions for semiconductor encapsulation, a curing accelerator is used to improve curing properties. For this reason, if left at room temperature, curing progresses gradually and fluidity deteriorates, which is a disadvantage. Therefore, attempts have been made to achieve both curability and storage stability by transporting or storing at low temperatures.
しかしながら、このような低温での輸送あるいは保管は
大幅なコストアンプになる。この為硬化研究が盛んに行
なわれてた。その結果テトラ置換ホスホニウム・テトラ
置換ボレート類（特公昭６０−５６１”ｊ２号公報）、
４級テンモニウムトリアゾレート化合物（特公昭６０−
２３５８２８、２３５８３０号公報）等が提案された。However, transportation or storage at such low temperatures results in significant cost amplifiers. For this reason, hardening research was actively conducted. As a result, tetra-substituted phosphonium/tetra-substituted borates (Japanese Patent Publication No. 60-561"j2),
Quaternary tenmonium triazole compound (Special Publication 1986-
235828, 235830), etc. were proposed.
しかしながらこれらはいずれも硬化性と常温での貯蔵安
定性の両立が不可能であった。However, it was impossible for any of these to achieve both curability and storage stability at room temperature.
〔発明の目的］
本発明は従来技術では不可能であった硬化性と常温での
貯蔵安定性の両立を目的として研究した結果硬化促進剤
をマイクロカプセル化することにより貯蔵安定性が向上
するとの知見を得、更にこの知見に基づき種々の研究を
進めて本発明を完成するに至ったものである。[Purpose of the Invention] The present invention was made with the aim of achieving both curability and storage stability at room temperature, which was impossible with conventional techniques.As a result of research, it was found that storage stability can be improved by microencapsulating a curing accelerator. After obtaining this knowledge, we proceeded with various studies based on this knowledge and completed the present invention.
本発明は、
（Ａ）１分子中にエポキシＵ基を少なくとも２個以上存
するエポキシ樹脂
（Ｂ）ノボラック型フェノール樹脂硬化剤（Ｃ）マイク
ロカプセル化した硬化促進剤（Ｄ）無機充填剤
を必須成分とすることを特徴とする半導体封止用エポキ
シ樹脂組成物と
硬化促進剤が溶出温度１００〜１５０℃の材質からなる
マイクロカプセルであり、該マイクロカプセルの壁厚が
０，１〜１μｍであり、且つマイクロカプセルの粒径が
２０μｍ以下となるようにマイクロカプセル化された請
求項１記載の硬化促進剤に関するものである。The present invention comprises (A) an epoxy resin containing at least two epoxy U groups in one molecule, (B) a novolak type phenolic resin curing agent, (C) a microencapsulated curing accelerator, and (D) an inorganic filler as an essential component. The epoxy resin composition for semiconductor encapsulation and the curing accelerator are microcapsules made of a material having an elution temperature of 100 to 150°C, and the wall thickness of the microcapsules is 0.1 to 1 μm, The curing accelerator according to claim 1, wherein the curing accelerator is microencapsulated so that the particle size of the microcapsules is 20 μm or less.
本発明でいうところのエポキシ樹脂組成物は、エポキシ
樹脂、硬化剤、本発明のマイクロカプセル化した硬化促
進剤及び無機充填剤を必須とし、更に必要に応じて難燃
剤、処理剤、顔料、離型剤その他添加剤を配合したもの
である。The epoxy resin composition referred to in the present invention essentially contains an epoxy resin, a curing agent, the microencapsulated curing accelerator of the present invention, and an inorganic filler, and further includes a flame retardant, a processing agent, a pigment, and a release agent as necessary. It contains a molding agent and other additives.
エポキシ樹脂とはエポキシ基を有するもの全般のことを
いい、例えばビスフェノール型エポキシ樹脂、ノボラン
ク型エポキシ樹脂、複素環型エポキシ樹脂といった一般
名を挙げることができる。Epoxy resin refers to all compounds having an epoxy group, and includes common names such as bisphenol type epoxy resin, novolank type epoxy resin, and heterocyclic type epoxy resin.
本発明の硬化促進剤とは次のようなものをいいマイクロ
カプセル化されていることが必須である。The curing accelerator of the present invention refers to the following, and it is essential that it is microencapsulated.
硬化促進剤とマイクロカプセル壁材の種類及びマイクロ
カプセルの粒径、厚みが技術的にポイントになる。Technical points are the type of curing accelerator and microcapsule wall material, and the particle size and thickness of the microcapsules.
硬化促進剤としては、ジアザビシクロウンデセン、トリ
フェニルホスフィン、２メチルイミダゾール、ジメチル
ベンジルアミン等が挙げられる。Examples of the curing accelerator include diazabicycloundecene, triphenylphosphine, 2methylimidazole, and dimethylbenzylamine.
尚マイクロカプセル壁材としては？吉川温度が１００〜
１５０℃が好ましい。ここでいう溶出温度とは、マイク
ロカプセル化された硬化促進剤が壁材を通して外部に溶
出あるいは壁材が破壊されることにより外部に溶出する
温度のことを言う。即ち組成物の混合・混練時には硬化
促進剤が溶出せず成形時に溶出することにより硬化促進
剤の触媒作用を引き出すものが好ましい。例えばメラミ
ン樹脂、フェノール樹脂といった熱硬化性樹脂を用いる
ことができる。What about microcapsule wall materials? Yoshikawa temperature is 100~
150°C is preferred. The elution temperature here refers to the temperature at which the microencapsulated curing accelerator elutes to the outside through the wall material or elutes to the outside when the wall material is destroyed. That is, it is preferable that the curing accelerator is not eluted during mixing and kneading of the composition, but is eluted during molding to bring out the catalytic action of the curing accelerator. For example, thermosetting resins such as melamine resin and phenol resin can be used.
さらに壁材の厚みとしては０１〜１μｍが好ましい。０
１μｍより薄いと混合・混練時に硬化促進剤が溶出して
しまう。又１μｍより厚いと成形時に硬化促進剤が溶出
しないからである。又マイクロカプセルの粒径としては
２０μｍ以下が好ましい。２０μｍより大きいと分散性
が悪くなり、硬化にむらが生してしまう。又更に粒径が
大きくなれば、必然的にカプセル強度が弱くなってしま
が好ましい。０．１重量％以下あるいは０．５重量％以
上に添加すると所望の硬化性が得られないからである。Furthermore, the thickness of the wall material is preferably 01 to 1 μm. 0
If it is thinner than 1 μm, the curing accelerator will be eluted during mixing and kneading. Moreover, if the thickness is more than 1 μm, the curing accelerator will not be eluted during molding. Further, the particle size of the microcapsules is preferably 20 μm or less. If it is larger than 20 μm, dispersibility will be poor and curing will be uneven. Furthermore, it is preferable that if the particle size becomes larger, the capsule strength will inevitably become weaker. This is because if it is added in an amount less than 0.1% by weight or more than 0.5% by weight, the desired curability cannot be obtained.
マイクロカプセル化法としては界面沈澱法、界面重合法
や液中硬化被膜法等を挙げることができる。Examples of the microencapsulation method include an interfacial precipitation method, an interfacial polymerization method, and an in-liquid curing film method.
を たとえば界面沈澱法によりマイクロカプセル金の 製造する方法は以下噂通りである。of For example, microcapsule gold can be prepared by interfacial precipitation method. The manufacturing method is as rumored below.
硬化促進剤としてはトリフェニルホスフィン及び／又は
２−メチルイミダゾールをメラミン樹脂の塩化メチレン
溶液に分散する（この場合硬化促進剤の分散径は２０／
１ｍ以下となるように分散し又メラミン樹脂量はカプセ
ルの被覆厚みが０．１〜１．０μｍとなるように調整す
る。）これを硬化剤を希釈剤に溶解した溶液に乳化分散
させ、撹拌を行ないながら５０℃に加温し、塩化エチレ
ンを系外に揮発除去し濾過乾燥によりマイクロカプセル
化粉末を得る方法である。As a curing accelerator, triphenylphosphine and/or 2-methylimidazole is dispersed in a methylene chloride solution of melamine resin (in this case, the dispersion diameter of the curing accelerator is 20/2
The amount of melamine resin is adjusted so that the capsule thickness is 0.1 to 1.0 μm. ) This is a method in which this is emulsified and dispersed in a solution of a curing agent dissolved in a diluent, heated to 50° C. while stirring, ethylene chloride is volatilized out of the system, and microencapsulated powder is obtained by filtration and drying.
本発明に従うと、従来技術をそのまま利用し且つ従来技
術では両立できなかった硬化性と常温での貯蔵安定性に
優れるエポキシ樹脂組成物を得ることができる。特に半
導体封止用途では今後まずますプラスチックパッケージ
化が予想され又そのために硬化性と常温での貯蔵安定性
の両立が望まれている今日においては本発明の産業的意
味役割は非常に大きい。According to the present invention, it is possible to obtain an epoxy resin composition that is excellent in curability and storage stability at room temperature, which were not compatible with the conventional techniques, while utilizing the conventional techniques as they are. Particularly in semiconductor encapsulation applications, it is expected that plastic packaging will become more common in the future, and for this reason, it is desired that both curability and storage stability at room temperature be achieved.The industrial significance of the present invention is therefore very large.
（マイクロカプセルの製造）
硬化促進剤としてトリフェニルホスフィンおよび／また
は２−メチルイミダゾールの粒径が２０μｍ以下である
顆粒状のものをメラミン樹脂の塩化メチレン溶１（樹脂
濃度２′０％）に分散させる。(Production of microcapsules) Granules of triphenylphosphine and/or 2-methylimidazole with a particle size of 20 μm or less as a curing accelerator are dispersed in a methylene chloride solution of melamine resin 1 (resin concentration 2'0%). let
尚メラミン樹脂量は、硬化促進剤の被覆厚みが０゜１〜
１．０μｍとなるように適宜調整を行った。The amount of melamine resin is determined when the coating thickness of the curing accelerator is 0°1~
Appropriate adjustments were made so that the thickness was 1.0 μm.
この分散液を、メラミン樹脂の硬化剤を希釈剤に溶解し
た溶液に乳化分散さ上撹拌をしながら５゜℃に加温し、
塩化メチレンを系外に揮発除去し、濾過乾燥しマイクロ
カプセル化したものを得る方法により第１表に示す構成
の硬化促進剤のマイクロカプセルを製造した。This dispersion was emulsified and dispersed in a solution of a melamine resin curing agent dissolved in a diluent, and heated to 5°C while stirring.
Microcapsules of a curing accelerator having the structure shown in Table 1 were produced by removing methylene chloride by evaporation from the system and filtering and drying to obtain microcapsules.
第１表
（実施例１〜５、比較例１〜３）
オルトクレゾールノボラノクエボキシ樹脂２０重量部
フェノールノボラック樹脂 １０重量部溶融シリカ
７０重量部脂環式エボキンシラン
０．５重１部カーボンブランク
０．５重量部モンクン酸 ０．５
重量部に対して第１表に示すマイクロカプセル■〜０を
硬化促進剤が、０．２重量部となる様に添加して、ブレ
ンダーを用い均一混合し、その後１００ ’Ｃの熱ロー
ルで３分間混練し、第２表に示す組み合せせで８種類の
半導体封止用エポキシ樹脂組成物からなる成形＋Ａ料を
得た。これらの成形材料の保存性及び硬化性を測定した
結果を第２表に示す。Table 1 (Examples 1 to 5, Comparative Examples 1 to 3) 20 parts by weight of ortho-cresol novolak resin 10 parts by weight Phenol novolac resin 10 parts by weight Fused silica 70 parts by weight Alicyclic evoquine silane 0.5 parts by weight 1 part Carbon blank
0.5 parts by weight Mongcunic acid 0.5
Microcapsules ■~0 shown in Table 1 were added to the curing accelerator in an amount of 0.2 parts by weight, and mixed uniformly using a blender, and then heated with a roll at 100'C for 3 The mixture was kneaded for a minute to obtain molding+A materials consisting of eight types of epoxy resin compositions for semiconductor encapsulation in the combinations shown in Table 2. Table 2 shows the results of measuring the storage stability and curing properties of these molding materials.
（比較例４〜６）
実施例１の組成において、マイクロカプセル化した硬化
促進剤を用いず、第２表に示す硬化促進剤を直接添加し
、混合し１００℃の熱ロールで３分間混練し半導体封止
用エポキシ樹脂組成物からなる成形材料を得た。(Comparative Examples 4 to 6) In the composition of Example 1, the curing accelerator shown in Table 2 was directly added without using the microencapsulated curing accelerator, mixed, and kneaded for 3 minutes with a hot roll at 100 ° C. A molding material made of an epoxy resin composition for semiconductor encapsulation was obtained.
これらの成形材料の保存性及び硬化性を測定した結果を
第２表に示す。Table 2 shows the results of measuring the storage stability and curing properties of these molding materials.
以上実施例及び比較例より明らかのように、マイクロカ
プセル化した硬化促進剤を用いることにより、保存性が
大１］に向上することがわかった。As is clear from the Examples and Comparative Examples above, it was found that by using a microencapsulated curing accelerator, the storage stability was greatly improved.
特に好ましい範囲で用いた場合は抜群の効果があり、保
存性と硬化性が両立していることがわかる。It can be seen that when used within a particularly preferable range, outstanding effects are achieved, and both preservability and curing properties are achieved.
Claims (2)
上有するエポキシ樹脂 （Ｂ）ノボラック型フェノール樹脂硬化剤 （Ｃ）マイクロカプセル化した硬化促進剤 （Ｄ）無機充填剤 を必須成分とすることを特徴とする半導体封止用エポキ
シ樹脂組成物。(1) (A) Epoxy resin having at least two epoxy groups in one molecule (B) Novolac type phenolic resin curing agent (C) Microencapsulated curing accelerator (D) Inorganic filler as an essential component An epoxy resin composition for semiconductor encapsulation, characterized by:
からなるマイクロカプセルであり、該マイクロカプセル
の壁厚が０．１〜１μｍであり、且つマイクロカプセル
の粒径が２０μｍ以下となるようにマイクロカプセル化
された請求項１記載の硬化促進剤。(2) The curing accelerator is a microcapsule made of a material with an elution temperature of 100 to 150°C, the wall thickness of the microcapsule is 0.1 to 1 μm, and the particle size of the microcapsule is 20 μm or less. The curing accelerator according to claim 1, which is microencapsulated in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6724488A JPH01287131A (en) | 1988-03-23 | 1988-03-23 | Epoxy resin composition for semiconductor sealing and curing accelerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6724488A JPH01287131A (en) | 1988-03-23 | 1988-03-23 | Epoxy resin composition for semiconductor sealing and curing accelerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01287131A true JPH01287131A (en) | 1989-11-17 |
Family
ID=13339312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6724488A Pending JPH01287131A (en) | 1988-03-23 | 1988-03-23 | Epoxy resin composition for semiconductor sealing and curing accelerator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01287131A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01242616A (en) * | 1988-03-23 | 1989-09-27 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor |
| JPH08301978A (en) * | 1995-05-02 | 1996-11-19 | Nitto Denko Corp | Epoxy resin composition for sealing semiconductor element, and resin-sealed semiconductor device |
| US6342309B1 (en) * | 1999-08-19 | 2002-01-29 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device |
| EP1184419A3 (en) * | 2000-08-24 | 2003-04-02 | Nitto Denko Corporation | Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| JP2012052051A (en) * | 2010-09-02 | 2012-03-15 | Asahi Kasei E-Materials Corp | Curing agent composition for epoxy resin and one-pack epoxy resin composition |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723625A (en) * | 1980-07-17 | 1982-02-06 | Toshiba Corp | Epoxy resin composition and resin-sealed semiconductor device |
| JPS58198525A (en) * | 1982-05-14 | 1983-11-18 | Sanyurejin Kk | Epoxy resin composition |
| JPS58225121A (en) * | 1982-06-23 | 1983-12-27 | Sanyurejin Kk | Epoxy resin composition and sealing of electronic parts using the same |
| JPS60223805A (en) * | 1984-03-23 | 1985-11-08 | ミネソタ マイニング アンド マニユフアクチユアリングコンパニー | Latent lewis acid catalyst concentrate |
| JPS6112724A (en) * | 1984-06-27 | 1986-01-21 | Toshiba Corp | Epoxy resin composition |
| JPS6189221A (en) * | 1984-10-08 | 1986-05-07 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| JPH01242616A (en) * | 1988-03-23 | 1989-09-27 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor |
-
1988
- 1988-03-23 JP JP6724488A patent/JPH01287131A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723625A (en) * | 1980-07-17 | 1982-02-06 | Toshiba Corp | Epoxy resin composition and resin-sealed semiconductor device |
| JPS58198525A (en) * | 1982-05-14 | 1983-11-18 | Sanyurejin Kk | Epoxy resin composition |
| JPS58225121A (en) * | 1982-06-23 | 1983-12-27 | Sanyurejin Kk | Epoxy resin composition and sealing of electronic parts using the same |
| JPS60223805A (en) * | 1984-03-23 | 1985-11-08 | ミネソタ マイニング アンド マニユフアクチユアリングコンパニー | Latent lewis acid catalyst concentrate |
| JPS6112724A (en) * | 1984-06-27 | 1986-01-21 | Toshiba Corp | Epoxy resin composition |
| JPS6189221A (en) * | 1984-10-08 | 1986-05-07 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| JPH01242616A (en) * | 1988-03-23 | 1989-09-27 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01242616A (en) * | 1988-03-23 | 1989-09-27 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor |
| JPH08301978A (en) * | 1995-05-02 | 1996-11-19 | Nitto Denko Corp | Epoxy resin composition for sealing semiconductor element, and resin-sealed semiconductor device |
| US6342309B1 (en) * | 1999-08-19 | 2002-01-29 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device |
| EP1184419A3 (en) * | 2000-08-24 | 2003-04-02 | Nitto Denko Corporation | Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| SG128412A1 (en) * | 2000-08-24 | 2007-01-30 | Nitto Denko Corp | Resin composition for sealing semiconductor, semiconductor device using the same semiconductor waferand mounted structure of semiconductor device |
| KR100776959B1 (en) * | 2000-08-24 | 2007-11-27 | 닛토덴코 가부시키가이샤 | Resin composition for sealing semiconductor, semiconductor device using the same, semiconductor wafer and mounted structure of semiconductor device |
| JP2012052051A (en) * | 2010-09-02 | 2012-03-15 | Asahi Kasei E-Materials Corp | Curing agent composition for epoxy resin and one-pack epoxy resin composition |
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