JPH01235360A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPH01235360A JPH01235360A JP6280388A JP6280388A JPH01235360A JP H01235360 A JPH01235360 A JP H01235360A JP 6280388 A JP6280388 A JP 6280388A JP 6280388 A JP6280388 A JP 6280388A JP H01235360 A JPH01235360 A JP H01235360A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- package body
- vertical
- lead
- auxiliary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 239000002184 metal Substances 0.000 abstract description 13
- 230000037431 insertion Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、パッケージ本体の側面からリードを引き出し
て成る半導体集積回路装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device in which leads are drawn out from the side surface of a package body.
［従来の技術］
従来、半導体集積回路装置（以下、ＩＣ装置という）と
して、第７図にその斜視図を示すようなものが提案され
ている。[Prior Art] Conventionally, a semiconductor integrated circuit device (hereinafter referred to as an IC device) has been proposed, a perspective view of which is shown in FIG.
このＩＣ装置１は、ＩＣチップを所定の樹脂でモールド
してパッケージ本体２を形成すると共にパッケージ本体
２の側面から複数のり一ド３を引き出して構成されてお
り、また、これら複数のリード３は、パッケージ本体２
の側面側から先端部に向けて水平部３Ａ、垂直部３Ｂ及
び水平部３Ｃを順次形成して構成されている。This IC device 1 is constructed by molding an IC chip with a predetermined resin to form a package body 2 and pulling out a plurality of leads 3 from the side of the package body 2. , package body 2
A horizontal portion 3A, a vertical portion 3B, and a horizontal portion 3C are sequentially formed from the side surface toward the tip.
第８図は、かかる従来のＩＣ装置１を配線基板４に実装
した状態を示す図であって、５は他の実装部品、６は半
田である。FIG. 8 is a diagram showing a state in which such a conventional IC device 1 is mounted on a wiring board 4, where 5 is another mounted component and 6 is solder.
［発明が解決しようとする課題］
ところで、かかる従来のＩＣ装置１は、リード３の垂直
部３Ｂの長さを短くし、パッケージ本体２の下面を配線
基板４に近接、或は密着して実装するように構成されて
おり、第８図に示すように、その実装高を低くできるも
のの、配線基板４の上方の空間部を有効に利用している
か否かという観点から、その実装高と池の実装部品５の
実装高とを比較すると、他の実装部品５の実装高は、Ｉ
Ｃ装置１の実装高よりも高くなっており、また、かかる
ＩＣ装置１の上方には他の部品を実装できないことを考
慮すると、かかるもＣ来のＩＣ装置１は配線基板４の上
方の空間を有効に利用しているとは言えない。[Problems to be Solved by the Invention] Incidentally, in the conventional IC device 1, the length of the vertical portion 3B of the lead 3 is shortened, and the lower surface of the package body 2 is mounted close to or in close contact with the wiring board 4. Although the mounting height can be reduced as shown in FIG. When comparing the mounting height of the mounted component 5 with the mounting height of the other mounted component 5, the mounting height of the other mounted component 5 is I
Considering that the mounting height of the IC device 1 is higher than that of the C device 1 and that other components cannot be mounted above the IC device 1, the IC device 1 of the C device 1 occupies the space above the wiring board 4. It cannot be said that they are being used effectively.
本発明は、かかる点に鑑み、配線基板上の空間と有効に
利用し、実装密度を高めることがてきるようにしたＩＣ
装置を提供することを目的とする。In view of the above, the present invention provides an IC that can effectively utilize the space on a wiring board and increase the packaging density.
The purpose is to provide equipment.
し課題を解決するための手段］
本発明によるＩＣ装置は、その構成要素を実施例図面に
対応させて説明すると、パッケージ本体８．１４の側面
から複数のり一ト９．１５を引き出すと共に、これら複
数のり−ド９．１５に垂直部９Ｂ、１５Ｂを設けてなる
半導体集積回路装置において、これら複数のリード９．
１５の垂直部９Ｂ、１５Ｂを充分に長くしてパッケージ
本体８．１４の下方の配線基板４上に他の部品１２を実
装できるようにしたものである。[Means for Solving the Problems] The IC device according to the present invention, to explain its constituent elements in accordance with the drawings of the embodiment, has a plurality of glues 9.15 pulled out from the side of the package body 8.14, and In a semiconductor integrated circuit device in which a plurality of leads 9.15 are provided with vertical portions 9B, 15B, the plurality of leads 9.15 are provided with vertical portions 9B, 15B.
The vertical portions 9B and 15B of the package body 8.15 are made sufficiently long so that other components 12 can be mounted on the wiring board 4 below the package body 8.14.
〔作用］
かかる本発明においては、パッケージ本体８．１４の下
方の配線基板４上に他の部品１２を実装することができ
るので、配線基板４に対する実装部品の実装密度を高め
ることかできる。[Function] In the present invention, other components 12 can be mounted on the wiring board 4 below the package body 8.14, so that the mounting density of the components on the wiring board 4 can be increased.
［実施例］
以下、先ず、第１図及び第２図を参照して、本発明の一
実施例につき説明する。[Embodiment] First, an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
第１図は本発明の一実施例を示す斜視図であって、この
第１図例のＩＣ装置７は、ＩＣチップをエポキシ樹脂等
でモールドして略直方体状をなすパンケージ本体８を形
成すると共に、このパッケージ本体８の有する４個の側
面からそれぞれ複数のリード９を引き出すと共に４個の
側面のそれぞれの両端部から補助金具ｌＯを引き出して
構成されている。FIG. 1 is a perspective view showing one embodiment of the present invention, and the IC device 7 in the example shown in FIG. At the same time, a plurality of leads 9 are drawn out from each of the four side surfaces of this package body 8, and auxiliary fittings 1O are drawn out from both ends of each of the four side surfaces.
ここに、リード９は、パッケージ本体８の側面側からそ
の先端部に向けて、水平部９Ａ、垂直部９Ｂ及び水平部
９Ｃを順次に設けて構成されている。また、補助金具１
０は、パッケージ本体８の側面側からその先端部に向け
て、水平部１０Ａ、垂直部１０Ｂ、水平部１０Ｃ、フッ
ク部１０Ｄ及び先尖部１０Ｅを順次に設けて構成されて
おり、その垂直部１０Ｂの長さは、リード９の垂直部９
Ｂと路間−長と成されている。尚、補助金具１０は、リ
ード９に比して、充分に強度の高い素材を使用すること
か好適である。Here, the lead 9 is constructed by sequentially providing a horizontal portion 9A, a vertical portion 9B, and a horizontal portion 9C from the side surface of the package body 8 toward its tip. In addition, auxiliary metal fittings 1
0 is constructed by sequentially providing a horizontal portion 10A, a vertical portion 10B, a horizontal portion 10C, a hook portion 10D, and a tip portion 10E from the side surface side of the package body 8 toward the tip thereof, and the vertical portion The length of 10B is the vertical part 9 of lead 9.
B and path length. It is preferable that the auxiliary fitting 10 be made of a material that is sufficiently stronger than the lead 9.
かかる第１図例のＩｃ装置７を、配線基板４に実装する
場合には、第２図に示すように、配線基板・４に補助金
具１０のフック部１０Ｄを圧入し得るフック部挿入孔１
１を形成しておき、このフック部挿入孔１１に補助金具
１０のフック部１０Ｄを挿入し、ＩＣ装置７を配線基板
４に保持させた後、リード先端の水平部９Ｃ及び補助金
具１０の先尖部１０Ｅをそれぞれ配線基板４の上面側及
び下面側において導体層（図示せず）に半田付けする。When the IC device 7 of the example shown in FIG. 1 is mounted on the wiring board 4, as shown in FIG.
1, insert the hook portion 10D of the auxiliary metal fitting 10 into the hook insertion hole 11, and after holding the IC device 7 on the wiring board 4, insert the horizontal portion 9C of the lead tip and the tip of the auxiliary metal fitting 10 The peaks 10E are soldered to conductor layers (not shown) on the upper and lower surfaces of the wiring board 4, respectively.
ここに、第１図例のＩＣ装置７の補助金具１０のフック
部１０Ｄを配線基板４のフック部挿入孔１１に挿入させ
た場合、リード９の先端の水平部９Ｃ及び補助金具１０
の水平部１０Ｃは、共に配線基板４の上面に衝止するこ
とになるので、この第１図例のＩＣ装置７においては、
リード９の垂直部９Ｂ及び補助金具１０の垂直部１０Ｂ
の長さがパッケージ本体８の高さを決定することになる
。Here, when the hook part 10D of the auxiliary metal fitting 10 of the IC device 7 of the example in FIG.
Since the horizontal portions 10C of both of them come into contact with the upper surface of the wiring board 4, in the IC device 7 of the example in FIG.
Vertical portion 9B of lead 9 and vertical portion 10B of auxiliary fitting 10
The length of will determine the height of the package body 8.
そこで、この第１図例のＩＣ装置７においては、これら
リード９の垂直部９Ｂ及び補助金具１０の垂直部１０Ｂ
の長さを充分にとり、これを配線基板４に実装した場合
、第２図に示すように、パッケージ本体８の下方の配線
基板４上に他の部品１２を実装できるように構成されて
いる。Therefore, in the IC device 7 of the example in FIG.
When a sufficient length is taken and this is mounted on the wiring board 4, the structure is such that other components 12 can be mounted on the wiring board 4 below the package body 8, as shown in FIG.
したがって、かかる第１図例のＩＣ装置７によれば、パ
ッケージ本体８の下方の配線基板４上に他の部品１２を
実装することができるので、配線基板４に対する実装部
品の実装密度を高めることができる。Therefore, according to the IC device 7 of the example in FIG. 1, other components 12 can be mounted on the wiring board 4 below the package main body 8, so that the mounting density of the mounted components on the wiring board 4 can be increased. Can be done.
また、かかる第１図例のＩＣ装置７によれば、パッケー
ジ本体８に補助金具１０を設けると共にこの補助金具１
０にフック部１０Ｄを設け、このフック部１０Ｄを配線
基板４のフック挿入孔１１に圧入することによって、こ
のＩＣ装Ｗ７を配線基板４に保持できるように構成され
ているので、リード９の先端の水平部９Ｃを半田付けす
るまでの間の取り扱い、例えば、クリーム半田用の高温
槽に入れるまでの間の移動か容易であり、かかる実装作
業における作業性を向上させることがてきる。Further, according to the IC device 7 of the example in FIG.
0 is provided with a hook portion 10D, and this hook portion 10D is press-fitted into the hook insertion hole 11 of the wiring board 4, so that the IC mounting W7 can be held on the wiring board 4. It is easy to handle the horizontal portion 9C until it is soldered, for example, to move it until it is placed in a high temperature bath for cream solder, and the workability in such mounting work can be improved.
また、かかる第１図例のＩＣ装置７によれば、リード９
の先端の水平部９Ｃを半田付けする際に、補助金具１０
の先端側の水平部１０Ｃ、フック部１０Ｄ又は先尖部１
０Ｅを配線基板４に半田付けすることができるので、配
線基板４に対する装着を強固にすることかでき、振動、
落下、衝撃を受けた場合に、リード９の半田付けが剥が
れ、接続不良か発生することを防止することができる。Further, according to the IC device 7 of the example in FIG.
When soldering the horizontal part 9C at the tip of the auxiliary metal fitting 10
Horizontal part 10C, hook part 10D or pointed part 1 on the distal end side of
Since the 0E can be soldered to the wiring board 4, it can be firmly attached to the wiring board 4, and vibrations and
It is possible to prevent the soldering of the leads 9 from peeling off and causing a connection failure in the event of a fall or impact.
次に、第３図〜第６図を参照して、本発明の他の実施例
につき説明する。Next, other embodiments of the present invention will be described with reference to FIGS. 3 to 6.
第３図は、本発明の他の実施例を示す斜視図であって、
この第３図例のＩＣ装置１３は、パッケージ本体１４の
対向する２個の側面からリード１５及び補助金具１６を
引き出して構成されている。ここに、リード１５は、パ
ッケージ本体１４の側面側からその先端部に向けて、水
平部１５Ａ及び垂直部１５Ｂを順次設けて構成されてお
り、垂直部１５Ｆ３は、その−上部及び下部をそれぞれ
幅広部１５ Ｉ３ 、及び幅狭部１５Ｂ２と成されてい
る。FIG. 3 is a perspective view showing another embodiment of the present invention,
The IC device 13 shown in FIG. 3 is constructed by pulling out leads 15 and auxiliary fittings 16 from two opposing sides of a package body 14. Here, the lead 15 is configured by sequentially providing a horizontal part 15A and a vertical part 15B from the side surface of the package body 14 toward its tip, and the vertical part 15F3 has a wide upper and lower part, respectively. portion 15 I3 and narrow portion 15B2.
また、補助金具１６も、パッケージ本体１４の側面側か
らその先端部に向けて、水平部１６Ａ及び垂直部１６Ｂ
を順次設けて構成されており、垂直部１６Ｂは、その上
部、中間部及び下端部をそれぞれ幅広部１６Ｂｌ、直線
状の傾斜部１７を有する傾斜形成部１６Ｂ２及び幅狭部
１６Ｆ３．． と成されている。ここに、補助金具１
６の垂直部１６［３の幅広部１６Ｂ１の長さは、リード
１５の幅広部１５Ｂ＋の長さと路間−長と成されている
。Further, the auxiliary fitting 16 also has a horizontal portion 16A and a vertical portion 16B, extending from the side surface of the package body 14 toward its tip.
The vertical portion 16B has a wide portion 16Bl, a slope forming portion 16B2 having a linear slope portion 17, and a narrow portion 16F3. ．． This has been accomplished. Here, auxiliary metal fittings 1
The length of the wide portion 16B1 of the vertical portion 16 [3 of the lead 15 is equal to the length of the wide portion 15B+ of the lead 15 and the distance between the leads 15.
かかる第３図例のＩＣ装置１３は、第４図に示すように
、リード１５及び補助金具１６をそれぞれ配線基板４に
設けられたリード挿入孔１８及び補助金具挿入孔１９に
挿入した後、これらリード１５の幅狭部１５Ｂ２．及び
補助金具１６の傾斜形成部１６Ｂ２又は幅狭部１６Ｂ３
を半田付けすることによって、これを配線基板４に実装
することができる。As shown in FIG. 4, the IC device 13 of the example in FIG. Narrow portion 15B2 of lead 15. and the slope forming part 16B2 or the narrow part 16B3 of the auxiliary fitting 16
This can be mounted on the wiring board 4 by soldering.
ここに、第５図に示すように、補助金具挿入孔１９の長
辺の長さＷは、第６図に示すように、補助金具１６の垂
直部１６Ｂの幅広部１６Ｂ１の幅をＷｌ、幅狭部１６Ｂ
３の幅をＷ３、パッケージ本体１４の下面と幅広部１６
Ｂ１の先端部との垂直方向の距離をｈｌ、傾斜形成部１
６Ｂ２の高さをｈ２、そして、設定したいパッケージ本
体１４の高さ、即ち、配線基板４とパッケージ本体の下
面との間隔をＨとすれば、
で決定することができる。また、補助金具挿入孔１９の
短辺の長さＴは、補助金具１６の厚みをｔ［ｍｍ］とす
れば、
Ｔ＝ｔ＋ｏ、２ ［ｍｍ］
程度とするのが好適である。Here, as shown in FIG. 5, the length W of the long side of the auxiliary fitting insertion hole 19 is the width Wl of the wide part 16B1 of the vertical part 16B of the auxiliary fitting 16, and the width Narrow part 16B
3 is W3, and the bottom surface of the package body 14 and the wide part 16
The vertical distance from the tip of B1 is hl, and the slope forming part 1
If the height of 6B2 is h2, and the desired height of the package body 14, that is, the distance between the wiring board 4 and the bottom surface of the package body is H, then it can be determined as follows. Further, the length T of the short side of the auxiliary fitting insertion hole 19 is preferably about 2 [mm], where T=t+o, where the thickness of the auxiliary fitting 16 is t [mm].
かかる本実施例によれば、リード１５の垂直部１５Ｂの
幅狭部１５Ｂ２及び補助金具１６の垂直部１６Ｂの傾斜
形成部１６Ｂ２を充分に長くすることで、第４図に示す
ように、パッケージ本体１４の下方の配線基板４上に他
の部品１２を実装することができるので、第１図例と同
様に配線基板４に対する実装部品の実装密度を高めるこ
とができる。この場合、配線基板４の補助金具挿入孔１
９の長辺の長さＷを必要に応じて決定することができる
ので、パッケージ本体１４の高さを必要に応じて設定す
ることができる。尚、第７図従来例のＩＣ装置１と同様
に、パッケージ本体１４の下面を配線基板４に近接、或
は密着して実装することもできる。According to this embodiment, by making the narrow portion 15B2 of the vertical portion 15B of the lead 15 and the slope forming portion 16B2 of the vertical portion 16B of the auxiliary fitting 16 sufficiently long, the package body can be formed as shown in FIG. Since other components 12 can be mounted on the wiring board 4 below the wiring board 14, the mounting density of the components on the wiring board 4 can be increased as in the example shown in FIG. In this case, the auxiliary fitting insertion hole 1 of the wiring board 4
Since the length W of the long side of the package 9 can be determined as necessary, the height of the package body 14 can be set as necessary. Note that, similarly to the conventional IC device 1 shown in FIG. 7, the lower surface of the package body 14 can be mounted close to or in close contact with the wiring board 4.
また、かかる第３図例のＩｃ装置１３によれは、補助金
具１６の垂直部１６Ｂを半田付けすることによって、第
１図例と同様にＩＣ装置１３の配線基板４への装着を強
固にすることができる。In addition, in the case of the IC device 13 in the example in FIG. 3, the vertical portion 16B of the auxiliary metal fitting 16 is soldered to securely attach the IC device 13 to the wiring board 4 as in the example in FIG. be able to.
尚、上述の第１図例及び第３図例のＩＣ装置７及び１３
においては、補助金具１０及び１６を設けるようにした
場合につき述べたが、この代わりに、リード９及び１５
の数本をそれぞれ補助金具１０及び１６と同一形状に形
成し、これらを補助金具１０及び１６と同様に機能させ
るようにしても良い。Incidentally, the IC devices 7 and 13 in the above-mentioned example in FIG. 1 and example in FIG.
, the case where the auxiliary fittings 10 and 16 are provided is described, but instead of this, the leads 9 and 15 are provided.
It is also possible to form several of them in the same shape as the auxiliary metal fittings 10 and 16, respectively, and to make them function in the same way as the auxiliary metal fittings 10 and 16.
また、上述の第１図例及び第３図例のＩｃ装置７及び１
３においては、補助金具１０及び１６の先端を半田付け
することによって、その配線基板４への装着を強固にす
るように構成したか、この代わりに、補助金具ｌＯ及び
１６の先端をかしめるようにしても良い。Furthermore, the IC devices 7 and 1 of the above-mentioned example in FIG. 1 and example in FIG.
In No. 3, the tips of the auxiliary fittings 10 and 16 are soldered to firmly attach them to the wiring board 4, or alternatively, the tips of the auxiliary fittings 10 and 16 are caulked. You can also do it.
［発明の効果］
本発明によれば、リードの垂直部を充分に長くし、パッ
ケージ本体の下方に他の部品を実装てきるように構成さ
れているので、配線基板に対する実装部品の実装密度を
高めることができ、ＩＣ装置を備える電子機器の小型化
を図ることができるという効果がある。[Effects of the Invention] According to the present invention, since the vertical portion of the lead is made sufficiently long and other components can be mounted below the package body, the mounting density of the mounted components on the wiring board can be reduced. This has the effect that it is possible to increase the size of the IC device, and to downsize electronic equipment including the IC device.
尚、パッケージ本体から補助金具を引き出し、その先端
を配線基板に固定する構成とするときは、配線基板に対
する装着を強固にすることができ、振動、落下、衝撃を
受けた場合に、リードの半田付けが剥がれ、接続不良が
発生ずることを防止することかできる。In addition, when the auxiliary metal fitting is pulled out from the package body and its tip is fixed to the wiring board, the attachment to the wiring board can be strengthened, and the solder of the leads can be removed in the event of vibration, dropping, or impact. This can prevent the adhesive from peeling off and causing poor connections.
第１図は本発明によるＩＣ装置の一実施例を示す斜視図
、第２図は本発明の一実施例を配線基板に実装した状態
を示す側面図、第３図は本発明の他の実施例を示す斜視
図、第４図は本発明の他の実施例を配線基板に実装した
状態を示す側面図、第５図は本発明の他の実施例を実装
する配線基板を示す部分平面図、第６図は本発明の他の
実施例で使用する補助金具を示す斜視図、第７図は従来
のＩＣ装置の一例を示す斜視図、第８図は第７図例のＩ
Ｃ装置を配線基板に実装した状態を示す側面図である。
７．１３・・・・・ＩＣ装置
８．１４・・・・・パッケージ本体
９．１５・・・・・・リード
９Ｂ、１５Ｂ・・・垂直部
１０．１６・・・・・・補助金具FIG. 1 is a perspective view showing an embodiment of an IC device according to the present invention, FIG. 2 is a side view showing an embodiment of the present invention mounted on a wiring board, and FIG. 3 is a perspective view showing an embodiment of an IC device according to the present invention. FIG. 4 is a side view showing another embodiment of the present invention mounted on a wiring board; FIG. 5 is a partial plan view showing a wiring board on which another embodiment of the invention is mounted. , FIG. 6 is a perspective view showing an auxiliary fitting used in another embodiment of the present invention, FIG. 7 is a perspective view showing an example of a conventional IC device, and FIG. 8 is a perspective view showing an example of the conventional IC device.
FIG. 3 is a side view showing a state in which the C device is mounted on a wiring board. 7.13...IC device 8.14...Package body 9.15...Leads 9B, 15B...Vertical part 10.16...Auxiliary metal fittings
Claims (1)
共に該複数のリードに垂直部を設けてなる半導体集積回
路装置において、 上記リードの上記垂直部を充分に長くして上記パッケー
ジ本体の下方の配線基板上に他の部品を実装できるよう
にしたことを特徴とする半導体集積回路装置。[Claims] In a semiconductor integrated circuit device in which a plurality of leads are drawn out from a side surface of a package body and vertical portions are provided on the plurality of leads, the vertical portions of the leads are sufficiently long to extend the vertical portions of the package body. A semiconductor integrated circuit device characterized in that other components can be mounted on a lower wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6280388A JPH01235360A (en) | 1988-03-16 | 1988-03-16 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6280388A JPH01235360A (en) | 1988-03-16 | 1988-03-16 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01235360A true JPH01235360A (en) | 1989-09-20 |
Family
ID=13210861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6280388A Pending JPH01235360A (en) | 1988-03-16 | 1988-03-16 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01235360A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03232292A (en) * | 1989-08-08 | 1991-10-16 | Nec Corp | Circuit board |
| JPH0521682A (en) * | 1991-07-11 | 1993-01-29 | Mitsubishi Electric Corp | Integrated circuit |
| JP2007266130A (en) * | 2006-03-27 | 2007-10-11 | Fujitsu Ltd | Optical module cage mounting structure |
| JP2010016289A (en) * | 2008-07-07 | 2010-01-21 | Mitsubishi Electric Corp | Semiconductor package and semiconductor device |
| WO2014171340A1 (en) * | 2013-04-15 | 2014-10-23 | 矢崎総業株式会社 | Electronic component and electronic component attachment structure |
| CN105051994A (en) * | 2013-03-15 | 2015-11-11 | 矢崎总业株式会社 | Electronic-component assembly structure and junction box |
| CN105144519A (en) * | 2013-03-15 | 2015-12-09 | 矢崎总业株式会社 | Electronic-component assembly structure, junction box and electronic component |
| CN105165132A (en) * | 2013-04-15 | 2015-12-16 | 矢崎总业株式会社 | Electronic component attachment structure and electrical junction box |
| EP4261881A1 (en) * | 2022-04-11 | 2023-10-18 | Infineon Technologies Austria AG | Semiconductor package comprising an external lead with a barb portion and method of fabricating the same |
-
1988
- 1988-03-16 JP JP6280388A patent/JPH01235360A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03232292A (en) * | 1989-08-08 | 1991-10-16 | Nec Corp | Circuit board |
| JPH0521682A (en) * | 1991-07-11 | 1993-01-29 | Mitsubishi Electric Corp | Integrated circuit |
| JP2007266130A (en) * | 2006-03-27 | 2007-10-11 | Fujitsu Ltd | Optical module cage mounting structure |
| JP2010016289A (en) * | 2008-07-07 | 2010-01-21 | Mitsubishi Electric Corp | Semiconductor package and semiconductor device |
| CN105051994A (en) * | 2013-03-15 | 2015-11-11 | 矢崎总业株式会社 | Electronic-component assembly structure and junction box |
| CN105144519A (en) * | 2013-03-15 | 2015-12-09 | 矢崎总业株式会社 | Electronic-component assembly structure, junction box and electronic component |
| JP2014207821A (en) * | 2013-04-15 | 2014-10-30 | 矢崎総業株式会社 | Electronic component and assembly structure of electronic component |
| WO2014171340A1 (en) * | 2013-04-15 | 2014-10-23 | 矢崎総業株式会社 | Electronic component and electronic component attachment structure |
| CN105122564A (en) * | 2013-04-15 | 2015-12-02 | 矢崎总业株式会社 | Electronic component and electronic component attachment structure |
| CN105165132A (en) * | 2013-04-15 | 2015-12-16 | 矢崎总业株式会社 | Electronic component attachment structure and electrical junction box |
| US9805892B2 (en) | 2013-04-15 | 2017-10-31 | Yazaki Corporation | Electronic component and electronic component assembly structure |
| CN105165132B (en) * | 2013-04-15 | 2017-11-28 | 矢崎总业株式会社 | The assembling structure and electric circuit connection container of electronic component |
| EP4261881A1 (en) * | 2022-04-11 | 2023-10-18 | Infineon Technologies Austria AG | Semiconductor package comprising an external lead with a barb portion and method of fabricating the same |
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