JPH01216759A - Method and device for slice machining - Google Patents
Method and device for slice machiningInfo
- Publication number
- JPH01216759A JPH01216759A JP4286288A JP4286288A JPH01216759A JP H01216759 A JPH01216759 A JP H01216759A JP 4286288 A JP4286288 A JP 4286288A JP 4286288 A JP4286288 A JP 4286288A JP H01216759 A JPH01216759 A JP H01216759A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- wire
- oil
- cleaning
- slicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 17
- 238000003754 machining Methods 0.000 title abstract 5
- 238000005520 cutting process Methods 0.000 claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims description 37
- 238000005406 washing Methods 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 8
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000006061 abrasive grain Substances 0.000 abstract description 19
- 230000010355 oscillation Effects 0.000 abstract description 7
- 239000003921 oil Substances 0.000 description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、例えばシリコン鋳塊からウェハ等を切り出
すのに使用されるスライス加工法およびその装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a slicing method and apparatus used for cutting wafers or the like from a silicon ingot, for example.
（従来の技術〕
シリコン、水晶、フェライト結晶あるいはガラス等の脆
性材料の精密スライス加工には、線刃となるワイヤと砥
液とにより切削を行うマルチワイヤソーマシンが多（用
いられる。このスライス加工装置は、切削ヘッド、押上
手段を持つ加工テーブル、砥液ノズルおよび洗油ノズル
を収容するスライスルーム内で被加工物のスライス加工
を行う。(Prior Art) For precision slicing of brittle materials such as silicon, quartz, ferrite crystal, or glass, a multi-wire saw machine that performs cutting using a wire serving as a wire blade and an abrasive liquid is often used. The workpiece is sliced in a slicing room that accommodates a cutting head, a processing table with push-up means, an abrasive liquid nozzle, and an oil washing nozzle.
この装置を用いたスライス加工の方法を簡単に説明する
。The slicing method using this device will be briefly explained.
第２図は上記加工装置の切削ヘッドの概略を示した斜視
図である０図にみるように、シリコン等の被加工物ｌは
セラミックス板、ガラス板あるいは黒鉛板等からなる緩
衝用支持台２上に固定され、支持台２は第３図に示す固
定台７上に固定され、固定台７は押上手段８０を有する
加工テーブル８に設置されている。一方、硬鋼線、ピア
ノ線等のワイヤ３は、線材送出手段（図示せず）から線
材巻取手段（図示せず）に向かう間で、三角形の各頂点
に設定された３本の溝付ローラ４，４．４間を掛渡すよ
うに幾重にも巻回されて切削ヘッド３０を形成している
。スライス加工の際は、砥粒と切削液を混合した砥液が
被加工物上方より滴下されながら、被加工物１が加工テ
ーブル８により矢印Ａ方向に押上げられ、ワイヤ３の往
復動および、ワイヤ３と砥粒とのラフビッグ作用により
切削される。FIG. 2 is a perspective view schematically showing the cutting head of the processing device. As shown in FIG. The support base 2 is fixed on a fixed base 7 shown in FIG. 3, and the fixed base 7 is installed on a processing table 8 having a pushing up means 80. On the other hand, the wire 3, such as hard steel wire or piano wire, has three grooves set at each vertex of the triangle between the wire feeding means (not shown) and the wire winding means (not shown). The cutting head 30 is formed by being wound many times so as to span between the rollers 4, 4.4. During slicing, the workpiece 1 is pushed up in the direction of arrow A by the processing table 8 while an abrasive liquid containing abrasive grains and cutting fluid is dripped from above the workpiece, and the wire 3 reciprocates and It is cut by the rough big action of the wire 3 and the abrasive grains.
スライス加工後の被加工物の取出しは、従来は以下のよ
うに行われていた。即ち、第３図に示す支持台２上の被
加工物ｌを切削した後さらに支持台２の途中までワイヤ
３で切り込む、この状態で被加工物ｌに対し上方より洗
油をシャワー状に噴きつけ被加工物１の切り口に付着し
た砥粒を洗い流した後、加工テーブル８を下降させてワ
イヤ３を引き抜きスライス製品を得る。あるいは、スラ
・イス加工終了後に切削ヘッド３０のワイヤ全列を切断
してスライス製品を取出す。Conventionally, the workpiece was taken out after slicing in the following manner. That is, after cutting the workpiece l on the support stand 2 shown in FIG. 3, the wire 3 is further cut halfway into the support stand 2, and in this state, cleaning oil is sprayed from above onto the workpiece l in the form of a shower. After washing off the abrasive grains adhering to the cut end of the soaked workpiece 1, the processing table 8 is lowered and the wire 3 is pulled out to obtain a sliced product. Alternatively, after the slicing process is completed, all the wire rows of the cutting head 30 are cut to take out the sliced product.
しかしながら、被加工物に付着した砥粒はスライス面に
強くこびり着いており、しかも切り口の幅が極めて狭い
（通常１５０〜３００μｍ）ため、従来の如く洗油を噴
きつける程度では充分に除去され得ない、砥粒が付着し
たままの被加工物からワイヤを引抜けば、被加工物スラ
イス面に疵が付き製品不良になるという問題を生じる。However, the abrasive grains attached to the workpiece are strongly stuck to the sliced surface, and the width of the cut is extremely narrow (usually 150 to 300 μm), so spraying cleaning oil as in the past is not enough to remove them. If the wire is pulled out from the workpiece with the abrasive grains still attached, the problem arises that the sliced surface of the workpiece will be scratched and the product will be defective.
その原因は、ワイヤ引抜き時にスライス面に沿いワイヤ
を通線させると、砥粒が残留した部分でワイヤの通行が
停滞しかつ残留砥粒と共にワイヤが再度切削を行ってし
まうからである。The reason for this is that if the wire is passed along the slicing surface when drawing the wire, the passage of the wire will stagnate in areas where abrasive grains remain, and the wire will cut again together with the residual abrasive grains.
こびり着いた砥粒は噴布による洗浄時間を長くしても落
ちないし、ジェット噴射によっても狭い切り口のため充
分に落ちることはない。The stuck abrasive grains do not come off even if the cleaning time with spray cloth is prolonged, and even jet spray does not remove them sufficiently due to the narrow cut.
また、切削ヘッドの平行するワイヤ全列を切断して製品
を取出す場合には、スライス面の疵付きは生じないが、
スライス加工毎にローラにワイヤを巻回して取替えねば
ならず、多大な時間と労力を浪費するという問題がある
。In addition, when the cutting head cuts all the parallel wire rows to take out the product, there will be no scratches on the sliced surface, but
There is a problem in that the wire must be wound around the roller and replaced every time slicing is performed, which wastes a great deal of time and effort.
本発明は、これらの問題を全て解決し、被加工物のスラ
イス面にこびり着いた砥粒を残りなく洗い落としてスラ
イス面に疵を付けずに面精度の高いスライス製１品を取
り出すとともに、スライス加工後から製品取出しまでの
作業時間を短縮するスライス加工法およびその装置を提
供することを目的とする。The present invention solves all of these problems, removes all the abrasive grains stuck to the sliced surface of the workpiece, removes any scratches on the sliced surface, and takes out a sliced product with high surface precision. An object of the present invention is to provide a slicing method and an apparatus for shortening the working time from slicing to product removal.
本発明のスライス加工法は、被加工物をその底部まで完
全にスライスし終えた段階で被加工物の少なくとも底部
を洗油に浸漬させ、この状態で超音波洗浄を行ってから
、もしくは超音波洗浄を行いながらワイヤを被加工物よ
り引抜くものである。In the slicing method of the present invention, at the stage where the workpiece has been completely sliced to the bottom, at least the bottom of the workpiece is immersed in cleaning oil, and in this state, ultrasonic cleaning is performed, or ultrasonic The wire is pulled out from the workpiece while being cleaned.
また、本発明の装置は、マルチワイヤソーと呼ばれるス
ライス加工装置において、切削ヘッドと加工テーブルと
を洗油容器に収容し、洗油容器には洗油注入手段と゛超
音波発振装置とを具備せしめたものである。Further, the device of the present invention is a slicing device called a multi-wire saw, in which a cutting head and a processing table are housed in a washing oil container, and the washing oil container is equipped with washing oil injection means and an ultrasonic oscillation device. It is something.
本発明のスライス加工法によれば、スライス後の被加工
物を洗油に浸漬した状態で超音波により洗油を振動させ
るため、スライス面に洗油が充分に浸透するとともに超
音波振動によりスライス面の砥粒を洗い落とすことがで
きる。従って、疵の無い面精度の高いスライス製品を得
ることができる。更に、従来、製品の洗浄と取出しに多
くの時間を裂いていたが、この方法によれば、被加工物
を洗油に浸漬して超音波振動をかけるだけで充分な洗浄
力を発揮し、取出しも従来はど時間をかけて慎重に行わ
れな（でも良いので、作業時間の短縮を実現することが
できる。According to the slicing method of the present invention, the cleaning oil is vibrated by ultrasonic waves while the workpiece after slicing is immersed in the cleaning oil, so that the cleaning oil sufficiently penetrates into the sliced surface and the slices are sliced by ultrasonic vibration. The abrasive grains on the surface can be washed off. Therefore, it is possible to obtain a sliced product with high surface precision and no defects. Furthermore, in the past, it took a lot of time to clean and take out the product, but with this method, just by immersing the workpiece in cleaning oil and applying ultrasonic vibration, sufficient cleaning power can be achieved. Conventionally, taking out the product requires a lot of time and care, but it is not necessary to do so, so the work time can be shortened.
また、本発明のワイヤソーマシンによれば、スライス終
了後、洗油容器内に洗油を溜めることによりスライス後
の被加工物が洗油に浸漬される。Further, according to the wire saw machine of the present invention, after slicing, the workpiece after slicing is immersed in the cleaning oil by storing the cleaning oil in the cleaning oil container.
その状態で、超音波発振装置を作動させて被加工物に対
し超音波洗浄を打えば、被加工物は、浸漬した洗油がス
ライス面に浸透するとともに振動によりスライス面の付
着砥粒が残りなく洗い流される、従って、疵の無い面精
度の高いスライス製品を得ることができる。更に、従来
の如く被加工物に対して長時間洗油を噴きかける必要が
なく、洗油溜池時間と短時間の超音波発振時間だけで充
分な洗浄効果を示し、製品取出しを従来より円滑に行う
ことができるため、作業時間を大幅に短縮することがで
きる。In this state, if the ultrasonic oscillator is activated and the workpiece is subjected to ultrasonic cleaning, the soaked cleaning oil will penetrate into the sliced surface of the workpiece, and the vibration will leave the abrasive grains attached to the sliced surface. Therefore, sliced products with high surface precision and no scratches can be obtained. Furthermore, unlike conventional methods, there is no need to spray cleaning oil onto the workpiece for a long time, and the cleaning effect is sufficient with just the cleaning oil reservoir time and short ultrasonic oscillation time, making product removal smoother than before. This can significantly reduce work time.
以下に、本発明のワイヤソーマシンとそれぞれ用いたス
ライス加工法を実施例に基づき詳述する。Below, the wire saw machine of the present invention and the slicing method used therein will be described in detail based on examples.
第１図は、本発明にかかるワイヤソーマシンの一実施例
を示す断面図である。この図にみるように、被加工物１
のスライス加工を行うためのスライスルーム下室内には
、スライス加工を行う切削ヘッド３０、押上手段８０を
持つ加工テーブル８、砥粒ノズル５および洗油注入手段
である洗油ノズル６が収容されている。それらの内、切
削ヘッド３０は、ワイヤ３が線材送出手段（図示せず）
から線材巻取手段（図示せず）に向かう間で、三角形の
各頂点に設置された３本のワイヤ溝付ローラ４．４．４
間を掛渡すように幾重に巻回されてなる。スライスルー
ムｌＯはまた、仕切板９にて上下２室に分割され、洗油
落し口９０を閉じることによって、洗油容器である上室
に洗油６０を溜める仕組になっている。また、仕切板９
上方の切削ヘッド３０との間には、溜池後の洗浄時に作
動する超音波発振袋′ｌ１）１が備わっている１図中、
８１はスライスルーム下室に収容された押圧手段８０の
駆動モータ、８２はギヤボックスである。FIG. 1 is a sectional view showing an embodiment of a wire saw machine according to the present invention. As shown in this figure, workpiece 1
A cutting head 30 for slicing, a processing table 8 having a push-up means 80, an abrasive grain nozzle 5, and a washing oil nozzle 6 serving as a washing oil injection means are housed in the lower chamber of the slicing room for performing slicing processing. There is. Among them, the cutting head 30 has a wire 3 connected to a wire feeding means (not shown).
three wire grooved rollers 4.4.4 installed at each vertex of the triangle between the wire winding means (not shown);
It is wound in many layers so as to span the space between them. The slice room 10 is also divided into two upper and lower chambers by a partition plate 9, and by closing a washing oil drain port 90, washing oil 60 is stored in the upper chamber, which is a washing oil container. In addition, the partition plate 9
An ultrasonic oscillation bag 'l1) 1 is provided between the upper cutting head 30 and the cleaning chamber after cleaning.
81 is a drive motor for the pressing means 80 housed in the lower chamber of the slice room, and 82 is a gear box.
次に、上記ワイヤソーマシンを用いた本発明のスライス
加工法の一実施例を説明する。Next, an embodiment of the slicing method of the present invention using the above wire saw machine will be described.
第り図にみるように、シリコン等の被加工物１はガラス
板からなる緩衝用支持台２に固定され、支持台２は固定
台７に固定される。固定台７は押上手段８０を有する加
工テーブル８に設置される。As shown in FIG. 2, a workpiece 1 made of silicon or the like is fixed to a buffer support 2 made of a glass plate, and the support 2 is fixed to a fixing base 7. The fixed base 7 is installed on a processing table 8 having a push-up means 80.
スライスの際は、砥粒と切削液を混合した砥液が砥液ノ
ズル５より滴下された状態で、被加工物ｌを載せた加工
テーブル８を矢印入方向に押上げる。During slicing, the processing table 8 on which the workpiece 1 is placed is pushed up in the direction indicated by the arrow, with an abrasive liquid that is a mixture of abrasive grains and cutting liquid being dripped from the abrasive liquid nozzle 5.
そして被加工物１に対して、多数の緊張されたワイヤ３
を往復動させ、ワイヤ３と砥粒とのラフピッグ作用によ
りスライスを行う、被加工物ｌがその底部まで完全にス
ライスし終えたなら、洗油ノズル６より洗油を噴出させ
る。しかる後、洗油落し口９０を閉じスライスルーム１
０の上室内に洗油６０を溜めて被加工物１の全部もしく
は一部を浸漬させる０次いで、超音波発振装置１）を作
動させ溜った洗油６０に超音波振動を与える。その後、
加工テーブル８を矢印Ｂ方向に降下させてワイヤ３を被
加工物ｌから引抜く、この時、超音波振動を与えながら
引抜いてもよい。A large number of tensioned wires 3 are placed against the workpiece 1.
is reciprocated, and slicing is performed by the rough pig action of the wire 3 and the abrasive grains. When the workpiece l has been completely sliced to the bottom, cleaning oil is jetted from the oil cleaning nozzle 6. After that, close the washing oil drain port 90 and return to slice room 1.
Washing oil 60 is stored in the upper chamber of the washing machine to immerse all or a part of the workpiece 1. Next, the ultrasonic oscillator 1) is activated to apply ultrasonic vibrations to the washing oil 60 that has collected. after that,
The processing table 8 is lowered in the direction of arrow B to pull out the wire 3 from the workpiece 1. At this time, the wire 3 may be pulled out while applying ultrasonic vibration.
上記例に基づき特定条件でスライス加工を行った本発明
実施結果を、従来のスライス加工法を実施した場合と比
較して以下に述べる。The results of implementing the present invention in which slicing was performed under specific conditions based on the above example will be described below in comparison with the case where a conventional slicing method was implemented.
被加工物は全て１００１角シリコン鋳塊を用い、３００
枚を同時にスライスするものとした。使用ワイヤは０．
１８ｗφのピアノ線、砥粒はＳＩＣの’１０００ｍ、洗
油としては灯油をそれぞれ使用した。また、超音波発振
装置は出力１．２ ｋ ｗ、周波数２８ｋＨ２のものを
用いた。All workpieces are 1001 square silicon ingots, and 300
The slices were to be sliced at the same time. The wire used is 0.
Piano wire of 18wφ, SIC's 1000m abrasive grains, and kerosene were used as cleaning oil. Further, the ultrasonic oscillator used had an output of 1.2 kW and a frequency of 28 kHz.
スライス終了後は、従来の比較例がシャワーによる洗浄
６０分の後、速度１２ｆｉ／分でワイヤ引上げを行うも
のとした１本発明例はシャワー洗浄５分と超音波洗浄２
０分と継続して行った後、速度１２■／分と２０謹／分
とでワイヤ引上げを行うものとした。After slicing, in the conventional comparative example, the wire was pulled up at a speed of 12 fi/min after 60 minutes of shower cleaning; in the present invention, 5 minutes of shower cleaning and 2 ultrasonic cleanings were performed.
After the wire was pulled up continuously for 0 minutes, the wire was pulled up at a speed of 12 cm/min and 20 min/min.
結果は、スライス加工後のウェハの班付き不良率が比較
例で２３％、本発明例ではワイヤ引上速度が１２ｆｉＺ
分、２０−７分のいずれの場合も２％だった。また、ス
ライス加工終了後の洗浄引上げの全てに費やした時間は
、比較例が洗浄６０分＋ワイヤ引上９分だったのに対し
、本発明例ではシャワー洗浄５介十超音波洗浄２０分十
ワイヤ引上５〜９分であり、３５〜３９分の作業時間短
縮を図ることができた。The results show that the defective rate of wafers with spots after slicing was 23% in the comparative example, and the wire pulling speed was 12fiZ in the inventive example.
The rate was 2% for both minutes and 20-7 minutes. In addition, the time spent on cleaning and pulling up after slicing was 60 minutes for cleaning + 9 minutes for pulling up the wire in the comparative example, whereas in the example of the present invention, it took 5 minutes for shower cleaning and 20 minutes for ultrasonic cleaning. It took 5 to 9 minutes to pull up the wire, reducing the working time by 35 to 39 minutes.
本発明のスライス加工法において、前記実施例ではシャ
ワー洗浄でほとんどの砥粒を洗い流したのちに洗油落し
口を塞いで洗油を溜め超音波洗浄を行っていたが、シャ
ワー洗浄をしなから洗油を溜めたり、シャワー洗浄をし
ないで直接洗油溜めを行ったりしても良い、これらの手
順によっては、砥粒ノズルと洗油ノズルを共有のノズル
にしても構わない、シャワー洗浄を行う場合は、超音波
洗浄の際、被加工物１の少なくとも底部の半分が洗油に
浸漬されていればよい。In the slicing method of the present invention, in the above embodiment, most of the abrasive grains were washed away by shower cleaning, and then the cleaning oil drain hole was closed to collect cleaning oil and ultrasonic cleaning was performed. You can collect the cleaning oil or use the cleaning oil reservoir directly without shower cleaning.Depending on these procedures, it is okay to share the abrasive nozzle and the oil cleaning nozzle.Perform shower cleaning. In this case, it is sufficient that at least half of the bottom of the workpiece 1 is immersed in the cleaning oil during ultrasonic cleaning.
また本発明において、被加工物、砥粒、ワイヤ、洗油等
の種類が実施例に限定されないことは言うまでもない。Further, in the present invention, it goes without saying that the types of workpieces, abrasive grains, wires, cleaning oil, etc. are not limited to the examples.
本発明のスライス加工法および装置によれば、疵の無い
面精度の高いスライス製品を得ることができる上に、従
来に比べ製品の取出しを円滑に行うことができるため、
作業時間の大幅な短縮を実現し得る。According to the slicing method and apparatus of the present invention, it is possible to obtain sliced products with high surface precision without defects, and the product can be taken out more smoothly than in the past.
A significant reduction in work time can be achieved.
第１図は本発明の装置の一実施例を表わす断面図、第２
図は一般的なワイヤソーマシンの切削ヘッドの概略を示
す斜視図、第３図は一般的なスライス加工法を説明する
模式図である。
図中、１：被加工物、３：ワイヤ、５：砥液ノズル、６
：洗油ノズル、８：加工テーブル、９：仕切板、ｌＯニ
スライスルーム、ｌｌ：超音波発振装置、３０・・・切
削ヘッド、６０：洗油、８０：押上手段、９０；洗油落
し口。
出 願 人 大阪チタニウム製造株式会社第 １
図
第３図FIG. 1 is a sectional view showing one embodiment of the device of the present invention, and FIG.
The figure is a perspective view schematically showing a cutting head of a general wire saw machine, and FIG. 3 is a schematic diagram illustrating a general slicing method. In the figure, 1: Workpiece, 3: Wire, 5: Abrasive liquid nozzle, 6
: Oil washing nozzle, 8: Processing table, 9: Partition plate, lO nisi rice room, ll: Ultrasonic oscillator, 30... Cutting head, 60: Oil washing, 80: Push-up means, 90; Oil washing port . Applicant: Osaka Titanium Manufacturing Co., Ltd. No. 1
Figure 3
Claims (2)
張された平行ワイヤでスライスを行った後、ワイヤを被
加工物から引抜き製品を取出すスライス加工法において
、被加工物をその底部まで完全にスライスし終えた段階
で被加工物の少なくとも底部を洗油に浸漬させ、この状
態で超音波洗浄を行ってから、もしくは超音波洗浄を行
いながらワイヤを被加工物より引抜くことを特徴とする
スライス加工法。(1) In the slicing method, in which the workpiece is sliced with a large number of tensioned parallel wires while applying an abrasive liquid, the wires are pulled out from the workpiece to remove the product. When the workpiece has been completely sliced, immerse at least the bottom of the workpiece in cleaning oil, perform ultrasonic cleaning in this state, or pull out the wire from the workpiece while performing ultrasonic cleaning. Characteristic slicing method.
すように切削用ワイヤが幾重に巻回されてなる切削ヘッ
ドと、その下方にあって押上手段を持つ被加工物加工テ
ーブルとを洗油容器内に収容し、該洗油容器には洗油注
入手段と、超音波発振装置とを具備せしめたことを特徴
とするスライス加工装置。(2) A cutting head consisting of a cutting wire wound several times so as to span three rollers installed at each vertex of a triangle, and a workpiece processing table located below the head and having a pushing means. 1. A slicing device, characterized in that the slicing device is housed in a washing oil container, and the washing oil container is equipped with washing oil injection means and an ultrasonic oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4286288A JPH01216759A (en) | 1988-02-24 | 1988-02-24 | Method and device for slice machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4286288A JPH01216759A (en) | 1988-02-24 | 1988-02-24 | Method and device for slice machining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01216759A true JPH01216759A (en) | 1989-08-30 |
Family
ID=12647842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4286288A Pending JPH01216759A (en) | 1988-02-24 | 1988-02-24 | Method and device for slice machining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01216759A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03111104A (en) * | 1989-04-21 | 1991-05-10 | M Setetsuku Kk | Ingot cutting method |
| WO2013024451A3 (en) * | 2011-08-18 | 2013-04-11 | Memc Electronic Materials S.P.A. | Methods and systems for removing contamination from a wire of a saw |
| CN103128865A (en) * | 2011-11-29 | 2013-06-05 | 浙江昱辉阳光能源有限公司 | Silicon wafer cutting method |
| JP2016155197A (en) * | 2015-02-25 | 2016-09-01 | コニカミノルタ株式会社 | Wire saw and cutting method |
| EP3292968A1 (en) * | 2016-09-13 | 2018-03-14 | AUO Crystal Corporation | Wire saw apparatus, a method of sawing an object, and a method of producing etched wafers |
-
1988
- 1988-02-24 JP JP4286288A patent/JPH01216759A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03111104A (en) * | 1989-04-21 | 1991-05-10 | M Setetsuku Kk | Ingot cutting method |
| WO2013024451A3 (en) * | 2011-08-18 | 2013-04-11 | Memc Electronic Materials S.P.A. | Methods and systems for removing contamination from a wire of a saw |
| CN103732332A (en) * | 2011-08-18 | 2014-04-16 | Memc电子材料有限公司 | Methods and systems for removing contamination from a wire of a saw |
| CN103128865A (en) * | 2011-11-29 | 2013-06-05 | 浙江昱辉阳光能源有限公司 | Silicon wafer cutting method |
| JP2016155197A (en) * | 2015-02-25 | 2016-09-01 | コニカミノルタ株式会社 | Wire saw and cutting method |
| EP3292968A1 (en) * | 2016-09-13 | 2018-03-14 | AUO Crystal Corporation | Wire saw apparatus, a method of sawing an object, and a method of producing etched wafers |
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