JPH01210989A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JPH01210989A JPH01210989A JP3523788A JP3523788A JPH01210989A JP H01210989 A JPH01210989 A JP H01210989A JP 3523788 A JP3523788 A JP 3523788A JP 3523788 A JP3523788 A JP 3523788A JP H01210989 A JPH01210989 A JP H01210989A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal display
- printed circuit
- display element
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 25
- 125000006850 spacer group Chemical group 0.000 claims abstract description 14
- 230000000694 effects Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は液晶表示装置に係り、特番こ液晶表示素子とプ
リント回路基板とを並置し、両者の接続端子間をフィル
ムコネクタで接続してなる平面実装形の液晶表示素子条
こ関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a liquid crystal display device, and is made by arranging a liquid crystal display element and a printed circuit board side by side, and connecting the connecting terminals of the two with a film connector. It relates to flat-mounted liquid crystal display elements.
従来の平面実装形の液晶表示装置は、第２図に示すよう
な構造よりなる。即ち、液晶表示素子１とプリント回路
基板２にフィルムコネクタ３を熱圧着して両者１．２の
接続端子間を接続してなる。A conventional flat-mounted liquid crystal display device has a structure as shown in FIG. That is, the film connector 3 is thermocompression bonded to the liquid crystal display element 1 and the printed circuit board 2, and the connection terminals 1.2 of the two are connected.
また液晶表示素子１とプリント回路基板２を筐体４番こ
両面テープ５等を用いて接着し℃なる。Further, the liquid crystal display element 1 and the printed circuit board 2 are bonded to the housing No. 4 using double-sided tape 5 or the like at a temperature of 0.degree.
なお、この種の装置として関連するものには、例えば特
開昭５９−１２４３２２号があげられる。Note that related devices of this type include, for example, Japanese Patent Application Laid-Open No. 124322/1983.
上記従来技術は、フィルムコネクタ３の接続信頼性の点
について配慮されておらず、熱膨張差（こより接続不良
が発生する問題があった。また液晶表示素子１及びプリ
ント回路基板２の固定も完全ではなく、両面チーブ５の
はがれ及び液晶表示素子１がクラックする問題があった
。The above conventional technology does not take into account the connection reliability of the film connector 3, and there is a problem that connection failure occurs due to the difference in thermal expansion.Also, the liquid crystal display element 1 and the printed circuit board 2 are not completely fixed. Instead, there was a problem that the double-sided chip 5 peeled off and the liquid crystal display element 1 cracked.
本発明の目的は、フィルムコネクタの接続信頼性及び機
械的強度の向上が図れる液晶表示装置を提供することに
ある。An object of the present invention is to provide a liquid crystal display device that can improve the connection reliability and mechanical strength of a film connector.
上記目的は、フィルムコネクタに対応した液晶表示素子
とプリント回路基板の両外側舎こそれぞれゴムスペーサ
を配置し、これらのゴムスペーサをフレームと筐体とで
圧縮固定することにより達成。The above objective is achieved by placing rubber spacers on both outer sides of the liquid crystal display element and printed circuit board that are compatible with the film connector, and compressing and fixing these rubber spacers between the frame and the housing.
される。be done.
フィルムコネクタと液晶表示素子及びプリント回路基板
の各端子とを電気的に接続している接続粒子にゴムスペ
ーサによって常に圧縮力を加えているので、電気的接続
信頼性が向上する。また液晶表示素子とプリント回路基
板とをゴムスペーサ（こよって２方向より固定している
ので、機械的ストレスを吸収でき、機械的強度が向上す
る。Since compressive force is constantly applied by the rubber spacer to the connecting particles that electrically connect the film connector and each terminal of the liquid crystal display element and the printed circuit board, the reliability of the electrical connection is improved. Furthermore, since the liquid crystal display element and the printed circuit board are fixed from two directions using rubber spacers, mechanical stress can be absorbed and mechanical strength can be improved.
以下、本発明の一実施例を第１図１こより説明する。な
お、第２図と同じまたは相当部材には同一番号を付して
説明する。液晶表示素子１とプリント回路基板２Ｉこフ
ィルムコネクタ３を熱圧着し℃両者１．２の接続端子間
を接続してなる。このようｆこフィルムコネクタ３を熱
圧着した液晶表示素子１とプリント回路基板２の園外１
１１１１１こゴムスペーサ６．７を配置し、コムスペー
サ６．７の外側ヨリフレーム８と筐体４で圧縮固定して
なる。Hereinafter, one embodiment of the present invention will be described with reference to FIG. 1. It should be noted that the same or equivalent members as in FIG. 2 will be described with the same reference numerals. A liquid crystal display element 1, a printed circuit board 2I, and a film connector 3 are bonded together by thermocompression, and connecting terminals at 1.2 DEG C. are connected. In this way, the outside 1 of the liquid crystal display element 1 and the printed circuit board 2 with the film connector 3 bonded by thermocompression.
A rubber spacer 6.7 is arranged and compressed and fixed between the frame 8 and the casing 4 on the outside of the com spacer 6.7.
このヨウ（こ、ゴムスペーサ６の圧縮力を常にフィルム
コネクタ３の圧着部に加えているので、フィルムコネク
タ３の電気的接続信頼性が向上する。Since the compressive force of the rubber spacer 6 is always applied to the crimp portion of the film connector 3, the reliability of the electrical connection of the film connector 3 is improved.
マタゴムスベーサ６．７ζこよって液晶表示素子ｌとプ
リント回路基板２を弾力性を持たせながら保持している
ので、機械的強度が同上する。Since the matago rubber baser 6.7ζ holds the liquid crystal display element 1 and the printed circuit board 2 with elasticity, the mechanical strength is the same as above.
不発明によれば、フィルムコネクタの圧着部に圧縮力を
加え、また液晶表示素子とプリント回路基板を弾力性を
持たせて固定してなるので、接続信頼性及び機械的強度
が向上する。According to the invention, compressive force is applied to the crimp portion of the film connector, and the liquid crystal display element and the printed circuit board are fixed with elasticity, thereby improving connection reliability and mechanical strength.
第１図は本発明の一実施例の断面図、第２図は従来例の
断面図である。
１・・液晶表示素子、 ２ プリント回路基板、３
・フィルムコネクタ、 ４・・・筐体、６．７・・
・ゴムスペーサ、 ８ フレーム。FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1...Liquid crystal display element, 2 Printed circuit board, 3
・Film connector, 4... Housing, 6.7...
・Rubber spacer, 8 frames.
Claims (1)
の接続端子間をフィルムコネクタで接続してなる液晶表
示装置において、フィルムコネクタに対応した液晶表示
素子とプリント回路基板の両外側にそれぞれゴムスペー
サを配置し、これらのゴムスペーサをフレームと筐体と
で圧縮固定してなることを特徴とする液晶表示装置。1. In a liquid crystal display device in which a liquid crystal display element and a printed circuit board are arranged side by side and the connecting terminals of the two are connected by a film connector, rubber is placed on both outer sides of the liquid crystal display element and the printed circuit board corresponding to the film connector. A liquid crystal display device characterized in that spacers are arranged and these rubber spacers are compressed and fixed between a frame and a housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3523788A JPH01210989A (en) | 1988-02-19 | 1988-02-19 | Liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3523788A JPH01210989A (en) | 1988-02-19 | 1988-02-19 | Liquid crystal display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01210989A true JPH01210989A (en) | 1989-08-24 |
Family
ID=12436235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3523788A Pending JPH01210989A (en) | 1988-02-19 | 1988-02-19 | Liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01210989A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001257350A (en) * | 2000-03-08 | 2001-09-21 | Semiconductor Energy Lab Co Ltd | Semiconductor device and its preparation method |
| US8873011B2 (en) | 2000-03-16 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method of manufacturing the same |
| US9048146B2 (en) | 2000-05-09 | 2015-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9099355B2 (en) | 2000-03-06 | 2015-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
-
1988
- 1988-02-19 JP JP3523788A patent/JPH01210989A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9099355B2 (en) | 2000-03-06 | 2015-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
| JP2001257350A (en) * | 2000-03-08 | 2001-09-21 | Semiconductor Energy Lab Co Ltd | Semiconductor device and its preparation method |
| US7414266B2 (en) | 2000-03-08 | 2008-08-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9059045B2 (en) | 2000-03-08 | 2015-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9368514B2 (en) | 2000-03-08 | 2016-06-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9786687B2 (en) | 2000-03-08 | 2017-10-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8873011B2 (en) | 2000-03-16 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method of manufacturing the same |
| US9298056B2 (en) | 2000-03-16 | 2016-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method of manufacturing the same |
| US9048146B2 (en) | 2000-05-09 | 2015-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9429807B2 (en) | 2000-05-09 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
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