JPH01205441A - Stage for apparatus for cutting and dividing semiconductor element wafer - Google Patents
Stage for apparatus for cutting and dividing semiconductor element waferInfo
- Publication number
- JPH01205441A JPH01205441A JP63029170A JP2917088A JPH01205441A JP H01205441 A JPH01205441 A JP H01205441A JP 63029170 A JP63029170 A JP 63029170A JP 2917088 A JP2917088 A JP 2917088A JP H01205441 A JPH01205441 A JP H01205441A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- vacuum
- wafer
- semiconductor element
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 235000012431 wafers Nutrition 0.000 claims description 34
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 4
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体ウェハーを切削分割する装置、特に半導
体素子ウェハー（以下ウエノ入−と呼、Ｓ：）を位置合
せし、切削分割（以下ダイシングと呼、３テ）する際に
ウェハーを真空吸着させるステージしこ関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an apparatus for cutting and dividing semiconductor wafers, particularly for aligning semiconductor element wafers (hereinafter referred to as wafers, S:) and performing cutting and dividing (hereinafter referred to as dicing). This involves a stage for vacuum suction of the wafer.
第２図（ａ）、（ｂ）は従来のウェハーをダイシングす
る装置用ステージの一例を示す断面図である。FIGS. 2(a) and 2(b) are cross-sectional views showing an example of a stage for a conventional wafer dicing apparatus.
第２図（ａ）に示すように、従来、半導体素子ウェハー
の切削分割装置７では、ウェハー１が粘着性シー１−２
に貼付られ、粘着固定リング治具９で固定されている。As shown in FIG. 2(a), in the conventional cutting and dividing apparatus 7 for semiconductor element wafers, the wafer 1 is separated by adhesive sheets 1-2.
and is fixed with an adhesive fixing ring jig 9.
このウェハー１はウェハー吸着用ステージ１３上に載せ
、位置決めされた後、真空孔４より真空吸引１４シてシ
ー１〜２の全面をステージ１３上に真空吸着し、その後
回転する砥石にてシー１へ２上のウェハー１にダイシン
グ１０が行われる。This wafer 1 is placed on a wafer adsorption stage 13, and after being positioned, the entire surfaces of the sheets 1 and 2 are vacuum-adsorbed onto the stage 13 by vacuum suction 14 from the vacuum hole 4, and then the sheets 1 and 2 are vacuum-adsorbed using a rotating grindstone. Dicing 10 is performed on the wafer 1 on the substrate 2.
ダイシング１０が完了した粘着性シー１−２上のウェハ
ー１は、ウェハー吸着用ステージ１３より真空吸引１４
を解除し、粘着固定リング治具９に保持したまま、第２
図（ｂ）に示すように離脱される。The wafer 1 on the adhesive sheet 1-2 after dicing 10 is vacuum-suctioned 14 from the wafer suction stage 13.
, and while holding it in the adhesive fixing ring jig 9,
It is separated as shown in Figure (b).
しかし、粘着性シート２はダイシング装置より離脱後、
時間の経過と共にダイシング１０が完了したウェハー１
の重さにより、たわみ、伸される状態１２になる。その
ために、ウェハー」からダイシングされて個々に分割さ
れた半導体素子チップ１１のエツジ１５が周囲の半導体
素子チップ１１のエツジ１５とが衝撃し合い、半導体素
子チップ］１にキズ、カケが発生する。However, after the adhesive sheet 2 is removed from the dicing device,
Wafer 1 on which dicing 10 has been completed over time
It is in state 12 where it is deflected and stretched due to the weight of. For this reason, the edges 15 of the semiconductor element chips 11 that have been diced from the wafer and are individually divided collide with the edges 15 of the surrounding semiconductor element chips 11, causing scratches and chips on the semiconductor element chips 1.
また、半導体素子チップ１１が半導体集積回路装置のパ
ッケージにダイボンディングされる製造過程までにさら
に半導体素子チップ１１のエツジ１５にキズ、カケが新
たに発生されるという欠点がある。Another disadvantage is that new scratches and chips are generated on the edges 15 of the semiconductor element chip 11 during the manufacturing process in which the semiconductor element chip 11 is die-bonded to the package of the semiconductor integrated circuit device.
本発明の目的は前記課題を解決した切削分割装置のステ
ージを提供することにある。An object of the present invention is to provide a stage for a cutting and dividing device that solves the above problems.
］二述した従来のウェハーのダイシング・ステージに対
し、本発明は切削分割装置のウェハー吸着用ステージに
、シートに貼付したウェハーを真空吸着したまま次工程
のダイシング工程に搬送を可能としたという相違点を有
する。] In contrast to the conventional wafer dicing stage mentioned above, the present invention has a difference in that the wafer attached to the sheet can be vacuum-adsorbed on the wafer suction stage of the cutting and dividing device and transported to the next dicing process. Has a point.
上記目的を達成するため、本発明の切削分割装置におい
ては、ウェハー吸着用ステージを装置本体から脱着可能
に二二ノ１〜化し、前記真空孔を真空源に接続する該ス
テージの接続部に、外部から操作される開閉弁を設けた
ものである。In order to achieve the above object, in the cutting and dividing apparatus of the present invention, the wafer suction stage is removably attached to the main body of the apparatus, and the connection part of the stage that connects the vacuum hole to the vacuum source has a It is equipped with an on-off valve that is operated from the outside.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図において、ウェハー吸着用ステージ３を切削分割
装置本体７と別体に構成し、該ステージ３の下面に凸状
の嵌合部３ａを設ける。一方、装置本体７の上面に凹状
の嵌合部７ａを設け、凸状嵌合部３ａを凹状嵌合部７ａ
に嵌合させてステージ３を装置本体７に脱着可能に装着
する。またステージ３及び装置本体７には位置決め用の
ピン８ａとピン孔８ｂとが設けられている。In FIG. 1, a wafer suction stage 3 is constructed separately from a cutting/dividing device main body 7, and a convex fitting portion 3a is provided on the lower surface of the stage 3. On the other hand, a concave fitting part 7a is provided on the upper surface of the device main body 7, and the convex fitting part 3a is connected to the concave fitting part 7a.
The stage 3 is removably attached to the apparatus main body 7 by fitting the stage 3 to the main body 7. Further, the stage 3 and the apparatus main body 7 are provided with positioning pins 8a and pin holes 8b.
また、ステージ３の」二面にはウェハー１を貼付したシ
ート２の全面を真空吸着する複数の真空孔４．４−を開
口し、各真空孔４を集束させて凸状の嵌合部３ａ内に設
けた真空路４ａに接続する。一方、装置本体７の凹状嵌
合部７ａ内には図示しない真空源に連なる真空路７ｂが
ステージ３の真空路４ａに接続可能な位置に設けである
。In addition, a plurality of vacuum holes 4.4- for vacuum adsorbing the entire surface of the sheet 2 on which the wafer 1 is attached are opened on the second surface of the stage 3, and each vacuum hole 4 is converged to form a convex fitting portion 3a. It is connected to the vacuum path 4a provided inside. On the other hand, a vacuum path 7b connected to a vacuum source (not shown) is provided in the concave fitting portion 7a of the apparatus main body 7 at a position where it can be connected to the vacuum path 4a of the stage 3.
さらに、ステージ３の真空路４ａにはノブ６による外部
操作にて開閉する開閉弁５を設けである。Further, the vacuum path 4a of the stage 3 is provided with an on-off valve 5 which is opened and closed by external operation using a knob 6.
３一
実施例において、ステージ３の凸状嵌合部３ａを装置本
体７の凹状嵌合部７ａに装着し、ステージ３ど装置本体
７の真空路４ａ、７ｂ同士を接続するとともに、ノブ６
により開閉弁５を開弁する。In the third embodiment, the convex fitting part 3a of the stage 3 is attached to the concave fitting part 7a of the apparatus main body 7, and the stage 3 and the vacuum paths 4a and 7b of the apparatus main body 7 are connected to each other, and the knob 6
The on-off valve 5 is opened.
次にウェハー１を貼付けた粘着シー１〜２をステージ３
上に載置し、図示しない真空源により真空路４ａ、 ７
ｂ及び真空孔４を介してシー１〜２の全面製真空吸着し
、ダイシング］０を行う。このウェハー吸着用ステージ
３はダイシンク終了後、ノブ６により開閉弁５を閉じて
装置本体７より離脱させる。Next, move adhesive sheets 1 and 2 to which wafer 1 is attached to stage 3.
vacuum paths 4a and 7 by a vacuum source (not shown).
The entire surface of the sheets 1 and 2 is vacuum-adsorbed through the vacuum holes 4 and 4, and dicing]0 is performed. After die sinking is completed, the wafer suction stage 3 is removed from the apparatus main body 7 by closing the on-off valve 5 using the knob 6.
本発明によれば、開閉弁５を閉じるので、ステージ３の
真空孔４内は真空状態に保持され、シー１〜２の全面は
ステージ２に真空吸着されたままとなる。According to the present invention, since the on-off valve 5 is closed, the inside of the vacuum hole 4 of the stage 3 is maintained in a vacuum state, and the entire surfaces of the seats 1 and 2 remain vacuum-adsorbed on the stage 2.
第１図（ｂ）に示すように、ダイシング１０が行われた
ウェハー１を保持するシー１−２はウェハー吸着用ステ
ージ３上に真空吸着され平面状に展開されたまま保持さ
れるために、粘着性シー１〜２はたるみ、伸ばされるこ
とがなくなり、半導体素子チップ１１のエツジ１５が周
囲の半導体素子チップ１１の工ッジ１５と衝撃し合うこ
ともなくなり、半導体素子チップ１１にキズ、カケが発
生することがなくなる。As shown in FIG. 1(b), the sheath 1-2 holding the wafer 1 subjected to dicing 10 is vacuum-adsorbed onto the wafer adsorption stage 3 and held in a flat state. The adhesive sheets 1 and 2 no longer slacken or stretch, and the edges 15 of the semiconductor element chip 11 no longer impact against the edges 15 of the surrounding semiconductor element chips 11, thereby preventing scratches and chips on the semiconductor element chip 11. will no longer occur.
また、半導体素子チップ１１は真空吸引】４された状態
で、かつ位置決め用ピン８ａを備えであるウェハー吸着
用ステージ３上に載せであるために、別過程の装置への
位置決め装着が簡単にできる。In addition, since the semiconductor element chip 11 is placed on the wafer suction stage 3 in a vacuum suctioned state and equipped with positioning pins 8a, it can be easily positioned and mounted on a device for another process. .
以上説明したように本発明はダイシングされた半導体素
子チップをステージ上に平面状に展開したまま次工程に
送られることとなり、半導体素子チップにキズ、クラッ
クが発生することはなく、半導体装置の品質を向上でき
る効果がある。As explained above, in the present invention, the diced semiconductor element chips are sent to the next process while laid out flat on the stage, so that no scratches or cracks occur on the semiconductor element chips, and the quality of the semiconductor device is improved. It has the effect of improving
第１図（ａ）、 （ｂ）は本発明のウェハーをダイシン
クする装置の一実施例を示す断面図、第２図（ａ）、（
ｂ）は従来のウェハーをダイシングする装置を示す断面
図である。
１ ウェハー ２ 粘着性シー１〜３・
・ウェハー吸着用ステージ ４・・・真空孔５・開閉弁FIGS. 1(a) and 1(b) are cross-sectional views showing an embodiment of the apparatus for die-sinking wafers according to the present invention, and FIGS.
b) is a sectional view showing a conventional wafer dicing device. 1 Wafer 2 Adhesive sheet 1-3・
・Wafer adsorption stage 4...Vacuum hole 5・Opening/closing valve
Claims (1)
きする複数の真空孔を開口したウェハー吸着用ステージ
を有する半導体素子ウェハーの切削分割装置において、
ウェハー吸着用ステージを装置本体から脱着可能にユニ
ット化し、前記真空孔を真空源に接続する該ステージの
接続部に、外部から操作される開閉弁を設けたことを特
徴とする半導体素子ウェハーの切削分割装置用ステージ
。1. In a semiconductor element wafer cutting and dividing apparatus having a wafer suction stage with a plurality of vacuum holes for evacuating the entire surface of a sheet to which semiconductor element wafers are attached,
Cutting of semiconductor device wafers, characterized in that a wafer suction stage is made into a unit that can be detached from the apparatus main body, and a connection part of the stage that connects the vacuum hole to a vacuum source is provided with an on-off valve that is operated from the outside. Stage for splitting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63029170A JPH01205441A (en) | 1988-02-10 | 1988-02-10 | Stage for apparatus for cutting and dividing semiconductor element wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63029170A JPH01205441A (en) | 1988-02-10 | 1988-02-10 | Stage for apparatus for cutting and dividing semiconductor element wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01205441A true JPH01205441A (en) | 1989-08-17 |
Family
ID=12268766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63029170A Pending JPH01205441A (en) | 1988-02-10 | 1988-02-10 | Stage for apparatus for cutting and dividing semiconductor element wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01205441A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0639338U (en) * | 1992-10-30 | 1994-05-24 | ユーエイチティー株式会社 | Work holder |
| JPH0831772A (en) * | 1994-07-15 | 1996-02-02 | Nec Corp | Dicing equipment |
| US5738165A (en) * | 1993-05-07 | 1998-04-14 | Nikon Corporation | Substrate holding apparatus |
| US6202292B1 (en) * | 1998-08-26 | 2001-03-20 | Micron Technology, Inc. | Apparatus for removing carrier film from a semiconductor die |
-
1988
- 1988-02-10 JP JP63029170A patent/JPH01205441A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0639338U (en) * | 1992-10-30 | 1994-05-24 | ユーエイチティー株式会社 | Work holder |
| US5738165A (en) * | 1993-05-07 | 1998-04-14 | Nikon Corporation | Substrate holding apparatus |
| JPH0831772A (en) * | 1994-07-15 | 1996-02-02 | Nec Corp | Dicing equipment |
| JP2715916B2 (en) * | 1994-07-15 | 1998-02-18 | 日本電気株式会社 | Dicing equipment |
| US6202292B1 (en) * | 1998-08-26 | 2001-03-20 | Micron Technology, Inc. | Apparatus for removing carrier film from a semiconductor die |
| US6505395B1 (en) | 1998-08-26 | 2003-01-14 | Micron Technology, Inc. | Apparatus and method for removing carrier tape from a singulated die |
| US6658718B2 (en) | 1998-08-26 | 2003-12-09 | Micron Technology, Inc. | Method for removing carrier film from a singulated die |
| US6751853B2 (en) | 1998-08-26 | 2004-06-22 | Micron Technology, Inc. | Apparatus and system for removing carrier film from a singulated die |
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