JPH01201666A - Exposing method - Google Patents
Exposing methodInfo
- Publication number
- JPH01201666A JPH01201666A JP63025706A JP2570688A JPH01201666A JP H01201666 A JPH01201666 A JP H01201666A JP 63025706 A JP63025706 A JP 63025706A JP 2570688 A JP2570688 A JP 2570688A JP H01201666 A JPH01201666 A JP H01201666A
- Authority
- JP
- Japan
- Prior art keywords
- exposure
- exposed
- filter
- exposing
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 25
- 238000005286 illumination Methods 0.000 claims description 10
- 230000001186 cumulative effect Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000005192 partition Methods 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、例えば電子部品の実装等で用いられるプリン
ト基板製作の露光方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an exposure method for manufacturing printed circuit boards used, for example, in mounting electronic components.
［従来の技術］
一般にプリント基板と呼ばれているものには、コンピュ
ータ、テレビ、ステレオ等で用いられるプリンティラド
ワイヤードボード（以下ＰＷＢという）や、カメラ、電
卓、ＶＴＲ等で用いられるフレキシブルプリンティッド
サーキイット（以下ＦＰＣという）等が知られている。[Prior Art] Commonly called printed circuit boards include printed circuit boards (hereinafter referred to as PWBs) used in computers, televisions, stereos, etc., and flexible printed circuit boards used in cameras, calculators, VTRs, etc. It (hereinafter referred to as FPC) and the like are known.
ＰＷＢは基板素材としてエポキシ樹脂、フェノール樹脂
、セラミックス等を使用し、厚さが０．８から３．２−
、程度、ＦＰＣは基板素材としてポリエステルフィルム
、ポリイミドフィルム等を使用し厚さか２５から１２５
ル、程度である。PWB uses epoxy resin, phenol resin, ceramics, etc. as the substrate material, and has a thickness of 0.8 to 3.2-
, FPC uses polyester film, polyimide film, etc. as the substrate material and has a thickness of 25 to 125 mm.
This is about the same level.
これらプリント基板の製作には、基板の表面に液状レジ
スト、ドライフィルムレジスト等の薄いフォトレジスト
層を設け、プリントすべきパターンが描かれたフォトマ
スクを通して該フォトレジストの感光波長で露光する工
程を経て所望のパターンを該フォトレジスト層に設ける
。To manufacture these printed circuit boards, a thin photoresist layer such as a liquid resist or dry film resist is placed on the surface of the board, and the process of exposing the substrate to light at the photoresist's sensitive wavelength through a photomask on which the pattern to be printed is drawn is performed. A desired pattern is provided in the photoresist layer.
この際、基板素材とフォトマスクの位置関係の違いによ
り、従来方式としてコンタクト方式とプロキシミティ方
式の２つの方式が知られている。At this time, two conventional methods are known: a contact method and a proximity method, depending on the positional relationship between the substrate material and the photomask.
前者はフォトレジスト層の設けられた基板素材とフォト
マスクとを密着させて配置する露光方式であるのに対し
、後者は基板素材とフォトマスクとの間に一定のわずか
な間隙を設けて配置する露光方式である。また、これら
２つの方式ともフォトマスクと露光されるパターンの倍
率は、実質上等倍である。The former is an exposure method in which the substrate material on which the photoresist layer is provided and the photomask are placed in close contact with each other, whereas the latter is placed with a certain small gap between the substrate material and the photomask. It is an exposure method. Furthermore, in both of these methods, the magnification of the photomask and the exposed pattern are substantially the same.
最近では、１枚のプリント基板が大型化する傾向がみら
れ、例えばコンピュータメモリボード等で用いられるプ
リント基板は、５００□×６００１程度の大きさを有し
、この様な基板を一度に露光することが必要となってき
ている。Recently, there has been a tendency for single printed circuit boards to become larger. For example, printed circuit boards used in computer memory boards, etc. have a size of about 500 x 6001, and it is difficult to expose such a board at once. It has become necessary.
また、このような大型のプリント基板において、露光現
像後に形成される導通部の導通状態の均一性の要請から
、各部に均一な露光量を得ることが必要である。Further, in such a large-sized printed circuit board, it is necessary to obtain a uniform amount of exposure to each part in order to ensure uniformity of the conductive state of the conductive parts formed after exposure and development.
［発明が解決しようとする課題］
上述の如く露光処理されるプリント基板が大型化するに
伴って、大面積のプリント基板をコンタクト方式または
プロキシミティ方式により一度に等倍露光することが必
要になってきている。[Problems to be Solved by the Invention] As the size of printed circuit boards to be exposed has increased as described above, it has become necessary to expose large-area printed circuit boards at the same magnification at one time using a contact method or a proximity method. It's coming.
ところか、大面積の被処理物を一度に光照射するための
照明系を装備することは、光の収差及び均一性等光学上
の設計も難しく、コストも高くなり、さらに装置も大型
化するので製作は困難であることか判った。そこで、被
処理物を一度に光照射することなく、複数の区画に分割
して各区画毎に露光することを検討した。However, equipping an illumination system to irradiate a large area of the workpiece with light at once is difficult to design optically due to light aberrations and uniformity, increases costs, and also increases the size of the equipment. So it turned out that it was difficult to manufacture. Therefore, instead of irradiating the object with light all at once, we considered dividing it into a plurality of sections and exposing each section to light.
一般にランプ等の光源による光の照度分布は中心部に対
して周辺部で弱くなる、いわゆる逆Ｕ字形の特性曲線を
描くものである。従って、上記のような各区画に分割し
た露光方法によれば、各区画の川辺端部と中心部で光の
強さが違うので、各区画の周辺部を互いに重複して露光
して各区画の中心部と光の強さを一定にすることが考え
られる。Generally, the illuminance distribution of light from a light source such as a lamp has a so-called inverted U-shaped characteristic curve, which is weaker at the periphery than at the center. Therefore, according to the exposure method that divides each section as described above, the intensity of light differs between the edge of the riverside and the center of each section, so the periphery of each section is exposed overlapped with each other. It is conceivable to keep the intensity of the light constant at the center of the area.
ところが、重複部分（各区画の周辺部）の光の強さと、
重複しない部分（各区画の中心部）の光の強さを一定す
ることは難しく、均一な露光を行うことは困難であると
いうことが判った。However, the intensity of light in the overlapping area (periphery of each section)
It has been found that it is difficult to keep the intensity of light constant in non-overlapping areas (the center of each section) and that it is difficult to perform uniform exposure.
この発明はこれらの課題を解決するためになされたもの
で、コンタクト方式またはプロキシミティ方式による大
面積露光において、安価で簡単な装置を用いて均一な露
光をすることのできる露光方法を提供することを目的と
する。The present invention has been made to solve these problems, and an object of the present invention is to provide an exposure method that can perform uniform exposure using an inexpensive and simple device in large-area exposure using a contact method or a proximity method. With the goal.
［課題を解決するための手段］
上記の目的を達成するために、この発明は被露光処理物
の露光面及びフォトマスクを複数の方形の露光区画に区
画し、これら各露光区画を相互に重なり合うような重複
露光部分を作りつつ、フォトマスク及び被露光処理物の
組か、もしくは照明系を連続的に移動させて順次露光し
、各露光区画における積算露光量がほぼ等しくなるよう
露光するものである。[Means for Solving the Problems] In order to achieve the above object, the present invention divides the exposure surface of the object to be exposed and the photomask into a plurality of rectangular exposure sections, and overlaps each other with each other. While creating overlapping exposure areas, the combination of the photomask and the object to be exposed, or the illumination system, is continuously moved and exposed in sequence so that the cumulative exposure amount in each exposure section is approximately equal. be.
［作用］
この露光方法によれば、各区画の積算露光量が均一にな
って大面積の露光も大規模な装置を用いることなく行う
ことができる。[Function] According to this exposure method, the cumulative exposure amount of each section becomes uniform, and a large area can be exposed without using a large-scale device.
［実施例］
第１図はこの発明のコンタクト方式によって露光を行う
ための一実施例を説明するための主要部の概略を示す図
て、ｌは超高圧水銀灯、２は楕円集光鏡、３，５は平面
反射鏡、４はインテグレータレンズ、６はコリメータレ
ンズ、７はフィルタで、これら超高圧水銀灯１乃至ブレ
ード７によって照明系１１を形成している。また、８は
フォトマスク、９は露光すべき被処理物（以下ワークと
いう）、１０はこのワーク９をｘ−ｙ （水平）方向に
移動するためのテーブルである。[Embodiment] Fig. 1 is a diagram schematically showing the main parts for explaining an embodiment of exposure using the contact method of the present invention, in which l is an ultra-high pressure mercury lamp, 2 is an elliptical condenser mirror, and 3 , 5 is a plane reflecting mirror, 4 is an integrator lens, 6 is a collimator lens, and 7 is a filter, and the ultra-high pressure mercury lamp 1 to the blade 7 form an illumination system 11. Further, 8 is a photomask, 9 is an object to be exposed (hereinafter referred to as a work), and 10 is a table for moving this work 9 in the x-y (horizontal) direction.
第２図は第１図で用いるフィルタ７を示した図で、同図
（ｂ）はフィルタフの側面図で、光透過性の薄膜の表面
にＣｒを膜厚数オングストロームの単位で蒸着し、この
フィルタフの周辺部に遠ざかるにつれてその厚みか増す
ように形成したものてあり、同図（Ｃ）はフィルタ７の
膜厚の分布と光の透過率の関係を示した図であり、同図
（ｄ）はこのフィルタ７を複数の区画（９−□ ９−
、 、 ＋＋＋９−ｎ）に分割して露光する方法及び露
光順序（矢印）を示した図である。Fig. 2 shows the filter 7 used in Fig. 1, and Fig. 2(b) is a side view of the filter. The filter 7 is formed so that its thickness increases as it moves away from the periphery of the filter 7. Figure (C) shows the relationship between the film thickness distribution and light transmittance of the filter 7. ) divides this filter 7 into multiple sections (9-□ 9-
, +++9-n) and the exposure order (arrow).
第２図（ａ）に示すフィルタフについて詳しく説明する
と、フィルタフの光の透過率を中心部イて１００％とす
ると、同図（ｂ）に示すようにＣｒ蒸着膜の膜厚か増す
周辺部口ての透過率は低下して、同図（ｃ）に示すよう
なほぼ台形状の透過特性を示すように膜厚を設定してお
く。即ち、フィルタフの周辺部口の透過率を示す曲線か
中心部イに対して直線的に低下して周辺端部ハでは０（
光を全く透過しない）になるようにする。To explain in detail about the filter shown in Fig. 2(a), if the light transmittance of the filter is set to 100% in the center, the thickness of the Cr vapor deposited film increases at the periphery as shown in Fig. 2(b). The film thickness is set so that the transmittance of each layer decreases and exhibits a substantially trapezoidal transmission characteristic as shown in FIG. 2(c). In other words, the curve showing the transmittance of the peripheral opening of the filter decreases linearly with respect to the center part A and becomes 0 (
so that it does not transmit any light at all.
そして、ワーク９の露光に際しては、露光すべき各区画
（１，，１２，−−−−−−１，）が互いに重なり合う
ように連続的にスキャンしながら光を照射することによ
り、隣接する区画（９−１と９−Ｋ。When exposing the workpiece 9, each section (1,, 12,-----1,) to be exposed is continuously scanned and irradiated with light so that each section (1,, 12,----1,) overlaps with the adjacent section. (9-1 and 9-K.
９−２と１Ｋ−１，・・・・・・・）の周辺部口が互い
に重複して露光されることになる。従って、周辺部口に
おいて、重複露光によってもたらされる積算露光量か中
心部イの露光量と等しくなるように周辺部口の蒸着膜の
膜厚を設定する。9-2 and 1K-1, . . . ) are exposed in an overlapping manner. Therefore, the thickness of the vapor deposited film at the peripheral aperture is set so that the cumulative exposure amount brought about by overlapping exposure is equal to the exposure amount at the center A in the peripheral aperture.
以上、第２図（ｄ）に矢印て示す順序に連続的にＸ−Ｙ
テーブルか照明系を移動して光を照射して露光すること
により、ワーク９の点線で囲った部分９ａは均一に露光
される。As described above, the X-Y
By irradiating and exposing the workpiece 9 with light by moving the table or the illumination system, the portion 9a of the workpiece 9 surrounded by the dotted line is uniformly exposed.
また、第３図はこの発明の他の実施例を説明するための
図て、：５３図（ａ）は第２図（ａ）に示すフィルタフ
に代えてこの実施例て用いるブレード７′の詳細を示す
図で、ブレード７′の中心部に菱形の切欠穴７’ａか設
けられたもので、同図（ｂ）はこの切欠穴７’ａを透過
する光の照度分布を示した図であり、同図（ｃ）はワー
ク９′の各区画を順次露光する状態を説明するための図
である。FIG. 3 is a diagram for explaining another embodiment of the present invention: FIG. 53(a) shows details of a blade 7' used in this embodiment in place of the filter shown in FIG. 2(a). In this figure, a diamond-shaped notch hole 7'a is provided in the center of the blade 7', and FIG. FIG. 9C is a diagram for explaining a state in which each section of the workpiece 9' is sequentially exposed.
第１図、第３図において、Ｘ−Ｙテーブル１０を駆動し
てワーク９′の最初の区画９−５°を照明系１１の照射
部に移動する。そして、超高圧水銀灯１からの光を楕円
集光鏡２．平面反射鏡３．インテグレータレンズ４．平
面反射鏡５．コリメータレンズ６、プレート７′からな
る照明系１１を経て、フォトマスク８に密接したワーク
９′に照射して、ワーク９′の区画９−１′を露光する
。次に、ｘ−Ｙテーブル１０を駆動してワーク９′の区
画９−２°を照射部に移動し、区画９−１°の場合と同
様にして区画９−２°を露光する。以、下、第２図（ｃ
）の矢印の順序にワーク９′を移動して各１、’、・・
・・・・９−ｏ゛を順次露光する。尚、移動は連続的で
も良いし、逐次移動でも良い。逐次移動の場合は、移動
中は不図示のシャッタで光を遮断する。1 and 3, the X-Y table 10 is driven to move the first section 9-5° of the workpiece 9' to the irradiation section of the illumination system 11. Then, the light from the ultra-high pressure mercury lamp 1 is collected by an elliptical condenser mirror 2. Plane reflector 3. Integrator lens 4. Plane reflector 5. A workpiece 9' in close contact with a photomask 8 is irradiated through an illumination system 11 consisting of a collimator lens 6 and a plate 7' to expose a section 9-1' of the workpiece 9'. Next, the x-y table 10 is driven to move the section 9-2[deg.] of the work 9' to the irradiation section, and the section 9-2[deg.] is exposed in the same manner as the section 9-1[deg.]. Below, Figure 2 (c
), move the workpiece 9' in the order of the arrows and move each 1,',...
...9-o゛ is sequentially exposed. Note that the movement may be continuous or sequential. In the case of sequential movement, a shutter (not shown) blocks light during movement.
上記の露光方法についてさらに詳しく説明すると、超高
圧水銀灯ｌからの光は照明系１１を経て第３図（ｂ）の
如き照度分布て平行光線となって照射されるのて、ブレ
ード７′の切欠穴７’ａを通る光の強さか最も強く、か
つ−様な照度分布を有する点の光を用いて露光すること
にすればよい。その結果、各区画９−．＋、９−２°、
−−−−−−９−７°の露光量はそれぞれ積算されて、
第３図（Ｃ）において点線で囲った区分９’ａに照射さ
れる積算露光量はほぼ均一になる。従って、ワーク９″
の露光処理部分を点線で囲った区分９’ａに含まれるよ
うに設定することにより、いかなる大面積のプリント基
板であっても、必要な領域は均一に露光することかでき
る。To explain the above exposure method in more detail, the light from the ultra-high pressure mercury lamp 1 passes through the illumination system 11 and is irradiated as parallel rays with an illuminance distribution as shown in FIG. 3(b). The exposure may be performed using light at a point where the intensity of the light passing through the hole 7'a is the strongest and has a -like illuminance distribution. As a result, each section 9-. +, 9-2°,
−−−−−−The exposure amount of 9-7° is integrated,
In FIG. 3(C), the cumulative amount of exposure applied to the section 9'a surrounded by the dotted line is approximately uniform. Therefore, the workpiece 9″
By setting the exposure processing portion to be included in the section 9'a surrounded by the dotted line, the necessary area can be uniformly exposed no matter how large the printed circuit board is.
尚、上記２つの実施例においてはＸ−Ｙテーブル１０を
駆動してワーク９．９′を移動させる点について述べた
か、ワーク９．９′は固定しておいて照明系１１を移動
させることにより、各区画の順次露光を行ってもよいこ
とは勿論であって、照明系１１とワーク９．９′のいず
れを移動させるかは、適宜選択することかできる。In the above two embodiments, the workpiece 9.9' is moved by driving the X-Y table 10, but the workpiece 9.9' is fixed and the illumination system 11 is moved. Of course, each section may be exposed sequentially, and which of the illumination system 11 and the workpieces 9,9' to be moved can be selected as appropriate.
［発明の効果］
以上説明したとおり、この発明はコンタクト方式または
プロキシミティ方式の露光方法にて、大面積の被露光処
理物を複数区画に分割し、各露光区画の積算露光量がほ
ぼ等しくなるように順次露光するので、光学的に特別大
規模な装置を用いることなく、簡単な装置によって低コ
ストて均一露光量の処理を行うことかできる。[Effects of the Invention] As explained above, the present invention divides a large-area object to be exposed into a plurality of sections using a contact method or a proximity method, and the cumulative exposure amount of each exposure section is approximately equal. Since the exposure is carried out sequentially in this manner, processing with a uniform exposure amount can be performed at low cost using a simple device without using a particularly large-scale optical device.
第１図はこの発明のコンタクト方式によって露光を行う
ための一実施例を説明するための主要部の概略を示す図
、第２図は第１図て用いるフィルタを示した図で、同図
（ａ）は第１図におけるフィルタの詳細を示した図、同
図（ｂ）はフィルタの側面図、同図（Ｃ）はフィルタの
膜厚の分布と光の透過率の関係を示した図、同図（ｄ）
はこのフィルタを複数の区画に分割して露光する方法及
び露光順序（矢印）を示した図、第３図はこの発明の他
の実施例を説明するための図で、同図（ａ）は第２図（
ａ）に示すフィルタに代えて、この実施例て用いるブレ
ードの詳細を示した図、同図（ｂ）は切欠穴を透過する
光の照度分布を示した図、同図（ｃ）はワークの各区画
を順次露光する状態を説明するための図である。
図中。
ｌ：超高圧水銀灯 ２：楕円集光鏡３．５：平面反
射鏡
４：インテグレータレンズ
６：コリメータレンズ ７゛ニブレード８：フォトマス
ク ９，９°：ワーク１０：Ｘ−Ｙテーブル
代理人 弁理士 １）北 嵩 晴
第１図
第２図
（Ｃ）
第３図FIG. 1 is a diagram schematically showing the main parts for explaining an embodiment of exposure using the contact method of the present invention, and FIG. 2 is a diagram showing a filter used in FIG. a) is a diagram showing the details of the filter in FIG. 1, FIG. 1(b) is a side view of the filter, and FIG. Same figure (d)
3 is a diagram showing a method of dividing this filter into a plurality of sections for exposure and the exposure order (arrows); FIG. 3 is a diagram for explaining another embodiment of the present invention; FIG. Figure 2 (
A diagram showing the details of the blade used in this example instead of the filter shown in a), FIG. FIG. 6 is a diagram for explaining a state in which each section is sequentially exposed. In the figure. 1: Ultra-high pressure mercury lamp 2: Elliptical condenser mirror 3.5: Plane reflector 4: Integrator lens 6: Collimator lens 7゛ni blade 8: Photomask 9,9°: Work 10: X-Y table agent Patent attorney 1 ) Haru Kitatake Figure 1 Figure 2 (C) Figure 3
Claims (1)
方法において、被露光処理物の露光面及びフォトマスク
を複数の方形の露光区画に区画し、これら各露光区画を
相互に重なり合うような重複露光部分を作りつつ、フォ
トマスク及び被露光処理物の組か、もしくは照明系を連
続的に、または逐次移動させて順次露光し、各露光区画
における積算露光量がほぼ等しくなるよう露光すること
を特徴とする露光方法。In an exposure method using a contact method or a proximity method, the exposure surface of the object to be exposed and a photomask are divided into a plurality of rectangular exposure sections, and each of these exposure sections overlaps each other to create an overlapping exposure area. An exposure method characterized by sequentially exposing a set of a mask and an object to be exposed, or by moving an illumination system continuously or sequentially, so that the cumulative exposure amount in each exposure section is approximately equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63025706A JPH01201666A (en) | 1988-02-08 | 1988-02-08 | Exposing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63025706A JPH01201666A (en) | 1988-02-08 | 1988-02-08 | Exposing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01201666A true JPH01201666A (en) | 1989-08-14 |
Family
ID=12173229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63025706A Pending JPH01201666A (en) | 1988-02-08 | 1988-02-08 | Exposing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01201666A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009300580A (en) * | 2008-06-11 | 2009-12-24 | V Technology Co Ltd | Proximity exposure apparatus |
| JP2011033908A (en) * | 2009-08-04 | 2011-02-17 | Nikon Corp | Exposure apparatus, exposure method, and device manufacturing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63174046A (en) * | 1987-01-14 | 1988-07-18 | Hitachi Ltd | Exposure device |
-
1988
- 1988-02-08 JP JP63025706A patent/JPH01201666A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63174046A (en) * | 1987-01-14 | 1988-07-18 | Hitachi Ltd | Exposure device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009300580A (en) * | 2008-06-11 | 2009-12-24 | V Technology Co Ltd | Proximity exposure apparatus |
| JP2011033908A (en) * | 2009-08-04 | 2011-02-17 | Nikon Corp | Exposure apparatus, exposure method, and device manufacturing method |
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