JPH01199758A - Ultrasonic machine - Google Patents
Ultrasonic machineInfo
- Publication number
- JPH01199758A JPH01199758A JP2476188A JP2476188A JPH01199758A JP H01199758 A JPH01199758 A JP H01199758A JP 2476188 A JP2476188 A JP 2476188A JP 2476188 A JP2476188 A JP 2476188A JP H01199758 A JPH01199758 A JP H01199758A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- vibration
- amplitude
- displacement sensor
- vibration amplitude
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006073 displacement reaction Methods 0.000 claims abstract description 17
- 238000003754 machining Methods 0.000 abstract description 14
- 239000004575 stone Substances 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 7
- 238000007493 shaping process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、工具を振動させて加工を行う超音波加工機に
関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an ultrasonic processing machine that performs processing by vibrating a tool.
〈従来の技術〉
かかる超音波加工機は、超音波発振器からの高周波電流
によって振動子を振動させ、この振動子の振動をホーン
によって拡大して工具に振動を与えている。<Prior Art> Such an ultrasonic processing machine vibrates a vibrator using a high frequency current from an ultrasonic oscillator, and amplifies the vibration of the vibrator with a horn to give vibration to a tool.
〈発明が解決しようとする課題〉
前記振動子は、使用中に温度変化等によって振動特性が
変化し、工具の振幅幅が変化するため、加工精度が悪く
なる問題があった。<Problems to be Solved by the Invention> The vibration characteristics of the vibrator change due to temperature changes and the like during use, and the amplitude width of the tool changes, resulting in a problem of poor processing accuracy.
く課題を解決するための手段〉
本発明は上述した問題点を解決するためになされたもの
で、工具の振動方向で工具に対応する位置に非接触式変
位センサを設け、非接触式変位センサによって得られた
工具の実際の振幅幅があらかじめ設定された工具の振幅
幅になるように超音波発振器を制御する発振器制御装置
を設けたものである。Means for Solving the Problems> The present invention has been made to solve the above-mentioned problems, and a non-contact displacement sensor is provided at a position corresponding to the tool in the vibration direction of the tool. The apparatus is equipped with an oscillator control device that controls the ultrasonic oscillator so that the actual amplitude width of the tool obtained by the method becomes the preset amplitude width of the tool.
〈作用〉
加工中に工具と非接触式センサを対応させ、工具の実際
の振幅幅とあらかじめ設定された振幅幅とが一致するよ
うに発振器制御装置によって超音波発振器を制御する。<Operation> During machining, the tool and the non-contact sensor are made to correspond, and the oscillator control device controls the ultrasonic oscillator so that the actual amplitude width of the tool matches the preset amplitude width.
〈実施例〉
以下本発明の実施例を第1図に基づいて説明する。工0
はベツドであり、このベツド10に案内\ 台11が
設置されている。案内台11にテーブル12が水平移動
可能に案内され、このテーブル12は案内台11に取付
けられたサーボモータ13により回路のボールネジ機構
を介して駆動されるようになっている。テーブル12の
後方でベツド10上にコラム14が立設され、このコラ
ム14の前面には上下方向に案内面15が形成されてい
る。案内面15に加工ヘッド20が上下方向に移動可能
に案内され、この加工ヘッド20はコラム14に取付け
られたサーボモータ21により回路のボールネジ機構を
介して駆動されるようになっている。加工ヘッド20に
は主軸22が垂直軸線回りに回転可能に軸承され、この
主軸22は加工ヘッド20に取付けられた主軸用モータ
23によって回転駆動されるようになっている。<Example> Hereinafter, an example of the present invention will be described based on FIG. 1. Labor 0
is a bed, and a guide stand 11 is installed in this bed 10. A table 12 is guided by a guide stand 11 so as to be horizontally movable, and this table 12 is driven by a servo motor 13 attached to the guide stand 11 via a ball screw mechanism of a circuit. A column 14 is erected on the bed 10 behind the table 12, and a guide surface 15 is formed in the vertical direction on the front surface of the column 14. A processing head 20 is guided by the guide surface 15 so as to be movable in the vertical direction, and this processing head 20 is driven by a servo motor 21 attached to the column 14 via a ball screw mechanism of a circuit. A main shaft 22 is rotatably supported on the processing head 20 about a vertical axis, and the main shaft 22 is rotationally driven by a main shaft motor 23 attached to the processing head 20.
主軸22の先端には上下方向の振動を発生する振動子3
0が取付けられ、この振動子30には振動子30の振動
を拡大するホーン31が取付けられている。ホーン31
の先端には円筒状の砥石(工具)32が取付けられてい
る。前記テーブル12上には非接触式変位センサ40が
設置され、この非接触式変位センサ40はテーブル12
の移動によって砥石32の振動方向で砥石32に対応す
る位置に割り出されるようになっている。前記振動子3
0には高周波電気を発生する超音波発振器41が接続さ
れ、この超音波発振器41には超音波発振器41を制御
する発振器制御装置42が接続されている。前記非接触
式変位センサ40には非接触式変位センサ40からの波
形信号を整形する波形整形回路43が接続され、この波
形整形回路43には波形信号の振幅幅を測定する振幅測
定回路44が接続されている。前記発振器制御装置42
は主にゲート回路50と振幅設定回路51と比較回路5
2とからなり、ゲート回路50の開閉制御は数値制御装
置53によってなされるようになっている。前記振幅設
定回路51は砥石32の最適な振幅幅を記憶するもので
あり、前記比較回路52は振幅設定回路51に記憶され
た振幅幅と振幅測定回路44からの実際の振幅幅との比
較を行なうものである。前記数値制御装置53によって
サーボモータ13.21と主軸用モータ23の駆動制御
がなされるようになっている。前記テーブル12上には
複数を穴Waを持つ工作物Wが設置されている。At the tip of the main shaft 22 is a vibrator 3 that generates vibrations in the vertical direction.
0 is attached to the vibrator 30, and a horn 31 for magnifying the vibration of the vibrator 30 is attached to the vibrator 30. horn 31
A cylindrical grindstone (tool) 32 is attached to the tip. A non-contact displacement sensor 40 is installed on the table 12, and this non-contact displacement sensor 40 is installed on the table 12.
By the movement of , the position corresponding to the grindstone 32 is determined in the vibration direction of the grindstone 32 . Said vibrator 3
0 is connected to an ultrasonic oscillator 41 that generates high-frequency electricity, and an oscillator control device 42 that controls the ultrasonic oscillator 41 is connected to this ultrasonic oscillator 41. A waveform shaping circuit 43 that shapes the waveform signal from the noncontact displacement sensor 40 is connected to the non-contact displacement sensor 40, and an amplitude measurement circuit 44 that measures the amplitude width of the waveform signal is connected to the waveform shaping circuit 43. It is connected. The oscillator control device 42
mainly consists of a gate circuit 50, an amplitude setting circuit 51, and a comparison circuit 5.
2, and the opening/closing control of the gate circuit 50 is controlled by a numerical control device 53. The amplitude setting circuit 51 stores the optimum amplitude width of the grinding wheel 32, and the comparison circuit 52 compares the amplitude width stored in the amplitude setting circuit 51 with the actual amplitude width from the amplitude measuring circuit 44. It is something to do. The numerical control device 53 controls the drive of the servo motor 13.21 and the spindle motor 23. A workpiece W having a plurality of holes Wa is installed on the table 12.
次に第2図のフローチャートに基づいて動作について説
明する。数値制御装置53から加工指令が出されるとサ
ーボモータ13が駆動され、砥石32に一番目の穴Wa
が対応する位置へテーブル12が移動する。次に主軸用
モータ23によって主軸22を回転させるとともに振動
子30に高周波電流を印加し、サーボモータ21によっ
て加工ヘッド20を下降させる。このとき、砥石32は
回転しながら上下に振動し、穴Waの超音波加工がなさ
れる。Next, the operation will be explained based on the flowchart shown in FIG. When a machining command is issued from the numerical control device 53, the servo motor 13 is driven, and the first hole Wa is formed on the grindstone 32.
The table 12 moves to the corresponding position. Next, the main shaft 22 is rotated by the main shaft motor 23 and a high frequency current is applied to the vibrator 30, and the processing head 20 is lowered by the servo motor 21. At this time, the grindstone 32 vibrates up and down while rotating, and the hole Wa is ultrasonically processed.
加工が終わると加工ヘッド20が上昇し、加工完了指令
と振幅測定指令が出なければ砥石32に次の穴Waに対
応する位置にテーブル12が移動し、上述した加工と同
じ加工がなされる。加工完了指令で出れば、テーブル1
2は原位置に移動し、主軸32の回転と砥石32の上下
方向の振動が停止する。When the machining is completed, the machining head 20 is raised, and unless a machining completion command and an amplitude measurement command are issued, the table 12 is moved to a position corresponding to the next hole Wa on the grindstone 32, and the same machining as described above is performed. If a machining completion command is issued, table 1
2 moves to the original position, and the rotation of the main shaft 32 and the vertical vibration of the grindstone 32 are stopped.
振幅測定指令が出れば、砥石32に変位センサ40が対
応する位置へテーブル12が移動し、砥石32が変位セ
ンサ40に接近する位置まで加工ヘッド20が下降する
。主軸12の回転を停止した状態で砥石32を振動させ
ると、変位センサ40から波形信号が得られる。この波
形信号は波形整形回路43によって整形され、整形され
た波形信号は振幅測定回路44によって振幅幅が測定さ
れる。ゲート回路50は数値制御装置53によって振幅
測定中だけ開かれ、測定された振幅幅信号が比較回路5
2に入力され、また比較回路52には振幅測定回路51
に記憶された振幅幅信号が入力される。測定された振幅
幅が記憶された振幅幅より小さければ、高周波電流の振
幅が大きくなるように超音波発振器41が制御され、逆
に測定された振幅幅が記憶された振幅幅より大きければ
、高周波電流の振幅が小さくなるように超音波発振器4
1が制御される。測定された振幅幅が記憶された振幅幅
と等しくなればゲート回路50を閉じ、加工ヘッド20
を上昇させ、砥石に次の穴Waが対応する位置へテーブ
ルエ2を移動させる・続いて上述した加工と同じ超音波
加工を行う。このとき、砥石32の振動は、最適な振幅
幅となっているため、良好な加工が行われる。When an amplitude measurement command is issued, the table 12 moves to a position where the displacement sensor 40 corresponds to the grindstone 32, and the processing head 20 descends to a position where the grindstone 32 approaches the displacement sensor 40. When the grindstone 32 is vibrated while the rotation of the main shaft 12 is stopped, a waveform signal is obtained from the displacement sensor 40. This waveform signal is shaped by a waveform shaping circuit 43, and the amplitude width of the shaped waveform signal is measured by an amplitude measuring circuit 44. The gate circuit 50 is opened only during amplitude measurement by the numerical controller 53, and the measured amplitude width signal is sent to the comparison circuit 5.
2, and the amplitude measurement circuit 51 is input to the comparison circuit 52.
The amplitude width signal stored in is input. If the measured amplitude width is smaller than the stored amplitude width, the ultrasonic oscillator 41 is controlled to increase the amplitude of the high-frequency current, and conversely, if the measured amplitude width is larger than the stored amplitude width, the high-frequency current is increased. Ultrasonic oscillator 4 so that the amplitude of the current is small
1 is controlled. When the measured amplitude width becomes equal to the stored amplitude width, the gate circuit 50 is closed and the processing head 20
is raised and the table 2 is moved to the position corresponding to the next hole Wa on the grindstone.Subsequently, the same ultrasonic processing as described above is performed. At this time, the vibration of the grindstone 32 has an optimal amplitude width, so that good machining can be performed.
なお、上述した実施例は、テーブル12上に変位センサ
40を設けた例について述べたが、コラム14にアーム
を水平面内で旋回できるように取付け、アームの先端に
変位センサを取付けても良い。In the above embodiment, the displacement sensor 40 is provided on the table 12, but an arm may be attached to the column 14 so as to be able to rotate in a horizontal plane, and the displacement sensor may be attached to the tip of the arm.
、〈発明の効果〉
以上述べたように本発明は、工具の振動方向で工具に対
応する位置に非接触式変位センサを設け、非接触式変位
センサによって得られた工具の実際の振幅幅があらかじ
め設定された工具の振幅幅になるように超音波発振器を
制御する発振器制御装置を設けた構造であるので、加工
中に振動子の温度が変化しても、工具の振幅幅を一定に
でき、加工積度を一定に保てる効果が得られる。, <Effects of the Invention> As described above, the present invention provides a non-contact displacement sensor at a position corresponding to the tool in the vibration direction of the tool, and the actual amplitude width of the tool obtained by the non-contact displacement sensor is The structure is equipped with an oscillator control device that controls the ultrasonic oscillator so that the amplitude width of the tool is set in advance, so even if the temperature of the vibrator changes during machining, the amplitude width of the tool can be kept constant. , the effect of keeping the machining volume constant is obtained.
図面は本発明の実施例を示すもので、第1図は超音波加
工機の全体図、第2図は加工並びに測定動作を示すフロ
ーチャート。
30・・・振動子、31・・・ホーン、32・・・砥石
(工具)、40・・・非接触式変位センサ、41・・・
超音波発振器、42・・・発振器制御装置、43・・・
波形整形回路、44・・・振幅測定回路。The drawings show an embodiment of the present invention, and FIG. 1 is an overall view of an ultrasonic processing machine, and FIG. 2 is a flowchart showing processing and measurement operations. 30... Vibrator, 31... Horn, 32... Grindstone (tool), 40... Non-contact displacement sensor, 41...
Ultrasonic oscillator, 42... Oscillator control device, 43...
Waveform shaping circuit, 44...amplitude measurement circuit.
Claims (1)
振動させ、この振動子の振動をホーンによって拡大して
工具に振動を与えるようにした超音波加工機において、
前記工具の振動方向で工具に対応する位置に非接触式変
位センサを設け、非接触式変位センサによって得られた
工具の実際の振幅幅があらかじめ設定された工具の振幅
幅になるように前記超音波発振器を制御する発振器制御
装置を設けたことを特徴とする超音波加工機。(1) In an ultrasonic processing machine in which a vibrator is vibrated by high-frequency current from an ultrasonic oscillator, and the vibration of this vibrator is magnified by a horn to give vibration to the tool,
A non-contact displacement sensor is provided at a position corresponding to the tool in the vibration direction of the tool, and the vibration is adjusted so that the actual amplitude width of the tool obtained by the non-contact displacement sensor becomes a preset amplitude width of the tool. An ultrasonic processing machine characterized by being provided with an oscillator control device that controls a sonic oscillator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2476188A JPH01199758A (en) | 1988-02-04 | 1988-02-04 | Ultrasonic machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2476188A JPH01199758A (en) | 1988-02-04 | 1988-02-04 | Ultrasonic machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01199758A true JPH01199758A (en) | 1989-08-11 |
Family
ID=12147132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2476188A Pending JPH01199758A (en) | 1988-02-04 | 1988-02-04 | Ultrasonic machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01199758A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002006007A1 (en) * | 2000-07-13 | 2002-01-24 | Designmecha Co., Ltd. | Micro-burnishing apparatus using ultrasonic vibration |
US20100296886A1 (en) * | 2007-10-30 | 2010-11-25 | Dirk Prust | Method for machining workpieces on a cutting machine tool |
CN109773594A (en) * | 2019-02-21 | 2019-05-21 | 山东理工大学 | It is a kind of to can be realized ultrasonic vibration and the compound knife handle of low-frequency vibration |
JP2020517469A (en) * | 2017-04-21 | 2020-06-18 | ゼネラル・エレクトリック・カンパニイ | Ultrasonic roller burnishing system and method, and component processing method |
-
1988
- 1988-02-04 JP JP2476188A patent/JPH01199758A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002006007A1 (en) * | 2000-07-13 | 2002-01-24 | Designmecha Co., Ltd. | Micro-burnishing apparatus using ultrasonic vibration |
US20100296886A1 (en) * | 2007-10-30 | 2010-11-25 | Dirk Prust | Method for machining workpieces on a cutting machine tool |
US8257002B2 (en) * | 2007-10-30 | 2012-09-04 | Chiron-Werke Gmbh & Co. Kg | Method for machining workpieces on a cutting machine tool |
JP2020517469A (en) * | 2017-04-21 | 2020-06-18 | ゼネラル・エレクトリック・カンパニイ | Ultrasonic roller burnishing system and method, and component processing method |
US11136635B2 (en) | 2017-04-21 | 2021-10-05 | General Electric Company | Ultrasonic roller burnishing system and method, and method for machining component |
CN109773594A (en) * | 2019-02-21 | 2019-05-21 | 山东理工大学 | It is a kind of to can be realized ultrasonic vibration and the compound knife handle of low-frequency vibration |
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