JPH01186901A - Optical disk substrate - Google Patents
Optical disk substrateInfo
- Publication number
- JPH01186901A JPH01186901A JP63011229A JP1122988A JPH01186901A JP H01186901 A JPH01186901 A JP H01186901A JP 63011229 A JP63011229 A JP 63011229A JP 1122988 A JP1122988 A JP 1122988A JP H01186901 A JPH01186901 A JP H01186901A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- terpolymer
- heat resistance
- vinyl monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 21
- 230000003287 optical effect Effects 0.000 title abstract description 20
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000178 monomer Substances 0.000 claims abstract description 18
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 13
- 229920001897 terpolymer Polymers 0.000 claims description 27
- 238000007334 copolymerization reaction Methods 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 abstract description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract 3
- 229920006027 ternary co-polymer Polymers 0.000 abstract 2
- 239000000203 mixture Substances 0.000 description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 16
- 239000011259 mixed solution Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 6
- 239000004926 polymethyl methacrylate Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical group CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- FRQQKWGDKVGLFI-UHFFFAOYSA-N 2-methylundecane-2-thiol Chemical compound CCCCCCCCCC(C)(C)S FRQQKWGDKVGLFI-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920001890 Novodur Polymers 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- -1 butyl peroxyisopropyl carbonate Chemical group 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は耐熱性がすぐれ、しかも低吸湿性および低複屈
折性の光学式ディスク基板に関する。さらにくわしくは
、三元共重合体を成形してなり、耐熱性か良好であるば
かりでなく、吸湿性がすぐれており、かつ複屈折性が低
い光学式ディスク基板に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an optical disk substrate having excellent heat resistance, low moisture absorption, and low birefringence. More specifically, the present invention relates to an optical disk substrate formed by molding a terpolymer, which not only has good heat resistance but also excellent moisture absorption and low birefringence.
光学式ディスクは、ビデオ、オーディオの分野のみなら
ず、文書ファイル、コンピューター用外部メモリにも使
用されるに及んでいる。これらの光学式ディスク類は半
導体レーザーを使って情報を記録、再生を行なっている
。そのため、これらの光学式ディスクの基板は、耐熱性
が良好であり、吸湿性および複屈折性のいずれも低く、
かつ透明性がすぐれており、しかも生産性が良好である
ことが要求されている。これらの要求により、コンパク
トディスク（ＣＤ）には、ポリカーボネート樹脂（以下
ｒＰｃＪと云う）が、またビデオディスク（ＬＶＤ）に
はポリメチルメタクリレート樹脂（以下ｒＰＭＭＡＪと
云う）が、さらに文書ファイルにはガラス、ＰＣおよび
ＰＭＭＡが利用されている。Optical discs are now being used not only in the video and audio fields, but also for document files and external memory for computers. These optical discs use semiconductor lasers to record and reproduce information. Therefore, the substrates of these optical disks have good heat resistance, low hygroscopicity and low birefringence, and
It is also required to have excellent transparency and good productivity. Due to these demands, compact discs (CDs) are made of polycarbonate resin (hereinafter referred to as rPcJ), video discs (LVD) are made of polymethyl methacrylate resin (hereinafter referred to as rPMMAJ), document files are made of glass, PC and PMMA are used.
しかし、コンピューター用外部メモリなどのごとく、情
報の書込み、消去、再生が可能な光学式ディスク基板は
前記のごときディスク基板類よりもさらに高度の耐熱性
、低吸湿性、低複屈折性が要求されている。このため、
種々のＰＣ類、低吸湿性ＰＭＭＡが提案されている。However, optical disk substrates that can write, erase, and read information, such as external memory for computers, require higher heat resistance, lower moisture absorption, and lower birefringence than the disk substrates mentioned above. ing. For this reason,
Various PCs and low hygroscopic PMMA have been proposed.
しかし、ＰＣ類では、成形性が悪く、しかも得られるデ
ィスク基板の複屈折が大きくなるという欠点かある。ま
た、ＰＭＭＡ類では、複屈折は良いが、吸湿性と耐熱性
のバランスが悪いという欠点がある。さらに、強化ガラ
スを使用することも提案されているがプリグループを形
成するさい、２Ｐ法によるために生産性が大幅に低下す
るばかりでなく、ディスクが割れるという欠点もある。However, PCs have disadvantages such as poor moldability and increased birefringence of the resulting disk substrate. Furthermore, although PMMA has good birefringence, it has the disadvantage of having a poor balance between hygroscopicity and heat resistance. Further, it has been proposed to use tempered glass, but since the 2P method is used to form the pre-group, not only is productivity significantly reduced, but there is also the drawback that the disk may break.
以上のごとく、従来の材料は、種々の物性および生産性
のバランスがとれていない。As described above, conventional materials are not balanced in various physical properties and productivity.
以上のことから、本発明はこれらの欠点（問題点）がな
く、すなわち耐熱性が良好であるばかりでなく、吸湿性
が低く、かつ光学的均一性がすぐれており、しかも射出
成形も可能であって生産性もよく光学式ディスク基板を
得ることである。From the above, the present invention does not have these drawbacks (problems), that is, it not only has good heat resistance, but also has low moisture absorption, excellent optical uniformity, and can be injection molded. The objective is to obtain an optical disc substrate with good productivity.
（課題を解決するための手段）
本発明にしたがえば、これらの問題点は、（Ａ）芳香族
系ビニル単量体、（８）シクロヘキシルマレイミドおよ
び（Ｃ）シクロへキシルメタクリレニドよりなる三元共
重合体を成形してなり、該三元共重合体中９シクロヘキ
シルマレイミドの共重合割合は１０〜６０重量％であり
、かつシクロヘキシルメタクリレートの共重合割合は５
〜４５重量％であり、しかも残部が芳香族系ビニル単量
体である光学式ディスク基板、によって解決することが
できる。以下、本発明を具体的に説明する。(Means for Solving the Problems) According to the present invention, these problems can be solved by (A) aromatic vinyl monomer, (8) cyclohexyl maleimide, and (C) cyclohexyl methacrylenide. It is formed by molding a terpolymer, and the copolymerization ratio of 9 cyclohexyl maleimide in the terpolymer is 10 to 60% by weight, and the copolymerization ratio of cyclohexyl methacrylate is 5%.
This problem can be solved by using an optical disk substrate in which the amount is 45% by weight and the remainder is aromatic vinyl monomer. The present invention will be explained in detail below.
本発明において使われる三元共重合体は芳香族系ビニル
単量体、シクロヘキシルマレイミドおよびシクロヘキシ
ルメタクリレートの三元共重合体である。The terpolymer used in the present invention is a terpolymer of aromatic vinyl monomer, cyclohexylmaleimide, and cyclohexyl methacrylate.
芳香族系ビニル単量体としては、スチレンおよびα−メ
チルスチレンかあげられ、特にスチレンが好ましい。Examples of the aromatic vinyl monomer include styrene and α-methylstyrene, with styrene being particularly preferred.
本発明の三元共重合体中のシクロヘキシルマレイミドの
共重合割合は１０〜６０重量％であり、１０〜５５重量
％が望ましく、とりわけ２０〜５５重量％が好適である
。該三元共重合体中のシクロヘキシルマレイミドの共重
合割合が１０重量％未満では、耐熱性の点においてよく
ない、一方、６０重量％を超えるならば、三元共重合体
がもろくなる。The copolymerization ratio of cyclohexylmaleimide in the terpolymer of the present invention is 10 to 60% by weight, preferably 10 to 55% by weight, and particularly preferably 20 to 55% by weight. If the copolymerization ratio of cyclohexylmaleimide in the terpolymer is less than 10% by weight, the heat resistance is not good, whereas if it exceeds 60% by weight, the terpolymer becomes brittle.
また、シクロヘキシルメタクリレートの共重合割合は５
〜４５重量％であり、１０〜４０重量％が好ましく、特
に１５〜３５重量％が好適である。三元共重合体中のシ
クロヘキシルメタクリレートの共重合割合が５重量％未
満では、三元共重合体がもろくなるばかりでなく、ディ
スク基板の複屈折が大きくなる。一方、４５重量％を超
えると、ディスク基板の耐熱性が悪くなる。In addition, the copolymerization ratio of cyclohexyl methacrylate is 5
-45% by weight, preferably 10-40% by weight, particularly preferably 15-35% by weight. If the copolymerization ratio of cyclohexyl methacrylate in the terpolymer is less than 5% by weight, not only the terpolymer becomes brittle but also the birefringence of the disk substrate increases. On the other hand, if it exceeds 45% by weight, the heat resistance of the disk substrate will deteriorate.
さらに、残部が芳香族系ビニル単量体であり、少なくと
も３０重量％であるか、多くとも８０重量％が望ましく
、とりわけ３０〜７０重量％が好適である。三元共重合
体中の芳香族系ビニル単量体の共重合割合が５重量％未
満では、該三元共重合体の吸湿性および複屈折が大きく
なる。一方、８０重量％を超えると複屈折が増大するば
かりでなく、耐熱性がよくない。Further, the remainder is an aromatic vinyl monomer, preferably at least 30% by weight, or preferably at most 80% by weight, and particularly preferably from 30 to 70% by weight. If the copolymerization ratio of the aromatic vinyl monomer in the terpolymer is less than 5% by weight, the hygroscopicity and birefringence of the terpolymer will increase. On the other hand, if it exceeds 80% by weight, not only birefringence increases but also heat resistance is poor.
以上の「芳香族系ビニル単量体、シクロヘキシルマレイ
ミドおよびアクリロニトリルの三元共重合体」 （以下
「三元共重合体」と云う）を後記のごとく成形して光学
式ディスク基板を製造するにあたり、該三元共重合体を
そのまま成形してもよく、また三元共重合体が有する物
性をそこなわない程度にスチレン系樹脂の分野において
一般に添加されている酸化防止剤、紫外線吸収剤、帯電
防止剤および離型剤のごとき添加剤をさらに配合しても
よい、これらの添加剤を配合するさい、合成樹脂の分野
において広く用いられているヘンシェルミキサーのごと
き混合機を使用してトライブレンドしてもよく、また押
出機、バンバリーミキサ−、ニーダ−のごとき混合機を
使って溶融混練させてもよい。この場合、あらかじめト
ライブレンドし、得られる混合物をさらに溶融混練させ
ることによって一層均一な混合５Ｎ（組成物）を製造す
ることができる。In manufacturing an optical disc substrate by molding the above "terpolymer of aromatic vinyl monomer, cyclohexyl maleimide and acrylonitrile" (hereinafter referred to as "terpolymer") as described below, The terpolymer may be molded as is, and antioxidants, ultraviolet absorbers, and antistatic agents that are commonly added in the field of styrenic resins may be used to the extent that the physical properties of the terpolymer are not impaired. Additives such as agents and mold release agents may be further blended. When blending these additives, triblending is performed using a mixer such as a Henschel mixer, which is widely used in the field of synthetic resins. Alternatively, the mixture may be melt-kneaded using a mixer such as an extruder, Banbury mixer, or kneader. In this case, a more uniform mixed 5N (composition) can be produced by tri-blending in advance and further melt-kneading the resulting mixture.
三元共重合体および前記添加剤を含有する三元共重合体
の組成物を使って本発明の光学式ディスり基板は熱可塑
性樹脂の分野において行なわれているプレス成形させる
ことによって製造することができる。しかし、生産性の
点から、合成樹脂の分野において一般に行なわれている
射出成形法によって製造することが望ましい、とりわけ
、光学式ディスク基板の製造分野において行なわれてい
る成形法で射出成形することが好適である。The optical disc substrate of the present invention can be manufactured by press molding, which is performed in the field of thermoplastic resins, using a terpolymer composition containing a terpolymer and the above-mentioned additives. Can be done. However, from the viewpoint of productivity, it is desirable to manufacture the product using an injection molding method that is commonly used in the field of synthetic resins. suitable.
前記組成物を製造するために溶融混練する場合でもプレ
ス成形する場合でも、また射出成形する場合でも、三元
共重合体が溶融する温度範囲で実施する必要がある。し
かし、高い温度で実施すると、三元共重合体が熱劣化す
ることがある。これらのことから、一般には２２０〜３
５０℃の温度範囲て実施することが好ましく、特に２３
０〜３４０℃の温度範囲か好適である。Regardless of whether the composition is melt-kneaded, press-molded, or injection-molded to produce the composition, it is necessary to carry out the process within a temperature range in which the terpolymer melts. However, when carried out at high temperatures, the terpolymer may undergo thermal deterioration. From these reasons, generally 220-3
It is preferable to carry out at a temperature range of 50°C, especially at 23°C.
A temperature range of 0 to 340°C is preferred.
（作 用）
本発明の三元共重合体において、共重合成分であるシク
ロヘキシルマレイミドは該三元共重合体の耐熱性の向上
に効果がある。また、シクロヘキシルメタクリレートは
三元共重合体の可撓性を付与するのみならず、低複屈折
化に効果がある。さらに、芳香族系ビニル単量体は吸湿
性の低減および成形性の改良に効果があるばかりでなく
、シクロヘキシルマレイミドと組合わせることによって
得られる光学式ディスク基板を低複屈折性にさせる。(Function) In the terpolymer of the present invention, cyclohexylmaleimide, which is a copolymerization component, is effective in improving the heat resistance of the terpolymer. Furthermore, cyclohexyl methacrylate not only imparts flexibility to the terpolymer, but is also effective in reducing birefringence. Furthermore, the aromatic vinyl monomer is not only effective in reducing hygroscopicity and improving moldability, but also makes the resulting optical disk substrate have low birefringence when combined with cyclohexylmaleimide.
（実施例および比較例）
以下、実施例によって本発明をさらにくわしく説明する
。(Examples and Comparative Examples) Hereinafter, the present invention will be explained in more detail with reference to Examples.
なお、実施例および比較例において、“複屈折”は自動
エリプソメーターを使って測定した。In addition, in Examples and Comparative Examples, "birefringence" was measured using an automatic ellipsometer.
使用した波長はＨｅ−Ｎｅレーザーの６３３０−である
。The wavelength used was 6330- of a He-Ne laser.
値はダブルバスてのレタデーションを示す。また、“透
明性”は分光光度計を用い、 ７８０ｎｍおよび８３
Ｑｎ＠の透過率を計測した。さらに、′光弾性定数”は
前記の自動エリプソメーターに荷重装置を取付け、下式
により計算にて求めた。The value indicates the retardation for double bass. In addition, "transparency" was measured using a spectrophotometer at 780 nm and 83 nm.
The transmittance of Qn@ was measured. Furthermore, the ``photoelastic constant'' was determined by attaching a loading device to the above-mentioned automatic ellipsometer and calculating it using the following formula.
Ｒ＝ｄＣσ
Ｒニレタデ−ジョン
ｄ：試料の厚さ
σ：応力
Ｃ：光弾性定数
また、“吸水性”はＡＳＴＭθ５７０にしたがって測定
した。さらに“耐熱性”はＡＳＴＭ Ｄ６４８に従って
測定した。R=dCσ R Nitradiation d: Thickness of sample σ: Stress C: Photoelastic constant Further, “water absorption” was measured according to ASTM θ570. Furthermore, "heat resistance" was measured according to ASTM D648.
実施例 ｌ
あらかじめ室温（２３℃）において４５重量部のスチレ
ン、４０重量部のシクロヘキシルマレイミドおよび１５
重量部のシクロヘキシルメタクリレートを加え、均一に
なるように混合した。この混合液（以下「混合液（１）
」と云う〕に０．２重量部の第三級ドデシルメルカプタ
ン（連鎖移動剤として）、 ０．１重量部のラウリルパ
ーオキサイド（重合開始剤として）および０．３５重量
部の第三級ブチルパーオキシイソプロピルカーボネート
を加え、均一になるようにモノマー混合液（以下混合液
（■）」と云う）を製造した。Example l 45 parts by weight of styrene, 40 parts by weight of cyclohexylmaleimide and 15 parts by weight were prepared in advance at room temperature (23°C).
Parts by weight of cyclohexyl methacrylate were added and mixed uniformly. This mixed liquid (hereinafter referred to as “mixed liquid (1)”)
], 0.2 parts by weight of tertiary dodecyl mercaptan (as a chain transfer agent), 0.1 parts by weight of lauryl peroxide (as a polymerization initiator) and 0.35 parts by weight of tertiary butyl peroxide. Oxyisopropyl carbonate was added to produce a homogeneous monomer mixture (hereinafter referred to as mixture (■)).
このようにして得られた混合液（ｎ）から４０重量部を
窒素導入管、撹拌機および温度計を装着したオートクレ
ーブ中に仕込み、さらに０．３重量部のリン酸カルシウ
ム（分散剤として） ０．０００４５重量部のドデシ
ルベンゼンスルホン酸ソーダ（分散安定剤として）およ
び５０重量部の水を仕込み、８０℃において撹拌しなが
ら２時間反応させた後、１時間かけて１２０℃まで昇温
させ、この温度において２時間反応させた後、さらに１
３５°Ｃに系内の温度を上昇させた後、直ちに系内をほ
ぼ室温まで放冷した後、塩酸によりｐＨ１にし、撹拌し
た後、充分な水洗、ろ過および充分な乾燥からなる後処
理を行なった。その結果、ビーズ状の重合体が得られた
。重合体の収量は、理論値に対して９８．１％であった
。40 parts by weight of the mixture (n) thus obtained was charged into an autoclave equipped with a nitrogen inlet tube, a stirrer and a thermometer, and 0.3 parts by weight of calcium phosphate (as a dispersant) 0.00045 Parts by weight of sodium dodecylbenzenesulfonate (as a dispersion stabilizer) and 50 parts by weight of water were charged and reacted at 80°C for 2 hours with stirring, then heated to 120°C over 1 hour, and at this temperature. After reacting for 2 hours, add 1 more
After raising the temperature inside the system to 35°C, the inside of the system was immediately allowed to cool down to approximately room temperature, and after adjusting the pH to 1 with hydrochloric acid and stirring, a post-treatment consisting of sufficient water washing, filtration, and sufficient drying was performed. Ta. As a result, bead-shaped polymers were obtained. The yield of polymer was 98.1% of theory.
実施例 ２
あらかじめ室温において３５重量部のスチレン、５３重
量部のシクロヘキシルマレイミドおよび１２重量部のシ
クロヘキシルメタクリレートを均一になるよう撹拌し、
混合液を製造した。実施例１において混合液（ｒ［）を
製造するさいにこのようにして得られた混合液を用い、
また、第三級ブチルパーオキシイソプロピルカーボネー
トのかわりに、 ０．１重量部のアゾイソブチロニトリ
ルを使ったほかは、実施例１と同様にモノマー混合液を
製造した。Example 2 35 parts by weight of styrene, 53 parts by weight of cyclohexylmaleimide and 12 parts by weight of cyclohexyl methacrylate were stirred uniformly at room temperature in advance.
A mixed solution was produced. In Example 1, when producing the mixed solution (r[), the mixed solution obtained in this way was used,
A monomer mixture was also produced in the same manner as in Example 1, except that 0.1 part by weight of azoisobutyronitrile was used instead of tertiary butyl peroxyisopropyl carbonate.
実施例１において重合を行なうさいに使用した混合液の
かわりに、４０重量部の前記七ツマー混合液を用い、７
０℃において３時間反応させた後、９０分間かけて１０
０℃まで昇温させ、この温度において２時間反応させた
。ついで１２０℃まで昇温させた後、直ちに室温まで放
冷させて重合を行なったほかは、実施例１と同様に重合
および後処理を行な９た。その結果、ビーズ状の重合体
が得られた０重合体の収量は理論値に対して９７．７％
であった。In place of the mixed solution used in the polymerization in Example 1, 40 parts by weight of the above 7-mer mixed solution was used,
After reacting for 3 hours at 0°C, 10
The temperature was raised to 0° C., and the reaction was continued at this temperature for 2 hours. Polymerization and post-treatment were carried out in the same manner as in Example 1, except that the temperature was raised to 120° C. and then immediately cooled to room temperature. As a result, the yield of 0 polymer, in which bead-shaped polymers were obtained, was 97.7% of the theoretical value.
Met.
実施例 ３
実施例１において使用した混合液（Ｉ）のかわりに、２
５重量部のスチレン、２０重量部のα−メチルスチレン
、４０重量部のシクロヘキシルマレイミドおよび１５重
量部のシクロヘキシルメタクリレートからなる混合液を
用い、さらに混合液（ＩＩ）を製造するさいに、この混
合液とラウリルパーオキサイドの使用量を０．１５重量
部にかえたほかは、実施例１と同様にモノマー混合液を
製造した。この七ツマー混合液を使って実施例１と同様
に反応を行なった後、後処理を行なった。その結果、ビ
ーズ状の重合体か得られた０重合体の収量は、理論値に
対して９５．６％であった。Example 3 Instead of the mixed solution (I) used in Example 1, 2
A mixed solution consisting of 5 parts by weight of styrene, 20 parts by weight of α-methylstyrene, 40 parts by weight of cyclohexylmaleimide and 15 parts by weight of cyclohexyl methacrylate is used to further produce the mixed solution (II). A monomer mixture was produced in the same manner as in Example 1, except that the amounts of lauryl peroxide and monomer were changed to 0.15 parts by weight. After carrying out a reaction in the same manner as in Example 1 using this seven-mer mixture, post-treatment was carried out. As a result, the yield of bead-shaped polymer was 95.6% of the theoretical value.
比較例 ｌ
実施例１において使用した混合液（Ｉ）のかわりに、４
５重量部のスチレン、４０重量部のシクロヘキシルマレ
イミドおよび１５重量部のメチルメタクリレートからな
る混合液を用い、さらに混合液（ＩＩ）を製造するさい
に、得られた該混合液を用い、かつラウリルパーオキサ
イドの使用量を０．０５重量部にかえたほかは、実施例
１と同様に七ツマー混合液（混合液（■）に相当）を製
造した。Comparative Example l Instead of the mixed solution (I) used in Example 1, 4
Using a mixed solution consisting of 5 parts by weight of styrene, 40 parts by weight of cyclohexylmaleimide and 15 parts by weight of methyl methacrylate, and further using the obtained mixed solution when producing mixed solution (II), A 7-mer mixed solution (corresponding to the mixed solution (■)) was produced in the same manner as in Example 1, except that the amount of oxide used was changed to 0.05 part by weight.
この七ツマー混合液を使って実施例１と同様に反応を行
なった後、後処理を行なった。その結果、数色のビーズ
状の重合体が得られた０重合体の収量は、理論値に対し
て９８．５％であった。After carrying out a reaction in the same manner as in Example 1 using this seven-mer mixture, post-treatment was carried out. As a result, the yield of 0 polymer, in which bead-shaped polymers of several colors were obtained, was 98.5% of the theoretical value.
比較例 ２．３
実施例１において使フな混合液のかわりに、４５重量部
のスチレン、４０重量部のＮ−フェニルマレイミドおよ
び１５重量部のシクロヘキシルメタクリレートからなる
混合液（比較例２）ならびに３０重量部のスチレン、３
０重量部のシクロヘキシルマレイミドおよび４０重量部
のシクロヘキシルメタクリレートからなる混合液（比較
例３）をあらかじめ製造した。Comparative Example 2.3 Instead of the unused mixture in Example 1, a mixture consisting of 45 parts by weight of styrene, 40 parts by weight of N-phenylmaleimide and 15 parts by weight of cyclohexyl methacrylate (Comparative Example 2) and 30 parts by weight were used. parts by weight styrene, 3
A mixed solution (Comparative Example 3) consisting of 0 parts by weight of cyclohexyl maleimide and 40 parts by weight of cyclohexyl methacrylate was prepared in advance.
実施例１において混合液（ＩＩ）を製造するさいにこの
ようにして製造した各混合液を使９たほかは、実施例１
と同様にモノマー混合液を製造した。実施例１において
重合を行なうさい、前記混合液（ｎ）のかわりに、この
ようにして製造した七ツマー混合液を使用したほか体、
実施例１と同じ条件で重合および後処理を行ない、各重
合体を製造した。得られた重合体の収量は、理論値に対
してそれぞれ９８．３％（比較例２）および９８．０％
（比較例３）でありた。Example 1 except that each of the mixed liquids produced in this way was used in producing the mixed liquid (II) in Example 1.
A monomer mixture was prepared in the same manner as in . In addition, when carrying out the polymerization in Example 1, the 7-mer mixture prepared in this way was used instead of the mixture (n).
Polymerization and post-treatment were carried out under the same conditions as in Example 1 to produce each polymer. The yields of the obtained polymers were 98.3% (Comparative Example 2) and 98.0% of the theoretical value, respectively.
(Comparative Example 3).
実施例１ないし３ならびに比較例１ないし３によって得
られた各重合体１００重量部に０．１重量部のテトラキ
ス（メチレン−３−（３°５°−ジー第三級−ブチル−
４°−ヒドロキシフェニル）プロピオネート）メタンを
ベント付二軸押出機（径 ３０ｔｉｌｌ）を使い、樹脂
温度が２３０℃において溶融させながら混線を行ない、
各ベレットを製造し、試験に供した。0.1 part by weight of tetrakis(methylene-3-(3°5°-di-tert-butyl-
4°-Hydroxyphenyl) propionate) methane was mixed using a vented twin-screw extruder (diameter 30 till) while melting the resin at a temperature of 230°C.
Each pellet was manufactured and subjected to testing.
実施例工ないし３および比較例１ないし３によりて得ら
れた各重合体に酸化防止剤を含有させた各ベレットを樹
脂温度が３２０℃ならびに分子量が約ｔｓ、ｏｏｏであ
るビスフェノールＡとホスゲンとを結合させたポリカー
ボネート樹脂（比較例４）を樹脂温度が３２０℃および
分子量か約７５，０００であるポリメチルメタクリレー
ト樹脂（比較例５）を樹脂温度が２８０℃においてそれ
ぞれ射出成形を行ない、外径が１３０１および厚さが１
．２■−の光学式ディスク基板を製造した。このように
して得られた光学式ディスク基板の複屈折、透明性、光
弾性定数、吸水性および耐熱性の測定を行なった。それ
らの結果を第１表に示す。Each pellet obtained by adding an antioxidant to each polymer obtained in Examples 1 to 3 and Comparative Examples 1 to 3 was heated to a resin temperature of 320°C and bisphenol A and phosgene having a molecular weight of about ts, ooo. The bonded polycarbonate resin (Comparative Example 4) was injection molded at a resin temperature of 320°C, and the polymethyl methacrylate resin (Comparative Example 5) having a molecular weight of about 75,000 was injection molded at a resin temperature of 280°C. 1301 and thickness 1
．． An optical disk substrate of 2.2- was manufactured. The birefringence, transparency, photoelastic constant, water absorption, and heat resistance of the optical disc substrate thus obtained were measured. The results are shown in Table 1.
以上の実施例および比較例の結果から、本発明の三元共
重合体の複屈折が小さく、透明性がすぐれているばかり
でなく、光弾性定数も小さい。すなわち、得られる光学
式ディスク基板を回転させて使用するさいに複屈折が小
さい。また吸水による変形も小さく、耐熱性は市販され
ている光学式ディスク基板の製造に用いられているポリ
カーボネート樹脂およびポリメチルメタクリレート樹脂
に対して高いために熱による変形やレーザーによる情報
の書き込み時のプリグループの損傷も抑止することかで
きることが明らかである。From the results of the above Examples and Comparative Examples, the terpolymer of the present invention not only has low birefringence and excellent transparency, but also has a small photoelastic constant. That is, when the obtained optical disk substrate is rotated and used, the birefringence is small. In addition, deformation due to water absorption is small, and its heat resistance is higher than that of polycarbonate resin and polymethyl methacrylate resin, which are used to manufacture commercially available optical disk substrates. It is clear that group damage can also be inhibited.
（発明の効果）
以上のごとく、本発明の光学式ディスク基板の製造に用
いられる三元共重合体は透明性、耐熱性、低吸湿性およ
び低複屈折性ともすぐれているばかりでなく、従来の光
学式ディスクと同様に射出成形も可能なため、生産性が
よく製造することができ、コンパクトディスクおよびビ
デオディスクとして利用することができる。(Effects of the Invention) As described above, the terpolymer used for manufacturing the optical disk substrate of the present invention not only has excellent transparency, heat resistance, low moisture absorption, and low birefringence, but also has Because it can be injection molded like other optical discs, it can be manufactured with high productivity and can be used as compact discs and video discs.
Claims (1)
レイミドおよび（Ｃ）シクロヘキシルメタクリレートよ
りなる三元共重合体を成形してなり、該三元共重合体中
のシクロヘキシルマレイミドの共重合割合は１０〜６０
重量％であり、かつシクロヘキシルメタクリレートの共
重合割合は５〜４５重量％であり、しかも残部が芳香族
系ビニル単量体である光学式ディスク基板。A terpolymer consisting of (A) aromatic vinyl monomer, (B) cyclohexylmaleimide, and (C) cyclohexyl methacrylate is molded, and the copolymerization ratio of cyclohexylmaleimide in the terpolymer is 10-60
% by weight, and the copolymerization ratio of cyclohexyl methacrylate is 5 to 45% by weight, and the remainder is an aromatic vinyl monomer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63011229A JPH01186901A (en) | 1988-01-20 | 1988-01-20 | Optical disk substrate |
| EP89106217A EP0390957A1 (en) | 1987-12-22 | 1989-04-07 | Optical disk substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63011229A JPH01186901A (en) | 1988-01-20 | 1988-01-20 | Optical disk substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01186901A true JPH01186901A (en) | 1989-07-26 |
Family
ID=11772117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63011229A Pending JPH01186901A (en) | 1987-12-22 | 1988-01-20 | Optical disk substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01186901A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5998556A (en) * | 1995-09-27 | 1999-12-07 | Nippon Shokubai Co., Ltd. | Raw material used for producing heat-resistant resins, heat-resistant resins, and process for producing heat-resistant resins |
| US10686220B2 (en) | 2013-04-04 | 2020-06-16 | Solvay Sa | Nonaqueous electrolyte compositions |
-
1988
- 1988-01-20 JP JP63011229A patent/JPH01186901A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5998556A (en) * | 1995-09-27 | 1999-12-07 | Nippon Shokubai Co., Ltd. | Raw material used for producing heat-resistant resins, heat-resistant resins, and process for producing heat-resistant resins |
| US10686220B2 (en) | 2013-04-04 | 2020-06-16 | Solvay Sa | Nonaqueous electrolyte compositions |
| US10916805B2 (en) | 2013-04-04 | 2021-02-09 | Solvay Sa | Nonaqueous electrolyte compositions |
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