JPH01184914A - Solid electrolytic capacitor - Google Patents
Solid electrolytic capacitorInfo
- Publication number
- JPH01184914A JPH01184914A JP983088A JP983088A JPH01184914A JP H01184914 A JPH01184914 A JP H01184914A JP 983088 A JP983088 A JP 983088A JP 983088 A JP983088 A JP 983088A JP H01184914 A JPH01184914 A JP H01184914A
- Authority
- JP
- Japan
- Prior art keywords
- water
- metal wire
- valve
- repellent plate
- semiconductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims description 12
- 239000007787 solid Substances 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000005871 repellent Substances 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000007767 bonding agent Substances 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 238000007602 hot air drying Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000002940 repellent Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 241000287828 Gallus gallus Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012452 mother liquor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Spark Plugs (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は固体電解コンデンサに関するものである。[Detailed description of the invention] Industrial applications The present invention relates to solid electrolytic capacitors.
従来の技術
従来のタンタル固体電解コンデンサ、特にチップ形タン
タル固体電解コンデンサは、第４図に示すような構成で
ある。すなわち、１は電極体、６は電極体１に埋め込ま
れている弁作用金属線、２は弁作用金属線に挿入されて
いる撥水性板である。2. Description of the Related Art A conventional tantalum solid electrolytic capacitor, particularly a chip-type tantalum solid electrolytic capacitor, has a structure as shown in FIG. That is, 1 is an electrode body, 6 is a valve metal wire embedded in the electrode body 1, and 2 is a water-repellent plate inserted into the valve metal wire.
それらにコンデンサの陽極及び陰極の引出しとして陽極
引出し端子４と陰極引出し端子３が接続されておシ、そ
して全体を外装樹脂５により被覆し、陽極引出し端子４
及び陰極引出し端子３を外装樹脂５の両側面及び底面に
沿って折り曲げた構成である。An anode lead terminal 4 and a cathode lead terminal 3 are connected to these as drawers for the anode and cathode of the capacitor, and the whole is covered with an exterior resin 5, and the anode lead terminal 4
Also, the cathode lead terminal 3 is bent along both side surfaces and the bottom surface of the exterior resin 5.
発明が解決しようとする課題
しかしながら、このような従来の撥水性板を弁作用金属
線に挿入しただけの構成では、誘電体層。Problems to be Solved by the Invention However, in the conventional structure in which such a water-repellent plate is simply inserted into the valve metal wire, the dielectric layer cannot be removed.
半導体層を形成する際に撥水性板が弁作用金属線や電極
体面との密着が悪くなり、浮き上がってしまい、弁作用
金属線への半導体母液の這い上がり現象が起こってしま
う場合があシ、組立を行なうと漏れ電流不良や、最悪の
場合、短絡状態になシ、コンデンサとしての機能をはた
さなくなってしまう。When forming a semiconductor layer, the water-repellent plate may not adhere well to the valve metal wire or the electrode body surface and may float, causing the semiconductor mother liquor to creep up onto the valve metal wire. When assembled, a leakage current may occur, or in the worst case, a short circuit may occur, causing the capacitor to no longer function as a capacitor.
また、撥水性板を弁作用金属線に挿入しただけでは、組
立時に加わってしまう弁作用金属線の根元への機械的ス
トレスは防げずに、これもまた漏れ電流不良になってし
まっていた。Furthermore, simply inserting a water-repellent plate into the valve metal wire does not prevent mechanical stress on the base of the valve metal wire during assembly, which also results in leakage current failure.
本発明は、このような従来の課題を解決するためのもの
である。The present invention is intended to solve such conventional problems.
課題を解決するだめの手段
そこで、本発明は、弁作用を有する金属粉末に弁作用を
有する金属線を植設して成形、焼結してなる電極体の前
記金属線を植設した根元部に撥水性を有する絶縁部材を
固着させ、誘電体層、半導体層、陰極層を形成するもの
である。Means for Solving the Problems Therefore, the present invention provides a base portion of an electrode body in which a metal wire having a valve action is implanted into a metal powder having a valve action, and formed and sintered. A dielectric layer, a semiconductor layer, and a cathode layer are formed by fixing a water-repellent insulating member to the substrate.
作用
本発明は以上の構成によシ、撥水性板の浮き上がり及び
組立時の弁作用金属線の根元に加わる機械的ストレスを
防止することが出来る。Operation The present invention can prevent lifting of the water-repellent plate and mechanical stress applied to the root of the valve action metal wire during assembly due to the above-described configuration.
実施例
以下本発明の一実施例を第１図〜第３図の図面を用いて
説明する。EXAMPLE Hereinafter, an example of the present invention will be explained using the drawings of FIGS. 1 to 3.
第２図の様に誘電体層及び半導体層の形成及び組立に便
利なように焼結体をステンレス等の帯状の金属板８に溶
接するが、その時、弁作用金属線６に撥水性板２を挿入
しながら、撥水性板２と焼結体との間にシリコン系の接
着剤７をはさみ込む。As shown in FIG. 2, the sintered body is welded to a belt-shaped metal plate 8 made of stainless steel or the like for convenience in forming and assembling the dielectric layer and the semiconductor layer. While inserting the silicon adhesive 7 between the water repellent plate 2 and the sintered body.
その後、さらに密着させた後、熱風乾燥器で約１２５’
Ｃ，１０分〜１６分硬化させた後、誘電体層、半導体層
を形成させ、組立を行い、第１図に示すチップ状のタン
タル電解コンデンサとした。After that, after further adhesion, it is dried in a hot air dryer for about 125'
C. After curing for 10 to 16 minutes, a dielectric layer and a semiconductor layer were formed and assembled to form a chip-shaped tantalum electrolytic capacitor as shown in FIG.
ここで、チップタンタル定格１６Ｖ、１０μＦの製品に
本発明を実施し、そして表１に撥水性板の浮き上がシネ
良の状況を、表２に組立時の機械的ストレスが弁作用金
属線の根元に加わシ漏れ電流（ＬＣ）が大きくなる組立
・完成不良率の状況を、また第３図に半田耐熱テスト（
半田デイツプ法２６０’Ｃ，１０秒浸漬）の結果をそれ
ぞれ従来品と比較して示す。Here, the present invention was implemented on a product with a chip tantalum rating of 16 V and 10 μF, and Table 1 shows the situation where the water repellent plate lifted up well and the mechanical stress during assembly was good. Figure 3 shows the situation of the assembly/completion defect rate where the leakage current (LC) applied to the root increases, and the solder heat resistance test (
The results of the solder dip method (260'C, 10 second immersion) are shown in comparison with conventional products.
表１
表２
表１からも従来の撥水性板を挿入しただけでは６５００
個中８個中撥水性板の浮き上がシが観られたが、本発明
のように撥水性板と電極体を接着してしまう構造では、
７０００個中浮き上がりは０個となった。又、組立・完
成時のＬＣ不良を比較すると、従来品では６３００個中
２１５個ＬＣ不良になくいたものが、本発明を行なうこ
とによって６８００個中９１個ＬＣ不良となシ激減した
。Table 1 Table 2 From Table 1, just inserting the conventional water-repellent plate costs 6,500 yen.
Lifting of the water-repellent plate was observed in 8 of the samples, but with the structure of the present invention in which the water-repellent plate and the electrode body are bonded,
Out of 7000 pieces, 0 pieces were raised. Furthermore, when comparing the number of LC defects at the time of assembly and completion, the conventional product had 215 LC defects out of 6,300, but by implementing the present invention, the number was drastically reduced to 91 out of 6,800 LC defects.
また、半田耐熱テストにおいても同様に本発明を実施し
たものは、ＬＣ不良の発生が減少しておシ、本発明が優
位であることがわかる。Furthermore, in the solder heat resistance test, the occurrence of LC defects was reduced in the solder heat resistance test in which the present invention was similarly applied, and it can be seen that the present invention is superior.
発明の詳細
な説明したように本発明によれば、弁作用金属線に挿入
した撥水性板と電極体を接着固定することにより、撥水
性板の浮き上がりを防止すると共に、弁作用金属線の根
元に加わる機械的ストレスを防止することができる。DETAILED DESCRIPTION OF THE INVENTION According to the present invention, by adhesively fixing the water-repellent plate inserted into the valve-acting metal wire and the electrode body, lifting of the water-repellent plate is prevented, and the base of the valve-acting metal wire is It is possible to prevent mechanical stress from being applied to the
第１図は本発明の一実施例によるチップ状タンタル電解
コンデンサの断面図、第２図は本発明のコンデンサの製
造方法の一例を示す平面図、第３図は本発明と従来品と
の半田耐熱テストによるＬＣの劣化特性を表わした特性
図、第４図は従来のチップ状タンタル電解コンデンサの
断面図である。
１・・・・・・電極体、２・・・・・・撥水性板、３・
・・・・・陰極引出し端子、４・・・・・・陽極引出し
端子、６・・・・・・外装樹脂、６・・・・・・弁作用
金属線、７・・・・・・接着剤。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名／−
一一電＆Ａ本
？−づ亮７１（性版
３− 謄徊３１七し篇子
４− 鶏攻３ｊカレ篇チ
５−−一外裏創脂
第１図 ６−弁作Ｍ４烏線
７−−＃１）Ｆす
第３図FIG. 1 is a cross-sectional view of a chip-shaped tantalum electrolytic capacitor according to an embodiment of the present invention, FIG. 2 is a plan view showing an example of the method for manufacturing a capacitor of the present invention, and FIG. 3 is a solder diagram of the present invention and a conventional product. FIG. 4 is a characteristic diagram showing the deterioration characteristics of LC by a heat resistance test, and is a cross-sectional view of a conventional chip-shaped tantalum electrolytic capacitor. 1... Electrode body, 2... Water repellent plate, 3.
...Cathode lead-out terminal, 4...Anode lead-out terminal, 6...Exterior resin, 6...Valve metal wire, 7...Adhesion agent. Name of agent: Patent attorney Toshio Nakao and 1 other person/-
Ichiden & A book? -Zu Ryo 71 (Sex version 3- Mibun 31 Nanashi Henshi 4- Chicken Attack 3j Kare Henchi 5--Ichigai Ura Sobutsu Figure 1 6- Bensaku M4 Karasusen 7--#1) Fsu Figure 3
Claims (1)
設して成形、焼結してなる電極体の前記金属線を植設し
た根元部に、撥水性を有する絶縁部材を固着させ、誘電
体層、半導体層、陰極層を形成してなる固体電解コンデ
ンサ。A water-repellent insulating member is fixed to the base of the electrode body where the metal wire is implanted, and a dielectric A solid electrolytic capacitor consists of a body layer, a semiconductor layer, and a cathode layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP983088A JPH01184914A (en) | 1988-01-20 | 1988-01-20 | Solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP983088A JPH01184914A (en) | 1988-01-20 | 1988-01-20 | Solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01184914A true JPH01184914A (en) | 1989-07-24 |
Family
ID=11731049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP983088A Pending JPH01184914A (en) | 1988-01-20 | 1988-01-20 | Solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01184914A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7042190B2 (en) | 2003-01-16 | 2006-05-09 | Toyota Jidosha Kabushiki Kaisha | Motor control apparatus and motor control method |
-
1988
- 1988-01-20 JP JP983088A patent/JPH01184914A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7042190B2 (en) | 2003-01-16 | 2006-05-09 | Toyota Jidosha Kabushiki Kaisha | Motor control apparatus and motor control method |
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