JPH01176936U - - Google Patents
Info
- Publication number
- JPH01176936U JPH01176936U JP7290888U JP7290888U JPH01176936U JP H01176936 U JPH01176936 U JP H01176936U JP 7290888 U JP7290888 U JP 7290888U JP 7290888 U JP7290888 U JP 7290888U JP H01176936 U JPH01176936 U JP H01176936U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- contact hole
- types
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
Description
第１図は本考案の一実施例の上面図であり、第
２図は従来技術の一例の上面図である。
１，６，７，８，９……上層配線、２……下層
配線、３……コンタクト・ホール、４……上層配
線の幅、５……下層配線の幅。尚、同一符号は同
一部分を示す。
FIG. 1 is a top view of an embodiment of the present invention, and FIG. 2 is a top view of an example of the prior art. 1, 6, 7, 8, 9...upper layer wiring, 2...lower layer wiring, 3...contact hole, 4...width of upper layer wiring, 5...width of lower layer wiring. Note that the same reference numerals indicate the same parts.
Claims (1)
的に接続するコンタクト・ホールにおいて接続さ
れる二種類の配線の配線幅より大きなコンタクト
・ホールを持つことを特徴とする半導体集積回路
。 A semiconductor integrated circuit characterized by having a contact hole that electrically connects two types of wiring layers in the semiconductor integrated circuit and has a contact hole that is larger than the wiring width of two types of wiring to be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7290888U JPH01176936U (en) | 1988-05-31 | 1988-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7290888U JPH01176936U (en) | 1988-05-31 | 1988-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176936U true JPH01176936U (en) | 1989-12-18 |
Family
ID=31298061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7290888U Pending JPH01176936U (en) | 1988-05-31 | 1988-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176936U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012623A (en) * | 1996-06-20 | 1998-01-16 | Semiconductor Energy Lab Co Ltd | Integrated circuit and its manufacture |
| JP2009515361A (en) * | 2005-11-07 | 2009-04-09 | フリースケール セミコンダクター インコーポレイテッド | Fine pitch interconnects and methods of making the same |
| JP2012080124A (en) * | 2005-06-28 | 2012-04-19 | Semiconductor Energy Lab Co Ltd | Electronic appliance |
-
1988
- 1988-05-31 JP JP7290888U patent/JPH01176936U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012623A (en) * | 1996-06-20 | 1998-01-16 | Semiconductor Energy Lab Co Ltd | Integrated circuit and its manufacture |
| KR100480675B1 (en) * | 1996-06-20 | 2005-09-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Electronic devices, integrated circuits and their fabrication methods |
| JP2012080124A (en) * | 2005-06-28 | 2012-04-19 | Semiconductor Energy Lab Co Ltd | Electronic appliance |
| JP2009515361A (en) * | 2005-11-07 | 2009-04-09 | フリースケール セミコンダクター インコーポレイテッド | Fine pitch interconnects and methods of making the same |