JPH01168867A - Production of article coated with copper film - Google Patents
Production of article coated with copper filmInfo
- Publication number
- JPH01168867A JPH01168867A JP62325569A JP32556987A JPH01168867A JP H01168867 A JPH01168867 A JP H01168867A JP 62325569 A JP62325569 A JP 62325569A JP 32556987 A JP32556987 A JP 32556987A JP H01168867 A JPH01168867 A JP H01168867A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- article
- acid
- copper film
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 37
- 239000010949 copper Substances 0.000 title claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 22
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims abstract description 10
- 239000005750 Copper hydroxide Substances 0.000 claims abstract description 10
- 229910001956 copper hydroxide Inorganic materials 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 239000012298 atmosphere Substances 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 14
- 150000007524 organic acids Chemical class 0.000 claims description 8
- 230000006866 deterioration Effects 0.000 claims description 5
- 239000005749 Copper compound Substances 0.000 claims description 3
- 150000001880 copper compounds Chemical class 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 abstract description 10
- 235000011187 glycerol Nutrition 0.000 abstract description 5
- 239000002253 acid Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 239000012299 nitrogen atmosphere Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 150000001879 copper Chemical class 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- -1 polyethylene Polymers 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
- 235000011054 acetic acid Nutrition 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical group OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- OIBIEVMGTDETCN-GGWOSOGESA-N (2e,6e)-octa-2,6-diene-4,5-diol Chemical compound C\C=C\C(O)C(O)\C=C\C OIBIEVMGTDETCN-GGWOSOGESA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- ZTBHEZIOGARBOD-UHFFFAOYSA-N 2,3,4-trimethylpentane-2,3,4-triol Chemical compound CC(C)(O)C(C)(O)C(C)(C)O ZTBHEZIOGARBOD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- 102100028541 Guanylate-binding protein 2 Human genes 0.000 description 1
- 101001058858 Homo sapiens Guanylate-binding protein 2 Proteins 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 241000750631 Takifugu chinensis Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- YIYBQIKDCADOSF-UHFFFAOYSA-N alpha-Butylen-alpha-carbonsaeure Natural products CCC=CC(O)=O YIYBQIKDCADOSF-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000001014 amino acid Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- KUQWZSZYIQGTHT-UHFFFAOYSA-N hexa-1,5-diene-3,4-diol Chemical compound C=CC(O)C(O)C=C KUQWZSZYIQGTHT-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- YIYBQIKDCADOSF-ONEGZZNKSA-N trans-pent-2-enoic acid Chemical compound CC\C=C\C(O)=O YIYBQIKDCADOSF-ONEGZZNKSA-N 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、熱硬化性樹脂物品に銅被膜を形成する新規な
方法に関するものであり、本製造法による銅膜形成物品
は、特別の前処理をすることなく銅が強固に付着したも
のであり、しかもハロゲンなどの腐食性を有する元素を
全く含まないものであるので、そのままで或いは更に銅
その他の金属をメツキして、フィルム、シート、成形品
、繊維、布、粉、その他の各種形態の各種用途用物品に
好適に使用されるものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a novel method for forming a copper film on a thermosetting resin article, and the copper film-formed article produced by this manufacturing method is manufactured using a special preparatory process. Copper is firmly attached to it without any treatment, and it does not contain any corrosive elements such as halogens, so it can be used as it is or plated with copper or other metals to form films, sheets, etc. It is suitably used for molded articles, fibers, cloth, powder, and other articles for various purposes in various forms.
熱硬化性樹脂物品、例えば積層板に、銅被膜を形成する
方法としては、無電解メツキ法、蒸着法、圧接法、接着
剤による接着などがある。Methods for forming a copper coating on a thermosetting resin article, such as a laminate, include electroless plating, vapor deposition, pressure bonding, and bonding with an adhesive.
無電解メツキ法は、最も一般的であり優れた方法である
が、通常は用いる熱硬化性樹脂に応じた前処理を必須と
するものであり、その工程が煩雑であるという欠点を有
している。また、前処理工程を省くため或いは簡略化し
するためにジエン系ゴム等を予め配合してなる組成物層
を表面に形成した積層板を使用する方法があるが、熱硬
化性樹脂本来の性能が劣化する欠点があった。The electroless plating method is the most common and excellent method, but it usually requires pretreatment depending on the thermosetting resin used, and has the disadvantage that the process is complicated. There is. In addition, in order to omit or simplify the pretreatment process, there is a method of using a laminate on the surface of which a composition layer is formed by pre-blending diene rubber, etc., but the original performance of the thermosetting resin is It had the disadvantage of deterioration.
更に、通常の繊維や充填材強化された熱硬化性樹脂成形
品の場合、充填材等が成形品の表面に露出した部分には
、良好な密着性が得られないという欠点があった。Furthermore, in the case of thermosetting resin molded articles reinforced with ordinary fibers or fillers, there is a drawback in that good adhesion cannot be obtained in areas where the fillers and the like are exposed on the surface of the molded article.
蒸着法は、蒸着のための特別の設備を必須とし、大型品
の製造が困難であり、また樹脂の種類によっては接着性
を向上させるための前処理が必要であった。The vapor deposition method requires special equipment for vapor deposition, making it difficult to manufacture large products, and depending on the type of resin, pretreatment is required to improve adhesiveness.
更に、熱硬化性樹脂は通常接着剤としての性能を有する
ものであるので、銅張積層板などを製造することは容易
であるが、この場合、極薄銅膜を形成するこきは極めて
高価であり、また接着を適用する成形品の形状が限定さ
れたり、接着層が厚くなるなどの欠点があるものであっ
た。Furthermore, since thermosetting resins usually have properties as adhesives, it is easy to manufacture copper-clad laminates, etc., but in this case, the wood used to form ultra-thin copper films is extremely expensive. However, there are also disadvantages such as the shape of the molded product to which adhesive is applied is limited and the adhesive layer becomes thick.
本発明は、上記の事情に鑑み、簡便な方法により、経済
的で高品質の銅膜の形成された材料を提供する方法につ
いて検討した結果、完成したものである。In view of the above circumstances, the present invention was completed as a result of studies on a method of providing an economical and high-quality material with a copper film formed thereon by a simple method.
すなわち、本発明は、熱硬化性樹脂物品の所望部に、水
酸化銅又は有機酸銅から選択された銅化合物と多価アル
コールとを必須成分とする混合液を塗布した後、非酸化
性雰囲気中で１６５℃以上で該熱硬化性樹脂物品の変形
劣化温度以下の温度に加熱し保持することを特徴とする
銅膜形成物品の製造法である。That is, in the present invention, after applying a liquid mixture containing a copper compound selected from copper hydroxide or organic acid copper and a polyhydric alcohol as essential components to a desired part of a thermosetting resin article, a non-oxidizing atmosphere is applied. This is a method for producing a copper film-formed article, characterized by heating and holding the thermosetting resin article at a temperature of 165° C. or higher and lower than the deformation deterioration temperature of the thermosetting resin article.
以下、本発明について説明する。The present invention will be explained below.
本発明の熱硬化性樹脂物品とは、フィルム、シート、射
出成形、圧縮成形、積層成形その他手段で成形してなる
成形品、繊維、布、粉等の各梯形の成形体である。具体
的な熱硬化性樹脂としては、フェノール樹脂、ジアリル
フタレート樹脂、エポキシ樹脂、ポリアミン−ビスマレ
イミド樹脂、ポリマレイミド−エポキシ樹脂、ポリマレ
イミド−イソシアネート樹脂、シアナト樹脂、シアネー
ト−エポキシ樹脂、シアネート−ポリマレイミド樹脂、
シアネート−エポキシ−ポリマレイミド樹脂などの通常
の熱硬化性樹脂類：上記の熱硬化性樹脂類とポリアミド
（ナイロン）、芳香族ポリエステル、ポリエーテルイミ
ド、ポリエーテルエーテルケトン、ポリサルホン、ポリ
フェニレンエーテルなどのエンジニアリングプラスチッ
クとを配合し、さらに適宜触媒類を添加してなる熱硬化
性の所謂ｒＩＰ、Ｎにポリエチレンなどのポリオレフィ
ン、１．２−ポリブタジェンなどの樹脂に架橋剤として
の有機過酸化物、更に適宜ラジカル重合性の多官能性の
化合物、熱硬化性樹脂などを配合してなる架橋硬化性の
樹脂類など、並びにこれらにガラス、炭素、アルミナ、
その他の＃ａ維、繊維織布、粉体、その他充填材を配合
した強化物等が挙げられる。これらの中でも、ガラス転
位温度が１６０℃以上のものが好ましく、特に１８０℃
以上のものが、銅膜形成のための処理条件がより広くと
れること等から好ましい。The thermosetting resin article of the present invention is a film, a sheet, a molded article formed by injection molding, compression molding, lamination molding or other means, a trapezoid-shaped molded article such as fiber, cloth, powder, etc. Specific thermosetting resins include phenol resin, diallyl phthalate resin, epoxy resin, polyamine-bismaleimide resin, polymaleimide-epoxy resin, polymaleimide-isocyanate resin, cyanato resin, cyanate-epoxy resin, cyanate-polymaleimide. resin,
Common thermosetting resins such as cyanate-epoxy-polymaleimide resins: engineering of the above thermosetting resins and polyamides (nylons), aromatic polyesters, polyetherimides, polyetheretherketones, polysulfones, polyphenylene ethers, etc. Thermosetting so-called rIP, which is made by blending with plastic and adding appropriate catalysts, N is a polyolefin such as polyethylene, resin such as 1,2-polybutadiene, an organic peroxide as a crosslinking agent, and an appropriate radical. Polymerizable polyfunctional compounds, crosslinked curable resins made by blending thermosetting resins, etc., as well as glass, carbon, alumina,
Examples include other #a fibers, fiber woven fabrics, powders, and reinforcements containing other fillers. Among these, those with a glass transition temperature of 160°C or higher are preferred, particularly those with a glass transition temperature of 180°C.
The above methods are preferable because a wider range of processing conditions can be used for forming the copper film.
上記の熱硬化性樹脂物品に銅膜を形成するために使用す
る本発明の水酸化銅又は有機酸銅から選択された銅化合
物と多価アルコールとを必須成分とする混合液（以下、
処理液と記す）に使用する銅化合物とは、水酸化銅又は
有機酸の銅塩であり、これらは特に限定されないもので
あるが、銅膜形成に使用する温度にふいて表面から離脱
し易い化合物が好ましく、価格や入手のし易さを考慮し
て適宜選択する。具体的には、蟻酸、酢酸、プロピオン
酸、醋酸、ピバリン酸、カプロン酸、カプリン酸、ラウ
リン酸、ステアリン酸、ナフテン酸、安息香酸、オレイ
ン酸、アクリル酸、メタクリル酸、クロトン酸、ペンテ
ン酸などのモノカルボン酸の銅塩；蓚酸、マロン酸、コ
ハク酸、グルタル酸、アジピン酸、ピメリン酸、コハク
酸、アゼライン酸、ブラシリン酸、マレイン酸、フマル
酸、フタル酸、トリメリット酸、マレイン酸などのポリ
カルボン酸のの銅塩；更に、モノ−或いはポリカルボン
酸のエステル、アミドなど、グリコール酸などの水酸基
、グルタミン酸などのアミノ酸などの銅塩も挙げられる
。A mixed solution (hereinafter referred to as
The copper compound used in the treatment solution is copper hydroxide or a copper salt of an organic acid, and is not particularly limited, but it is easy to separate from the surface when exposed to the temperature used for forming the copper film. Compounds are preferred and are appropriately selected in consideration of price and availability. Specifically, formic acid, acetic acid, propionic acid, acetic acid, pivalic acid, caproic acid, capric acid, lauric acid, stearic acid, naphthenic acid, benzoic acid, oleic acid, acrylic acid, methacrylic acid, crotonic acid, pentenoic acid, etc. Copper salts of monocarboxylic acids; oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, succinic acid, azelaic acid, brassylic acid, maleic acid, fumaric acid, phthalic acid, trimellitic acid, maleic acid, etc. Further examples include copper salts of polycarboxylic acids such as esters and amides of mono- or polycarboxylic acids, hydroxyl groups such as glycolic acid, and amino acids such as glutamic acid.
また、多価アルコールとは、水酸基を２個以上含有する
化合物であり、これらは特に限定されないものであるが
、用いる成形体の表面との濡れ特性が良好で、銅膜形成
に使用する温度において表面から離脱し易い化合物が好
ましい。具体的には、エチレングリコール、プロピレン
グリｊ−ル、ブタンジオール、ベンタンジオール、ヘキ
サンジオール、１．５−へキサジエン−３，４−ジオー
ル、２．６−オクタジエン−４，５−ジオール、グリセ
リン、１．２゜３−ブタントリオール、１．２．３−ペ
ンタントリオール、ペンタメチルグリセリン、エリトリ
ット、ペンタエリトリット、アトニット、アラビット、
ジエチレングリコール、トリエチレングリコール、ジプ
ロピレングリコール、その他のポリアルキレングリコー
ル類、さらはジェタノールアミン、トリエタノールアミ
ンなどが挙げられる。In addition, polyhydric alcohol is a compound containing two or more hydroxyl groups, and although it is not particularly limited, it has good wettability with the surface of the molded product and is suitable for use at the temperature used for forming the copper film. Compounds that are easily released from the surface are preferred. Specifically, ethylene glycol, propylene glycol, butanediol, bentanediol, hexanediol, 1,5-hexadiene-3,4-diol, 2,6-octadiene-4,5-diol, glycerin, 1.2゜3-butanetriol, 1.2.3-pentanetriol, pentamethylglycerin, erythritol, pentaerythritol, attonite, aravit,
Examples include diethylene glycol, triethylene glycol, dipropylene glycol, other polyalkylene glycols, jetanolamine, triethanolamine, and the like.
本発明の処理液は、上記した水酸化銅又は有機酸銅と多
価アルコールとを混合して調整する。処理液中の水酸化
銅又は有機酸銅と多価アルコールとの組成比は、塗布し
たときに均一な塗膜となる程度に均一な液が調整出来る
範囲であれば特に限定されないが、水酸化銅又は有機酸
銅をより多く使用することが好ましく、通常、水酸化銅
又は有機酸銅を１０〜７０重量％の範囲、好ましくは２
０〜６０重量％の範囲で用い、常温乃至加熱下に混練し
て均一とする。The treatment liquid of the present invention is prepared by mixing the above-described copper hydroxide or organic acid copper with a polyhydric alcohol. The composition ratio of copper hydroxide or organic acid copper and polyhydric alcohol in the treatment solution is not particularly limited as long as it can be adjusted to a uniform solution to form a uniform coating when applied. It is preferable to use a larger amount of copper or organic acid copper, and usually copper hydroxide or organic acid copper is used in a range of 10 to 70% by weight, preferably 2% by weight.
It is used in a range of 0 to 60% by weight, and is homogenized by kneading at room temperature or under heating.
なお、本発明の処理液の調整にあたっては、適宜、上記
以外の添加剤類を併用してもよいものであり、有機酸、
アミン、有機溶剤、界面活性剤、銅その他金属の塩類、
ポリビニルアルコールなどが例示される。In addition, in preparing the treatment liquid of the present invention, additives other than those mentioned above may be used in combination, as appropriate, such as organic acids,
Amines, organic solvents, surfactants, salts of copper and other metals,
Examples include polyvinyl alcohol.
上記の処理液を熱硬化性物品の所望部に、印刷、刷毛像
、デイピング、スプレーコート、バーコード、ロールコ
ートなどし、バッチ式或いは連続的に不活性雰囲気中で
熱処理することにより本発明の銅膜形成物品を製造する
。The above-mentioned treatment liquid is applied to a desired part of a thermosetting article by printing, brushing, dipping, spray coating, bar code, roll coating, etc., and then heat-treated in a batchwise or continuous manner in an inert atmosphere. A copper film forming article is manufactured.
非酸化性雰囲気としては、Ｎ２． Ａｒ、 ＣＯｚ、
ＣＤ、 Ｌなどのガス雰囲気下とする方法や、単に、塗
布面を耐熱性のフィルム類で被い加熱して、塗布層より
の分解発生ガス雰囲気に維持することによる。The non-oxidizing atmosphere is N2. Ar, COz,
This can be done by using a gas atmosphere such as CD or L, or by simply covering the coated surface with a heat-resistant film and heating it to maintain an atmosphere of decomposed gas from the coated layer.
又、加熱は、赤外線、電子線、マイクロ波などの放射線
加熱、電気炉、オーブン、オイル加熱、加圧蒸気その他
の手段を適宜使用する温度等により選択し、バッチ或い
は連続的に行う。通常、昇温速度 ５０〜ｂ
ｔｌ：／Ｈｒで加熱し、所定の温度、すなわち１６５℃
から熱硬化性樹脂物品の変形劣化温度以下の範囲、好ま
しくは１７０℃以上から熱硬化性樹脂物品の変形劣化温
度以下の範囲、０〜３時間、好ましくは数分〜２時間程
度保持することによる。The heating may be carried out batchwise or continuously by selecting appropriate temperatures such as radiation heating such as infrared rays, electron beams, or microwaves, electric furnaces, ovens, oil heating, pressurized steam, or other means. Usually, heating is performed at a heating rate of 50 to 165°C, i.e., 165°C.
to below the deformation deterioration temperature of the thermosetting resin article, preferably from 170°C or higher to the deformation deterioration temperature of the thermosetting resin article, for 0 to 3 hours, preferably several minutes to 2 hours. .
以下、実施例、比較例によって本発明をさらに具体的に
説明する。尚、実施例中の部は特に断らない限り重量基
準である。Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples. In addition, parts in the examples are based on weight unless otherwise specified.
実施例１
蟻酸銅１００部とグリセリン２００部とを撹拌混合して
粘性のある青色の処理液（以下、処理液１と記す）を得
た。Example 1 100 parts of copper formate and 200 parts of glycerin were stirred and mixed to obtain a viscous blue treatment liquid (hereinafter referred to as treatment liquid 1).
この処理液１をガラス繊維強化シアン酸エステル−マレ
イミド−エポキシ系樹脂積層板（商品名、 ＢＴ−ＧＨ
Ｌ ８００、三菱瓦斯化学■製）の片面に厚み１２０ｐ
で塗布した後、ボンベよりの窒素ガス雰囲気下において
、３０分間で１８０℃まで昇温し、この温度で６０分間
保持した後、取り出した。This treatment solution 1 was applied to a glass fiber-reinforced cyanate ester-maleimide-epoxy resin laminate (trade name: BT-GH).
L 800, made by Mitsubishi Gas Chemical ■), thickness 120p on one side
After coating, the temperature was raised to 180° C. in 30 minutes under a nitrogen gas atmosphere from a cylinder, and after being held at this temperature for 60 minutes, it was taken out.
得られた積層板表面には、銅膜が均一密着していた。The copper film was uniformly adhered to the surface of the obtained laminate.
この銅膜の厚みは３−１体積抵抗１．０Ｘ１０−’Ω・
印、セロテープ基盤目（クロスカット）テストによる剥
離試験結果は１００／１００、煮沸２時間後も膨れ剥が
れなどは生じなかった。The thickness of this copper film is 3-1 volume resistance 1.0X10-'Ω・
The cross-cut test result of the cellophane tape was 100/100, and no swelling or peeling occurred even after 2 hours of boiling.
実施例２
水酸化銅１００部とグリセリン２００部とを撹拌混合し
て粘性のある青色の処理液（以下、処理液２と記す）を
得た。Example 2 100 parts of copper hydroxide and 200 parts of glycerin were stirred and mixed to obtain a viscous blue treatment liquid (hereinafter referred to as treatment liquid 2).
この処理液２を使用する他は実施例１と同様にして光沢
ある銅膜が均一密着した積層板を得た。A laminate with a glossy copper film uniformly adhered was obtained in the same manner as in Example 1 except that this treatment liquid 2 was used.
この銅膜の厚みは６−１体積抵抗？、 ＯＸ １０−’
Ω・国、セロテープ基盤目（クロスカット）テストによ
る剥離試験結果は１００／１００、煮沸２時間後も膨れ
剥がれなどは生じなかった。Is the thickness of this copper film 6-1 volume resistance? , OX 10-'
The peel test result of Ω・Country and Cellotape base cross-cut test was 100/100, and no swelling or peeling occurred even after 2 hours of boiling.
また、上記において処理液２の塗布厚みを２０−とする
他は同様にして光沢ある銅膜が均一密着した積層板を得
た。Further, a laminate with a glossy copper film uniformly adhered was obtained in the same manner as described above except that the coating thickness of treatment liquid 2 was changed to 20 -.
この銅膜の厚みは０．５ｐ、体積抵抗１．０Ｘ１０−’
Ω・国、セロテープ基盤目（クロスカット）テストによ
る剥離試験結果は１００／１００、煮沸２時間後も膨れ
剥がれなどは生じなかった。The thickness of this copper film is 0.5p, and the volume resistance is 1.0X10-'
The peel test result of Ω・Country and Cellotape base cross-cut test was 100/100, and no swelling or peeling occurred even after 2 hours of boiling.
実施例３
実施例１において、蟻酸銅１００部に代えて酢酸１ｍ
１００ｇＢを使用する他は同様にして処理液（以下、処
理液３と記す）を得、この処理液３を用いる他は同様に
して同様にして光沢ある銅膜が均−密着した積層板を得
た。Example 3 In Example 1, 1 m of acetic acid was substituted for 100 parts of copper formate.
A treatment solution (hereinafter referred to as treatment solution 3) was obtained in the same manner except that 100 gB was used, and a laminate with a glossy copper film evenly adhered was obtained in the same manner except that this treatment solution 3 was used. Ta.
実施例４
実施例１において、グリセリン２００部に代えてトリエ
タノールアミン２００部を使用する他は同様にして処理
液（以下、処理液４と記す）を得、この処理液４を用い
る他は同様にして同様にして銅膜が均一密着した積層板
を得た。Example 4 A treatment liquid (hereinafter referred to as treatment liquid 4) was obtained in the same manner as in Example 1, except that 200 parts of triethanolamine was used instead of 200 parts of glycerin; In the same manner as above, a laminate in which the copper film was uniformly adhered was obtained.
実施例５〜９
実施例１〜４において、ガラス繊維強化シアン酸エステ
ル−マレイミド−エポキシ系樹脂積層板に代えて、ガラ
ス繊維強化エポキシ樹脂積層板（商品名；カラスエポキ
シＧｔ！Ｐ １７０ 、三菱瓦斯化学■製、以下、ＧＲ
ＰＩと記す）、キシリレンジアミンとエビクロリヒドリ
ンとの反応により合成される四官能エポキシ樹脂（商品
名；テトラッドｘ１三菱瓦斯化学■製）を使用してなる
ガラス繊維強化エポキシ樹脂積層板（以下、ＧＢＰ２と
記す）を使用し、第１表に記載の条件にて処理して銅膜
が均一に形成された成形品を得た。結果を第１表に示し
た。Examples 5 to 9 In Examples 1 to 4, a glass fiber reinforced epoxy resin laminate (trade name: Karasu Epoxy Gt!P 170, manufactured by Mitsubishi Gas) was used instead of the glass fiber reinforced cyanate ester-maleimide-epoxy resin laminate. Made by Kagaku ■, hereinafter referred to as GR
Glass fiber-reinforced epoxy resin laminate (hereinafter referred to as PI) made using a tetrafunctional epoxy resin (product name: Tetrad , GBP2) was processed under the conditions listed in Table 1 to obtain a molded product in which a copper film was uniformly formed. The results are shown in Table 1.
なお、第１表中の処理液５は、水酸化銅１００部とトリ
エタノールアミン２００部とを撹拌混合して得たもので
あり、また、銅膜外観は目視観察によるもので、○は均
一密着していたことを示す。In addition, treatment liquid 5 in Table 1 was obtained by stirring and mixing 100 parts of copper hydroxide and 200 parts of triethanolamine, and the appearance of the copper film was determined by visual observation, and ○ indicates uniformity. Indicates that they were in close contact.
以上の如くである本発明の製造法によれば、極めて簡単
な手段により容易に密着性に優れた銅膜が形成された物
品が得られるので、この銅膜を電気メツキ、無電解メツ
キ、真空蒸着、銅箔接着の代替、溶接用下地などの下地
処理として、銅張フィルム、銅張積層板その他の用途に
、或いは、そのまま或いは耐酸化塗膜を、形成して、導
電性、熱伝導性膜、粉体、繊維、布等として好適に使用
されるものである。According to the manufacturing method of the present invention as described above, an article on which a copper film with excellent adhesion is formed can be easily obtained by extremely simple means. It can be used as a base treatment for vapor deposition, as a substitute for copper foil adhesion, as a base for welding, for copper-clad films, copper-clad laminates, and other uses, or as it is or by forming an oxidation-resistant coating to improve electrical conductivity and thermal conductivity. It is suitably used as a film, powder, fiber, cloth, etc.
Claims (1)
ら選択された銅化合物と多価アルコールとを必須成分と
する混合液を塗布した後、非酸化性雰囲気中で１６５℃
以上で該熱硬化性樹脂物品の変形劣化温度以下の温度に
加熱し保持することを特徴とする銅膜形成物品の製造法
。After applying a liquid mixture containing a copper compound selected from copper hydroxide or organic acid copper and a polyhydric alcohol as essential components to a desired part of a thermosetting resin article, the mixture is heated at 165°C in a non-oxidizing atmosphere.
A method for producing a copper film-forming article, which comprises heating and maintaining the above temperature at a temperature below the deformation deterioration temperature of the thermosetting resin article.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62325569A JPH01168867A (en) | 1987-12-24 | 1987-12-24 | Production of article coated with copper film |
| KR1019880017274A KR960010822B1 (en) | 1987-12-24 | 1988-12-22 | Method for porducing copper film-formed articles |
| EP88121504A EP0322764B1 (en) | 1987-12-24 | 1988-12-22 | Method for producing copper film-formed articles |
| DE8888121504T DE3879441T2 (en) | 1987-12-24 | 1988-12-22 | METHOD FOR PRODUCING BODIES WITH A COPPER COVER. |
| US07/288,928 US4913938A (en) | 1987-12-24 | 1988-12-23 | Method for producing copper film-formed articles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62325569A JPH01168867A (en) | 1987-12-24 | 1987-12-24 | Production of article coated with copper film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01168867A true JPH01168867A (en) | 1989-07-04 |
Family
ID=18178351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62325569A Pending JPH01168867A (en) | 1987-12-24 | 1987-12-24 | Production of article coated with copper film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01168867A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003075455A (en) * | 2001-09-07 | 2003-03-12 | Sysmex Corp | Automatic blood analyzer and lock device for specimen rack used therefor |
| JP2008111093A (en) * | 2006-10-03 | 2008-05-15 | Shinko Electric Ind Co Ltd | Method for producing copper membrane |
| WO2013136937A1 (en) | 2012-03-16 | 2013-09-19 | 株式会社Adeka | Copper film-forming composition, and method for producing copper film by using the composition |
| KR20160027174A (en) | 2013-07-25 | 2016-03-09 | 가부시키가이샤 아데카 | Composition for copper film formation and copper film production method using same |
| KR20160114175A (en) | 2014-03-12 | 2016-10-04 | 가부시키가이샤 아데카 | Copper film forming composition and process for manufacturing copper film using same |
| JP2019529599A (en) * | 2016-07-28 | 2019-10-17 | ナショナル リサーチ カウンシル オブ カナダ | Copper ink and conductive solderable copper traces made therefrom |
| EP3662027A4 (en) * | 2017-08-01 | 2021-04-14 | National Research Council of Canada | Copper ink |
-
1987
- 1987-12-24 JP JP62325569A patent/JPH01168867A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003075455A (en) * | 2001-09-07 | 2003-03-12 | Sysmex Corp | Automatic blood analyzer and lock device for specimen rack used therefor |
| JP2008111093A (en) * | 2006-10-03 | 2008-05-15 | Shinko Electric Ind Co Ltd | Method for producing copper membrane |
| WO2013136937A1 (en) | 2012-03-16 | 2013-09-19 | 株式会社Adeka | Copper film-forming composition, and method for producing copper film by using the composition |
| US9028599B2 (en) | 2012-03-16 | 2015-05-12 | Adeka Corporation | Copper film-forming composition, and method for producing copper film by using the composition |
| KR20160027174A (en) | 2013-07-25 | 2016-03-09 | 가부시키가이샤 아데카 | Composition for copper film formation and copper film production method using same |
| KR20160114175A (en) | 2014-03-12 | 2016-10-04 | 가부시키가이샤 아데카 | Copper film forming composition and process for manufacturing copper film using same |
| JP2019529599A (en) * | 2016-07-28 | 2019-10-17 | ナショナル リサーチ カウンシル オブ カナダ | Copper ink and conductive solderable copper traces made therefrom |
| EP3662027A4 (en) * | 2017-08-01 | 2021-04-14 | National Research Council of Canada | Copper ink |
| US11505712B2 (en) | 2017-08-01 | 2022-11-22 | National Research Council Of Canada | Copper ink |
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