JPH01168866A - Production of article coated with copper film - Google Patents
Production of article coated with copper filmInfo
- Publication number
- JPH01168866A JPH01168866A JP62325568A JP32556887A JPH01168866A JP H01168866 A JPH01168866 A JP H01168866A JP 62325568 A JP62325568 A JP 62325568A JP 32556887 A JP32556887 A JP 32556887A JP H01168866 A JPH01168866 A JP H01168866A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- acid
- article
- temp
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 32
- 239000010949 copper Substances 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims abstract description 10
- 239000005750 Copper hydroxide Substances 0.000 claims abstract description 10
- 229910001956 copper hydroxide Inorganic materials 0.000 claims abstract description 10
- 239000012298 atmosphere Substances 0.000 claims abstract description 9
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 7
- 150000007524 organic acids Chemical class 0.000 claims description 8
- 239000005749 Copper compound Substances 0.000 claims description 3
- 150000001880 copper compounds Chemical class 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 abstract description 12
- 239000000203 mixture Substances 0.000 abstract description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 abstract description 6
- 150000001879 copper Chemical class 0.000 abstract description 6
- 235000011187 glycerol Nutrition 0.000 abstract description 6
- 239000002253 acid Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000001361 adipic acid Substances 0.000 abstract description 3
- 235000011037 adipic acid Nutrition 0.000 abstract description 3
- 239000004677 Nylon Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000012299 nitrogen atmosphere Substances 0.000 abstract 1
- 229920001778 nylon Polymers 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- -1 aliphatic dicarboxylic acids Chemical class 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 229920000007 Nylon MXD6 Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical group OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 229920004738 ULTEM® Polymers 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OIBIEVMGTDETCN-GGWOSOGESA-N (2e,6e)-octa-2,6-diene-4,5-diol Chemical compound C\C=C\C(O)C(O)\C=C\C OIBIEVMGTDETCN-GGWOSOGESA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- ZTBHEZIOGARBOD-UHFFFAOYSA-N 2,3,4-trimethylpentane-2,3,4-triol Chemical compound CC(C)(O)C(C)(O)C(C)(C)O ZTBHEZIOGARBOD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920003188 Nylon 3 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920000577 Nylon 6/66 Polymers 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- YIYBQIKDCADOSF-UHFFFAOYSA-N alpha-Butylen-alpha-carbonsaeure Natural products CCC=CC(O)=O YIYBQIKDCADOSF-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000001014 amino acid Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- TZYHIGCKINZLPD-UHFFFAOYSA-N azepan-2-one;hexane-1,6-diamine;hexanedioic acid Chemical compound NCCCCCCN.O=C1CCCCCN1.OC(=O)CCCCC(O)=O TZYHIGCKINZLPD-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- KUQWZSZYIQGTHT-UHFFFAOYSA-N hexa-1,5-diene-3,4-diol Chemical compound C=CC(O)C(O)C=C KUQWZSZYIQGTHT-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- AALKGALVYCZETF-UHFFFAOYSA-N pentane-1,2,3-triol Chemical compound CCC(O)C(O)CO AALKGALVYCZETF-UHFFFAOYSA-N 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- YIYBQIKDCADOSF-ONEGZZNKSA-N trans-pent-2-enoic acid Chemical compound CC\C=C\C(O)=O YIYBQIKDCADOSF-ONEGZZNKSA-N 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、低荷重下の熱変形温度が１６５℃以上である
熱可塑性樹脂物品に銅被膜を形成する新規な方法に関す
るものであり、本製造法による銅膜形成物品は、特別の
前処理をすることなく銅が強固に付着したものであり、
しかもハロゲンなどの腐食性を有する元素を全く含まな
いものであるので、そのままで或いは更に銅その他の金
属をメツキして、フィルム、シート、成形品、繊維、布
、粉、その他の各種形態の各種用途用物品に好適に使用
されるものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a novel method for forming a copper coating on a thermoplastic resin article having a heat distortion temperature of 165° C. or higher under low load. Copper film-formed articles manufactured using this manufacturing method have copper firmly attached to them without any special pretreatment.
Moreover, since it does not contain any corrosive elements such as halogens, it can be used as is or by plating with copper or other metals to produce films, sheets, molded products, fibers, cloth, powders, and various other forms. It is suitable for use in articles for use.
熱可塑性樹脂物品、例えば成形品に、銅被膜を形成する
方法としては、無電解メツキ法、蒸着法、圧接法、接着
剤による接着などがある。Methods for forming a copper coating on a thermoplastic resin article, such as a molded article, include electroless plating, vapor deposition, pressure welding, bonding with an adhesive, and the like.
無電解メツキ法は、最も一般的であり優れた方法である
が、通常は用いる熱可塑性樹脂に応じた前処理を必須と
するものであり、その工程が煩雑であるという欠点を有
している。また、前処理工程を省くためにジエン系ゴム
等を予め配合してなる組成物からの成形品を使用する方
法があるが、熱可塑性樹脂本来の性能が劣化する場合が
多いものであった。更に、この方法の場合、ガラス繊維
等の充填材を配合した成形体の場合、充填材が成形品の
表面に露出した場合には、良好な密着性が得られないと
いう欠点があった。The electroless plating method is the most common and excellent method, but it usually requires pretreatment depending on the thermoplastic resin used, and has the disadvantage that the process is complicated. . In addition, there is a method of using a molded article made from a composition that is pre-blended with a diene rubber or the like in order to omit a pretreatment step, but this often results in deterioration of the inherent performance of the thermoplastic resin. Furthermore, in the case of a molded article containing a filler such as glass fiber, this method has the disadvantage that good adhesion cannot be obtained if the filler is exposed on the surface of the molded article.
蒸着法は、蒸着のための特別の設備を必須とし、大型品
の製造が困難であり、また樹脂の種類によっては接着性
を向上させるための前処理が必要であった。更に、圧接
法、接着剤による接着など適宜使用されるものであるが
、成形品の形状が限定されたり、接着層が厚くなるなど
の欠点があるものであった。The vapor deposition method requires special equipment for vapor deposition, making it difficult to manufacture large products, and depending on the type of resin, pretreatment is required to improve adhesiveness. Furthermore, although pressure bonding methods and bonding with adhesives are used as appropriate, they have drawbacks such as the shape of the molded product being limited and the adhesive layer becoming thick.
本発明は、上記の事情に鑑み、簡便な方法により、経済
的で高品質の銅膜め形成された材料を提供する方法につ
いて検討した結果、完成したものである。In view of the above circumstances, the present invention was completed as a result of research into a method of providing an economical and high-quality copper film-coated material using a simple method.
すなわち、本発明は、低荷重下の熱変形温度が１６５℃
以上である熱可塑性樹脂物品の所望部に、水酸化銅又は
有機酸銅から選択された銅化合物と多価アルコールとを
必須成分とする混合液を塗布した後、非酸化性雰囲気中
で１６５℃以上で該熱可塑性樹脂物品の低荷重下の熱変
形温度以下の温度に加熱し保持することを特徴とする銅
膜形成物品の製造法である。That is, in the present invention, the heat distortion temperature under low load is 165°C.
After applying a liquid mixture containing a copper compound selected from copper hydroxide or organic acid copper and a polyhydric alcohol as essential components to a desired part of the above thermoplastic resin article, the mixture is heated to 165°C in a non-oxidizing atmosphere. The above is a method for producing a copper film-formed article, which is characterized by heating and holding the thermoplastic resin article at a temperature below the thermal deformation temperature under a low load.
以下、本発明について説明する。The present invention will be explained below.
本発明の低荷重下の熱変形温度が１６５℃以上である熱
可塑性樹脂物品とは、フィルム、シート、射出成形、圧
縮成形その他手段で成形してなる成形品、繊維、布、粉
等の各梯形の成形体である。The thermoplastic resin articles of the present invention having a heat deformation temperature of 165°C or higher under low load include films, sheets, molded articles formed by injection molding, compression molding, and other means, fibers, cloth, powder, etc. It is a trapezoidal molded body.
具体的な熱可塑性樹脂としては、ナイロン−６、ナイロ
ン−６６、ナイロン−６／６６ 、ナイロン−１１、ナ
イロン−３、メタキシリレンジアミンと脂肪族ジカルボ
ン酸類から誘導されるＭＸＤ６、ＭＸＤ６／１０などの
ポリアミド樹脂、ポリブチレンテレフタレート、ポリエ
チレンテレフタレートなどの結晶性ポリエステル樹脂な
どの汎用エンジニアリングプラスチック類；Ｐ−ヒドロ
キシ安息香酸、フタル酸、ビスフェノールなどを主要モ
ノマーとする全芳香族ポリエステルやこれらにポリエチ
レンテレフタレート等をグラフトしてなる芳香族ポリエ
ステル液晶ポリマー、ポリエーテルイミド、ポリスルホ
ン、ポリサルホン、ポリエーテルサルホン、ポリエーテ
ルエーテルケトン、ポリフェニレンエーテル等のエンジ
ニアリングプラスチック並びにこれらのポリマーの繊維
、ミネラル、その他充填材強化物等が挙げられ、これら
の中でも、上記した熱変形温度が１９０℃以上のものが
好ましく、特に２１０℃以上のものが、銅膜形成のため
の処理条件がより広くとれること等から好ましい。Specific thermoplastic resins include nylon-6, nylon-66, nylon-6/66, nylon-11, nylon-3, MXD6 and MXD6/10 derived from meta-xylylene diamine and aliphatic dicarboxylic acids. General-purpose engineering plastics such as crystalline polyester resins such as polyamide resins, polybutylene terephthalate, and polyethylene terephthalate; wholly aromatic polyesters whose main monomers are P-hydroxybenzoic acid, phthalic acid, and bisphenol, and polyethylene terephthalate, etc. Engineering plastics such as grafted aromatic polyester liquid crystal polymers, polyetherimide, polysulfone, polysulfone, polyethersulfone, polyetheretherketone, and polyphenylene ether, as well as fibers, minerals, and other filler reinforcements of these polymers, etc. Among these, those having the above-described heat distortion temperature of 190° C. or higher are preferable, and those having a heat distortion temperature of 210° C. or higher are particularly preferable because they allow a wider range of processing conditions for forming a copper film.
上記の樹脂或いは充填材強化樹脂に銅膜を形成するため
に使用する本発明の水酸化銅又は有機酸銅から選択され
た銅化合物と多価アルコールとを必須成分とする混合液
（以下、処理液と記す）に使用する銅化合物とは、水酸
化銅又は有機酸の銅塩であり、これらは特に限定されな
いものであるが、銅膜形成に使用する温度において表面
から離脱し易い化合物が好ましく、価格や入手のし易さ
を考慮して適宜選択する。具体的には、蟻酸、酢酸、プ
ロピオン酸、酪酸、ピバリン酸、カプロン酸、カプリン
酸、ラウリン酸、ステアリン酸、ナフテン酸、安息香酸
、オレイン酸、アクリル酸、メタクリル酸、クロトン酸
、ペンテン酸などのモノカルボン酸の銅塩；蓚酸、マロ
ン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸
、コハク酸、アゼライン酸、ブラシリン酸、マレイン酸
、フマル酸、フタル酸、トリメリット酸、マレイン酸な
どのポリカルボン酸のの銅塩：更に、モノ−或いはポリ
カルボン酸のエステル、アミドなど、グリコール酸など
の水酸基、グルタミン酸などのアミノ酸などの銅塩も、
挙げられる。A mixed solution (hereinafter referred to as treatment The copper compound used in the liquid (referred to as "liquid") is copper hydroxide or a copper salt of an organic acid, and is not particularly limited, but preferably a compound that is easily released from the surface at the temperature used for forming the copper film. , to be selected appropriately taking into consideration price and availability. Specifically, formic acid, acetic acid, propionic acid, butyric acid, pivalic acid, caproic acid, capric acid, lauric acid, stearic acid, naphthenic acid, benzoic acid, oleic acid, acrylic acid, methacrylic acid, crotonic acid, pentenoic acid, etc. Copper salts of monocarboxylic acids; oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, succinic acid, azelaic acid, brassylic acid, maleic acid, fumaric acid, phthalic acid, trimellitic acid, maleic acid, etc. Copper salts of polycarboxylic acids: In addition, copper salts of mono- or polycarboxylic acid esters, amides, etc., hydroxyl groups such as glycolic acid, amino acids such as glutamic acid, etc.
Can be mentioned.
また、多価アルコールとは、水酸基を２個以上含有する
化合物であり、これらは特に限定されないものであるが
、用いる成形体の表面との濡れ特性が良好で、銅膜形成
に使用する温度において表面から離脱し易い化合物が好
ましい。具体的には、エチレングリコール、プロピレン
グリコール、ブタンジオール、ベンタンジオール、ヘキ
サンジオール、１．５−ヘキサジエン−３，４−ジオー
ル、２．６−オクタジエン−４，５−ジオール、グリセ
リン、１，２゜３−ブタントリオール、１，２．３−ペ
ンタントリオール、ペンタメチルグリセリン、エリトリ
ット、ペンタエリトリット、アトニット、アラビット、
ジエチレングリコール、トリエチレングリコール、ジプ
ロピレングリコール、その他のポリアルキレングリコー
ル類、さらはジェタノールアミン、トリエタノールアミ
ンなどが挙げられる。In addition, polyhydric alcohol is a compound containing two or more hydroxyl groups, and although it is not particularly limited, it has good wettability with the surface of the molded product and is suitable for use at the temperature used for forming the copper film. Compounds that are easily released from the surface are preferred. Specifically, ethylene glycol, propylene glycol, butanediol, bentanediol, hexanediol, 1,5-hexadiene-3,4-diol, 2,6-octadiene-4,5-diol, glycerin, 1,2° 3-butanetriol, 1,2,3-pentanetriol, pentamethylglycerin, erythritol, pentaerythritol, attonite, aravit,
Examples include diethylene glycol, triethylene glycol, dipropylene glycol, other polyalkylene glycols, jetanolamine, triethanolamine, and the like.
本発明の処理液は、上記した水酸化銅又は有機酸銅と多
価アルコールとを混合して調整する。処理液中の水酸化
銅又は有機酸銅と多価アルコールとの組成比は、塗布し
たときに均一な塗膜となる程度に均一な液が調整出来る
範囲であれば特に限定されないが、水酸化銅又は有機酸
銅をより多く使用することが好ましく、通常、水酸化銅
又は有機酸銅を１０〜７０重量％の範囲、好ましくは２
０〜６０重量％の範囲で用い、常温乃至加熱下に混練し
て均一とする。The treatment liquid of the present invention is prepared by mixing the above-described copper hydroxide or organic acid copper with a polyhydric alcohol. The composition ratio of copper hydroxide or organic acid copper and polyhydric alcohol in the treatment solution is not particularly limited as long as it can be adjusted to a uniform solution to form a uniform coating when applied. It is preferable to use a larger amount of copper or organic acid copper, and usually copper hydroxide or organic acid copper is used in a range of 10 to 70% by weight, preferably 2% by weight.
It is used in a range of 0 to 60% by weight, and is homogenized by kneading at room temperature or under heating.
なお、本発明の処理液の調整にあたっては、適宜、上記
以外の添加剤類を併用してもよいものであり、有機酸、
アミン、有機溶剤、界面活性剤、銅その他金属の塩類、
ポリビニルアルコールなどが例示される。In addition, in preparing the treatment liquid of the present invention, additives other than those mentioned above may be used in combination, as appropriate, such as organic acids,
Amines, organic solvents, surfactants, salts of copper and other metals,
Examples include polyvinyl alcohol.
上記の処理液を低荷重下の熱変形温度が１６５℃以上で
ある熱可塑性樹脂成形体の所望部に、印刷、刷毛像、デ
イピング、スプレーコート、バーコード、ロールコート
などし、バッチ式或いは連続的に不活性雰囲気中で熱処
理することにより本発明の銅膜形成物品を製造する。The above treatment liquid is printed, brushed, dipping, spray coated, bar coded, roll coated, etc. on a desired part of a thermoplastic resin molded body whose heat deformation temperature under low load is 165°C or higher, and is applied in a batch or continuous manner. The copper film-formed article of the present invention is produced by heat treatment in an inert atmosphere.
非酸化性雰囲気としては、Ｎ２． Ａｒ、 ＣＯ２，Ｃ
Ｄ、 Ｈａなどのガス雰囲気下とする方法や、単に、塗
布面を耐熱性のフィルム類で被い、加熱して塗布層より
の分解発生ガス雰囲気に維持することによる。The non-oxidizing atmosphere is N2. Ar, CO2, C
D, Ha or the like gas atmosphere, or simply covering the coated surface with a heat-resistant film and heating it to maintain an atmosphere of decomposed gas from the coated layer.
又、加熱は、赤外線、電子線、マイクロ波などの放射線
加熱、電気炉、オーブン、オイル加熱、加圧蒸気その他
の手段を適宜使用する温度等により選択し、バッチ或い
は連続的に行う。通常、昇温速度 ５０〜ｂ
ｔ／Ｈｒで加熱し、所定の温度、すなわち１６５℃から
熱可塑性樹脂物品の低荷重下の熱変形温度の範囲、好ま
しくは１７０℃から熱可塑性樹脂物品の低荷重下の熱変
形温度の範囲に０〜３時間、好ましくは数分〜２時間程
度保持することによる。The heating may be carried out batchwise or continuously by selecting appropriate temperatures such as radiation heating such as infrared rays, electron beams, or microwaves, electric furnaces, ovens, oil heating, pressurized steam, or other means. Usually, heating is carried out at a heating rate of 50 to 100 bt/Hr, and from a predetermined temperature, i.e., 165°C, to the thermal deformation temperature under low load of the thermoplastic resin article, preferably from 170°C to the low load of the thermoplastic resin article. By maintaining the heat distortion temperature in the following range for 0 to 3 hours, preferably several minutes to 2 hours.
以下、実施例、比較例によって本発明をさらに具体的に
説明する。尚、実施例、比較例中の部は特に断らない限
り重量基準である。Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples. In addition, parts in Examples and Comparative Examples are based on weight unless otherwise specified.
実施例１
水酸化銅１００部とグリセリン２００部とを撹拌混合し
て粘性のある青色の処理液（以下、処理液１と記す）を
得た。Example 1 A viscous blue treatment liquid (hereinafter referred to as treatment liquid 1) was obtained by stirring and mixing 100 parts of copper hydroxide and 200 parts of glycerin.
この処理液１をガラス繊維強化メタキシリレンジアミン
とアジピン酸とからのナイロンＭＸＤ６の厚み３ｍｍの
成形品の片面に厚み６０．ｕで塗布した後、ボンベより
の窒素ガス雰囲気下において、３０分間で１８０℃まで
昇温し、この温度で６０分間保持した後、取り出した。This treatment solution 1 was applied to one side of a 3 mm thick molded product of nylon MXD6 made from glass fiber reinforced metaxylylene diamine and adipic acid to a thickness of 60 mm. After coating with U, the temperature was raised to 180° C. in 30 minutes under a nitrogen gas atmosphere from a cylinder, and after being held at this temperature for 60 minutes, it was taken out.
得られたナイロンＭＸＤ６の成形品表面には、銅膜が均
一密着していた。The copper film was uniformly adhered to the surface of the obtained nylon MXD6 molded product.
この銅膜の厚みは３−１体積抵抗３Ｘ１０−’Ω・印、
セロテープ基盤目（クロスカット）テストによる剥離試
験結果は１００／ＩＯＱであった。The thickness of this copper film is 3-1 volume resistance 3X10-'Ω・mark,
The peel test result by cellotape base cross cut test was 100/IOQ.
実施例２
蟻酸銅１００部とエチレングリコール１００部とを撹拌
混合して粘性のある青色の処理液（以下、処理液２と記
す）を得た。Example 2 100 parts of copper formate and 100 parts of ethylene glycol were stirred and mixed to obtain a viscous blue treatment liquid (hereinafter referred to as treatment liquid 2).
この処理液２を使用する他は実施例１と同様にして光沢
ある銅膜が均一密着したナイロンＭＸＤ６の成形品を得
た。A molded article of nylon MXD6 to which a shiny copper film was evenly adhered was obtained in the same manner as in Example 1, except that this treatment liquid 2 was used.
実施例３
実施例１において、グリセリン２００部に代えてトリエ
タノールアミン２００部を使用する他は同様にして処理
液（以下、処理液３と記す）を得、この処理液３を用い
る他は同様にして同様にして銅膜が均一密着したナイロ
ンＭＸＤ６の成形品を得た。Example 3 A treatment liquid (hereinafter referred to as treatment liquid 3) was obtained in the same manner as in Example 1 except that 200 parts of triethanolamine was used instead of 200 parts of glycerin; In the same manner, a molded product of nylon MXD6 to which the copper film was uniformly adhered was obtained.
実施例４〜１１
実施例１〜３において、ナイロンＭＸＤ６の成形品に代
えて、ボリアリレート（商品名；Ｕポリマー、ユニチカ
■製、以下、Ｕポリマーと記す）、ポリサルホン（商品
名；ユーデルボリサルフオン、アモコケミカルズ■製、
以下、ｔｌＰｓＰと記す）、２０重量％ガラス繊維強化
ポリエーテルサルホン（三井東圧■製、以下、ｐＥｓｐ
と記す）、ポリエーテルイミド（商品名；ウルテム、ジ
ェネラル・エレクトリック■製、以下、ウルテムと記す
）、ポリエーテルエーテルケトン（商品名；ピクトレッ
クス、英国ＩＣＩ社製、以下、ＰＥＥＫと記す）の成形
品を使用し、第１表に記載の条件にて処理して銅膜が均
一に形成された成形品を得た。Examples 4 to 11 In Examples 1 to 3, polyarylate (trade name: U Polymer, manufactured by Unitika ■, hereinafter referred to as U Polymer), polysulfone (trade name: Udelboly) was used instead of the molded product of nylon MXD6. Sulfon, manufactured by Amoco Chemicals,
(hereinafter referred to as tlPsP), 20% by weight glass fiber reinforced polyether sulfone (manufactured by Mitsui Toatsu ■, hereinafter referred to as pEsp)
Molding of polyetherimide (trade name: Ultem, manufactured by General Electric ■, hereinafter referred to as Ultem), polyetheretherketone (trade name: Pictrex, manufactured by ICI, UK, hereinafter referred to as PEEK) The product was treated under the conditions listed in Table 1 to obtain a molded product in which a copper film was uniformly formed.
結果を第１表に示した。The results are shown in Table 1.
なお、第１表中の処理液４は、蟻酸銅１００部とグリセ
リン２００部とを撹拌混合して得たものであり、処理液
５は、酢酸銅１００部とグリセリン２００部とを撹拌混
合して得たものである。In addition, treatment liquid 4 in Table 1 was obtained by stirring and mixing 100 parts of copper formate and 200 parts of glycerin, and treatment liquid 5 was obtained by stirring and mixing 100 parts of copper acetate and 200 parts of glycerin. This is what I got.
また、銅膜外観は目視観察によるものであり、○は均一
密着銅膜の生成を示す。Further, the appearance of the copper film is based on visual observation, and ◯ indicates the formation of a uniformly adhered copper film.
以上の如くである本発明の製造法によれば、極めて簡単
な手段により容易に密着性に優れた銅膜が形成された成
形体が得られるので、この銅膜を電気メツキ、無電解メ
ツキ、真空蒸着、銅箔接着の代替、溶接用下地などの下
地処理として、銅張フィルム、銅張積層板その他の用途
に、或いは、そのまま或いは耐酸化塗膜を形成して、導
電性、熱伝導性膜として好適に使用されるものである。According to the manufacturing method of the present invention as described above, a molded article on which a copper film with excellent adhesion is formed can be easily obtained by extremely simple means. It can be used as a base treatment for vacuum evaporation, as a substitute for copper foil adhesion, as a base for welding, for copper-clad films, copper-clad laminates, and other uses, or as it is or by forming an oxidation-resistant coating to improve electrical conductivity and thermal conductivity. It is suitably used as a membrane.
Claims (1)
脂物品の所望部に、水酸化銅又は有機酸銅から選択され
た銅化合物と多価アルコールとを必須成分とする混合液
を塗布した後、非酸化性雰囲気中で１６５℃以上で該熱
可塑性樹脂物品の低荷重下の熱変形温度以下の温度に加
熱し保持することを特徴とする銅膜形成物品の製造法。A mixed solution containing a copper compound selected from copper hydroxide or organic acid copper and a polyhydric alcohol as essential components was applied to a desired part of a thermoplastic resin article whose heat distortion temperature under low load was 165°C or higher. A method for producing a copper film-formed article, comprising heating and holding the thermoplastic resin article at a temperature of 165° C. or higher and lower than the thermal deformation temperature under a low load in a non-oxidizing atmosphere.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62325568A JPH01168866A (en) | 1987-12-24 | 1987-12-24 | Production of article coated with copper film |
| KR1019880017274A KR960010822B1 (en) | 1987-12-24 | 1988-12-22 | Method for porducing copper film-formed articles |
| EP88121504A EP0322764B1 (en) | 1987-12-24 | 1988-12-22 | Method for producing copper film-formed articles |
| DE8888121504T DE3879441T2 (en) | 1987-12-24 | 1988-12-22 | METHOD FOR PRODUCING BODIES WITH A COPPER COVER. |
| US07/288,928 US4913938A (en) | 1987-12-24 | 1988-12-23 | Method for producing copper film-formed articles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62325568A JPH01168866A (en) | 1987-12-24 | 1987-12-24 | Production of article coated with copper film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01168866A true JPH01168866A (en) | 1989-07-04 |
Family
ID=18178340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62325568A Pending JPH01168866A (en) | 1987-12-24 | 1987-12-24 | Production of article coated with copper film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01168866A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013136937A1 (en) | 2012-03-16 | 2013-09-19 | 株式会社Adeka | Copper film-forming composition, and method for producing copper film by using the composition |
| KR20160027174A (en) | 2013-07-25 | 2016-03-09 | 가부시키가이샤 아데카 | Composition for copper film formation and copper film production method using same |
| KR20160114175A (en) | 2014-03-12 | 2016-10-04 | 가부시키가이샤 아데카 | Copper film forming composition and process for manufacturing copper film using same |
| JPWO2015045932A1 (en) * | 2013-09-30 | 2017-03-09 | 新日鉄住金化学株式会社 | Copper thin film forming composition |
-
1987
- 1987-12-24 JP JP62325568A patent/JPH01168866A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013136937A1 (en) | 2012-03-16 | 2013-09-19 | 株式会社Adeka | Copper film-forming composition, and method for producing copper film by using the composition |
| US9028599B2 (en) | 2012-03-16 | 2015-05-12 | Adeka Corporation | Copper film-forming composition, and method for producing copper film by using the composition |
| KR20160027174A (en) | 2013-07-25 | 2016-03-09 | 가부시키가이샤 아데카 | Composition for copper film formation and copper film production method using same |
| JPWO2015045932A1 (en) * | 2013-09-30 | 2017-03-09 | 新日鉄住金化学株式会社 | Copper thin film forming composition |
| KR20160114175A (en) | 2014-03-12 | 2016-10-04 | 가부시키가이샤 아데카 | Copper film forming composition and process for manufacturing copper film using same |
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