JPH01166545A - Zigzag type ic - Google Patents

Zigzag type ic

Info

Publication number
JPH01166545A
JPH01166545A JP32618387A JP32618387A JPH01166545A JP H01166545 A JPH01166545 A JP H01166545A JP 32618387 A JP32618387 A JP 32618387A JP 32618387 A JP32618387 A JP 32618387A JP H01166545 A JPH01166545 A JP H01166545A
Authority
JP
Japan
Prior art keywords
leads
zigzag type
surface mounting
zigzag
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32618387A
Other languages
Japanese (ja)
Inventor
Fushimi Yamauchi
山内　節美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP32618387A priority Critical patent/JPH01166545A/en
Publication of JPH01166545A publication Critical patent/JPH01166545A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate the formation of a pattern on a printed substrate by forming a structure of leads corresponding to surface mounting technique. CONSTITUTION:The leads at both ends of an IC body 1 are composed of leads 2 to be soldered to prevent an IC from overturning, and other leads are formed of leads 3, 4 for a surface mounting technique, and disposed in a zigzag state. When a zigzag type IC is mounted on a printed substrate, the leads 2 are inserted to through holes, and other leads are solderconnected by cream-solder on pads formed on the substrate. Thus, the formation of a pattern on the substrate can be facilitated.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はジグザグ型ＩＣ１特に、電子機器に使用される
ジグザグ型ＩＣに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a zigzag type IC 1, particularly to a zigzag type IC used in electronic equipment.

〔従来の技術〕[Conventional technology]

従来のジグザグ型ＩＣは第２図に示すようにプリント基
板に接続するものにも半田付用リードで接続していた。Conventional zigzag type ICs are also connected to the printed circuit board using soldering leads, as shown in FIG.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながらこのような上述した従来のジグザグ型ＩＣ
は半田付用リードのため、実装パターンが引きすらいと
いう欠点がある。However, the above-mentioned conventional zigzag type IC
Because it is a lead for soldering, it has the disadvantage that the mounting pattern is uneven.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のジグザグ型ＩＣは表面実装技術用リードを含ん
で構成される。The zigzag type IC of the present invention includes leads for surface mounting technology.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.

第１図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.

第１図に示すジグザグ型ＩＣは、ＩＣ本体１０両端のリ
ードが半田付用リード２となり、ＩＣの転倒を防いでい
る。In the zigzag type IC shown in FIG. 1, the leads at both ends of the IC body 10 serve as soldering leads 2 to prevent the IC from falling over.

他のリードは表面実装技術用リード３，４であり、これ
らは互いに千鳥状となるように配置されている。The other leads are surface mount technology leads 3 and 4, which are arranged in a staggered manner.

プリント基板にジグザグ型ＩＣを実装する時は、スルー
ホールに半田付用リード２を挿入し、ＩＣの転倒を防ぎ
、他のリードはプリント基板上につくられたパッド上に
クリーム半田により半田接続される。When mounting a zigzag IC on a printed circuit board, insert the soldering lead 2 into the through hole to prevent the IC from falling over, and connect the other leads to the pads made on the printed circuit board using cream solder. Ru.

〔発明の効果〕〔Effect of the invention〕

本発明のジグザグ型ＩＣは表面実装技術に対応したリー
ドの構造にすることによりプリント基板上でのパターン
を作成しやすいという効果がある。The zigzag type IC of the present invention has the effect of making it easy to create a pattern on a printed circuit board by having a lead structure compatible with surface mounting technology.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例を示す斜視図、第２図は従来
の一例を示す斜視図である。 １・・・・・・ＩＣ本体、２，２′・・・・・・半田付
用リード、３．４・・・・・・表面実装技術用リード。 代理人　弁理士　　内　原　　　音 、１ｆ５１　＠ ３５２図FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 1...IC body, 2,2'...lead for soldering, 3.4...lead for surface mounting technology. Agent Patent attorney Oto Uchihara, 1f51 @352 drawing

Claims (1)

【特許請求の範囲】[Claims] 　ＩＣ本体と、前記ＩＣ本体の両端に設けられた半田付
用リードと、表面実装のために千鳥状に配置された表面
実装技術用リードとを含むことを特徴とするジグザグ型
ＩＣ。A zigzag IC characterized in that it includes an IC body, soldering leads provided at both ends of the IC body, and leads for surface mounting technology arranged in a staggered manner for surface mounting.
JP32618387A 1987-12-22 1987-12-22 Zigzag type ic Pending JPH01166545A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32618387A JPH01166545A (en) 1987-12-22 1987-12-22 Zigzag type ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32618387A JPH01166545A (en) 1987-12-22 1987-12-22 Zigzag type ic

Publications (1)

Publication Number Publication Date
JPH01166545A true JPH01166545A (en) 1989-06-30

Family

ID=18184963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32618387A Pending JPH01166545A (en) 1987-12-22 1987-12-22 Zigzag type ic

Country Status (1)

Country Link
JP (1) JPH01166545A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5319755A (en) * 1990-04-18 1994-06-07 Rambus, Inc. Integrated circuit I/O using high performance bus interface
US5446317A (en) * 1992-03-09 1995-08-29 Fujitsu Limited Single in-line package for surface mounting
US5574310A (en) * 1991-05-17 1996-11-12 Fujitsu Limited Semiconductor package for surface mounting with reinforcing members on support legs
US5831332A (en) * 1991-05-17 1998-11-03 Fujitsu Limited Semiconductor package for surface mounting
US6002589A (en) * 1997-07-21 1999-12-14 Rambus Inc. Integrated circuit package for coupling to a printed circuit board
US6007357A (en) * 1995-05-26 1999-12-28 Rambus Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6234820B1 (en) 1997-07-21 2001-05-22 Rambus Inc. Method and apparatus for joining printed circuit boards
US8096812B2 (en) 1995-05-26 2012-01-17 Rambus Inc. Chip socket assembly and chip file assembly for semiconductor chips

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5657481A (en) * 1990-04-18 1997-08-12 Rambus, Inc. Memory device with a phase locked loop circuitry
US5983320A (en) * 1990-04-18 1999-11-09 Rambus, Inc. Method and apparatus for externally configuring and modifying the transaction request response characteristics of a semiconductor device coupled to a bus
US5473575A (en) * 1990-04-18 1995-12-05 Rambus, Inc. Integrated circuit I/O using a high performance bus interface
US5499385A (en) * 1990-04-18 1996-03-12 Rambus, Inc. Method for accessing and transmitting data to/from a memory in packets
US5513327A (en) * 1990-04-18 1996-04-30 Rambus, Inc. Integrated circuit I/O using a high performance bus interface
US5319755A (en) * 1990-04-18 1994-06-07 Rambus, Inc. Integrated circuit I/O using high performance bus interface
US5606717A (en) * 1990-04-18 1997-02-25 Rambus, Inc. Memory circuitry having bus interface for receiving information in packets and access time registers
US5861669A (en) * 1991-05-17 1999-01-19 Fujitsu Limited Semiconductor package for surface mounting
US5831332A (en) * 1991-05-17 1998-11-03 Fujitsu Limited Semiconductor package for surface mounting
US5574310A (en) * 1991-05-17 1996-11-12 Fujitsu Limited Semiconductor package for surface mounting with reinforcing members on support legs
US5728601A (en) * 1992-03-09 1998-03-17 Fujitsu Limited Process for manufacturing a single in-line package for surface mounting
US5446317A (en) * 1992-03-09 1995-08-29 Fujitsu Limited Single in-line package for surface mounting
US6007357A (en) * 1995-05-26 1999-12-28 Rambus Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6352435B1 (en) 1995-05-26 2002-03-05 Rambus, Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6589059B2 (en) 1995-05-26 2003-07-08 Rambus, Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6619973B2 (en) 1995-05-26 2003-09-16 Rambus, Inc. Chip socket assembly and chip file assembly for semiconductor chips
US8096812B2 (en) 1995-05-26 2012-01-17 Rambus Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6002589A (en) * 1997-07-21 1999-12-14 Rambus Inc. Integrated circuit package for coupling to a printed circuit board
US6234820B1 (en) 1997-07-21 2001-05-22 Rambus Inc. Method and apparatus for joining printed circuit boards
US6447321B1 (en) 1997-07-21 2002-09-10 Rambus, Inc. Socket for coupling an integrated circuit package to a printed circuit board

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