JPH01118394A - Brazing filler metal for joining ti and ti alloy and its forming method - Google Patents
Brazing filler metal for joining ti and ti alloy and its forming methodInfo
- Publication number
- JPH01118394A JPH01118394A JP27298487A JP27298487A JPH01118394A JP H01118394 A JPH01118394 A JP H01118394A JP 27298487 A JP27298487 A JP 27298487A JP 27298487 A JP27298487 A JP 27298487A JP H01118394 A JPH01118394 A JP H01118394A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- joining
- bonding
- insert
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005304 joining Methods 0.000 title claims abstract description 33
- 229910001069 Ti alloy Inorganic materials 0.000 title claims description 28
- 238000005219 brazing Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 title claims description 10
- 239000000945 filler Substances 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 title claims description 8
- 239000002184 metal Substances 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims abstract description 65
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 24
- 239000000956 alloy Substances 0.000 claims abstract description 24
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 14
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 10
- 229910001252 Pd alloy Inorganic materials 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims abstract description 3
- 229910018525 Al—Pt Inorganic materials 0.000 claims abstract 3
- 229910052719 titanium Inorganic materials 0.000 claims description 28
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 abstract description 18
- 238000005260 corrosion Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 9
- 239000012535 impurity Substances 0.000 abstract description 6
- 238000000992 sputter etching Methods 0.000 abstract description 2
- 238000004506 ultrasonic cleaning Methods 0.000 abstract description 2
- 238000001179 sorption measurement Methods 0.000 abstract 1
- 239000010936 titanium Substances 0.000 description 31
- 239000007789 gas Substances 0.000 description 10
- 230000007423 decrease Effects 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 238000010884 ion-beam technique Methods 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 230000009466 transformation Effects 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910000861 Mg alloy Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 244000062175 Fittonia argyroneura Species 0.000 description 2
- 229910001260 Pt alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- AMGNHZVUZWILSB-UHFFFAOYSA-N 1,2-bis(2-chloroethylsulfanyl)ethane Chemical compound ClCCSCCSCCCl AMGNHZVUZWILSB-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910000711 U alloy Inorganic materials 0.000 description 1
- 229910001093 Zr alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ろう接、及び、液相拡散接合に係り、特にＴ
ｉ及びＴｉ合金の接合に好適な接合用ろう材及びその形
成法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to soldering and liquid phase diffusion bonding, and in particular to T.
The present invention relates to a joining brazing material suitable for joining Ti and Ti alloys and a method for forming the same.
従来のＴｉ及びＴｉ合金のろう接については、溶接技術
１９８６年９月号の第２４頁から第３２頁において論じ
られているように、接合用ろう材として銀糸、アルミニ
ウム系、及び、チタン系ろうが用いられている。また、
液相拡散接合では、接合用インサート材として、純銅、
特公昭５５−６４７６号公報に記載のように、０．５〜
１０．０％Ｐｄ、または、Ｐｔを含有したＺｒ合金、Ｃ
ｕ合金、Ｎｉ合金及びＡｇ合金及び、特公昭６１−３４
９１５号公報に記載のように、３２〜８０％Ｚｒ−Ｃｕ
合金が用いられている。For conventional soldering of Ti and Ti alloys, as discussed in Welding Technology, September 1986, pages 24 to 32, silver thread, aluminum-based, and titanium-based brazing materials are used as joining brazing materials. is used. Also,
In liquid phase diffusion bonding, pure copper,
As described in Japanese Patent Publication No. 55-6476, 0.5~
Zr alloy containing 10.0% Pd or Pt, C
U alloy, Ni alloy, Ag alloy, and Special Publication 1986-34
As described in Japanese Patent No. 915, 32-80% Zr-Cu
Alloys are used.
これらのろう材やインサート材を被接合材間に形成する
には、箔もしくは粉末にして、または、各種コーティン
グによって接合面に適用している。In order to form these brazing materials or insert materials between the materials to be joined, they are applied to the joint surfaces in the form of foil or powder, or by various coatings.
Ｔｉ及びＴｉ合金は、接合時の熱サイクルを与えられる
ことによって著しく性質が劣化する。The properties of Ti and Ti alloys are significantly degraded by thermal cycling during bonding.
Ｔｉ及びＴｉ合金はα−β変態があり、それ以上の温度
に加熱されると耐食性、及び、機械的性質が劣化する。Ti and Ti alloys undergo α-β transformation, and when heated to a temperature higher than that, corrosion resistance and mechanical properties deteriorate.
また、強度の加工を受けたり、長時間の加熱にさらされ
ることによって母材の結晶粒の粗大化をまねき、母材の
延性が低下する。さらに接合時の雰囲気も重要である。Further, when subjected to intense processing or exposed to long-term heating, the crystal grains of the base material become coarsened, resulting in a decrease in the ductility of the base material. Furthermore, the atmosphere during bonding is also important.
Ｔｉ及びＴｉ合金は高温において多くのガス（Ｃ，Ｎ、
○、Ｈ）との親和力が強く、これらのガスを吸収して、
硬さが増し、じん性が低下する。Ti and Ti alloys release many gases (C, N,
It has a strong affinity with ○, H) and absorbs these gases,
Hardness increases and toughness decreases.
従来技術のろう材やインサート材を用いたろう接、及び
、液相拡散接合では、銀糸（一部）、アルミニウム系ろ
う相思外のろう材を使用した場合、接合温度が高く、母
材の機械的性質が低下する。In brazing welding using conventional brazing filler metals and insert materials, and in liquid phase diffusion bonding, when silver thread (partially) or aluminum-based brazing filler metals are used, the joining temperature is high and the mechanical strength of the base material is high. properties deteriorate.
また、液相拡散接合のように、長時間加熱されることに
よって母材の結晶粒が粗大化し延性が低下したり、ガス
を吸収して硬さが増し、じん性が低下したりする。アル
ミニウム系ろう材を用いた場合、母材であるＴｉ及びＴ
ｉ合金が耐食性が良好であるのに対し、その接合部の耐
食性が劣る。In addition, as in liquid phase diffusion bonding, when heated for a long time, the crystal grains of the base material become coarse and the ductility decreases, or the base material absorbs gas, increasing its hardness and decreasing its toughness. When using an aluminum brazing filler metal, the base metals Ti and T
Although the i-alloy has good corrosion resistance, the corrosion resistance of its joints is poor.
前述のように、ろう材やインサート材を被接合材間に形
成する方法では、被接合材であるＴｉ及びＴｉ合金の接
合面には、Ｔ ｉ Ｏ２やＡｌｚＯｓなどの酸化皮膜や
不純物が形成されており、接合部に残存し接合不良や接
合強度の低下の原因となる。As mentioned above, in the method of forming a brazing filler metal or insert material between materials to be joined, oxide films and impurities such as TiO2 and AlzOs are formed on the joint surfaces of Ti and Ti alloys, which are the materials to be joined. It remains in the bonded area and causes bonding defects and a decrease in bonding strength.
また、粉末や箔の形で供給する場合にも、その表面には
、酸化皮膜が形成されており、接合部に残存し悪影響を
及ぼす。In addition, even when supplied in the form of powder or foil, an oxide film is formed on the surface of the powder and remains at the joint, causing adverse effects.
本発明の目的は、被接合材の接合面の酸化皮膜を除去す
るとともに、ガス成分の吸収を抑制し。The purpose of the present invention is to remove the oxide film on the joint surfaces of the materials to be joined, and to suppress the absorption of gas components.
被接合材の接合時の熱サイクルによる機械的性質、及び
、耐食性の劣化を防止し、かつ、接合部の耐食性が向上
することができるＴｉ及びＴｉ合金の接合用Ａｌ合金イ
ンサート材、及び、その形成法を提供することにある。An Al alloy insert material for joining Ti and Ti alloys that can prevent deterioration of mechanical properties and corrosion resistance due to heat cycles during joining of materials to be joined, and improve the corrosion resistance of the joined part, and The objective is to provide a formation method.
上記目的は、あらかじめ被接合材であるＴｉ及びＴｉ合
金の接合面をドライエツチング処理（イオンスパッタリ
ング、グロー放電等）により清浄化した後、同一容器内
で大気に触れることなく清浄化された接合面上に接合用
インサート材の形成処理として、蒸着、又は、スパッタ
リングによって０．１〜５％のＰｄ、またはＰｔを含有
したＡｌ合金膜を設けて、Ａｌ合金膜が形成された接合
面同士を対向させ、真空中（５Ｘ Ｉ Ｑ−５Ｔｏｒｒ
以下）で低圧、低温接合することにより達成される。The above purpose is to clean the joint surfaces of the Ti and Ti alloy materials to be joined in advance by dry etching treatment (ion sputtering, glow discharge, etc.), and then clean the joint surfaces in the same container without exposing them to the atmosphere. As a bonding insert material forming process, an Al alloy film containing 0.1 to 5% Pd or Pt is provided by vapor deposition or sputtering, and the bonding surfaces on which the Al alloy film is formed are placed opposite each other. in vacuum (5X IQ-5Torr
This is achieved by low-pressure, low-temperature bonding under conditions (below).
本発明の接合用インサート材及びその形成法について第
１図に従って説明する。The joining insert material of the present invention and its forming method will be explained with reference to FIG.
まず、あらかじめ加工及び超音波洗浄した被接合材１の
接合面２をＡｒイオンガン５から発生するＡｒ＋イオン
でスパッタエツチングを行い、接合面２に形成、または
、付着している酸化皮膜。First, sputter etching is performed on the joint surface 2 of the materials 1 to be joined, which have been previously processed and ultrasonically cleaned, using Ar+ ions generated from the Ar ion gun 5 to remove the oxide film that is formed or adhered to the joint surface 2.
吸着ガス、不純物を除去し、清浄面３を設ける。Adsorbed gas and impurities are removed and a clean surface 3 is provided.
次に、同一容器７内で、被接合材１に設けた清浄面３上
でマグネトロンスパッタ装＠６によって接合用Ａｌ１合
金インサート層４を設けた後、接合に供する。Next, in the same container 7, an Al1 alloy insert layer 4 for bonding is provided on the clean surface 3 provided on the material 1 to be bonded using a magnetron sputtering device @6, and then the material is subjected to bonding.
被接合材であるＴｉ及びＴｉ合金の接合面を清浄化する
ことは、接合面に形成されているＴｉＯ２やＡｌｚＯｓ
などの酸化皮膜、吸着ガス（○、Ｈ２Ｎ）、不純物（Ｃ
など）を除去することができ、接合時に接合部に吸収さ
れるのを抑制し、接合部の接合欠陥の発生や脆化を防止
できる。Cleaning the joint surfaces of Ti and Ti alloys, which are the materials to be joined, is to clean the TiO2 and AlzOs formed on the joint surfaces.
oxide films, adsorbed gases (○, H2N), impurities (C
etc.) can be suppressed from being absorbed into the joint during bonding, thereby preventing the occurrence of joint defects and embrittlement of the joint.
蒸着、または、スパッタリングによってＴｉ及びＴｉ合
金の接合用Ａｆ１合金インサート膜を形成することは、
従来用いられているろう材の供給方法（粉末、箔）より
も吸着ガスや不純物の混入及び吸収を少なくすることが
でき、接合部の接合欠陥の発生及び脆化を防止すること
ができる。Forming an Af1 alloy insert film for bonding Ti and Ti alloy by vapor deposition or sputtering is as follows:
It is possible to reduce the mixing and absorption of adsorbed gases and impurities compared to conventional brazing filler metal supply methods (powder, foil), and it is possible to prevent the occurrence of bonding defects and embrittlement of the bonded portion.
次に、本発明のＴｉ及びＴｉ合金の接合用インサート材
について説明する。本発明の接合用インサート材は、０
．１〜５％Ｐｄ、または、Ｐｔを含有したＡｌ−Ｐｄ合
金、または、Ａｆｌ−Ｐｔ合金、ならびに、０．１〜５
％Ｐｄ、または、Ｐｔを含有し、カッ、０．５〜１５％
Ｓｉ、０．５ 〜１５％Ｃｕ、０．１ 〜５％Ｍｇの少
なくとも一種以上を含有したＡｌ合金である。Next, the insert material for joining Ti and Ti alloy of the present invention will be explained. The joining insert material of the present invention has 0
．． 1 to 5% Pd or Al-Pd alloy containing Pt or Afl-Pt alloy and 0.1 to 5% Pd
Contains % Pd or Pt, 0.5-15%
It is an Al alloy containing at least one of Si, 0.5 to 15% Cu, and 0.1 to 5% Mg.
本発明のＴｉ及びＴｉ合金の接合用インサート材である
Ａｌ合金は、Ｔｉ及びＴｉ合金のα−β変態温度以下で
の低温接合が可能となり、従来のアルミニウムろうでは
なかった耐食性を具備した接合用インサート材である。The Al alloy, which is the insert material for joining Ti and Ti alloys of the present invention, enables low-temperature joining below the α-β transformation temperature of Ti and Ti alloys, and has corrosion resistance that conventional aluminum solders do not have. It is an insert material.
次に、各成分の機能について述べる。Next, the functions of each component will be described.
Ｐｄ及びＰｔはＡｌ及びＡｎ合金インサート材自体の耐
食性を向上させ、接合部の耐食性が向上する。しかし、
Ｐｄ及びＰｔの含有量が０．１ ％未満では、インサ
ート材及びその接合部の耐食性を向上させる効果が少な
い。また、５％以上のＰｄまたはＰｔを含有することは
、耐食性の向上が認められるが、金属間化合物が生成し
やすくなり、接合部が脆弱となる。さらにＰｄ及びＰｔ
は高価であるため少量で耐食性が向上することがよい。Pd and Pt improve the corrosion resistance of the Al and An alloy insert material itself, thereby improving the corrosion resistance of the joint. but,
If the content of Pd and Pt is less than 0.1%, the effect of improving the corrosion resistance of the insert material and its joints will be small. Furthermore, if Pd or Pt is contained in an amount of 5% or more, corrosion resistance is improved, but intermetallic compounds are likely to be formed, and the joint becomes brittle. Furthermore, Pd and Pt
Since it is expensive, it is better to improve corrosion resistance with a small amount.
Ｓｉは接合用インサート材の融点を低下させ、流動性を
高め、被接合材へのぬれ性を改善させる。Si lowers the melting point of the joining insert material, increases fluidity, and improves wettability to the materials to be joined.
０．５ ％未満では、その効果が認められず、１５％よ
り含有量が多くなると金属間化合物が生成しやすくなり
、接合部が脆弱となる。If the content is less than 0.5%, no effect will be observed, and if the content is more than 15%, intermetallic compounds will be more likely to be formed and the joint will become brittle.
Ｃｕｔ；！１合用インサート材の融点を低下させる効果
がある。０．５ ％未満では、その効果が少なく、１５
％より含有量が多くなると金属間化合物が生成しやすく
なり、接合部が脆弱となる。また、被接合材へのぬれ性
が悪くなる。Cut;! It has the effect of lowering the melting point of the insert material for one cup. If it is less than 0.5%, the effect is small and 15
When the content is higher than %, intermetallic compounds are likely to be generated, and the joint becomes brittle. Moreover, the wettability to the materials to be joined becomes poor.
Ｍｇは接合時にＭｇ蒸気を発生し、Ａｌ２０ｓｚＴｉＯ
２などの酸化物を還元し、被接合材へのぬれ性が改善さ
れ、接合部への酸素の吸収を防ぐ。Mg generates Mg vapor during bonding, and Al20szTiO
Reduces oxides such as 2, improves wettability to materials to be joined, and prevents absorption of oxygen into the joint.
０．１ ％未満では、その効果が少なく、５％より含有
量が多くなると蒸発が多くなり、接合炉を汚染する。If the content is less than 0.1%, the effect will be small, and if the content is more than 5%, evaporation will increase and contaminate the bonding furnace.
Ｔｉ及びＴｉ合金は、接合時の熱サイクルを与えられる
ことによって、著しく性質が劣化する。The properties of Ti and Ti alloys deteriorate significantly when subjected to thermal cycles during bonding.
Ｔｉ及びＴｉ合金は、α−β変態温度（純Ｔｉ：約８８
５℃）以上に加熱されると機械的性質や耐食性が劣化す
る。また、液相拡散接合のように高温で長時間の加熱は
、Ｔｉ及びＴｉ合金の結晶粒の粗大化をまねき、延性が
低下する。これらの要因から、Ｔｉ及びＴｉ合金の接合
では、α−β変態温度以下の低温で接合する必要がある
。本発明の接合用インサート材であるＡｆ１合金は、約
６６０℃以下で溶融することから、低温接合が可能とな
り、母材の機械的性質や耐食性を損なうことなく、母材
の結晶粒の粗大化を抑制し、延性低下を防げる。Ti and Ti alloys have an α-β transformation temperature (pure Ti: about 88
If heated above 5°C, the mechanical properties and corrosion resistance will deteriorate. Further, heating at high temperature for a long time as in liquid phase diffusion bonding causes the crystal grains of Ti and Ti alloys to become coarser, resulting in a decrease in ductility. Due to these factors, it is necessary to join Ti and Ti alloys at a low temperature below the α-β transformation temperature. The Af1 alloy, which is the bonding insert material of the present invention, melts at about 660°C or lower, so low-temperature bonding is possible, and the crystal grains of the base material can be coarsened without impairing the mechanical properties or corrosion resistance of the base material. can be suppressed and prevent a decrease in ductility.
本発明のインサート材を用いて接合を行ない、形成され
た接合部は、Ｐｄ、または、Ｐｔを含有する接合層とな
り、母材であるＴｉ及びＴｉ合金より耐食性が劣るが、
従来のアルミニウムろうによる接合部よりは、耐食性が
向上する。The bonded part formed by bonding using the insert material of the present invention becomes a bonding layer containing Pd or Pt, and has inferior corrosion resistance than the base material Ti and Ti alloy.
Corrosion resistance is improved compared to conventional aluminum solder joints.
Ｔｉ及びＴｉ合金の接合を行うにあたっては、接合時の
雰囲気に注意する必要がある。Ｔｉ及びＴｉ合金はガス
成分（Ｃ，Ｏ，Ｎ、Ｈ）と活性であり、硬化し、脆弱に
なる。そこで本発明のインサート材を用いて接合を行う
場合、接合時の雰囲気は、５ Ｘ １０−’Ｔｏｒｒ以
下の真空中で行うのがよい。When joining Ti and Ti alloys, it is necessary to pay attention to the atmosphere at the time of joining. Ti and Ti alloys are active with gaseous components (C, O, N, H) and become hardened and brittle. Therefore, when bonding is performed using the insert material of the present invention, the atmosphere at the time of bonding is preferably a vacuum of 5 x 10-'Torr or less.
本発明の接合用インサート材は、Ｔｉ及びＴｉ合金と他
の異種材の接合、Ａｌ及びＡｌ合金の接合にも応用でき
る。The bonding insert material of the present invention can also be applied to bonding Ti and Ti alloys to other dissimilar materials, and to bonding Al and Al alloys.
以下１本発明の実施例について説明する。 An embodiment of the present invention will be described below.
被接合材として純Ｔｉ （寸法：１０ｍｍ口）を用いた
。まず、あらかじめアセトン中で杓子分間超音波洗浄を
行った。Pure Ti (dimensions: 10 mm opening) was used as the material to be joined. First, ultrasonic cleaning was performed in advance in acetone for a minute using a ladle.
次に、Ａｒイオンスパッタリング装置、及び、マグネト
ロンスパッタ蒸着装置を具備した真空装置によって、接
合用インサート材を被接合材の接合面に形成した。まず
、真空装置内のＡｒイオンスパッタリング装置で被接合
材である純Ｔｉの接合面をスパッタリングし、洗浄面を
形成した。表１はＡｒイオンビーム処理条件を示す。Next, a bonding insert material was formed on the bonding surface of the materials to be bonded using a vacuum device equipped with an Ar ion sputtering device and a magnetron sputter deposition device. First, a bonding surface of pure Ti, which is a material to be bonded, was sputtered using an Ar ion sputtering device in a vacuum apparatus to form a cleaned surface. Table 1 shows Ar ion beam processing conditions.
第 １ 表
表１に示すように３ Ｘ １０−３ＴｏｒｒのＡｒ雰囲
気下で６００Ｗ （３ＫＶ、２００ｍＡ）の出力のＡｒ
イオンビームによって、純Ｔｉの接合面を約２００人（
１０人／ｍ１ｎ） 削って、接合面上の酸化皮膜、吸
着ガス及び不純物を除去し、清浄面を形成した。Table 1 As shown in Table 1, an Ar with an output of 600W (3KV, 200mA) was applied in an Ar atmosphere of 3 x 10-3 Torr.
Approximately 200 people (
10 people/m1n) to remove the oxide film, adsorbed gas, and impurities on the joint surface, and form a clean surface.
次に、同一真空装置内に具備されたマグネトロンスパッ
タ装置によって、純Ｔｉの清浄な接合面上に接合用イン
サート材を形成した。表２はスパッタ蒸着条件を、表３
は接合用インサート材の化学組成を示す。Next, a bonding insert material was formed on the clean bonding surface of pure Ti using a magnetron sputtering device provided in the same vacuum device. Table 2 shows the sputter deposition conditions, and Table 3 shows the sputter deposition conditions.
indicates the chemical composition of the joining insert material.
第 ２ 表
第 ３ 表
表２に示すように、３ Ｘ １０−”ＴｏｒｒのＡｒ雰
囲気下で４００Ｖ、３．２ Ａの出力で２０ｍ１ｎ（
０，５μｍ／ｗｉｎ）行い、約１ｏμｍの接合用インサ
ート材である表３に示す１２合金膜を形成した。As shown in Table 2, Table 3, 20 m1n(
0.5 μm/win) to form a 12 alloy film shown in Table 3, which is a bonding insert material of about 1 μm.
形成された本発明の接合用インサート材である ／Ａｌ
合金膜の組成は、表３に示すように、Ａｌ−２％Ｐｄ合
金、Ａｌ−０．８ ％Ｐｔ合金、Ａｌ−２．０ ％Ｐｄ
−１０％５ｉ−５％Ｃｕ−１，５％Ｍｇ合金及びＡｌ２
−０．８ ％Ｐｔ−１０％５ｉ−５％Ｃｕ−１，５％
Ｍｇ合金である。また、比較のための接合用インサート
材である１２合金膜は、純Ａｌ及びＡｌ２−１０％合金
合金いた。/Al is the bonding insert material of the present invention formed
As shown in Table 3, the composition of the alloy film is Al-2%Pd alloy, Al-0.8%Pt alloy, Al-2.0%Pd
-10%5i-5%Cu-1,5%Mg alloy and Al2
-0.8%Pt-10%5i-5%Cu-1,5%
It is an Mg alloy. Further, the 12 alloy film, which is a bonding insert material for comparison, was made of pure Al and an Al2-10% alloy.
本発明の接合用インサート材の形成法であるドライエツ
チング処理の一つであるＡｒイオンビーム処理を施こさ
ずにスパッタ蒸着によって１２合金膜を形成した場合に
は、１２合金膜が純Ｔｉの接合面よりはがれたりした。When the 12 alloy film is formed by sputter deposition without performing Ar ion beam treatment, which is one of the dry etching processes used to form the bonding insert material of the present invention, the 12 alloy film is a pure Ti bond. It peeled off from the surface.
形成された接合用人Ｑ合金膜の膜厚は、約１０μｍ一定
とした。その１２合金膜の融点は、Ａｌ−２，ＯＰｄ合
金＝６５５℃、Ａｌ−０，８Ｐｔ合金：６４０℃、Ａｌ
−２．ＯＰｄ−１，０％５ｉ−５％Ｃｕ−１，５％Ｍｇ
合金：５５０°Ｃ，Ａｌ−〇、８ ％Ｐｔ−１０％５ｉ
−５％Ｃｕ −１、５％Ｍｇ合金＝５６０℃、Ａｌ ：
６６０℃、Ａｆｌ−１ｏ％Ｓｉ合金：５８０℃である
。The thickness of the formed bonding agent Q alloy film was kept constant at about 10 μm. The melting points of the 12 alloy film are: Al-2, OPd alloy = 655°C, Al-0,8Pt alloy: 640°C, Al
-2. OPd-1,0%5i-5%Cu-1,5%Mg
Alloy: 550°C, Al-〇, 8%Pt-10%5i
-5% Cu -1, 5% Mg alloy = 560°C, Al:
660°C, Afl-1o%Si alloy: 580°C.
次に、純Ｔｉの接合面に形成された１２合金膜（Ｎα１
〜７）同士を対面させ、接合を行った。表４は接合条件
を示す。Next, a 12 alloy film (Nα1
~7) They were made to face each other and bonded. Table 4 shows the bonding conditions.
第 ４ 表
接合は、ガス成分の影響を排除した２×１０−δＴ ｏ
ｒｒの真空下で接合温度ニア００℃、接合時間：３０ｍ
１ｎ、加圧カニ０．１ｋｇｆ／ｍｍ２で行った。Table 4 Welding is performed using 2×10-δTo which excludes the influence of gas components.
Bonding temperature near 00℃ under vacuum of rr, bonding time: 30m
1n, pressurized crab at 0.1 kgf/mm2.
第２図は純Ｔｉ接合部の接合強さを示す。第２図に示す
ように、Ａｎ−２，ＯＰｄ合金（ＮＱＩ。FIG. 2 shows the bond strength of the pure Ti bond. As shown in FIG. 2, An-2, OPd alloy (NQI).
２）による純Ｔｉの接合部の接合強さは、Ａｒイオンビ
ーム処理を行った場合、約１６ｋｇｆ／ｎｙａ２であり
、Ａｒイオンビーム処理をしない場合約６ｋｇ ｆ ／
ｍｍ２である。このようにＡｒイオンビーム処理しな
い場合の接合部の接合強さは接合面の酸化皮膜の影響に
より低いことがわかる。The bonding strength of the pure Ti bonded portion according to 2) is approximately 16 kgf/nya2 when Ar ion beam treatment is performed, and approximately 6 kgf/nya2 when Ar ion beam treatment is not performed.
It is mm2. It can be seen that the bonding strength of the bonded portion without Ar ion beam treatment is low due to the influence of the oxide film on the bonded surface.
次に、第２図に示すように、接合のまま接合部の接合強
さと５％Ｎ ａ ＣＱ水浸漬（７２ｈ）試験後の接合部
の接合強さと比較、検討した。その結果、本発明のイン
サート材であるＡｌ合金膜（Ｎα１．３，４．５）によ
る接合部の接合強さは、５％ＮａＣｆ１水浸漬（７２ｈ
）試験によってやや低下する傾向が見られるが、純Ａｌ
膜（Ｎα６）及びＡｌ−１０％Ｓｉ膜（Ｎ（１７）によ
る接合部の接合強さの低下より少ないことがわかる。こ
のことから、本発明インサート材を用いて接合すること
により、その接合部は従来より耐食性がよいことがわか
る。Next, as shown in FIG. 2, the bonding strength of the bonded portion as bonded was compared with the bonding strength of the bonded portion after a 5% Na CQ water immersion test (72 hours). As a result, the bonding strength of the bonded portion using the Al alloy film (Nα1.3, 4.5), which is the insert material of the present invention, was determined by immersion in 5% NaCf1 water (72 hours).
) Although there is a slight tendency to decrease depending on the test, pure Al
It can be seen that the decrease in the bonding strength of the bonded portion is smaller than that of the film (Nα6) and the Al-10%Si film (N(17)).From this, by bonding using the insert material of the present invention, the bonding strength of the bonded portion is reduced by using the insert material of the present invention. It can be seen that the corrosion resistance is better than the conventional one.
本発明によれば、Ｔｉ及びＴｉ合金の接合において、α
−β変態温度以下での接合ができるので被接合材を劣化
させることがなく、ガスの影響が排除でき、さらに、接
合部の耐食性が向上する。According to the present invention, in joining Ti and Ti alloy, α
Since joining can be performed at a temperature below -β transformation temperature, the materials to be joined are not deteriorated, the influence of gas can be eliminated, and the corrosion resistance of the joint is improved.
第１図は本発明の一実施例のインサート材形成法を示す
図、第２図は本発明インサート材及び比較材による接合
部の接合強さを示す図である。
１・・・被接合材、２・・・接合面、３・・・清浄面、
４・・・接合用Ａｌ合金インサート膜、５・・・Ａ’ｒ
イオンガン、６・・・マグネトロンスパッタ装置、７・
・・真空容器。FIG. 1 is a diagram showing a method for forming an insert material according to an embodiment of the present invention, and FIG. 2 is a diagram showing the bonding strength of a joint portion using the insert material of the present invention and a comparative material. 1... Material to be joined, 2... Joining surface, 3... Clean surface,
4... Al alloy insert film for bonding, 5... A'r
Ion gun, 6... Magnetron sputtering device, 7.
...Vacuum container.
Claims (1)
またはＰｔを含有したＡｌ−ｐｄ合金またはＡｌ−Ｐｔ
合金を用いることを特徴とするＴｉ及びＴｉ合金の接合
用ろう材。 ２、特許請求の範囲第１項において、さらに、０．５〜
１５％Ｓｉ、０．５〜１５％Ｃｕ、０．１〜５％Ｍｇの
少なくとも一種以上を含有するＡｌ合金であることを特
徴とするＴｉ及びＴｉ合金の接合用ろう材。 ３、Ｔｉ及びＴｉ合金の接合において、被接合材である
Ｔｉ及びＴｉ合金の接合面をドライエッチング処理で清
浄化した後、清浄化された前記接合面にスパッタ蒸着に
よつて接合用インサート合金を形成することを特徴とす
るＴｉ及びＴｉ合金の接合用ろう材の形成法。[Claims] 1. 0.1 to 5% Pd as a joining insert alloy
Or Al-pd alloy containing Pt or Al-Pt
A brazing material for joining Ti and Ti alloy, characterized by using an alloy. 2. In claim 1, furthermore, from 0.5 to
A brazing filler metal for joining Ti and Ti alloys, which is an Al alloy containing at least one of 15% Si, 0.5 to 15% Cu, and 0.1 to 5% Mg. 3. In joining Ti and Ti alloy, after cleaning the joining surfaces of Ti and Ti alloy as the materials to be joined by dry etching treatment, a joining insert alloy is applied to the cleaned joining surface by sputter deposition. 1. A method for forming a brazing filler metal for joining Ti and Ti alloys.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27298487A JPH01118394A (en) | 1987-10-30 | 1987-10-30 | Brazing filler metal for joining ti and ti alloy and its forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27298487A JPH01118394A (en) | 1987-10-30 | 1987-10-30 | Brazing filler metal for joining ti and ti alloy and its forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01118394A true JPH01118394A (en) | 1989-05-10 |
Family
ID=17521522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27298487A Pending JPH01118394A (en) | 1987-10-30 | 1987-10-30 | Brazing filler metal for joining ti and ti alloy and its forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01118394A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002310788A (en) * | 2001-04-10 | 2002-10-23 | Atsumi Electric Co Ltd | Heat-ray sensor system |
| JP2015501222A (en) * | 2011-10-14 | 2015-01-15 | シーメンス アクティエンゲゼルシャフト | How to repair surface damage on turbomachine parts |
| CN107214433A (en) * | 2017-07-31 | 2017-09-29 | 安徽华众焊业有限公司 | A kind of Aluminum alloy foil solder |
-
1987
- 1987-10-30 JP JP27298487A patent/JPH01118394A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002310788A (en) * | 2001-04-10 | 2002-10-23 | Atsumi Electric Co Ltd | Heat-ray sensor system |
| JP2015501222A (en) * | 2011-10-14 | 2015-01-15 | シーメンス アクティエンゲゼルシャフト | How to repair surface damage on turbomachine parts |
| CN107214433A (en) * | 2017-07-31 | 2017-09-29 | 安徽华众焊业有限公司 | A kind of Aluminum alloy foil solder |
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