JPH01117280A - Socket for spring probe pin - Google Patents
Socket for spring probe pinInfo
- Publication number
- JPH01117280A JPH01117280A JP27504487A JP27504487A JPH01117280A JP H01117280 A JPH01117280 A JP H01117280A JP 27504487 A JP27504487 A JP 27504487A JP 27504487 A JP27504487 A JP 27504487A JP H01117280 A JPH01117280 A JP H01117280A
- Authority
- JP
- Japan
- Prior art keywords
- spring probe
- probe pin
- socket
- hole
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 32
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 239000012212 insulator Substances 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 description 3
- PCBOWMZAEDDKNH-HOTGVXAUSA-N [4-(trifluoromethoxy)phenyl]methyl (3as,6as)-2-(3-fluoro-4-sulfamoylbenzoyl)-1,3,3a,4,6,6a-hexahydropyrrolo[3,4-c]pyrrole-5-carboxylate Chemical class C1=C(F)C(S(=O)(=O)N)=CC=C1C(=O)N1C[C@H]2CN(C(=O)OCC=3C=CC(OC(F)(F)F)=CC=3)C[C@@H]2C1 PCBOWMZAEDDKNH-HOTGVXAUSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、スプリングプローブピン用ソケットに関し、
特にプリント基板又は電子部品の搭載されたプリント基
板の試験等に使用されるスプリングプローブピン用ソケ
ットに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a spring probe pin socket.
In particular, the present invention relates to a spring probe pin socket used for testing printed circuit boards or printed circuit boards on which electronic components are mounted.
（従来の技術）
従来のスプリングプローブピン用ソケットは、導電率の
高い物質だけで作られており、高密度実装に際しては、
そのソケットを埋め込むピンボードの穴位置精度を出す
ことと、埋め込むビンボードに対して直角であること等
の細心の注意を要する。(Prior art) Conventional sockets for spring probe pins are made only of materials with high conductivity.
Great care must be taken to ensure the accuracy of the hole position on the pin board in which the socket is to be embedded, and to ensure that the hole is perpendicular to the pin board in which the socket will be embedded.
しかし、被試験物側の形状やスプリンググローブピンに
加わる力の強さ等によってスプリングプローブピン用ソ
ケットが曲がってしまい、隣接する他のスプリングプロ
ーブピン用ソケットと接触する可能性が高かった。However, due to the shape of the test object, the strength of the force applied to the spring globe pin, etc., the spring probe pin socket is bent, and there is a high possibility that it will come into contact with another adjacent spring probe pin socket.
（発明が解決しようとする問題点）
前述した従来のスプリンググローブビン用ソケットの場
合、ソケット全体が導体であるから、高密度実装時に隣
接する他のスプリングプローブピン用ソケットと接触し
、通電した場合短絡するという問題がある。(Problems to be Solved by the Invention) In the case of the conventional spring probe pin socket described above, the entire socket is a conductor, so when it comes into contact with other adjacent spring probe pin sockets during high-density mounting and becomes energized. There is a problem with short circuits.
（問題点を解決するための手段）
前述の問題点を解決するために本発明が提供する手段は
、スプリングプローブピンを挿着する穴が導体に設けで
あるスプリングプローブピン用ソケットにおいて、前記
導体が絶縁物で被覆してあることを特徴とする。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a spring probe pin socket in which a hole into which the spring probe pin is inserted is provided in the conductor. is characterized by being covered with an insulating material.
（実施例） 次に、本発明について図面を参照して説明する。(Example) Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例のスプリングプローブピン用
ソケットを示す破断面図、第２図は第１図のスプリング
プローブピン用ソケットの使用状態を示す断面図である
。FIG. 1 is a broken sectional view showing a spring probe pin socket according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the state in which the spring probe pin socket of FIG. 1 is used.
図中、１はスプリング１０−ブピン用ソケツト、２は絶
縁物、３は導体、４はスプリングプローブピン、５は配
線、６はビンボード、７は被試験プリント基板、８は電
子部品、９ははんだ、１０は穴である。In the figure, 1 is a spring 10-pin socket, 2 is an insulator, 3 is a conductor, 4 is a spring probe pin, 5 is a wiring, 6 is a bin board, 7 is a printed circuit board under test, 8 is an electronic component, and 9 is a solder , 10 are holes.
本実施例のスプリング１０−ブピン用ソケツト１は、第
１図に示すように、スプリング１０−ブピン４の挿着用
の穴１０を導体３に設け、その導体３に絶縁物２を被覆
してなる。As shown in FIG. 1, the spring 10-pin socket 1 of this embodiment is constructed by providing a conductor 3 with a hole 10 for inserting the spring 10-pin 4, and covering the conductor 3 with an insulator 2. .
本実施例のスプリングプローブピン用ソケット１を使用
するには、第２図に示すように、電子部品８が実装しで
あるプリント基板７の下方に配置したピンボード６に、
２本のスプリングプローブピン用ソケット１，１１を貫
通させて設ける１次に、各スプリングプローブピン用ソ
ケ、ット１．１１の一端部の穴１０にスプリングプロー
ブピン４をそれぞれ挿着し、他端部に配線５をそれぞれ
接続する。To use the spring probe pin socket 1 of this embodiment, as shown in FIG.
The two spring probe pin sockets 1 and 11 are passed through the primary hole 10, and the spring probe pin 4 is inserted into the hole 10 at one end of each spring probe pin socket 1.11. Wires 5 are connected to each end.
このとき、スプリンググローブビン４の先端は被試験プ
リント基板７のはんだ９に接触している。At this time, the tip of the spring glove bottle 4 is in contact with the solder 9 of the printed circuit board 7 to be tested.
本実施例のスプリングプローブピン用ソケット１．１１
によれば、導体３が絶縁被覆しであるので、第２図に示
すように、スプリングプローブピン４に大きな力が加わ
って変型し、互いに隣接するソケット１同士が接触した
としても、短絡事故は生じない。Socket for spring probe pin of this example 1.11
According to the above, since the conductor 3 is insulated, even if a large force is applied to the spring probe pin 4 and it deforms, as shown in FIG. 2, and adjacent sockets 1 come into contact with each other, a short circuit will not occur. Does not occur.
（発明の効果）
以上に説明したように本発明のスプリングプローブピン
用ソケットによれば、変形して隣接する他のソケットに
接触したとしても、短絡事故が生じないので、例えば電
子部品を高密度実装したプリント基板等の試験を安全か
つ容易に行なうことができる。(Effects of the Invention) As explained above, according to the spring probe pin socket of the present invention, even if it is deformed and comes into contact with another adjacent socket, a short circuit will not occur. Tests on mounted printed circuit boards, etc. can be performed safely and easily.
第１図は本発明の一実施例のスプリングプローブピン用
ソケットを示す破断面図、第２図は第１図のスプリング
プローブピン用ソケットの使用状態を示す断面図である
。
１・・・スプリング１０−ブピン用ソケツト、２・・・
絶縁物、３・・・導体、４・・・スプリングプローブピ
ン、５・・・配線、６・・・ピンボード、７・・・被試
験プリント基板、８・・・電子部品、９・・・はんだ、
１０・・・穴。FIG. 1 is a broken sectional view showing a spring probe pin socket according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the state in which the spring probe pin socket of FIG. 1 is used. 1... Spring 10-pin socket, 2...
Insulator, 3... Conductor, 4... Spring probe pin, 5... Wiring, 6... Pin board, 7... Printed circuit board under test, 8... Electronic component, 9... solder,
10...hole.
Claims (1)
るスプリングプローブピン用ソケットにおいて、前記導
体が絶縁物で被覆してあることを特徴とするスプリング
プローブピン用ソケット。1. A spring probe pin socket in which a conductor is provided with a hole into which a spring probe pin is inserted, characterized in that the conductor is covered with an insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27504487A JPH01117280A (en) | 1987-10-29 | 1987-10-29 | Socket for spring probe pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27504487A JPH01117280A (en) | 1987-10-29 | 1987-10-29 | Socket for spring probe pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01117280A true JPH01117280A (en) | 1989-05-10 |
Family
ID=17550076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27504487A Pending JPH01117280A (en) | 1987-10-29 | 1987-10-29 | Socket for spring probe pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01117280A (en) |
-
1987
- 1987-10-29 JP JP27504487A patent/JPH01117280A/en active Pending
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