JPH01100453U - - Google Patents

Info

Publication number
JPH01100453U
JPH01100453U JP19568687U JP19568687U JPH01100453U JP H01100453 U JPH01100453 U JP H01100453U JP 19568687 U JP19568687 U JP 19568687U JP 19568687 U JP19568687 U JP 19568687U JP H01100453 U JPH01100453 U JP H01100453U
Authority
JP
Japan
Prior art keywords
electrode terminal
external electrode
protective film
semiconductor device
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19568687U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19568687U priority Critical patent/JPH01100453U/ja
Publication of JPH01100453U publication Critical patent/JPH01100453U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体装置の一実施例の斜視
図、第２図はその外部電極端子の拡大図、第３図
は本考案の他の実施例の斜視図、第４図は更に他
の実施例の外部電極端子の拡大図である。 １，１Ａ……ヒートシンク、２……樹脂付ケー
ス、２Ａ……樹脂モールド、３，３Ａ……外部電
極端子、４，４Ａ……保護膜、５……紐。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子等を封止したパツケージから突出さ
    れる外部電極端子の表面を、含油性樹脂からなる
    保護膜で剥離可能に被覆したことを特徴とする半
    導体装置。
JP19568687U 1987-12-25 1987-12-25 Pending JPH01100453U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19568687U JPH01100453U (ja) 1987-12-25 1987-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19568687U JPH01100453U (ja) 1987-12-25 1987-12-25

Publications (1)

Publication Number Publication Date
JPH01100453U true JPH01100453U (ja) 1989-07-05

Family

ID=31486351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19568687U Pending JPH01100453U (ja) 1987-12-25 1987-12-25

Country Status (1)

Country Link
JP (1) JPH01100453U (ja)

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