JP7505440B2 - Plastic moldings - Google Patents

Plastic moldings Download PDF

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JP7505440B2
JP7505440B2 JP2021067818A JP2021067818A JP7505440B2 JP 7505440 B2 JP7505440 B2 JP 7505440B2 JP 2021067818 A JP2021067818 A JP 2021067818A JP 2021067818 A JP2021067818 A JP 2021067818A JP 7505440 B2 JP7505440 B2 JP 7505440B2
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resin
pressure
molded product
mold
primary molded
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JP2022162811A (en
JP2022162811A5 (en
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裕之 北村
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I Pex Inc
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Dai Ichi Seiko Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles

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  • Injection Moulding Of Plastics Or The Like (AREA)

Description

開示の実施形態は、樹脂成形品に関する。 The disclosed embodiment relates to a resin molded product.

従来、樹脂成形された１次成形品を被成形品として２次成形用金型にセットして、樹脂材料をキャビティに流し込むことで、被成形品に樹脂材料を一体化する、所謂インサート成形技術が知られている（例えば、特許文献１参照）。 Conventionally, a so-called insert molding technique has been known in which a resin-molded primary molded product is set in a secondary molding die as the molded product, and resin material is poured into the cavity to integrate the resin material with the molded product (see, for example, Patent Document 1).

特開２０１７－１０９３７２号公報JP 2017-109372 A

しかしながら、上記従来の技術では、樹脂材料をキャビティに流し込む際、樹脂材料の流路の下流に被成形品である１次成形品が配置されていれば、１次成形品に対して、樹脂材料が流れる際に生じる圧力、所謂、樹脂圧が加わることにより、例えば、１次成形品の端部が金型に押し付けられて、金型と当接した部分が変形する可能性がある。 However, in the above conventional technology, when the resin material is poured into the cavity, if the primary molded product, which is the product to be molded, is placed downstream of the flow path of the resin material, the pressure generated when the resin material flows, known as resin pressure, is applied to the primary molded product, and, for example, the end of the primary molded product may be pressed against the mold, causing the part that abuts against the mold to deform.

実施形態の一態様は、上記に鑑みてなされたものであって、樹脂材料をキャビティに流し込む際、被成形品に対して、樹脂圧が加えられた場合であっても、被成形品が変形し難い樹脂成形品を提供することを目的とする。 One aspect of the embodiment has been made in consideration of the above, and aims to provide a resin molded product in which the molded product is less likely to deform even when resin pressure is applied to the molded product when the resin material is poured into the cavity.

実施形態の一態様に係る樹脂成形品は、熱可塑性樹脂で形成された１次成形樹脂部と１次成形樹脂部に接続される回路基板とを備える被成形品と、熱硬化性樹脂である樹脂材料を用いた成形処理によって被成形品と一体化される２次成形樹脂部とを備える。回路基板は、１次成形樹脂部のうち成形処理で樹脂材料が流れる方向である第１方向における上流に位置する一端部に接続される。１次成形樹脂部の外周には、成形処理で樹脂材料が流れる際に生じる圧力を受ける圧受部が設けられる。圧受部は、第１方向と交差する方向である第２方向に広がる面で金型と当接する圧受面を有する。 A resin molded product according to one aspect of the embodiment includes a molded product including a primary molded resin part made of thermoplastic resin and a circuit board connected to the primary molded resin part, and a secondary molded resin part integrated with the molded product by a molding process using a resin material that is a thermosetting resin . The circuit board is connected to one end of the primary molded resin part located upstream in a first direction, which is the direction in which the resin material flows in the molding process. A pressure-receiving part is provided on the outer periphery of the primary molded resin part to receive a pressure generated when the resin material flows in the molding process. The pressure-receiving part has a pressure-receiving surface that abuts against the mold on a surface that extends in a second direction, which is a direction intersecting the first direction.

実施形態の一態様によれば、樹脂材料をキャビティに流し込む際、被成形品に対して、樹脂圧が加えられた場合であっても被成形品が変形し難い樹脂成形品を提供することができる。 According to one aspect of the embodiment, it is possible to provide a resin molded product in which the molded product is less likely to deform even when resin pressure is applied to the molded product when the resin material is poured into the cavity.

図１は、実施形態に係る樹脂成形品の構成の一例を示す側面図である。FIG. 1 is a side view showing an example of the configuration of a resin molded product according to an embodiment. 図２は、図１に示す樹脂成形品の平面図である。FIG. 2 is a plan view of the resin molded product shown in FIG. 図３は、実施形態に係る１次成形品の構成の一例を示す側面図である。FIG. 3 is a side view showing an example of the configuration of the primary molded product according to the embodiment. 図４は、図３に示す１次成形品の平面図である。FIG. 4 is a plan view of the primary molded product shown in FIG. 図５は、図３に示す１次成形品の正面図である。FIG. 5 is a front view of the primary molded product shown in FIG. 図６は、実施形態に係る１次成形品が第１金型と第２金型との間に配置された状態の２次成形用金型の平面図である。FIG. 6 is a plan view of a secondary molding die in a state in which a primary molded product according to the embodiment is disposed between a first die and a second die. 図７は、図６に示すVII－VII線に沿った断面図である。FIG. 7 is a cross-sectional view taken along line VII-VII shown in FIG. 図８は、図７に示す第１金型と第２金型とが型締された状態を示す断面図である。FIG. 8 is a cross-sectional view showing a state in which the first mold and the second mold shown in FIG. 7 are clamped together. 図９は、実施形態に係る１次成形品が２次成形工程において２次成形用樹脂材料によって受ける圧力の方向を示す図である。FIG. 9 is a diagram showing the direction of pressure that the primary molded product according to the embodiment receives from the secondary molding resin material in the secondary molding step. 図１０は、実施形態に係る圧受部がない１次成形品を用いた２次成形処理を説明するための図である。FIG. 10 is a diagram for explaining a secondary molding process using a primary molded product having no pressure-receiving portion according to the embodiment. 図１１は、実施形態に係る１次成形品の構成の他の例を示す正面図である。FIG. 11 is a front view showing another example of the configuration of the primary molded product according to the embodiment. 図１２は、実施形態に係る１次成形品の構成の他の例を示す側面図である。FIG. 12 is a side view showing another example of the configuration of the primary molded product according to the embodiment. 図１３は、図１２に示す１次成形品の正面図である。FIG. 13 is a front view of the primary molded product shown in FIG. 図１４は、図１２に示す１次成形品が型締前の第１金型と第２金型との間に配置された状態を示す断面図である。FIG. 14 is a cross-sectional view showing a state in which the primary molded product shown in FIG. 12 is disposed between the first and second molds before the molds are clamped. 図１５は、図１２に示す１次成形品が型締後の第１金型と第２金型との間に配置された状態を示す断面図である。FIG. 15 is a cross-sectional view showing a state in which the primary molded product shown in FIG. 12 is disposed between the first and second molds after the molds are clamped. 図１６は、実施形態に係る１次成形品の構成のさらに他の例を示す側面図である。FIG. 16 is a side view showing still another example of the configuration of the primary molded product according to the embodiment. 図１７は、図１６に示す１次成形品の正面図である。FIG. 17 is a front view of the primary molded product shown in FIG. 図１８は、図１６に示す１次成形品が型締前の第１金型と第２金型との間に配置された状態を示す断面図である。FIG. 18 is a cross-sectional view showing a state in which the primary molded product shown in FIG. 16 is disposed between the first and second molds before the molds are clamped. 図１９は、図１６に示す１次成形品が型締後の第１金型と第２金型との間に配置された状態を示す断面図である。FIG. 19 is a cross-sectional view showing a state in which the primary molded product shown in FIG. 16 is disposed between the first and second molds after the molds are clamped.

以下、添付図面を参照して、本願の開示する樹脂成形品の実施形態を詳細に説明する。なお、以下に示す実施形態によりこの発明が限定されるものではない。また、図１および図２を含む複数の図面には、説明を分かりやすくするために、ＸＹＺ軸の座標を付している。Ｚ軸方向は、樹脂成形品に含まれる回路基板の主面と直交する方向であり、以下において、Ｚ軸正方向を上方向と記載し、Ｚ軸負方向を下方向と記載する場合がある。また、樹脂成形品の構成の一部のみを図示する場合において、Ｘ軸方向、Ｙ軸方向、およびＺ軸方向の各々は、樹脂成形品が完成した状態での方向である。 Below, with reference to the attached drawings, an embodiment of the resin molded product disclosed in the present application will be described in detail. Note that the present invention is not limited to the embodiment described below. In addition, to facilitate understanding of the description, XYZ coordinates are attached to several drawings including FIG. 1 and FIG. 2. The Z axis direction is a direction perpendicular to the main surface of the circuit board included in the resin molded product, and hereinafter, the positive direction of the Z axis may be described as the upward direction, and the negative direction of the Z axis may be described as the downward direction. In addition, when only a part of the configuration of the resin molded product is illustrated, each of the X axis direction, Y axis direction, and Z axis direction is the direction when the resin molded product is completed.

図１および図２に示すように、実施形態に係る樹脂成形品１は、回路基板１０と、１次成形樹脂部２０と、２次成形樹脂部３０とを備える。回路基板１０には、導電部材１１および不図示の電子部品が搭載されている。回路基板１０は、例えば、両面配線基板であるが、３層以上の配線基板であってもよい。 As shown in Figs. 1 and 2, the resin molded product 1 according to the embodiment includes a circuit board 10, a primary molded resin part 20, and a secondary molded resin part 30. A conductive member 11 and electronic components (not shown) are mounted on the circuit board 10. The circuit board 10 is, for example, a double-sided wiring board, but may also be a wiring board with three or more layers.

樹脂成形品１では、回路基板１０が、１次成形樹脂部２０および２次成形樹脂部３０を含む樹脂によって封止されることで、防水性を確保すると共に強度を向上させることができる。なお、図１および図２に示す例では、樹脂成形品１は、２次成形樹脂部３０が回路基板１０の全体を覆う構成であるが、樹脂成形品１は、２次成形樹脂部３０が回路基板１０の一部を覆う構成であってもよい。 In the resin molded product 1, the circuit board 10 is sealed with resin including the primary molded resin part 20 and the secondary molded resin part 30, thereby ensuring waterproofing and improving strength. In the example shown in Figures 1 and 2, the resin molded product 1 is configured such that the secondary molded resin part 30 covers the entire circuit board 10, but the resin molded product 1 may also be configured such that the secondary molded resin part 30 covers only a portion of the circuit board 10.

１次成形樹脂部２０は、回路基板１０の端部に一端部２１が接合されている。そして、樹脂成形品１では、１次成形樹脂部２０の一端部２１が２次成形樹脂部３０によって覆われていることで、１次成形樹脂部２０と回路基板１０との接合強度が高くなっている。 The primary molded resin part 20 has one end 21 joined to an end of the circuit board 10. In the resin molded product 1, the one end 21 of the primary molded resin part 20 is covered by the secondary molded resin part 30, so that the bonding strength between the primary molded resin part 20 and the circuit board 10 is high.

１次成形樹脂部２０は、１次成形用樹脂材料を用いた１次成形処理によって導電部材１１と一体化され、導電部材１１および不図示の電子部品は回路基板１０と半田によって電気的に接続される。１次成形用樹脂材料は、例えば、ポリエチレン、ポリプロピレン、ポリスチレン、アクリル樹脂、ＡＢＳ樹脂、またはポリ塩化ビニルなどの熱可塑性樹脂であるが、熱可塑性樹脂以外の樹脂であってもよい。１次成形処理は、例えば、射出成形による成形処理である。１次成形処理は、１次成形工程で行われる。また、導電部材１１は、半田によって回路基板１０と接続されるが、ケーブルと接続されてもよい。 The primary molding resin part 20 is integrated with the conductive member 11 by a primary molding process using a primary molding resin material, and the conductive member 11 and electronic components (not shown) are electrically connected to the circuit board 10 by solder. The primary molding resin material is, for example, a thermoplastic resin such as polyethylene, polypropylene, polystyrene, acrylic resin, ABS resin, or polyvinyl chloride, but may be a resin other than a thermoplastic resin. The primary molding process is, for example, a molding process by injection molding. The primary molding process is performed in the primary molding step. Also, the conductive member 11 is connected to the circuit board 10 by solder, but may also be connected to a cable.

図３および図４に示す１次成形品２において、１次成形樹脂部２０の一端部２１は、１次成形処理によって回路基板１０の主面Ｍに接合される。１次成形樹脂部２０の他端部２２は、図３における左右方向を円筒軸Ｌｃ方向とする円筒状に形成されており、図３および図４における左右方向の端面２２ａは、円環状の端面である。 In the primary molded product 2 shown in Figures 3 and 4, one end 21 of the primary molded resin part 20 is joined to the main surface M of the circuit board 10 by the primary molding process. The other end 22 of the primary molded resin part 20 is formed in a cylindrical shape with the left-right direction in Figure 3 as the direction of the cylindrical axis Lc, and the end face 22a in the left-right direction in Figures 3 and 4 is an annular end face.

１次成形樹脂部２０の一端部２１と他端部２２との間に位置する中途部分における外周には、２次成形処理で２次成形用樹脂材料が流れる際に生じる圧力を受ける圧受部２３が設けられている。圧受部２３は、１次成形樹脂部２０の中途部分における外周に凸状に形成されており、後述するように、２次成形処理時に金型に当接する圧受面２３ａを有する。圧受部２３は、図５に示すように、フランジ状に形成され、円筒軸Ｌｃから遠ざかる方向に突出しており、圧受部２３の圧受面２３ａは、円環状に形成されている。 A pressure receiving portion 23 is provided on the outer periphery of the intermediate portion between one end 21 and the other end 22 of the primary molded resin portion 20, which receives the pressure generated when the secondary molding resin material flows in the secondary molding process. The pressure receiving portion 23 is formed in a convex shape on the outer periphery of the intermediate portion of the primary molded resin portion 20, and has a pressure receiving surface 23a that abuts against the mold during the secondary molding process, as described below. As shown in FIG. 5, the pressure receiving portion 23 is formed in a flange shape and protrudes in a direction away from the cylindrical axis Lc, and the pressure receiving surface 23a of the pressure receiving portion 23 is formed in an annular shape.

圧受部２３は、ＹＺ平面において、図３に示すＺ軸に沿って中心Ｏから離れるほど、図３における左右方向（Ｘ軸方向）の厚みが薄く形成される。これにより、圧受面２３ａは２次成形用樹脂材料が流れる方向と交差する方向であるＹ軸方向およびＺ軸方向に広がる面が傾斜するテーパー面になっている。かかる圧受面２３ａは、ＹＺ平面においてＺ軸に沿って中心Ｏに近づくほどＸ軸方向の距離が他端部２２に近づく。また、圧受部２３のうち図３における圧受面２３ａの反対側にある面２３ｂもテーパー面であり、ＹＺ平面においてＺ軸に沿って中心Ｏに近づくほどＸ軸方向の距離が一端部２１に近づく。なお、圧受面２３ａおよび面２３ｂは、ＹＺ平面に平行な面であってもよい。 In the YZ plane, the pressure-receiving portion 23 is formed so that the thickness in the left-right direction (X-axis direction) in FIG. 3 becomes thinner as it moves away from the center O along the Z-axis shown in FIG. 3. As a result, the pressure-receiving surface 23a is a tapered surface in which the surfaces extending in the Y-axis direction and the Z-axis direction, which are directions intersecting the direction in which the secondary molding resin material flows, are inclined. The closer the pressure-receiving surface 23a is to the center O along the Z-axis in the YZ plane, the closer it is to the other end 22 in the X-axis direction. In addition, the surface 23b of the pressure-receiving portion 23 on the opposite side of the pressure-receiving surface 23a in FIG. 3 is also a tapered surface, and the closer it is to the center O along the Z-axis in the YZ plane, the closer it is to the one end 21 in the X-axis direction. Note that the pressure-receiving surface 23a and the surface 23b may be surfaces parallel to the YZ plane.

図１および図２に戻って、樹脂成形品１の説明を続ける。２次成形樹脂部３０は、２次成形用樹脂材料を用いた２次成形処理によって回路基板１０および１次成形樹脂部２０と一体化される。また、図１および図２に示す例では、２次成形樹脂部３０が回路基板１０に接合されているが、樹脂成形品１は、２次成形樹脂部３０が１次成形樹脂部２０だけに接合される構成であってもよい。 Returning to Figures 1 and 2, the explanation of the resin molded product 1 will continue. The secondary molded resin part 30 is integrated with the circuit board 10 and the primary molded resin part 20 by a secondary molding process using a secondary molding resin material. In the example shown in Figures 1 and 2, the secondary molded resin part 30 is joined to the circuit board 10, but the resin molded product 1 may be configured such that the secondary molded resin part 30 is joined only to the primary molded resin part 20.

２次成形用樹脂材料は、例えば、フェノール樹脂、メラミン樹脂、またはエポキシ樹脂などの熱硬化性樹脂であるが、熱硬化性樹脂以外の樹脂であってもよい。２次成形処理は、例えば、トランスファ成形による成形処理である。２次成形処理は、１次成形工程の後の２次成形工程で行われる。 The resin material for secondary molding is, for example, a thermosetting resin such as phenolic resin, melamine resin, or epoxy resin, but may be a resin other than a thermosetting resin. The secondary molding process is, for example, a molding process by transfer molding. The secondary molding process is performed in a secondary molding process after the primary molding process.

上述したように、樹脂成形品１には、２次成形処理で２次成形用樹脂材料が流れる際に生じる圧力、所謂、樹脂圧を受ける圧受部２３が設けられており、これにより、２次成形処理が行われる２次成形工程において１次成形品２に加わる樹脂圧による１次成形品２の変形が抑制される。以下、２次成形について説明する。 As described above, the resin molded product 1 is provided with a pressure receiving portion 23 that receives the pressure generated when the secondary molding resin material flows in the secondary molding process, i.e., the resin pressure. This suppresses deformation of the primary molded product 2 due to the resin pressure applied to the primary molded product 2 in the secondary molding step where the secondary molding process is performed. The secondary molding will be described below.

図６に示すように、２次成形工程では、２次成形用金型４０が用いられる。２次成形用金型４０は、図７に示すように、２次成形用樹脂材料が注入されるキャビティ４３（図８参照）を形成する第１金型４１と第２金型４２とを含む。第１金型４１は、２次成形樹脂部３０の下側を形成するための金型であり、下金型とも呼ばれる。また、第２金型４２は、２次成形樹脂部３０の上側を形成するための金型であり、上金型とも呼ばれる。 As shown in FIG. 6, a secondary molding die 40 is used in the secondary molding process. As shown in FIG. 7, the secondary molding die 40 includes a first die 41 and a second die 42 that form a cavity 43 (see FIG. 8) into which the secondary molding resin material is injected. The first die 41 is a die for forming the lower side of the secondary molded resin part 30, and is also called the lower die. The second die 42 is a die for forming the upper side of the secondary molded resin part 30, and is also called the upper die.

２次成形工程において、第１金型４１と第２金型４２とは上下方向で間隔を空けて互いに対向しており、第１金型４１と第２金型４２との間の空間に、１次成形品２が不図示の搬送装置によって搬送され、搬送装置から第１金型４１に１次成形品２が受け渡される。 In the secondary molding process, the first mold 41 and the second mold 42 face each other with a gap between them in the vertical direction, and the primary molded product 2 is transported by a transport device (not shown) into the space between the first mold 41 and the second mold 42, and the primary molded product 2 is transferred from the transport device to the first mold 41.

次に、第１金型４１および第２金型４２のうちの一方が他方に対して近づくように移動して、図８に示すように、第１金型４１の当接面４１ａと第２金型４２の当接面４２ａとが互いに当接し、第１金型４１と第２金型４２とが型締される。これにより、１次成形品２は、第１金型４１と第２金型４２とによって形成されるキャビティ４３内に位置決めされる。 Next, one of the first mold 41 and the second mold 42 moves closer to the other, and as shown in FIG. 8, the abutment surface 41a of the first mold 41 and the abutment surface 42a of the second mold 42 come into contact with each other, and the first mold 41 and the second mold 42 are clamped together. This positions the primary molded product 2 in the cavity 43 formed by the first mold 41 and the second mold 42.

図８に示す状態では、圧受部２３が第１金型４１に形成された凹部４１ｂと第２金型４２に形成された凹部４２ｂとに係合した状態であり、これにより、１次成形品２の図６における左右方向（Ｘ軸方向）の移動が規制される。 In the state shown in FIG. 8, the pressure-receiving portion 23 is engaged with the recess 41b formed in the first mold 41 and the recess 42b formed in the second mold 42, thereby restricting the movement of the primary molded product 2 in the left-right direction (X-axis direction) in FIG. 6.

２次成形工程において、第１金型４１と第２金型４２とが型締された後、キャビティ４３内に溶融した２次成形用樹脂材料３３が注入される。このとき、１次成形品２の一端部２１は、キャビティ４３内に注入された２次成形用樹脂材料３３がキャビティ４３を流れる際に生じる２次成形用樹脂材料３３による圧力Ｐ（樹脂圧）を受ける。圧力Ｐの方向である圧力方向Ｄｐは、図９に示すように、１次成形品２の一端部２１から他端部２２へ向かう方向であり、図９における左方向である。 In the secondary molding process, after the first mold 41 and the second mold 42 are clamped, the molten secondary molding resin material 33 is injected into the cavity 43. At this time, one end 21 of the primary molded product 2 is subjected to pressure P (resin pressure) by the secondary molding resin material 33 that is generated when the secondary molding resin material 33 injected into the cavity 43 flows through the cavity 43. The pressure direction Dp, which is the direction of pressure P, is the direction from one end 21 to the other end 22 of the primary molded product 2, as shown in FIG. 9, and is the left direction in FIG. 9.

図９に示すように、１次成形品２における圧受部２３の圧受面２３ａは、圧力方向Ｄｐで第１金型４１の当接面４１ｃおよび第２金型４２の当接面４２ｃと対向して当接しているため、２次成形用樹脂材料３３による圧力Ｐによって１次成形品２の他端部２２の端面２２ａが２次成形用金型４０と接触することがなく、圧力方向Ｄｐで他端部２２の端面２２ａは２次成形用金型４０と間隔を空けて対向する。 As shown in FIG. 9, the pressure receiving surface 23a of the pressure receiving portion 23 in the primary molded product 2 faces and abuts against the abutment surface 41c of the first mold 41 and the abutment surface 42c of the second mold 42 in the pressure direction Dp, so that the end face 22a of the other end 22 of the primary molded product 2 does not come into contact with the secondary molding die 40 due to the pressure P from the secondary molding resin material 33, and the end face 22a of the other end 22 faces the secondary molding die 40 with a gap in between in the pressure direction Dp.

１次成形品２の他端部２２は、円筒状に形成されているため、圧力方向Ｄｐと直交する方向の厚みが薄い。そのため、１次成形品２において圧受部２３を設けずに、他端部２２の端面２２ａで２次成形用樹脂材料３３による圧力Ｐを受けるようにした場合、１次成形品２の他端部２２が変形する可能性がある。特に、他端部２２の端面２２ａが２次成形用樹脂材料３３で覆われないことから、他端部２２が金型に当接するため、他端部２２の端面２２ａが２次成形用樹脂材料３３で覆われる場合に比べて、他端部２２に加わる圧力が大きく、他端部２２が変形する可能性が高くなる。 The other end 22 of the primary molded product 2 is cylindrically formed, and therefore has a thin thickness in the direction perpendicular to the pressure direction Dp. Therefore, if the pressure receiving portion 23 is not provided in the primary molded product 2 and the end face 22a of the other end 22 receives the pressure P from the secondary molding resin material 33, the other end 22 of the primary molded product 2 may be deformed. In particular, since the end face 22a of the other end 22 is not covered with the secondary molding resin material 33, the other end 22 abuts against the mold, and the pressure applied to the other end 22 is greater than when the end face 22a of the other end 22 is covered with the secondary molding resin material 33, and the other end 22 is more likely to be deformed.

ここで、圧受部２３が設けられていない１次成形品２Ａに対して２次成形処理を行った場合の例について説明する。図１０に示すように、圧受部２３が設けられていない１次成形品２Ａに対して２次成形用金型４０を用いて２次成形処理を行う場合、キャビティ４３内に２次成形用樹脂材料３３による圧力Ｐを受けるための圧受部材４４が１次成形品２Ａにおける１次成形樹脂部２０の他端部２２における端面２２ａと２次成形用金型４０との間に配置される。 Here, an example of a case where a secondary molding process is performed on a primary molded product 2A that does not have a pressure-receiving portion 23 will be described. As shown in FIG. 10, when a secondary molding process is performed on a primary molded product 2A that does not have a pressure-receiving portion 23 using a secondary molding die 40, a pressure-receiving member 44 for receiving pressure P from the secondary molding resin material 33 in the cavity 43 is placed between the end face 22a at the other end 22 of the primary molded resin portion 20 in the primary molded product 2A and the secondary molding die 40.

そして、第１金型４１と第２金型４２とを型締した後、キャビティ４３内に溶融した２次成形用樹脂材料３３を注入すると、１次成形樹脂部２０の一端部２１に加わる２次成形用樹脂材料３３による圧力Ｐが端面２２ａに加わる。１次成形品２Ａの他端部２２は、円筒状に形成され、圧力方向Ｄｐ（図９参照）と直交する方向の厚みが薄いことから、２次成形品である樹脂成形品１Ａは、図１０に示すように、樹脂成形品１Ａにおける１次成形樹脂部２０の他端部２２が変形する場合がある。 After clamping the first mold 41 and the second mold 42 together, the molten secondary molding resin material 33 is injected into the cavity 43, and the pressure P from the secondary molding resin material 33 applied to one end 21 of the primary molded resin part 20 is applied to the end face 22a. The other end 22 of the primary molded product 2A is formed cylindrically and has a small thickness in the direction perpendicular to the pressure direction Dp (see FIG. 9). Therefore, the other end 22 of the primary molded resin part 20 of the secondary molded product 1A may be deformed as shown in FIG. 10.

そこで、圧受部２３は、一端部２１が圧力Ｐを受けた場合であっても変形し難いように、圧力方向Ｄｐと直交する方向の厚みが他端部２２よりも厚く形成されている。そのため、２次成形工程において１次成形品２に加わる圧力による１次成形品２の変形が抑制される。 Therefore, the pressure-receiving portion 23 is formed so that its thickness in the direction perpendicular to the pressure direction Dp is greater than that of the other end 22 so that the pressure-receiving portion 23 is less likely to deform even when the one end 21 receives pressure P. This suppresses deformation of the primary molded product 2 due to the pressure applied to the primary molded product 2 in the secondary molding process.

また、２次成形工程において、１次成形品２の一端部２１以外の部分は、２次成形用樹脂材料３３で覆われない構成であり、２次成形用樹脂材料３３で覆われない領域に圧受部２３の圧受面２３ａが形成される。そのため、２次成形用樹脂材料３３の注入によって１次成形品２に加わる圧力を圧受部２３の圧受面２３ａで精度よく受けることができる。 In addition, in the secondary molding process, the portions of the primary molded product 2 other than one end 21 are not covered with the secondary molding resin material 33, and the pressure receiving surface 23a of the pressure receiving portion 23 is formed in the area not covered with the secondary molding resin material 33. Therefore, the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33 can be received with high precision by the pressure receiving surface 23a of the pressure receiving portion 23.

また、圧受部２３の圧受面２３ａは、図５に示すように、１次成形樹脂部２０の外周に円環状に形成されるため、圧受面２３ａの面積を広くとることができ、１次成形品２の一端部２１に加わる圧力によって１次成形品２に加わる力を圧受面２３ａで分散させることができる。そのため、圧受面２３ａが円環状に形成されずに圧受面２３ａの面積が広くとれていない場合に比べて、圧受面２３ａに加わる圧力を低減することができる。 In addition, as shown in FIG. 5, the pressure-receiving surface 23a of the pressure-receiving portion 23 is formed in a circular ring shape on the outer periphery of the primary molded resin portion 20, so that the area of the pressure-receiving surface 23a can be made large, and the force applied to the primary molded product 2 by the pressure applied to one end 21 of the primary molded product 2 can be dispersed by the pressure-receiving surface 23a. Therefore, the pressure applied to the pressure-receiving surface 23a can be reduced compared to when the pressure-receiving surface 23a is not formed in a circular ring shape and the area of the pressure-receiving surface 23a is not large.

また、圧受部２３は、圧力方向Ｄｐの厚みが第１金型４１と第２金型４２とが当接する当接面４１ａ，４２ａに向かうほど厚い。そのため、２次成形処理後の樹脂成形品１を２次成形用金型４０から容易に取り出すことができる。 The thickness of the pressure-receiving portion 23 in the pressure direction Dp increases toward the contact surfaces 41a, 42a where the first mold 41 and the second mold 42 contact each other. This allows the resin molded product 1 after the secondary molding process to be easily removed from the secondary molding mold 40.

圧受部２３の形状は、図５に示す形状に限定されず、例えば、図１１に示すように、円環状でなくてもよい。図１１に示す圧受面２３ａは、図１１における左右方向に間隔を空けて２つの圧受面２３ａが形成されている。 The shape of the pressure-receiving portion 23 is not limited to the shape shown in FIG. 5, and does not have to be annular, for example, as shown in FIG. 11. The pressure-receiving surface 23a shown in FIG. 11 has two pressure-receiving surfaces 23a formed with a gap between them in the left-right direction in FIG. 11.

また、１次成形品２における圧受部の位置および構成は上述した例に限定されない。図１２および図１３に示す１次成形品２は、圧受部２３に代えて、圧受部２４を備える。圧受部２４は、１次成形樹脂部２０の一端部２１と他端部２２との間に位置する中途部分における外周に、円筒軸に近づく方向において凹状に形成されており、２次成形処理時に２次成形用金型４０に当接する圧受面２４ａを有する。 The position and configuration of the pressure-receiving portion in the primary molded product 2 are not limited to the above-mentioned example. The primary molded product 2 shown in Figures 12 and 13 has a pressure-receiving portion 24 instead of the pressure-receiving portion 23. The pressure-receiving portion 24 is formed in a concave shape in the direction approaching the cylindrical axis on the outer periphery of the intermediate portion located between one end 21 and the other end 22 of the primary molded resin part 20, and has a pressure-receiving surface 24a that abuts against the secondary molding die 40 during the secondary molding process.

圧受部２４は、１次成形樹脂部２０の中途部分における外周に凹状に形成されており、圧受部２４の圧受面２４ａは、円環状に形成されている。圧受部２４の圧受面２４ａは、テーパー面であり、図１２に示すＹＺ平面において、Ｚ軸に沿って中心Ｏに近づくほどＸ軸方向の距離が他端部２２に近づく。これにより、２次成形処理後の樹脂成形品１を２次成形用金型４０から容易に取り出すことができる。 The pressure-receiving portion 24 is formed in a concave shape on the outer periphery of the middle part of the primary molded resin portion 20, and the pressure-receiving surface 24a of the pressure-receiving portion 24 is formed in an annular shape. The pressure-receiving surface 24a of the pressure-receiving portion 24 is a tapered surface, and in the YZ plane shown in FIG. 12, the closer it is to the center O along the Z axis, the closer it is to the other end portion 22 in the X-axis direction. This allows the resin molded product 1 after the secondary molding process to be easily removed from the secondary molding die 40.

図１４に示すように、第１金型４１と第２金型４２との間の空間に、１次成形品２が不図示の搬送装置によって搬送され、搬送装置から第１金型４１に１次成形品２が受け渡される。そして、第１金型４１および第２金型４２のうちの一方が上下方向に移動して、第１金型４１の当接面４１ａと第２金型４２の当接面４２ａとが互いに当接し、第１金型４１と第２金型４２とが型締される。これにより、１次成形品２は、図１５に示すように、第１金型４１と第２金型４２とによって形成されるキャビティ４３内に位置決めされる。 As shown in FIG. 14, the primary molded product 2 is transported by a transport device (not shown) into the space between the first mold 41 and the second mold 42, and the primary molded product 2 is transferred from the transport device to the first mold 41. Then, one of the first mold 41 and the second mold 42 moves vertically, and the abutment surface 41a of the first mold 41 and the abutment surface 42a of the second mold 42 abut against each other, and the first mold 41 and the second mold 42 are clamped. As a result, the primary molded product 2 is positioned in the cavity 43 formed by the first mold 41 and the second mold 42, as shown in FIG. 15.

図１５に示す状態では、圧受部２４が第１金型４１に形成された凸部４１ｄと第２金型４２に形成された凸部４２ｄとに係合した状態であり、これにより、１次成形品２の図１５における左右方向の移動が規制される。 In the state shown in FIG. 15, the pressure-receiving portion 24 is engaged with the convex portion 41d formed on the first mold 41 and the convex portion 42d formed on the second mold 42, thereby restricting the movement of the primary molded product 2 in the left-right direction in FIG. 15.

２次成形工程において、第１金型４１と第２金型４２とが型締された後、キャビティ４３内に溶融した２次成形用樹脂材料３３が注入される。このとき、圧受部２３の圧受面２３ａと同様に、圧受部２４の圧受面２４ａが２次成形用樹脂材料３３の注入によって１次成形品２に加わる圧力を受ける。圧受部２４の圧受面２４ａは、２次成形用樹脂材料３３で覆われていないため、２次成形用樹脂材料３３の注入によって１次成形品２に加わる圧力を精度よく受けることができる。 In the secondary molding process, after the first mold 41 and the second mold 42 are clamped, molten secondary molding resin material 33 is injected into the cavity 43. At this time, like the pressure receiving surface 23a of the pressure receiving portion 23, the pressure receiving surface 24a of the pressure receiving portion 24 receives the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33. Because the pressure receiving surface 24a of the pressure receiving portion 24 is not covered with the secondary molding resin material 33, it can accurately receive the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33.

また、圧受面２４ａは一端部２１によって支持されることから、１次成形品２の変形が抑制される。また、圧受面２４ａは、１次成形樹脂部２０の外周に円環状に形成されるため、圧受面２４ａの面積を広くとることができ、圧受面２３ａと同様に、圧受面２４ａに加わる圧力を低減することができる。なお、圧受面２４ａの形状は、円環状でなくてもよい。 In addition, since the pressure-receiving surface 24a is supported by the one end portion 21, deformation of the primary molded product 2 is suppressed. In addition, since the pressure-receiving surface 24a is formed in an annular shape on the outer periphery of the primary molded resin part 20, the area of the pressure-receiving surface 24a can be made large, and the pressure applied to the pressure-receiving surface 24a can be reduced, similar to the pressure-receiving surface 23a. Note that the shape of the pressure-receiving surface 24a does not have to be annular.

図１６および図１７に示す１次成形品２は、圧受部２３，２４に代えて、圧受部２５を備える。圧受部２５は、１次成形樹脂部２０の他端部２２における外周に、凸状に形成されており、２次成形処理時に２次成形用金型４０に当接する圧受面２５ａを有する。圧受部２５は、圧受部２３と同様に、円筒軸Ｌｃから遠ざかる方向にフランジ状に突出しており、圧受部２５の圧受面２５ａは、円環状に形成されている。圧受部２５の圧受面２５ａは、テーパー面であり、図１６に示すＹＺ平面において、Ｚ軸に沿って中心Ｏに近づくほどＸ軸方向の距離が一端部２１から遠ざかるように形成される。なお、図１６および図１７に示す１次成形品２においては、圧受部２５aと端面２２aとは同一面である。 The primary molded product 2 shown in Figures 16 and 17 has a pressure receiving part 25 instead of the pressure receiving parts 23 and 24. The pressure receiving part 25 is formed in a convex shape on the outer periphery of the other end 22 of the primary molded resin part 20, and has a pressure receiving surface 25a that abuts against the secondary molding die 40 during the secondary molding process. Like the pressure receiving part 23, the pressure receiving part 25 protrudes in a flange shape in a direction away from the cylindrical axis Lc, and the pressure receiving surface 25a of the pressure receiving part 25 is formed in an annular shape. The pressure receiving surface 25a of the pressure receiving part 25 is a tapered surface, and is formed so that the closer it is to the center O along the Z axis in the YZ plane shown in Figure 16, the farther it is from the one end 21 in the X-axis direction. Note that in the primary molded product 2 shown in Figures 16 and 17, the pressure receiving part 25a and the end surface 22a are on the same plane.

図１８に示すように、第１金型４１と第２金型４２との間の空間に、１次成形品２が不図示の搬送装置によって搬送され、搬送装置から第１金型４１に１次成形品２が受け渡される。そして、第１金型４１および第２金型４２のうちの一方が上下方向に移動して、第１金型４１の当接面４１ａと第２金型４２の当接面４２ａとが互いに当接し、第１金型４１と第２金型４２とが型締される。これにより、１次成形品２は、図１９に示すように、第１金型４１と第２金型４２とによって形成されるキャビティ４３内に位置決めされる。 As shown in FIG. 18, the primary molded product 2 is transported by a transport device (not shown) into the space between the first mold 41 and the second mold 42, and the transport device transfers the primary molded product 2 to the first mold 41. Then, one of the first mold 41 and the second mold 42 moves vertically, and the abutment surface 41a of the first mold 41 and the abutment surface 42a of the second mold 42 abut against each other, and the first mold 41 and the second mold 42 are clamped. As a result, the primary molded product 2 is positioned in the cavity 43 formed by the first mold 41 and the second mold 42, as shown in FIG. 19.

図１９に示す状態では、圧受部２５が第１金型４１に形成された凹部４１ｅと第２金型４２に形成された凹部４２ｅとに係合した状態であり、これにより、１次成形品２の図１９における左右方向の移動が規制される。 In the state shown in FIG. 19, the pressure-receiving portion 25 is engaged with the recess 41e formed in the first mold 41 and the recess 42e formed in the second mold 42, thereby restricting the movement of the primary molded product 2 in the left-right direction in FIG. 19.

２次成形工程において、第１金型４１と第２金型４２とが型締された後、キャビティ４３内に溶融した２次成形用樹脂材料３３が注入される。このとき、圧受部２３の圧受面２３ａと同様に、圧受部２５の圧受面２５ａが２次成形用樹脂材料３３の注入によって１次成形品２に加わる圧力を受ける。圧受部２５の圧受面２５ａは、２次成形用樹脂材料３３で覆われないため、２次成形用樹脂材料３３の注入によって１次成形品２に加わる圧力を精度よく受けることができる。 In the secondary molding process, after the first mold 41 and the second mold 42 are clamped, molten secondary molding resin material 33 is injected into the cavity 43. At this time, like the pressure receiving surface 23a of the pressure receiving portion 23, the pressure receiving surface 25a of the pressure receiving portion 25 receives the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33. Because the pressure receiving surface 25a of the pressure receiving portion 25 is not covered with the secondary molding resin material 33, it can accurately receive the pressure applied to the primary molded product 2 by the injection of the secondary molding resin material 33.

また、圧受面２５ａは、１次成形樹脂部２０の外周に円環状に形成されるため、圧受面２５ａの面積を広くとることができ、圧受面２３ａと同様に、圧受面２５ａに加わる圧力を低減することができる。また、圧受部２５の圧力方向Ｄｐ（図９参照）と直交する方向の厚みは、他端部２２の圧力方向Ｄｐと直交する方向の厚みよりも厚いため、圧受部２５の変形が抑制される。なお、圧受面２５ａの形状は円環状でなくてもよい。 In addition, since the pressure-receiving surface 25a is formed in an annular shape on the outer periphery of the primary molded resin portion 20, the area of the pressure-receiving surface 25a can be made large, and the pressure applied to the pressure-receiving surface 25a can be reduced, similar to the pressure-receiving surface 23a. In addition, since the thickness of the pressure-receiving portion 25 in a direction perpendicular to the pressure direction Dp (see FIG. 9) is thicker than the thickness of the other end portion 22 in a direction perpendicular to the pressure direction Dp, deformation of the pressure-receiving portion 25 is suppressed. Note that the shape of the pressure-receiving surface 25a does not have to be annular.

また、圧受部２５は、圧力方向Ｄｐの厚みが第１金型４１と第２金型４２とが当接する当接面４１ａ，４２ａに向かうほど厚い。そのため、２次成形処理後の樹脂成形品１を２次成形用金型４０から容易に取り出すことができる。 The thickness of the pressure-receiving portion 25 in the pressure direction Dp increases toward the contact surfaces 41a, 42a where the first mold 41 and the second mold 42 contact each other. This allows the resin molded product 1 after the secondary molding process to be easily removed from the secondary molding mold 40.

以上のように、実施の形態１にかかる樹脂成形品１は、１次成形品２と、２次成形用樹脂材料３３を用いた２次成形処理によって１次成形品２と一体化される２次成形樹脂部３０とを備える。１次成形品２は、被成形品の一例であり、２次成形用樹脂材料３３は、樹脂部材の一例であり、２次成形処は成形処理の一例であり、２次成形樹脂部３０は、成形樹脂部の一例である。１次成形品２の外周には、２次成形処理で２次成形用樹脂材料３３が流れる際に生じる圧力を受ける圧受部２３，２４，２５が設けられる。圧受部２３，２４，２５は、２次成形処理で２次成形用樹脂材料３３が流れる方向である第１方向と交差する方向である第２方向に広がる面で２次成形用金型４０と当接する圧受面２３ａ，２４ａ，２５ａを有する。第２方向は、回路基板１０の主面Ｍに交差する方向であり、Ｙ軸方向およびＺ軸方向である。言い換えれば、第２方向は、ＹＺ平面に沿う方向である。第１方向は、上述した圧力方向Ｄｐであり、Ｘ軸正方向である。これにより、樹脂成形品１では、樹脂材料をキャビティに流し込む際、被成形品に対して、樹脂圧が加えられた場合であっても１次成形品２の変形をし難くすることができる。 As described above, the resin molded product 1 according to the first embodiment includes the primary molded product 2 and the secondary molded resin part 30 that is integrated with the primary molded product 2 by the secondary molding process using the secondary molding resin material 33. The primary molded product 2 is an example of a molded product, the secondary molding resin material 33 is an example of a resin member, the secondary molding process is an example of a molding process, and the secondary molded resin part 30 is an example of a molded resin part. On the outer periphery of the primary molded product 2, pressure-receiving parts 23, 24, and 25 that receive the pressure generated when the secondary molding resin material 33 flows in the secondary molding process are provided. The pressure-receiving parts 23, 24, and 25 have pressure-receiving surfaces 23a, 24a, and 25a that abut against the secondary molding die 40 on a surface that extends in a second direction that is a direction intersecting the first direction in which the secondary molding resin material 33 flows in the secondary molding process. The second direction is a direction intersecting the main surface M of the circuit board 10, and is the Y-axis direction and the Z-axis direction. In other words, the second direction is a direction along the YZ plane. The first direction is the pressure direction Dp described above, and is the positive direction of the X-axis. This makes it possible to prevent deformation of the primary molded product 2 in the resin molded product 1, even if resin pressure is applied to the molded product when the resin material is poured into the cavity.

また、圧受部２３，２４，２５は、第２方向で凹状または凸状に形成される。これにより、圧受部２３，２４，２５を容易に形成することができる。 In addition, the pressure-receiving portions 23, 24, and 25 are formed to be concave or convex in the second direction. This makes it easy to form the pressure-receiving portions 23, 24, and 25.

また、１次成形品２のうち第１方向における下流に位置する端面２２ａは、２次成形用樹脂材料３３で覆われない。これにより、樹脂成形品１の成形工程において、端面２２ａに圧力が加わることを抑制することができ、他端部２２が変形し易い場合であっても、１次成形品２の変形をし難くすることができる。 In addition, the end face 22a of the primary molded product 2 located downstream in the first direction is not covered with the secondary molding resin material 33. This makes it possible to prevent pressure from being applied to the end face 22a during the molding process of the resin molded product 1, and makes it possible to make the primary molded product 2 less likely to deform even if the other end 22 is prone to deformation.

また、１次成形品２のうち第１方向における下流の端部である他端部２２は、第１方向を円筒軸方向とする円筒状に形成される。これにより、樹脂成形品１は、変形し易い円筒状に形成された他端部２２の変形を圧受部２３，２４，２５によってし難くすることができる。 The other end 22 of the primary molded product 2, which is the downstream end in the first direction, is formed into a cylindrical shape with the first direction as the cylindrical axis direction. This makes it possible for the pressure-receiving parts 23, 24, and 25 of the resin molded product 1 to make it difficult for the other end 22, which is formed into a cylindrical shape that is easily deformed, to deform.

また、圧受部２３，２４，２５は、１次成形樹脂部２０の外周に円環状に形成される。これにより、樹脂成形品１の成形工程において、圧受面２３ａが円環状に形成されずに圧受面２３ａの面積が広くとれていない場合に比べて、圧受面２３ａに加わる圧力を低減することができる。 The pressure-receiving portions 23, 24, and 25 are formed in an annular shape on the outer periphery of the primary molded resin portion 20. This allows the pressure applied to the pressure-receiving surface 23a to be reduced during the molding process of the resin molded product 1, compared to when the pressure-receiving surface 23a is not formed in an annular shape and the area of the pressure-receiving surface 23a is not large.

また、２次成形用金型４０は、２次成形用樹脂材料３３が注入されるキャビティ４３を形成する第１金型４１と第２金型４２とを備える。２次成形用金型４０は、金型の一例である。圧受部２３，２５は、第１方向の厚みが第１金型４１と第２金型４２とが当接する当接面４１ａ，４２ａに向かうほど厚い。これにより、２次成形処理後の樹脂成形品１を２次成形用金型４０から容易に取り出すことができる。 The secondary molding die 40 also includes a first die 41 and a second die 42 that form a cavity 43 into which the secondary molding resin material 33 is injected. The secondary molding die 40 is an example of a die. The pressure-receiving portions 23, 25 have a thickness in the first direction that increases toward the contact surfaces 41a, 42a where the first die 41 and the second die 42 contact each other. This allows the resin molded product 1 after the secondary molding process to be easily removed from the secondary molding die 40.

さらなる効果や変形例は、当業者によって容易に導き出すことができる。このため、本発明のより広範な態様は、以上のように表しかつ記述した特定の詳細および代表的な実施形態に限定されるものではない。したがって、添付の特許請求の範囲およびその均等物によって定義される総括的な発明の概念の精神または範囲から逸脱することなく、様々な変更が可能である。 Further advantages and modifications may readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and equivalents thereof.

１，１Ａ 樹脂成形品
２，２Ａ １次成形品
１０ 回路基板
２０ １次成形樹脂部
２１ 一端部
２２ 他端部
２２ａ 端面
２３，２４，２５ 圧受部
２３ａ，２４ａ，２５ａ 圧受面
３０ ２次成形樹脂部
３３ ２次成形用樹脂材料
４０ ２次成形用金型
４１ 第１金型
４１ａ，４２ａ，４１ｃ，４２ｃ 当接面
４２ 第２金型
４３ キャビティ
４４ 圧受部材 REFERENCE SIGNS LIST 1, 1A Resin molded product 2, 2A Primary molded product 10 Circuit board 20 Primary molded resin part 21 One end 22 Other end 22a End face 23, 24, 25 Pressure-receiving part 23a, 24a, 25a Pressure-receiving surface 30 Secondary molded resin part 33 Resin material for secondary molding 40 Secondary molding die 41 First die 41a, 42a, 41c, 42c Abutment surface 42 Second die 43 Cavity 44 Pressure-receiving member

Claims (6)

熱可塑性樹脂で形成された１次成形樹脂部と、前記１次成形樹脂部に接続される回路基板と、を備える被成形品と、
熱硬化性樹脂である樹脂材料を用いた成形処理によって前記被成形品と一体化される２次成形樹脂部と、を備え、
前記回路基板は、前記１次成形樹脂部のうち前記成形処理で前記樹脂材料が流れる方向である第１方向における上流に位置する一端部に接続され、
前記一端部は、前記成形処理によって２次成形樹脂部に覆われ、
前記１次成形樹脂部の外周には、
前記成形処理で前記樹脂材料が流れる際に生じる圧力を受ける圧受部が設けられ、
前記圧受部は、
前記第１方向と交差する方向である第２方向に広がる面で金型と当接する圧受面を有する
ことを特徴とする樹脂成形品。 A molded product including a primary molded resin part formed of a thermoplastic resin and a circuit board connected to the primary molded resin part;
a secondary molded resin portion that is integrated with the molded product by a molding process using a resin material that is a thermosetting resin ;
the circuit board is connected to one end of the primary molded resin part located upstream in a first direction, which is a direction in which the resin material flows during the molding process;
the one end is covered with a secondary molded resin portion by the molding process,
The outer periphery of the primary molded resin part is
a pressure receiving portion is provided that receives a pressure generated when the resin material flows during the molding process;
The pressure receiving portion is
a pressure-receiving surface extending in a second direction intersecting the first direction and contacting a mold; 前記圧受部は、
前記第２方向で凹状または凸状に形成される
ことを特徴とする請求項１に記載の樹脂成形品。 The pressure receiving portion is
The resin molded product according to claim 1 , wherein the resin molded product is formed in a concave or convex shape in the second direction. 前記１次成形樹脂部のうち前記第１方向における下流に位置する端面は、前記樹脂材料で覆われない
ことを特徴とする請求項１または２に記載の樹脂成形品。 The resin molded product according to claim 1 , wherein an end face of the primary molded resin portion located downstream in the first direction is not covered with the resin material. 前記１次成形樹脂部のうち前記第１方向における下流の他端部は、
前記第１方向を円筒軸方向とする円筒状に形成される
ことを特徴とする請求項１から３のいずれか１つに記載の樹脂成形品。 The other end portion of the primary molded resin portion downstream in the first direction is
The resin molded product according to claim 1 , wherein the resin molded product is formed in a cylindrical shape with the first direction being a cylindrical axis direction. 前記圧受部は、
前記１次成形樹脂部の外周に円環状に形成される
ことを特徴とする請求項１から４のいずれか１つに記載の樹脂成形品。 The pressure receiving portion is
The resin molded product according to claim 1 , wherein the first molded resin portion is formed in an annular shape on an outer periphery of the first molded resin portion . 前記金型は、
前記樹脂材料が注入されるキャビティを形成する第１金型と第２金型とを備え、
前記圧受部は、
前記第１方向の厚みが前記第１金型と前記第２金型とが当接する当接面に向かうほど厚い
ことを特徴とする請求項１から５のいずれか１つに記載の樹脂成形品。 The mold is
a first mold and a second mold for forming a cavity into which the resin material is injected;
The pressure receiving portion is
The resin molded product according to any one of claims 1 to 5, wherein the thickness in the first direction increases toward a contact surface where the first mold and the second mold are in contact with each other.
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