JP7504595B2 - 感光性ポリイミドをマイクロ波処理する方法 - Google Patents
感光性ポリイミドをマイクロ波処理する方法 Download PDFInfo
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Description
k=fpexp[Ea/RT] 式1
いくつかの実施形態では、感光性ポリイミド(PSPI)膜を硬化させる方法が、選択された基板上にPSPI膜を堆積させること、PSPI膜を光パターニングすること、光パターニングされたPSPI膜を現像すること、および現像された前記膜を、約200~275℃の選択された温度での、約20~200,000ppmの酸素濃度を含む選択された雰囲気中でのマイクロ波加熱によって硬化させることを含む。
本開示の他の追加の実施形態については以下で説明される。
本明細書に添付された、本明細書の部分を構成する図面は、本開示のある種の態様を示す。本開示のより明確な概念、ならびに本開示を含むシステムの構成要素および動作のより明確な概念は、図面に示された例示的なしたがって非限定的な実施形態を参照することによってより容易に明白になる。(2つ以上の図にある場合)同様の符号は同じ要素を示す。図面中の特徴物は必ずしも一定の尺度では描かれていない。
標準対流オーブン硬化とマイクロ波(VFM)硬化とを比較するために、標準シリコンウエハ上に、市販の感光性ポリイミド(PSPI)膜[HD4100、HD MicroSystems、ドイツWilmington]を厚さ5μmの膜として堆積させた。この例示的な厚さ(5μm)に対して、30秒、4000rpmのスピンコーティングでコーティングを塗布し、90℃、100秒+100℃、100秒のソフトベークを実施した。次いで、さまざまな時間およびさまざまな温度のVFM加熱または対流加熱によって膜を処理した。図5に示されているように、VFMでは、200℃という低温でイミド化反応の程度は完全になる。それに比較して標準対流プロセスでは375℃で完全になる。ポリイミド鎖の酸化は実質的に約300℃よりも高い温度でしか起こらないことが知られているため、これらのより低温の硬化条件では低酸素環境は必要なかった。
マイクロ波によって誘起された化学反応に見られる低活性化エネルギーが、熱分解を引き起こすことは認められていないため、ラジカルを発生させる感受性のアクリレート残基に対してVFM硬化中に酸素が利用可能であるときには、自動酸化(autoxidation)効果が生じる可能性がある。この自動酸化効果は、アクリレートのアルキル部分の酸化を漸進的に引き起こし、次いで二酸化炭素および他のガスを放出して、このような驚くほど低い温度でPSPI膜からのこれらの残基の除去を完了させる。
この低温VFM硬化と酸素補助の驚くべき組合せは、現在のところマイクロエレクトロニクス産業において最も一般的に使用されているポリマー誘電体材料である感光性ポリイミド膜を、非常に低い温度で完全に硬化させる実際的な方法を初めて利用可能にする。この完全な硬化はアクリレートの除去を含む。これらの温度で(空気中のまたは酸素流による)酸素を追加することには、膜に対する負の影響はないようである。低温硬化は、温度に敏感な材料および処理ステップを保護すること、ならびに膜により低い応力が加わることを含む、上に挙げた利点を可能にする。
図5の特定の例に示されているように、シリコンウエハ上のPSPI膜のVFM処理は、約230~270℃の硬化温度および約60~180分の時間にわたって実質的に同一の膜特性を達成する。これらの条件下では、ポリイミドを傷つけることなく酸素を安全に導入することができる。
対照的に、対流加熱では、同じレベルのイミド化を達成するのに375℃、300分の加熱が必要である。この条件に酸素が加わると、ポリイミドに対する望ましくない酸化損傷が生じると考えられる。
図6に示されているように、比較可能な温度(250℃)で処理した後のVFM硬化させたPSPI膜は、約50~350分の範囲全体にわたって、対流硬化させた膜よりもかなり高いTgを有する。
図7に示されているように、340℃、酸素分圧約20~200,000ppmのVFM硬化では、DMAによって測定されたTg値が約240~280℃になる。
図8に示されているように、濃度約200~200,000ppmの酸素を含む静止雰囲気中(右側の曲線)または流動雰囲気中(左側の曲線)での340℃でのバッチウエハVFM硬化の使用は、約250~320℃の範囲のTg値を有する膜を生成する。ここでの酸素の値は、名目上1気圧のキャリアガス(通常は窒素)中の酸素濃度を表し、最も高い値は実質的に空気を表す。本出願の出願人は一般に、同じ有効酸素活量(effective oxygen activity)を達成する低圧の純酸素を使用する等価の条件ではなしに、キャリアガス中の希釈された酸素の使用を好む。これは単に、周囲圧力で動作させた方がより単純であり、集中的な保守も必要ないためである。しかしながら、状況によっては、周囲圧力以外の圧力で動作させた方が望ましいことがある。周囲圧力での20~200,000ppm混合物の酸素活量と等価の所望のレベルの酸素活量を維持するために、チャンバ圧力および酸素濃度を独立にまたは一緒に調整することができる。前述の範囲の酸素活量を達成する手段は、本開示の範囲に含まれているとみなされる。例えば、1気圧の空気または0.2気圧の純酸素あるいは他のある組合せを使用して、200,000ppmの有効酸素濃度を維持することができる。
シリコンウエハ上に堆積させた特定の市販の膜形成材料の本明細書における議論は、単に例示のためだけに示したものであり、この議論が、基板としてシリコンを使用することだけに本開示を限定すること、または、任意の特定の製造業者のPSPI材料もしくは任意の特定の製造業者の感光性ポリマーだけに本開示を限定することは意図されていない。
Claims (5)
- ポリイミド膜を形成する方法であって、
感光性メタクリレートアルコールで修飾されたポリアミド酸前駆体樹脂を含む感光性ポリアミド酸エステルを含む感光性ポリアミド前駆体組成物を基板上に堆積させることと、
前記感光性ポリアミド前駆体組成物を、セ氏200~340度の温度で、20~200,000ppmの範囲の酸素濃度を有するプロセス雰囲気中で一定時間、可変周波数マイクロ波加熱によって硬化させて、前記ポリイミド膜を形成すること、
を備え、
前記プロセス雰囲気の前記酸素濃度は、追加の酸素ガス(O2)を前記プロセス雰囲気に与えることによって調整され、
前記ポリイミド膜は、アクリレート残基を含まないものであり、
前記ポリイミド膜は、315~325℃のガラス転移温度を有する方法。 - 前記感光性メタクリレートアルコールは、Rが有機部分を示す場合に、以下の式:R-CH2CH2OC(O)CH=C(CH3)2を有する、請求項1に記載の方法。
- 前記一定時間が60~180分である、請求項1又は2に記載の方法。
- 前記温度が、200~275℃の範囲にある、請求項1又は2に記載の方法。
- 前記プロセス雰囲気が、200~200,000ppmの範囲の酸素濃度を有する、請求項1又は2に記載の方法。
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