JP7502130B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP7502130B2 JP7502130B2 JP2020157707A JP2020157707A JP7502130B2 JP 7502130 B2 JP7502130 B2 JP 7502130B2 JP 2020157707 A JP2020157707 A JP 2020157707A JP 2020157707 A JP2020157707 A JP 2020157707A JP 7502130 B2 JP7502130 B2 JP 7502130B2
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- 239000004065 semiconductor Substances 0.000 title claims description 419
- 239000012535 impurity Substances 0.000 claims description 17
- 239000010410 layer Substances 0.000 description 300
- 238000010586 diagram Methods 0.000 description 14
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 230000015556 catabolic process Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Description
図1は、第1実施形態に係る半導体装置1Aを示す模式断面図である。半導体装置1Aは、例えば、IGBT(Insulated Gate Bipolar Transistor)である。
図5(a)は、隣り合う第1制御電極40aと第2制御電極40bとの間(図1参照)の第1半導体層11、第2半導体層13、第3半導体層15および第6半導体層17を示す斜視図である。
図5(b)は、第5半導体層21を示す斜視図であり、図5(c)は、第5半導体層21のY-Z面に沿った断面図である。
図6(a)は、隣り合う第1制御電極40aと第2制御電極40bとの間(図1参照)の第1半導体層11、第2半導体層13、第3半導体層15および第6半導体層17を示す斜視図である。
図6(b)は、第5半導体層21を示す斜視図であり、図6(c)は、第5半導体層21のY-Z面に沿った断面図である。
図7(a)は、隣り合う第1制御電極40aと第2制御電極40bとの間(図1参照)の第1半導体層11、第2半導体層13、第3半導体層15および第6半導体層17を示す斜視図である。図7(b)は、第5半導体層21を示す斜視図である。
図9(a)は、隣り合う第1制御電極40aと第2制御電極40bとの間(図1参照)の第1半導体層11、第2半導体層13、第3半導体層15および第6半導体層17を示す斜視図である。図9(b)は、第5半導体層21のY-Z面に沿った断面図である。
図12は、第2実施形態に係る半導体装置4を示す模式断面図である。半導体装置4は、例えば、第1導電形の第1半導体層111と、第2導電形の第2半導体層113と、第1導電形の第3半導体層115と、第2導電形の第4半導体層119と、第2導電形の第5半導体層121と、第2導電形の第6半導体層117と、を備える。また、半導体装置4は、第1電極120と、第2電極130と、制御電極140と、第1絶縁膜143と、を備える。
Claims (5)
- 第1電極と、
前記第1電極に対向する第2電極と、
前記第1電極と前記第2電極との間に設けられた第1導電形の第1半導体層と、
前記第1半導体層と前記第2電極との間に設けられ、前記第2電極に電気的に接続された第2導電形の第2半導体層と、
前記第2半導体層と前記第2電極との間に選択的に設けられ、前記第2電極に電気的に接続された前記第1導電形の第3半導体層と、
前記第1半導体層と前記第1電極との間に設けられ、前記第1電極に電気的に接続された前記第2導電形の第4半導体層と、
前記第3半導体層の表面から前記第1半導体層中に至る深さを有するトレンチの内部にぞれぞれ設けられ、前記第1半導体層と前記第2半導体層との境界に沿って並んだ複数の制御電極と、
前記複数の制御電極のそれぞれと前記第1半導体層との間、および、前記複数の制御電極のそれぞれと前記第2半導体層との間に設けられた第1絶縁膜と、
前記複数の制御電極のうちの隣合う第1制御電極と第2制御電極との間において、前記第1半導体層中に設けられた第1部分と、前記第1半導体層と前記第2半導体層との間に設けられ、前記第1部分および前記第2半導体層に電気的に接続された第2部分と、を含み、前記第1部分は前記第3半導体層と前記第4半導体層との間に位置する前記第2導電形の第5半導体層と、
を備え、
前記第1半導体層は、前記第5半導体層の前記第1部分と前記第1絶縁膜との間に位置する部分を含み、
前記第1半導体層は、前記第5半導体層の前記第2部分と前記第1絶縁膜との間に位置する部分を含む半導体装置。 - 前記第2半導体層と前記第2電極との間において、前記第3半導体層と並んで選択的に設けられた前記第2導電形の第6半導体層をさらに備え、
前記第5半導体層の前記第2部分は、前記第1半導体層と前記第6半導体層との間に位置し、
前記第6半導体層は、前記第2半導体層の第2導電形不純物よりも高濃度の第2導電形不純物を含み、
前記第2半導体層は、前記第6半導体層を介して前記第2電極に電気的に接続される請求項1記載の半導体装置。 - 前記第5半導体層は、前記第2半導体層の前記第2導電形不純物よりも高濃度の第2導電形不純物を含む請求項2記載の半導体装置。
- 前記第5半導体層と前記第1絶縁膜との間に設けられ、前記第1半導体層の第1導電形不純物よりも高濃度の第1導電形不純物を含む第7半導体層をさらに備えた請求項1~3のいずれか1つに記載の半導体装置。
- 第1導電形の第1半導体層と、
前記第1半導体層上に設けられた制御電極と、
前記第1半導体層と前記制御電極との間に設けられた第1絶縁膜と、
前記第1半導体層上に選択的に設けられ、前記第1絶縁膜を介して前記制御電極に向き合う部分を含む第2導電形の第2半導体層と、
前記第2半導体層上に選択的に設けられ、前記第2半導体層の前記制御電極に向き合う前記部分に並ぶ、前記第1導電形の第3半導体層と、
前記第1半導体層上において、前記第2半導体層から離れた位置に設けられた前記第2導電形の第4半導体層と、
前記第2半導体層中において、前記第1半導体層と前記第3半導体層との間に設けられ、前記第2半導体層の第2導電形不純物よりも高濃度の第2導電形不純物を含む前記第2導電形の第5半導体層と、
前記第2半導体層上に選択的に設けられ、前記第2半導体層の前記制御電極に向き合う前記部分および前記第3半導体層に並び、前記第5半導体層に電気的に接続された、前記第2導電形の第6半導体層と、
を備えた半導体装置。
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JP2020157707A JP7502130B2 (ja) | 2020-09-18 | 2020-09-18 | 半導体装置 |
US17/175,233 US20220093777A1 (en) | 2020-09-18 | 2021-02-12 | Semiconductor device |
CN202110226708.9A CN114203812A (zh) | 2020-09-18 | 2021-03-01 | 半导体装置 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007266133A (ja) | 2006-03-27 | 2007-10-11 | Toyota Central Res & Dev Lab Inc | 半導体装置 |
JP2010050307A (ja) | 2008-08-22 | 2010-03-04 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP2010283128A (ja) | 2009-06-04 | 2010-12-16 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2017045911A (ja) | 2015-08-28 | 2017-03-02 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
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