JP7489454B2 - 基板支持体のための一体化された電極及び接地面 - Google Patents
基板支持体のための一体化された電極及び接地面 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 52
- 238000010438 heat treatment Methods 0.000 claims description 27
- 239000000919 ceramic Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 description 22
- 239000007789 gas Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 239000000654 additive Substances 0.000 description 1
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
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- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
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Description
Claims (17)
- 基板支持体であって、
セラミック本体、
前記セラミック本体内に配置された電極、
前記セラミック本体内に配置された接地プレートであって、少なくとも一部が前記電極と同一平面上にある、接地プレート、
前記電極と同軸構造をなす接地シールドアセンブリであって、前記セラミック本体内に配置され、1つ又は複数の導電性素子から形成された、接地シールドアセンブリ、及び
前記接地シールドアセンブリ内に配置された1つ又は複数の加熱素子
を備えている基板支持体。 - 基板支持体であって、
セラミック本体、
前記セラミック本体内に配置された電極、
前記電極と同軸構造をなす接地シールドアセンブリであって、前記セラミック本体内に配置され、1つ又は複数の導電性素子から形成された、接地シールドアセンブリ、及び
前記接地シールドアセンブリ内に配置された1つ又は複数の加熱素子
を備え、前記接地シールドアセンブリが、
1つ又は複数の接地リード線、
前記1つ又は複数の接地リード線の反対側の第1の導電性部材、
前記1つ又は複数の接地リード線と前記第1の導電性部材との間で延在する第2の導電性部材、及び
前記第2の導電性部材の反対側にあり、前記1つ又は複数の接地リード線と前記第1の導電性部材との間で延在する第3の導電性部材
を備えている基板支持体。 - 前記第1の導電性部材が、前記1つ又は複数の接地リード線の径方向外側にあり、前記第1の導電性部材が、前記第2の導電性部材から前記第3の導電性部材へ延在する、請求項2に記載の基板支持体。
- 基板支持体であって、
セラミック本体、
前記セラミック本体内に配置された電極、
前記電極と同軸構造をなす接地シールドアセンブリであって、前記セラミック本体内に配置され、1つ又は複数の導電性素子から形成された、接地シールドアセンブリ、及び
前記接地シールドアセンブリ内に配置された1つ又は複数の加熱素子
を備え、前記接地シールドアセンブリが、
1つ又は複数の接地リード線、
前記1つ又は複数の接地リード線に対して、少なくとも部分的に、実質的に平行な複数の第1の導電性部材であって、前記1つ又は複数の接地リード線の径方向外側に配置された、複数の第1の導電性部材、
前記1つ又は複数の接地リード線と前記複数の第1の導電性部材との間で延在する複数の第2の導電性部材、及び
前記複数の第2の導電性部材の反対側にあり、前記1つ又は複数の接地リード線と前記複数の第1の導電性部材との間で延在する複数の第3の導電性部材
を備えている基板支持体。 - 前記接地シールドアセンブリが、前記1つ又は複数の加熱素子を取り囲む格子構造を形成する、請求項4に記載の基板支持体。
- 前記格子構造がファラデーケージである、請求項5に記載の基板支持体。
- 基板支持体であって、
第1の表面と、前記第1の表面の反対側の第2の表面とを有する本体であって、前記第1の表面が、複数のメサと、複数の谷とを含み、前記複数の谷の各々が、前記複数のメサのうちの少なくとも2つの間に配置されている、本体、
前記本体内に配置された電極であって、前記電極の複数の部分の各々が、前記複数のメサのうちの1つと整列している、電極、
前記本体内に配置された接地シールドアセンブリであって、格子構造を形成する、接地シールドアセンブリ、
前記本体内に配置され、前記接地シールドアセンブリに連結された接地プレートであって、前記電極と同一平面上にある、接地プレート、及び
前記本体内に配置され、前記接地シールドアセンブリによって取り囲まれた1つ又は複数の加熱素子
を備えている基板支持体。 - 基板支持体であって、
第1の表面と、前記第1の表面の反対側の第2の表面とを有する本体であって、前記第1の表面が、複数のメサと、複数の谷とを含み、前記複数の谷の各々が、前記複数のメサのうちの少なくとも2つの間に配置されている、本体、
前記本体内に配置された電極であって、前記電極の複数の部分の各々が、前記複数のメサのうちの1つと整列している、電極、
前記本体内に配置された接地シールドアセンブリであって、格子構造を形成する、接地シールドアセンブリ、及び
前記本体内に配置され、前記接地シールドアセンブリによって取り囲まれた1つ又は複数の加熱素子
を備え、前記接地シールドアセンブリが、
1つ又は複数の接地リード線、
前記1つ又は複数の接地リード線の反対側にあり、前記1つ又は複数の接地リード線の径方向外側にある複数の第1の部材、
複数の第2の部材であって、当該複数の第2の部材の各々が、前記1つ又は複数の接地リード線から前記複数の第1の部材へ延在する、複数の第2の部材、及び
前記複数の第2の部材の反対側の複数の第3の部材であって、当該複数の第3の部材の各々が、前記1つ又は複数の接地リード線から前記複数の第1の部材へ延在する、複数の第3の部材、
を備えている基板支持体。 - 前記接地シールドアセンブリのインピーダンスが、前記電極に連結された1つ又は複数の電力リード線のインピーダンスより小さい、請求項8に記載の基板支持体。
- 前記電極が単極性である、請求項7に記載の基板支持体。
- 前記電極が二極性である、請求項7に記載の基板支持体。
- 処理チャンバであって
チャンバ本体、及びその中の処理空間を画定するリッド、
前記処理空間内に配置され、前記リッドに連結されたシャワーヘッド、
前記リッドの反対側の前記チャンバ本体の底部から延在するステム、並びに
前記処理空間内で前記ステム上に配置された基板支持体であって、
本体と、
前記本体内に配置された電極と、
前記本体内に配置された接地プレートであって、少なくとも一部が前記電極と同一平面上にある、接地プレートと、
前記本体内に配置された接地シールドアセンブリと、
前記接地シールドアセンブリ内に配置された1つ又は複数の加熱素子と
を備えた基板支持体
を備えている処理チャンバ。 - 前記接地シールドアセンブリが、
1つ又は複数の接地リード線、
前記1つ又は複数の接地リード線の反対側にあり、前記1つ又は複数の接地リード線の径方向外側にある第1の部材、
前記1つ又は複数の接地リード線から前記第1の部材へ延在する第2の部材、及び
前記1つ又は複数の接地リード線から前記第1の部材へ延在し、前記第2の部材の反対側にある第3の部材、
を備えている、請求項12に記載の処理チャンバ。 - 前記1つ又は複数の加熱素子が、前記接地シールドアセンブリ内に封入されている、請求項13に記載の処理チャンバ。
- 前記第1の部材が、前記第2の部材から前記第3の部材へ延在する、請求項14に記載の処理チャンバ。
- 前記接地シールドアセンブリが、
複数の第1の部材、
複数の第2の部材、及び
複数の第3の部材
を備えている、請求項15に記載の処理チャンバ。 - 前記接地シールドアセンブリが、前記1つ又は複数の加熱素子を取り囲む格子構造を形成する、請求項16に記載の処理チャンバ。
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US201962911729P | 2019-10-07 | 2019-10-07 | |
US62/911,729 | 2019-10-07 | ||
PCT/US2020/051835 WO2021071659A1 (en) | 2019-10-07 | 2020-09-21 | Integrated electrode and ground plane for a substrate support |
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JP7489454B2 true JP7489454B2 (ja) | 2024-05-23 |
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US (1) | US12020912B2 (ja) |
JP (1) | JP7489454B2 (ja) |
KR (1) | KR20220073831A (ja) |
CN (1) | CN114467162A (ja) |
TW (1) | TW202121619A (ja) |
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